CN105063691A - Au-Sn alloy electroplating solution - Google Patents
Au-Sn alloy electroplating solution Download PDFInfo
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- CN105063691A CN105063691A CN201510518068.3A CN201510518068A CN105063691A CN 105063691 A CN105063691 A CN 105063691A CN 201510518068 A CN201510518068 A CN 201510518068A CN 105063691 A CN105063691 A CN 105063691A
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Abstract
The invention discloses an Au-Sn alloy electroplating solution. The Au-Sn alloy electroplating solution per liter includes 2-5 g of Au compounds, 22-25 g of tin methane sulfonate, 10-15 g of complexing agents, 80-100 g of stabilizers and 2-3 g of tin antioxidants. Compared with the prior art, precipitation is avoided in the storage and use processes of the Au-Sn alloy electroplating solution, performance is stable, and tiny resist figures on a plating part matrix are not damaged.
Description
Technical field
The present invention relates to a kind of electroplate liquid, relate to a kind of alloy plating liquid further, be specifically related to a kind of Au-Sn alloy plating liquid, belong to field of electroplating.
Background technology
When the assembling of the electronic component such as IC (unicircuit), using Au-Sn alloy slice as Au type solder, for the solder bond of semi-conductor chip and ceramic chassis and ceramic packing and lid etc.In order to the injury making the electronic components such as semi-conductor chip can not be subject to heat when welding.Must adopt and consist of 80Wt.%Au and 20Wt.%Sn, fusing point is the Au-Sn alloy of 280 DEG C.Industrial by melting, the operations such as casting and calendering are processed into certain thickness, the Au-Sn alloy weld tabs close with weld size shape.But there is fragility by the Au-Sn alloy foil sheet that the metallurgy method such as melting and calendering is processed into, when alloy foil sheet melting solder, easily change the original size shape of weld tabs, cause weld tabs position to offset, weld does not overlap.
In addition, when the size shape of weld tabs very fine complicated time, so the processing of alloy weld tabs very difficulty people imagination obtains Au-Sn solder in other words with electrochemical plating replacement metallurgy method, on the electronic components such as semi-conductor, shelter the position that need not weld, expose the Micropicture needing weld, then graphic plating Au-Sn alloy.Traditional Au-Sn alloy electroplating bath contains Sn
2p
2o
7, SnSO
4, SnCl
2etc. inorganic Sn compound.Sn in these plating solutions
2+easily be oxidized into Sn
4+, generate insoluble precipitate, along with the passing of electroplating time and precipitin reaction continue carry out, the Sn concentration in plating solution changes, and causes Au-Sn alloy layer to become unstable.In order to prevent Sn
2+oxidation precipitation reacts, and what adopt pH=10 ~ 11 contains NaCN cyaniding plating solution, but high alkalinity solution easily dissolves and damages resist, is not suitable for the plating of the electronic components such as the semi-conductor chip with resist Micropicture obviously.In view of above-mentioned condition, in order to prevent the Sn in plating solution
2+oxidation precipitation reacts, and the Au-Sn alloy layer that the composition obtained is stable, plating solution does not damage resist again.
Summary of the invention
Technical problem to be solved by this invention provides a kind of for the state of the art to deposit and stable performance in use procedure, the Au-Sn alloy plating liquid not producing precipitation.
The present invention solves the problems of the technologies described above adopted technical scheme: a kind of Au-Sn alloy plating liquid, comprises the component of following concentration:
Wherein, described stablizer comprises the component of following concentration:
Ethanol 2.5 ~ 4mol/L;
S-WAT 3.0 ~ 5.0mol/L;
Ferrous sulfate 0.5 ~ 1.5mol/L.
Wherein, described is KAu (CN) containing Au compound
2, NaAu (CN)
2, a kind of in HAuCl or at least two kinds mixture.
Wherein, described complexing agent is at least one in pyridine compounds, quinoline compound, water-soluble poly aminocarboxylic acid and salt thereof or ether.
Wherein, described pyridine compounds is pyridine, nicotinic acid, pyridine-3-sulphonic acid, and amino adjoins pyridine; Quinoline compound is quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline; Water-soluble polynary aminocarboxylic acid is ethylenediamine tetraacetic acid (EDTA), ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetic acid, iminodiethanoic acid.
Wherein, described tin oxidation inhibitor is at least one in water-soluble phenols, water-soluble phenolic carboxylic-acid, xitix and its esters or ethers.
Wherein, described water-soluble phenols is pyrocatechol, Resorcinol, Resorcinol, phenol; Water-soluble phenolic carboxylic-acid is Para Hydroxy Benzoic Acid, hydroxyl TRANSCINNAMIC ACID, hydroxybenzene diacid; Xitix and its esters or ethers are xitix, sodium ascorbate, ascorbyl palmitate sodium, xitix sodium stearate.
Compared with prior art, the invention has the advantages that: this Au-Sn alloy plating liquid deposit with use procedure in can not produce precipitation, and stable performance, the trickle resist figure on plating piece matrix can not be damaged.
In addition, this Au-Sn alloy plating liquid stablizer used effectively can improve the stability of plating solution, contributes to its industrialization promotion.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment 1
The Au-Sn alloy plating liquid of the present embodiment comprises the component of following concentration:
Wherein, stablizer comprises the component of following concentration:
Ethanol 2.5mol/L;
S-WAT 3.0mol/L;
Ferrous sulfate 0.5mol/L.
In above-mentioned electroplate liquid and stablizer, each component can make one's options from following material:
Be KAu (CN) containing Au compound
2, NaAu (CN)
2, a kind of in HAuCl or at least two kinds mixture; Complexing agent is at least one in pyridine compounds, quinoline compound, water-soluble poly aminocarboxylic acid and salt thereof or ether.
Pyridine compounds is pyridine, nicotinic acid, pyridine-3-sulphonic acid, and amino adjoins pyridine; Quinoline compound is quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline; Water-soluble polynary aminocarboxylic acid is ethylenediamine tetraacetic acid (EDTA), ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetic acid, iminodiethanoic acid.
Tin oxidation inhibitor is at least one in water-soluble phenols, water-soluble phenolic carboxylic-acid, xitix and its esters or ethers.Wherein, water-soluble phenols is pyrocatechol, Resorcinol, Resorcinol, phenol; Water-soluble phenolic carboxylic-acid is Para Hydroxy Benzoic Acid, hydroxyl TRANSCINNAMIC ACID, hydroxybenzene diacid; Xitix and its esters or ethers are xitix, sodium ascorbate, ascorbyl palmitate sodium, xitix sodium stearate.
Embodiment 2
The Au-Sn alloy plating liquid of the present embodiment comprises the component of following concentration:
Wherein, stablizer comprises the component of following concentration:
Ethanol 3.0mol/L;
S-WAT 4.0mol/L;
Ferrous sulfate 1.0mol/L.
Wherein, containing the selection reference example 1 of Au compound, complexing agent, stablizer and tin oxidation inhibitor.
Embodiment 3
The Au-Sn alloy plating liquid of the present embodiment comprises the component of following concentration:
Wherein, stablizer comprises the component of following concentration:
Ethanol 4mol/L;
S-WAT 5.0mol/L;
Ferrous sulfate 1.5mol/L.
Wherein, containing the selection reference example 1 of Au compound, complexing agent, stablizer and tin oxidation inhibitor.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (7)
1. an Au-Sn alloy plating liquid, is characterized in that, comprises the component of following concentration:
2. Au-Sn alloy plating liquid according to claim 1, it is characterized in that, described stablizer comprises the component of following concentration:
Ethanol 2.5 ~ 4mol/L;
S-WAT 3.0 ~ 5.0mol/L;
Ferrous sulfate 0.5 ~ 1.5mol/L.
3. Au-Sn alloy plating liquid according to claim 1, is characterized in that: described is KAu (CN) containing Au compound
2, NaAu (CN)
2, a kind of in HAuCl or at least two kinds mixture.
4. Au-Sn alloy plating liquid according to claim 1, is characterized in that: described complexing agent is at least one in pyridine compounds, quinoline compound, water-soluble poly aminocarboxylic acid and salt thereof or ether.
5. Au-Sn alloy plating liquid according to claim 4, is characterized in that: described pyridine compounds is pyridine, nicotinic acid, pyridine-3-sulphonic acid, and amino adjoins pyridine; Quinoline compound is quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline; Water-soluble polynary aminocarboxylic acid is ethylenediamine tetraacetic acid (EDTA), ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetic acid, iminodiethanoic acid.
6. Au-Sn alloy plating liquid according to claim 1, is characterized in that: described tin oxidation inhibitor is at least one in water-soluble phenols, water-soluble phenolic carboxylic-acid, xitix and its esters or ethers.
7. Au-Sn alloy plating liquid according to claim 6, is characterized in that: described water-soluble phenols is pyrocatechol, Resorcinol, Resorcinol, phenol; Water-soluble phenolic carboxylic-acid is Para Hydroxy Benzoic Acid, hydroxyl TRANSCINNAMIC ACID, hydroxybenzene diacid; Xitix and its esters or ethers are xitix, sodium ascorbate, ascorbyl palmitate sodium, xitix sodium stearate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510518068.3A CN105063691A (en) | 2015-08-21 | 2015-08-21 | Au-Sn alloy electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510518068.3A CN105063691A (en) | 2015-08-21 | 2015-08-21 | Au-Sn alloy electroplating solution |
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|---|---|
| CN105063691A true CN105063691A (en) | 2015-11-18 |
Family
ID=54493187
Family Applications (1)
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| CN201510518068.3A Pending CN105063691A (en) | 2015-08-21 | 2015-08-21 | Au-Sn alloy electroplating solution |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
| CN117758327A (en) * | 2024-02-22 | 2024-03-26 | 深圳创智芯联科技股份有限公司 | Gold-tin electroplating solution for eutectic welding |
Citations (5)
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|---|---|---|---|---|
| JPS56136994A (en) * | 1980-03-31 | 1981-10-26 | Nippon Mining Co Ltd | Gold-tin-copper alloy plating bath |
| JP2001192886A (en) * | 2000-01-06 | 2001-07-17 | Ne Chemcat Corp | Gold-tin alloy electroplating bath |
| CN101403112A (en) * | 2008-10-28 | 2009-04-08 | 昆山成利焊锡制造有限公司 | Chemical tin plating liquor for copper and copper alloy |
| CN102433576A (en) * | 2011-12-19 | 2012-05-02 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | Au-Sn alloy electroplating liquid |
| CN104136663A (en) * | 2011-12-09 | 2014-11-05 | Msc公司 | Method for preparing tin-silver alloy plating solution and plating solution prepared by same |
-
2015
- 2015-08-21 CN CN201510518068.3A patent/CN105063691A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56136994A (en) * | 1980-03-31 | 1981-10-26 | Nippon Mining Co Ltd | Gold-tin-copper alloy plating bath |
| JP2001192886A (en) * | 2000-01-06 | 2001-07-17 | Ne Chemcat Corp | Gold-tin alloy electroplating bath |
| CN101403112A (en) * | 2008-10-28 | 2009-04-08 | 昆山成利焊锡制造有限公司 | Chemical tin plating liquor for copper and copper alloy |
| CN104136663A (en) * | 2011-12-09 | 2014-11-05 | Msc公司 | Method for preparing tin-silver alloy plating solution and plating solution prepared by same |
| CN102433576A (en) * | 2011-12-19 | 2012-05-02 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | Au-Sn alloy electroplating liquid |
Non-Patent Citations (2)
| Title |
|---|
| 王丽丽: "An-Sn合金电镀液", 《电镀与精饰》 * |
| 王丽丽: "金-锡合金电镀", 《电镀与精饰》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
| CN105755512B (en) * | 2016-03-04 | 2018-01-05 | 昆山艾森半导体材料有限公司 | A kind of tin methane sulfonate antioxidant and preparation method thereof and application method |
| CN117758327A (en) * | 2024-02-22 | 2024-03-26 | 深圳创智芯联科技股份有限公司 | Gold-tin electroplating solution for eutectic welding |
| CN117758327B (en) * | 2024-02-22 | 2024-06-07 | 珠海市创智成功科技有限公司 | Gold-tin electroplating solution for eutectic welding |
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