GB1293356A - Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor - Google Patents

Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor

Info

Publication number
GB1293356A
GB1293356A GB57431/69A GB5743169A GB1293356A GB 1293356 A GB1293356 A GB 1293356A GB 57431/69 A GB57431/69 A GB 57431/69A GB 5743169 A GB5743169 A GB 5743169A GB 1293356 A GB1293356 A GB 1293356A
Authority
GB
United Kingdom
Prior art keywords
ions
metal
gold
bath
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB57431/69A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sel Rex Corp
Original Assignee
Sel Rex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sel Rex Corp filed Critical Sel Rex Corp
Publication of GB1293356A publication Critical patent/GB1293356A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/28Phosphorus compounds with one or more P—C bonds
    • C07F9/30Phosphinic acids [R2P(=O)(OH)]; Thiophosphinic acids ; [R2P(=X1)(X2H) (X1, X2 are each independently O, S or Se)]
    • C07F9/32Esters thereof
    • C07F9/3205Esters thereof the acid moiety containing a substituent or a structure which is considered as characteristic
    • C07F9/3235Esters of poly(thio)phosphinic acids
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/66Arsenic compounds
    • C07F9/70Organo-arsenic compounds
    • C07F9/74Aromatic compounds
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1293356 Gold-tin alloy plating baths SEL-REX CORP 24 Nov 1969 [28 Nov 1968] 57431/69 Heading C7B An aqueous gold-tin alloy plating bath contains 1 to 30 g/l Au in the form of an alkali metal (e.g. K) gold cyanide and 0À01 to 100 g/l Sn ions, or ions of Sn and at least one other metal chosen from Groups IIb, IIIb, IVb and Vb, e.g. Sb, In, Bi, Cd, Zn, As, Ga and Pb, added as a stable compound, e.g. antimony glycerolate, arsenic citrate or lead nitrate; with at least one other metal, the bath also contains 5 to 500 g/l of at least one compound capable of complexing the ions of Sn and the or each other metal, e. g. malic, maleic, lactic, gluconic, malonic or citric acid or salt thereof such as sodium gluconate and potassium citrate. The Sn ions may be added in the form of stannous sulphate, chloride or fluorborate with the corresponding sulphuric, hydrochloride or fluorboric acid. The bath may also contain a polyalcohol e.g. glycerine or ethylene glycol. Anodes of Sn or Sn and the or each other metal are used for continuously replenishing alloying ions. The anolyte and catholyte may be separated by a diaphragm.
GB57431/69A 1968-11-28 1969-11-24 Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor Expired GB1293356A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH1771068A CH494284A (en) 1968-11-28 1968-11-28 Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process
US88095069A 1969-11-28 1969-11-28
US23847372A 1972-03-27 1972-03-27

Publications (1)

Publication Number Publication Date
GB1293356A true GB1293356A (en) 1972-10-18

Family

ID=27177642

Family Applications (1)

Application Number Title Priority Date Filing Date
GB57431/69A Expired GB1293356A (en) 1968-11-28 1969-11-24 Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor

Country Status (8)

Country Link
US (1) US3764489A (en)
AT (1) AT301290B (en)
BE (1) BE742173A (en)
CH (1) CH494284A (en)
DE (1) DE1960047C2 (en)
FR (1) FR2032280A1 (en)
GB (1) GB1293356A (en)
NL (1) NL6917849A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4013523A (en) * 1975-12-24 1977-03-22 Oxy Metal Industries Corporation Tin-gold electroplating bath and process
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
DE3319772A1 (en) * 1983-05-27 1984-11-29 Schering AG, 1000 Berlin und 4709 Bergkamen BATH FOR GALVANIC DEPOSITION OF GOLD ALLOYS
EP0168705B1 (en) * 1984-07-05 1988-10-19 Siemens Aktiengesellschaft Bath and process for electroplating hard gold
DE4224012C1 (en) * 1992-07-21 1993-12-02 Heraeus Gmbh W C Solderable electric contact element - has silver@-tin@ alloy layer below gold@-tin@ solder alloy layer
DE4440176C2 (en) * 1994-02-05 1996-06-27 Heraeus Gmbh W C Bath for the electrodeposition of silver-tin alloys
EP0666342B1 (en) * 1994-02-05 1998-05-06 W.C. Heraeus GmbH Bath for electroplating silver-tin alloys
DE4406434C1 (en) * 1994-02-28 1995-08-10 Heraeus Gmbh W C Bright gold@-tin@ alloy electroplating bath
US20060237324A1 (en) * 2003-05-21 2006-10-26 Fred Hayward Pulse plating process for deposition of gold-tin alloy
CN101151401A (en) * 2004-05-11 2008-03-26 技术公司 Electroplating solution for gold-tin eutectic alloy
WO2006078549A1 (en) * 2005-01-21 2006-07-27 Technic, Inc. Pulse plating process for deposition of gold-tin alloy
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1111897B (en) * 1957-08-13 1961-07-27 Sel Rex Corp Bath for the galvanic deposition of shiny gold alloy coatings

Also Published As

Publication number Publication date
AT301290B (en) 1972-08-25
DE1960047C2 (en) 1983-04-28
BE742173A (en) 1970-05-04
US3764489A (en) 1973-10-09
FR2032280A1 (en) 1970-11-27
NL6917849A (en) 1970-06-01
DE1960047A1 (en) 1970-11-26
CH494284A (en) 1970-07-31

Similar Documents

Publication Publication Date Title
US3475292A (en) Gold plating bath and process
GB1293356A (en) Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor
US5514261A (en) Electroplating bath for the electrodeposition of silver-tin alloys
US2812299A (en) Electrolytic deposition of gold and gold alloys
US4435253A (en) Gold sulphite electroplating solutions and methods
US4366035A (en) Electrodeposition of gold alloys
JPS6031917B2 (en) Non-cyanide acidic silver electroplating bath
US3440151A (en) Electrodeposition of copper-tin alloys
US3770596A (en) Gold plating bath for barrel plating operations
GB2046794A (en) Silver and gold/silver alloy plating bath and method
US3586611A (en) Process for the electrolytic deposition of gold-copper-cadmium alloys
GB737713A (en) Improvements in or relating to the electro-deposition of lead and antimony and alloys thereof
US4048023A (en) Electrodeposition of gold-palladium alloys
GB1320373A (en) Copper electroplating in a citric acid bath
US4155817A (en) Low free cyanide high purity silver electroplating bath and method
US2793990A (en) Electrodeposition of alloys containing copper and tin
JP6207655B1 (en) Non-cyan Au-Sn alloy plating solution
GB1234793A (en) Brightening and hardening additive for electrolytic silvering baths
GB1300304A (en) Electroplated solder
GB1304424A (en)
GB760084A (en) Improvements in and relating to the electrodeposition of antimony
US4309256A (en) Process for the galvanoplastic deposition of a gold alloy
GB1294601A (en) Electrolytic plating solutions for deposition of noble metals
US2067534A (en) Method of and electrolyte for
JPH05271981A (en) Platinum alloy plating bath and production of platinum alloy-plated article using the bath

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee