CN102433576A - Au-Sn alloy electroplating liquid - Google Patents
Au-Sn alloy electroplating liquid Download PDFInfo
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- CN102433576A CN102433576A CN2011104247090A CN201110424709A CN102433576A CN 102433576 A CN102433576 A CN 102433576A CN 2011104247090 A CN2011104247090 A CN 2011104247090A CN 201110424709 A CN201110424709 A CN 201110424709A CN 102433576 A CN102433576 A CN 102433576A
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Abstract
The invention discloses an Au-Sn alloy electroplating liquid which consists of an Au compound, an organic acid Sn compound, a complexing agent, a pH buffering agent or stabilizing agent and a Sn<2+> antioxidant. Sinking is not generated in the processes of storing and using the Au-Sn alloy electroplating liquid disclosed by the invention; and the Au-Sn alloy electroplating liquid is stable in property, and dose not damage the fine corrosion inhibitor patterns on an electroplating piece substrate.
Description
Technical field
The invention belongs to the electroplating technology field, be specifically related to Au-Sn alloy plating liquid.
Background technology
When I C electronic components such as (unicircuit) is assembled, as Au type scolder, be used for the solder bond of semi-conductor chip and ceramic chassis and ceramic packing and lid etc. with the Au-Sn alloy slice.In order to make electronic components such as semi-conductor chip when welding, can not receive the injury of heat.Must adopt to consist of 80Wt.%Au and 20 Wt.% S n, fusing point is 280 ℃ an Au-Sn platform gold.Through fusion, casting becomes certain thickness, the Au-Sn alloy weld tabs close with the weld size shape with working procedure processing such as calendering in the industry.Yet the Au-Sn alloy foil sheet through metallurgy method such as fusion and calendering are processed into exists fragility, when the alloy foil sheet melting solder, changes the original size shape of weld tabs easily, causes the weld tabs offset, and the weld does not overlap.In addition; When the size shape of weld tabs very fine when complicated; So the processing of platform gold solder sheet very difficulty people imagination obtains the Au-Sn solder in other words with plating method replacement metallurgy method, on electronic components such as semi-conductor, shelters the position that need not weld; Expose the Micropicture that needs the weld, then graphic plating Au-Sn platform gold.Traditional Au-Sn alloy electroplating bath contains Sn
2P
2O
7, SnSO
4, SnCl
2Etc. inorganic Snization platform thing.Sn in these plating baths
2+Be oxidized into Sn easily
4+, generate insoluble precipitate, along with the passing of electroplating time and precipitin reaction continue carry out, the Sn concentration in the plating bath changes, and causes the Au-Sn alloy layer to become instability.In order to prevent Sn
2+Oxidation precipitation reaction, that adopts pH=10～11 contains NaCN cyaniding plating bath, but high alkalinity solution dissolving and damage resist easily are not suitable for the plating of the electronic components such as semi-conductor chip with resist Micropicture obviously.In view of above-mentioned condition, in order to prevent the Sn in the plating bath
2+The oxidation precipitation reaction, the Au-Sn platform gold plate that the composition that obtains is stable, plating bath does not damage resist again.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of deposit with use in stable performance, do not produce deposition, do not damage the Au-Sn alloy plating liquid of the trickle resist figure on the plating piece matrix.
For solving the problems of the technologies described above, the technical scheme that the present invention adopted is: Au-Sn alloy plating liquid, and by Auization platform thing, organic acid Sn compound, the agent of network platform, pH buffer reagent pH buffer reagent or stablizer, Sn
2+Oxidation inhibitor is formed; Au compound concentration in Au is 3～10g/L; Concentration in the organic acid tin salt of Sn is 12～30g/L; Complexing agent concentration is 5～30g/L; PH buffer reagent or stabilizer concentration are 50～200g/ L; Sn oxidation inhibitor concentration 5～20g/L.
Said Auization platform thing is selected from KAu (CN)
2, NaAu (CN)
2, among the HAuCl one or more.
Organic acid in the said organic acid tin salt is carboxylic acid, sulfonic acid,-sulfinic acid.
Said complexing agent is at least a in pyridine compounds, quinoline compound, water-soluble poly aminocarboxylic acid and salt or the ether.
Said pyridine compounds is pyridine, nicotinic acid, pyridine-3-sulphonic acid, and amino adjoins pyridine; Quinoline compound is quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline; Water-soluble polynary aminocarboxylic acid is YD 30, ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetate, iminodiethanoic acid.
Said pH buffer reagent or stablizer are at least a in propanedioic acid, Succinic Acid, Hydrocerol A, tartrate, glycol acid, lactic acid, the oxysuccinic acid.
Said Sn
2+Oxidation inhibitor has at least a in water-soluble phenols, water-soluble phenolic carboxylic-acid, xitix and its esters or the ethers.
Said water-soluble phenols is pyrocatechol, Resorcinol, Resorcinol, phenol; The water-soluble phenolic carboxylic-acid is a Para Hydroxy Benzoic Acid, hydroxyl TRANSCINNAMIC ACID, hydroxybenzene diacid; Xitix and its esters or ethers are xitix, sodium ascorbate, xitix sodium palmitate, xitix StNa.
Effect of the present invention is: Au-Sn alloy plating liquid provided by the present invention, deposit with use in do not produce and sink to the bottom, stable performance does not damage the trickle resist figure on the plating piece matrix.
Embodiment
Embodiment 1
Au-Sn alloy plating liquid is by KAu (CN)
2, (C
2H
5-SO
3)
2Sn's, pyridine-3-sulphonic acid, Succinic Acid and Hydrocerol A, Resorcinol and Resorcinol;
Au compound concentration in Au is 10g/L; Concentration in the organic acid tin salt of Sn is 15g/L; Complexing agent concentration is 30g/L; PH buffer reagent or stabilizer concentration are 150g/ L; Sn oxidation inhibitor concentration 20g/L.
Embodiment 2
Au-Sn alloy plating liquid is by NaAu (CN)
2, (C
3H
7COO)
2Sn, ethylenediamine triacetic acid and hydroxyquinoline, tartrate and terepthaloyl moietie, the hydroxybenzene diacid is formed;
Au compound concentration in Au is 10g/L; Concentration in the organic acid tin salt of Sn is 12g/L; Complexing agent concentration is 10g/L; PH buffer reagent or stabilizer concentration are 200g/ L; Sn oxidation inhibitor concentration 15g/L.
Embodiment 3
Au-Sn alloy plating liquid, NaAu (CN)
2And HAuCl, (C
4H
9SO
2)
2Sn, the agent of network platform: the mixture that hydroxyquinoline, YD 30 and pyridine-3-sulphonic acid are formed, the pH buffer reagent is propanedioic acid and oxysuccinic acid, Sn
2+Oxidation inhibitor: the mixture that hydroxyl TRANSCINNAMIC ACID, pyrocatechol and xitix StNa are formed;
Au compound concentration in Au is 7g/L; Concentration in the organic acid tin salt of Sn is 20g/L; Complexing agent concentration is 20g/L; PH buffer reagent or stabilizer concentration are 100g/ L; Sn oxidation inhibitor concentration 5g/L.
Claims (8)
1.Au-Sn alloy plating liquid, by Auization platform thing, organic acid Sn compound, the agent of network platform, pH buffer reagent or stablizer, Sn
2+Oxidation inhibitor is formed; Au compound concentration in Au is 3～10g/L; Concentration in the organic acid tin salt of Sn is 12～30g/L; Complexing agent concentration is 5～30g/L; PH buffer reagent or stabilizer concentration are 50～200g/L; Sn oxidation inhibitor concentration 5～20g/L.
2. Au-Sn alloy plating liquid according to claim 1 is characterized in that, said Auization platform thing is selected from KAu (CN)
2, NaAu (CN)
2, among the HAuCl one or more.
3. Au-Sn alloy plating liquid according to claim 1 is characterized in that the organic acid in the said organic acid tin salt is carboxylic acid, sulfonic acid,-sulfinic acid.
4. Au-Sn alloy plating liquid according to claim 1 is characterized in that, said complexing agent is at least a in pyridine compounds, quinoline compound, water-soluble poly aminocarboxylic acid and salt or the ether.
5. Au-Sn alloy plating liquid according to claim 4 is characterized in that said pyridine compounds is pyridine, nicotinic acid, pyridine-3-sulphonic acid, and amino adjoins pyridine; Quinoline compound is quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline; Water-soluble polynary aminocarboxylic acid is YD 30, ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetate, iminodiethanoic acid.
6. Au-Sn alloy plating liquid according to claim 1 is characterized in that, said pH buffer reagent or stablizer are at least a in propanedioic acid, Succinic Acid, Hydrocerol A, tartrate, glycol acid, lactic acid, the oxysuccinic acid.
7. Au-Sn alloy plating liquid according to claim 1 is characterized in that said Sn
2+Oxidation inhibitor has at least a in water-soluble phenols, water-soluble phenolic carboxylic-acid, xitix and its esters or the ethers.
8. Au-Sn alloy plating liquid according to claim 7 is characterized in that said water-soluble phenols is pyrocatechol, Resorcinol, Resorcinol, phenol; The water-soluble phenolic carboxylic-acid is a Para Hydroxy Benzoic Acid, hydroxyl TRANSCINNAMIC ACID, hydroxybenzene diacid; Xitix and its esters or ethers are xitix, sodium ascorbate, xitix sodium palmitate, xitix StNa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104247090A CN102433576A (en) | 2011-12-19 | 2011-12-19 | Au-Sn alloy electroplating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104247090A CN102433576A (en) | 2011-12-19 | 2011-12-19 | Au-Sn alloy electroplating liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102433576A true CN102433576A (en) | 2012-05-02 |
Family
ID=45981918
Family Applications (1)
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|---|---|---|---|
| CN2011104247090A Pending CN102433576A (en) | 2011-12-19 | 2011-12-19 | Au-Sn alloy electroplating liquid |
Country Status (1)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103469264A (en) * | 2013-09-16 | 2013-12-25 | 中国电子科技集团公司第三十八研究所 | Method for preparing Au-Sn alloy coating with nanocrystalline structure by use of electroplating deposition |
| CN105063691A (en) * | 2015-08-21 | 2015-11-18 | 无锡桥阳机械制造有限公司 | Au-Sn alloy electroplating solution |
| CN105177341A (en) * | 2015-08-21 | 2015-12-23 | 无锡桥阳机械制造有限公司 | Au-Sn alloy electroplate liquid |
| CN105483779A (en) * | 2015-12-01 | 2016-04-13 | 深圳市瑞世兴科技有限公司 | Au-Sn alloy electroplating solution and electroplating method thereof |
| CN113308718A (en) * | 2021-05-08 | 2021-08-27 | 河北博威集成电路有限公司 | Gold-tin alloy electroplating method for back of GaN microwave high-power chip |
| CN117758327A (en) * | 2024-02-22 | 2024-03-26 | 深圳创智芯联科技股份有限公司 | Gold-tin electroplating solution for eutectic welding |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56136994A (en) * | 1980-03-31 | 1981-10-26 | Nippon Mining Co Ltd | Gold-tin-copper alloy plating bath |
| JP2001192886A (en) * | 2000-01-06 | 2001-07-17 | Ne Chemcat Corp | Gold-tin alloy electroplating bath |
| CN101151401A (en) * | 2004-05-11 | 2008-03-26 | 技术公司 | Electroplating solution for gold-tin eutectic alloy |
| CN102011158A (en) * | 2009-09-08 | 2011-04-13 | 大连理工大学 | Co-deposition electroplating method with cyanogen-free Au-Sn alloy electrolyte |
-
2011
- 2011-12-19 CN CN2011104247090A patent/CN102433576A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56136994A (en) * | 1980-03-31 | 1981-10-26 | Nippon Mining Co Ltd | Gold-tin-copper alloy plating bath |
| JP2001192886A (en) * | 2000-01-06 | 2001-07-17 | Ne Chemcat Corp | Gold-tin alloy electroplating bath |
| CN101151401A (en) * | 2004-05-11 | 2008-03-26 | 技术公司 | Electroplating solution for gold-tin eutectic alloy |
| CN102011158A (en) * | 2009-09-08 | 2011-04-13 | 大连理工大学 | Co-deposition electroplating method with cyanogen-free Au-Sn alloy electrolyte |
Non-Patent Citations (1)
| Title |
|---|
| 王丽丽编译: "金-锡合金电镀", 《电镀与精饰》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103469264A (en) * | 2013-09-16 | 2013-12-25 | 中国电子科技集团公司第三十八研究所 | Method for preparing Au-Sn alloy coating with nanocrystalline structure by use of electroplating deposition |
| CN105063691A (en) * | 2015-08-21 | 2015-11-18 | 无锡桥阳机械制造有限公司 | Au-Sn alloy electroplating solution |
| CN105177341A (en) * | 2015-08-21 | 2015-12-23 | 无锡桥阳机械制造有限公司 | Au-Sn alloy electroplate liquid |
| CN105483779A (en) * | 2015-12-01 | 2016-04-13 | 深圳市瑞世兴科技有限公司 | Au-Sn alloy electroplating solution and electroplating method thereof |
| CN113308718A (en) * | 2021-05-08 | 2021-08-27 | 河北博威集成电路有限公司 | Gold-tin alloy electroplating method for back of GaN microwave high-power chip |
| CN117758327A (en) * | 2024-02-22 | 2024-03-26 | 深圳创智芯联科技股份有限公司 | Gold-tin electroplating solution for eutectic welding |
| CN117758327B (en) * | 2024-02-22 | 2024-06-07 | 珠海市创智成功科技有限公司 | Gold-tin electroplating solution for eutectic welding |
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Application publication date: 20120502 |