FR2053770A5 - Electrolytic deposition of gold-bismuth - alloys - Google Patents
Electrolytic deposition of gold-bismuth - alloysInfo
- Publication number
- FR2053770A5 FR2053770A5 FR6924342A FR6924342A FR2053770A5 FR 2053770 A5 FR2053770 A5 FR 2053770A5 FR 6924342 A FR6924342 A FR 6924342A FR 6924342 A FR6924342 A FR 6924342A FR 2053770 A5 FR2053770 A5 FR 2053770A5
- Authority
- FR
- France
- Prior art keywords
- bismuth
- alloys
- gold
- electrolytic deposition
- alkali metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Gold and bismuth are electrolytically co-deposited from a solution containing, preferably 12 g/l gold as an alkali metal auricyanide, and bismuth as the salt of a weak acid, preferably citric acid. Alkali metal citrate and citric acid are preferably used to buffer the soln. at pH 4-8, pref. 7. The bismuth concentration used depends on the alloy required and the current density. Alloys with bismuth concentrations above 35% are used for microcircuit encapsulation, while alloys with less than 20% bismuth are used as sputtering cathodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR6924342A FR2053770A5 (en) | 1969-07-17 | 1969-07-17 | Electrolytic deposition of gold-bismuth - alloys |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR6924342A FR2053770A5 (en) | 1969-07-17 | 1969-07-17 | Electrolytic deposition of gold-bismuth - alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2053770A5 true FR2053770A5 (en) | 1971-04-16 |
Family
ID=9037590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6924342A Expired FR2053770A5 (en) | 1969-07-17 | 1969-07-17 | Electrolytic deposition of gold-bismuth - alloys |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2053770A5 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0126921A2 (en) * | 1983-05-27 | 1984-12-05 | Schering Aktiengesellschaft | Bath for the galvanic deposition of gold alloys |
EP0384227A1 (en) * | 1989-02-24 | 1990-08-29 | Degussa Ag | Bath for the galvanic deposition of pure gold coatings |
US7465385B2 (en) | 2005-06-02 | 2008-12-16 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
US8142637B2 (en) | 2005-06-02 | 2012-03-27 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
-
1969
- 1969-07-17 FR FR6924342A patent/FR2053770A5/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0126921A2 (en) * | 1983-05-27 | 1984-12-05 | Schering Aktiengesellschaft | Bath for the galvanic deposition of gold alloys |
EP0126921A3 (en) * | 1983-05-27 | 1985-01-30 | Schering Aktiengesellschaft Berlin Und Bergkamen | Bath for the galvanic deposition of gold alloys |
EP0384227A1 (en) * | 1989-02-24 | 1990-08-29 | Degussa Ag | Bath for the galvanic deposition of pure gold coatings |
US7465385B2 (en) | 2005-06-02 | 2008-12-16 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
US8142637B2 (en) | 2005-06-02 | 2012-03-27 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1160314A (en) | Acidified Hydrogen Peroxide Solutions for Dissolving Metals | |
IE41858L (en) | Electrodeposition of noble metal alloys | |
GB1534453A (en) | Electroplating gold-cobalt alloys | |
FR2053770A5 (en) | Electrolytic deposition of gold-bismuth - alloys | |
GB1418933A (en) | Magnetic recording materials and process for preparation thereof | |
GB1448549A (en) | Gold-platinum plating bath | |
GB1293356A (en) | Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor | |
GB1224507A (en) | Electrodepositing a pink gold alloy | |
GB1270902A (en) | Continuously bronze plating aluminium wire or strip | |
GB1442325A (en) | Electroplating with gold and gold alloys | |
GB1320373A (en) | Copper electroplating in a citric acid bath | |
GB1352868A (en) | Method of producing tarnish-resistant film on cu and cu alloys | |
GB1389192A (en) | Electroplating solutions for depositing silver alloys and a method of forming silver alloys by electroplating | |
ES339924A1 (en) | Improvements in or relating to a Process for Obtaining Bright Zinc Deposits from Pyrophosphate Baths | |
GB1349796A (en) | Electrolytic gold plating solutions and methods utilising such solutions | |
JPS56136994A (en) | Gold-tin-copper alloy plating bath | |
SU362069A1 (en) | METHOD OF ELECTROCHEMICAL DEPOSITION OF A SILVER BASED ALLOY | |
GB1372850A (en) | Acidic copper electrolytes | |
ES393818A1 (en) | Bright tin electrodepositing | |
Shcherbak et al. | Electrochemical Machining Electrolyte | |
SU380749A1 (en) | METHOD OF ELECTROLYTIC DEPOSITION OF A TIN-ALLOY ALLOY | |
JPS52111820A (en) | Electro-deposition of zinc | |
FR2060106A1 (en) | Bath for electroplating gold | |
GB1251593A (en) | ||
GB799280A (en) | Improvements relating to the electro-deposition of lead-indium alloys |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |