JPS56136994A - Gold-tin-copper alloy plating bath - Google Patents

Gold-tin-copper alloy plating bath

Info

Publication number
JPS56136994A
JPS56136994A JP4039180A JP4039180A JPS56136994A JP S56136994 A JPS56136994 A JP S56136994A JP 4039180 A JP4039180 A JP 4039180A JP 4039180 A JP4039180 A JP 4039180A JP S56136994 A JPS56136994 A JP S56136994A
Authority
JP
Japan
Prior art keywords
gold
plating bath
tin
copper
alkali
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4039180A
Other languages
Japanese (ja)
Other versions
JPS5760437B2 (en
Inventor
Takashi Konase
Masayoshi Masuko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP4039180A priority Critical patent/JPS56136994A/en
Publication of JPS56136994A publication Critical patent/JPS56136994A/en
Publication of JPS5760437B2 publication Critical patent/JPS5760437B2/ja
Granted legal-status Critical Current

Links

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To provide a titled plating bath which contains a salt of gold by hydrogen sulfite stannous pyrophosphate, and pyrophosphoric acid, exhibits neutrality or alklalinity, shows a whitish pink gold color, and deposits electrodeposition material of superior corrosion resistance and solderability.
CONSTITUTION: This plating bath is formed of an aqueous soln. containing 3W 20g/l gold as salt of gold hydrogen sulfite (e.g. potassium gold sulfite), 1W20g/l tin as stannous pyrophosphate, and 0.1W10g/l copper as copper pyrophosphate, respectively. It is preferable to add 10W200g/l alkali sulfite as a stabilizing agent for gold, 1W300g/l alkali phyrophosphate as a stabilizing agent for tin and copper and 1W150g/l alkali dihydrogenphosphate as a buffer to this plating bath. In the case of performing plating by using this plating bath, it is preferable to keep bath temp. at room temp. W80°C, pH at 7W13 and current density at 0.1W5A/dm2.
COPYRIGHT: (C)1981,JPO&Japio
JP4039180A 1980-03-31 1980-03-31 Gold-tin-copper alloy plating bath Granted JPS56136994A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4039180A JPS56136994A (en) 1980-03-31 1980-03-31 Gold-tin-copper alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4039180A JPS56136994A (en) 1980-03-31 1980-03-31 Gold-tin-copper alloy plating bath

Publications (2)

Publication Number Publication Date
JPS56136994A true JPS56136994A (en) 1981-10-26
JPS5760437B2 JPS5760437B2 (en) 1982-12-20

Family

ID=12579351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4039180A Granted JPS56136994A (en) 1980-03-31 1980-03-31 Gold-tin-copper alloy plating bath

Country Status (1)

Country Link
JP (1) JPS56136994A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6126807A (en) * 1999-04-30 2000-10-03 Lucent Technologies Inc. Process for making sodium gold sulfite solution
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
US6797409B2 (en) 2001-12-20 2004-09-28 The Governors Of The University Of Alberta Electrodeposition process and a layered composite material produced thereby
CN102433576A (en) * 2011-12-19 2012-05-02 张家港舒马克电梯安装维修服务有限公司镀锌分公司 Au-Sn alloy electroplating liquid
CN105063691A (en) * 2015-08-21 2015-11-18 无锡桥阳机械制造有限公司 Au-Sn alloy electroplating solution
CN105177341A (en) * 2015-08-21 2015-12-23 无锡桥阳机械制造有限公司 Au-Sn alloy electroplate liquid

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
US6126807A (en) * 1999-04-30 2000-10-03 Lucent Technologies Inc. Process for making sodium gold sulfite solution
US6423202B1 (en) 1999-04-30 2002-07-23 Lucent Technologies Inc Process for making gold salt for use in electroplating
US6797409B2 (en) 2001-12-20 2004-09-28 The Governors Of The University Of Alberta Electrodeposition process and a layered composite material produced thereby
CN102433576A (en) * 2011-12-19 2012-05-02 张家港舒马克电梯安装维修服务有限公司镀锌分公司 Au-Sn alloy electroplating liquid
CN105063691A (en) * 2015-08-21 2015-11-18 无锡桥阳机械制造有限公司 Au-Sn alloy electroplating solution
CN105177341A (en) * 2015-08-21 2015-12-23 无锡桥阳机械制造有限公司 Au-Sn alloy electroplate liquid

Also Published As

Publication number Publication date
JPS5760437B2 (en) 1982-12-20

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