CN104561951A - Method and plating solution for chemical plating of nickel phosphorus alloy, and nickel phosphorus alloy layer - Google Patents
Method and plating solution for chemical plating of nickel phosphorus alloy, and nickel phosphorus alloy layer Download PDFInfo
- Publication number
- CN104561951A CN104561951A CN201410317528.1A CN201410317528A CN104561951A CN 104561951 A CN104561951 A CN 104561951A CN 201410317528 A CN201410317528 A CN 201410317528A CN 104561951 A CN104561951 A CN 104561951A
- Authority
- CN
- China
- Prior art keywords
- plating solution
- acid
- plating
- nickel
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Abstract
The invention discloses a method and a plating solution for chemical plating of a nickel phosphorus alloy, and a nickel phosphorus alloy layer. The plating solution comprises the following components: 2-50g/L of hypophosphite, 1-30g/L of a nickel salt, 1-100g/L of a complexing agent and 0.001-1g/L of an additive capable of releasing formaldehyde. In the plating solution disclosed by the invention, the additive capable of releasing formaldehyde can be used for slowly releasing formaldehyde during reaction, and a small amount of formaldehyde in the plating solution can ensure that the nickel phosphorus alloy layer which is obtained by virtue of precipitation is tiny and compact, has a flat surface and has good bending resistance and conductivity.
Description
Technical field
The present invention relates to the manufacture field of flexible circuit board, particularly relate to a kind of plating solution of chemical plating nickel-phosphorus alloy, and use this kind of plating solution to carry out the method for chemical plating nickel-phosphorus alloy, and the ni-p alloy coating prepared on flexible circuit board by the method.
Background technology
Existing flexible circuit board (FPC) free folding, quality is light, volume is little feature can become the research emphasis pursuing densification electron trade in recent years.Due to a large amount of productions of the ultralight ultra thin device such as smart mobile phone, intelligent watch, panel computer, require constantly to promote to the surface multifunctional of circuit substrate, and chemical nickel plating have concurrently can weld, dispel the heat, contact the functions such as conducting in one, be therefore widely used in the surface treatment of circuit substrate.
Nickel/the gold plate be widely applied in printed circuit board process industry, also need first at the circuit substrate plated surface one deck nickel with copper foil circuit pattern, again by method that current potential is replaced, immersed containing in Au (CN) 2-complex ion solution, while nickel dissolves, gold atom deposits on nickel dam, until layer gold covers nickel dam completely, reaction stops.The metal that in the periodic table of elements, position is close has the similar characteristic mixed, and layer gold and copper foil layer directly contact the problem that can produce and mix.The phase mutual diffusion that nickel dam both can prevent between copper foil layer with layer gold as screen layer, can protecting copper foil layer again, making it not oxidized because being directly exposed in air.
Nickel plating technology is more ripe, and method is various, wherein chemical plating nickel-phosphorus alloy process costs low, have good soldering reliability and solidity to corrosion, be widely used in electron trade.The method of the chemical plating nickel-phosphorus alloy in traditional rigid printed circuit boards is not also suitable for flexible circuit board, because the coating surface that its reduction obtains is granule shape, between particle, gap is larger, bending performance is poor, easily crack during bending, and ubiquity the problems such as plating speed is slow, bath stability is poor, production cost is high.
Summary of the invention
Main purpose of the present invention is the plating solution providing a kind of chemical plating nickel-phosphorus alloy, to solve the technical problem of existing printed circuit board ni-p alloy coating bending performance difference.
The plating solution of chemical plating nickel-phosphorus alloy provided by the invention comprises following component: hypophosphite, 2 ~ 50g/L; Nickel salt, 1 ~ 30g/L; Complexing agent, 1 ~ 100g/L; Can the additive of release formaldehyde, 0.001 ~ 1g/L.In this programme by add a small amount of can the additive of release formaldehyde, avoid directly adding high-concentration formaldehyde, in the reaction process of plating, this additive can slow releasing formaldehyde, keep the formaldehyde of lower concentration and continue to supplement formaldehyde, in plating solution, there is the formaldehyde of the reduction reaction participating on a small quantity nickel ion as reductive agent, can allow the tiny densification of coating, surfacing, thus the resistance to bending performance of coating and electric conductivity are effectively optimized.
Preferably:
Described plating solution also comprises the sodium lauryl sulphate as tensio-active agent, and concentration range is 1 ~ 3g/L.Appropriate tensio-active agent can improve plating piece wettability of the surface, makes plating solution interfacial tension lowering, and bubble hydrogen is easily separated out and can not rest on coating surface, prevents pin hole, pit.
Described plating solution also comprises the bath stability agent that concentration range is 0.05 ~ 5mg/L, for preventing described hypophosphite Auto-decomposition.The stablizer of trace can suppress the Auto-decomposition of hypophosphite in plating solution, and improve the controllability of plating process, the excessive sedimentation velocity that can reduce plating solution on the contrary of stablizer, even suppress the deposition of nickel, therefore the concentration range of stablizer controls at 0.05 ~ 5mg/L.
Described bath stability agent is selected from the inorganic salt containing zine ion, lead ion, tin ion, cadmium ion or bismuth ion, thiocarbamide, Sulfothiorine, iodate, and one or more in molybdate, and concentration range is 0.1 ~ 2mg/L.
Describedly the additive of release formaldehyde can be selected from Sodium hydroxymethyl glycinate, Imidurea, diazonium Imidurea, 1,3-dihydroxymethyl-5, one or more in 5-T10,2-bromo-2-nitro-1,3-propylene glycol and chlorination 3-chlorallyl vulkacit H.
Described hypophosphite is selected from the one in sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite, and concentration range is 10 ~ 40g/L.
Described nickel salt is selected from the one in single nickel salt, nickel acetate, nickelous nitrate, and concentration range is 5 ~ 15g/L.
Described complexing agent is selected from least containing one or more in the organic acid of a carboxyl and sodium salt thereof, sylvite, ammonium salt, and concentration range is 5 ~ 50g/L.The effect adding appropriate complexing agent in the plating solution forms more stable complex compound with free nickel ion, reduce the concentration of free nickel ion, avoid occurring that phosphorous acid nickel precipitates, because phosphorous acid nickel cannot provide effective nickel source, and the complex compound of nickel can provide effective nickel source, participate in reduction reaction with the surface arriving plating piece, deposition is got off.The stability constant of the nickel complex that different complexing agent is formed is different, and the free nickel ion number of nickel complex control and participate in deposition reaction is not identical yet.The nickel complex higher relative to stability constant, the available free nickel ion concentration of the nickel complex that stability constant is lower is higher, and the free nickel ion number of catalytic surface absorption is more, and plating speed is larger.
The described organic acid at least containing a carboxyl comprises acetic acid, propanedioic acid, succinic acid, citric acid, oxyacetic acid, lactic acid, tartrate, oxysuccinic acid, 2,3-dihydroxysuccinic acids, glycine, 2-amido propionic acid, halfcystine, ethylenediamine tetraacetic acid (EDTA).Wherein, lactic acid, glycine, succinic acid belong to the organic acid less with free nickel ion complex ability, can improve coating sedimentation rate; Citric acid, ethylenediamine tetraacetic acid (EDTA), tartrate belong to strong complexing agent, though sedimentation rate declines to some extent, can increase the massfraction of phosphorus in coating; And acetic acid plays shock absorption to plating solution pH value, prevent pH value from reducing too fast, the too low deposition that can suppress nickel of pH value.
Secondly, the present invention also provides a kind of method of chemical plating nickel-phosphorus alloy, and at flexible circuit board electroless nickel-phosphorus alloy plating layer on surface, the method comprises the step being immersed by flexible circuit board and carry out electroless plating in aforesaid plating solution.
Preferably:
Said method comprising the steps of:
S1, pickling and activation: before plating, described flexible circuit board is immersed in acidic cleaner and clean, then immerse in sulphuric acid soln and carry out microetch activation;
S2, displacement: the described flexible circuit board after activation is immersed acid containing in the solution of palladium, to displace the crystal seed of the palladium with catalytic at copper wire surface;
S3, plating: the described flexible circuit board after step S2 process is immersed in aforementioned plating solution.
Described step S3 also comprises pH value and regulates, and be specially: in described plating solution, add pH value buffer reagent in reaction process, to ensure that the pH value of described plating solution maintains 3 ~ 6, described buffer concentrations range is 1 ~ 25g/L.
Described buffer reagent is acetic acid, boric acid, sodium hydroxide, potassium hydroxide, ammoniacal liquor or carbonic acid, and concentration range is 3 ~ 18g/L, to keep the pH value of described plating solution for 4 ~ 4.5 in reaction process.
In described step S3, described bath temperature is 45 ~ 90 DEG C, and described flexible circuit board to immerse in described plating solution 1 ~ 60 minute.
Separately, the present invention also provides a kind of ni-p alloy coating, is plated on the surface of flexible circuit board, and this ni-p alloy coating adopts aforementioned plating solution to carry out obtained by electroless plating.
Preferably: the thickness of coating of described ni-p alloy coating is 0.5 ~ 5 μm, and wherein the content of phosphorus is between 3 ~ 12wt%.
To sum up, adopt plating solution provided by the invention to carry out Ni-P Chemical Plating Layer to flexible circuit board, the tiny densification of obtained ni-p alloy coating, surfacing, have good resistance to bending performance, electric conductivity is also well optimized simultaneously.
Embodiment
Below by specific embodiment and comparative example, the invention will be further described.
This part introduces the process adopting plating solution provided by the invention flexible circuit board to be carried out to Ni-P Chemical Plating Layer in detail.
According to embodiments of the invention, the plating solution of chemical plating nickel-phosphorus alloy comprises following component: hypophosphite, 2 ~ 50g/L; Nickel salt, 1 ~ 30g/L; Complexing agent, 1 ~ 100g/L; Can the additive of release formaldehyde, 0.001 ~ 1g/L.
In various embodiments, the additive of release formaldehyde can be selected from Sodium hydroxymethyl glycinate, Imidurea, diazonium Imidurea, 1,3-dihydroxymethyl-5, more than one in 5-T10,2-bromo-2-nitro-1,3-propylene glycol and chlorination 3-chlorallyl vulkacit H.Hypophosphite can be selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite more than one.Optional more than one in single nickel salt, nickel acetate, nickelous nitrate of nickel salt.Complexing agent can be selected from least containing more than one in the organic acid of a carboxyl and sodium salt thereof, sylvite, ammonium salt.Organic acid at least containing a carboxyl can be selected from acetic acid, propanedioic acid, succinic acid, citric acid, oxyacetic acid, lactic acid, tartrate, oxysuccinic acid, 2,3-dihydroxysuccinic acids, glycine, 2-amido propionic acid, halfcystine and ethylenediamine tetraacetic acid (EDTA).In various embodiments, the content of hypophosphite is such as 2g/L, 3g/L, 10g/L, 15g/L, 20g/L, 25g/L, 30g/L, 35g/L, 40g/L, 50g/L etc., the content of nickel salt is such as 1g/L, 2g/L, 3g/L, 5g/L, 10g/L, 15g/L, 20g/L, 25g/L, 30g/L etc., the content of complexing agent is such as 1g/L, 3g/L, 10g/L, 15g/L, 30g/L, 50g/L, 80g/L, 95g/L, 100g/L etc., can the content of additive of release formaldehyde be such as 0.001g/L, 0.002g/L, 0.005g/L, 0.01g/L, 0.03g/L, 0.05g/L, 0.08g/L, 0.15g/L, 0.3g/L, 0.4g/L, 0.6g/L, 0.8g/L, 1g/L etc.
Be further described below by way of exemplary embodiment.
Embodiment 1
There is provided substrate: provide thickness to be the flexible base board of 12 ~ 125 μm, be coated with copper foil circuit pattern at least one side of substrate, the material of substrate can be the polymkeric substance such as polyimide, polyester, tetrafluoroethylene.Described copper wire pattern part region need adopt the method for chemical plating nickel-phosphorus alloy to form screen layer on its surface, be convenient to implement the follow-up technical process such as leaching gold, welding.
Prepare plating solution: be dissolved in the water successively by feed composition according to following formula ratio, form stand-by plating solution:
Wherein: lactic acid and tartrate are as complexing agent, and thiocarbamide is as bath stability agent, and sodium lauryl sulphate is as tensio-active agent, and Sodium hydroxymethyl glycinate, as can the additive of slow releasing formaldehyde, regulates plating solution pH value to 4.6 with ammoniacal liquor.
Substrate pre-treatment: aforesaid base plate is immersed in acidic cleaner and clean, then immerse in sulphuric acid soln and carry out microetch activation, the substrate after activation immerses acid containing in the solution of palladium, to displace the crystal seed of the palladium with catalytic at copper wire surface.
Plating: will immerse in above-mentioned plating solution through above-mentioned pretreated substrate, in plating process, the temperature range of plating solution is 45 ~ 90 DEG C, and the time is 45min.With the palladium of substrate surface for catalytic core, potassium hypophosphite is oxidized, nickel ion is reduced to nickel at substrate deposition, separates out with the codeposition of phosphorus and hydrogen simultaneously.Newly-generated nickel also can catalyzed reaction proceed, the certain thickness nickel-phosphorus alloy of final generation.This process is also " autocatalysis " process, and whole reaction is without the need to impressed current.In reaction process, in plating solution, hydrogen ion concentration constantly increases, pH value can reduce gradually, the speed of pH value reduction is slowed down by adding the PH such as acetic acid, boric acid buffer reagent in the plating solution, the pH value that the materials such as sodium hydroxide, potassium hydroxide, ammoniacal liquor, carbonic acid regulate plating solution is added in necessary situation, keep the pH value of plating solution 3 ~ 6, preferably 4 ~ 4.5.The concentration range of buffer reagent is 1 ~ 25g/L, is preferably 3 ~ 18g/L.
In the process of nickel deposited phosphorus alloy, stir plating solution gently by inflating the method such as circulation stirring, mechanical stirring.Along with alloy constantly generates in reaction process, used up nickel salt, hypophosphite need to supplement in time.
Adopt above-mentioned plating solution, through the method for above-mentioned chemical plating nickel-phosphorus alloy, forming thickness on the surface of substrate is 3 μm, and phosphorus content is the ni-p alloy coating of 10wt%.
Embodiment 2
The difference of the present embodiment and embodiment 1 is the plating solution providing different ingredients, as follows:
Wherein: Potassium Iodate is as bath stability agent, and sodium lauryl sulphate is as tensio-active agent, and Sodium hydroxymethyl glycinate is as can the additive of slow releasing formaldehyde, and citric acid and glycine, as complexing agent, adopt ammoniacal liquor to regulate pH value to 5.0.In the present embodiment, forming thickness on the surface of substrate is 3 μm, and wherein the content of phosphorus is 11wt%.
Need to illustrate, above-mentioned single nickel salt also can adopt nickel acetate or nickelous nitrate to substitute; Potassium hypophosphite can adopt sodium hypophosphite or ammonium hypophosphite to substitute; Bath stability agent is not limited to the material mentioned in aforementioned two embodiments, containing the inorganic salt of zine ion, lead ion, tin ion, cadmium ion or bismuth ion, or adopts Sulfothiorine, iodate, molybdate etc.; Complexing agent can adopt the organic acid at least containing a carboxyl and corresponding sodium salt, sylvite, ammonium salt, wherein, organic acid at least containing a carboxyl comprises acetic acid, propanedioic acid, succinic acid, citric acid, oxyacetic acid, lactic acid, tartrate, oxysuccinic acid, 2,3-dihydroxysuccinic acids, glycine, 2-amido propionic acid, halfcystine and ethylenediamine tetraacetic acid (EDTA); Can the additive of release formaldehyde except the aforementioned Sodium hydroxymethyl glycinate mentioned, Sodium hydroxymethyl glycinate, Imidurea, diazonium Imidurea, 1 can also be adopted, 3-dihydroxymethyl-5,5-T10,2-bromo-2-nitro-1,3-propylene glycol or chlorination 3-chlorallyl vulkacit H.
Comparative example
Sodium lauryl sulphate 1g/L; Ammoniacal liquor is adopted to regulate pH value to 4.6.In this comparative example, the nickel-phosphorus alloy layer thickness of preparation is 3 μm, and wherein the content of phosphorus is 10wt%.
In resistance to bending performance test, the ni-p alloy coating of embodiment 1 and embodiment 2 bends all does not have for 40 times crackle to produce, and the ni-p alloy coating in comparative example just occurs obvious crackle the 2nd time in bending.
In sum, the method for chemical plating nickel-phosphorus alloy provided by the invention and plating solution, can form the good ni-p alloy coating of resistance to bending performance at substrate surface, is especially applicable to FPC and COF (covering brilliant film) surperficial Copper Foil process.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For those skilled in the art, without departing from the inventive concept of the premise, some equivalent to substitute or obvious modification can also be made, and performance or purposes identical, all should be considered as belonging to protection scope of the present invention.
Claims (16)
1. a plating solution for chemical plating nickel-phosphorus alloy, at flexible circuit board electroless nickel-phosphorus alloy plating layer on surface, is characterized in that, comprises following component:
Hypophosphite, 2 ~ 50g/L;
Nickel salt, 1 ~ 30g/L;
Complexing agent, 1 ~ 100g/L;
Can the additive of release formaldehyde, 0.001 ~ 1g/L.
2. plating solution as claimed in claim 1, it is characterized in that: also comprise the sodium lauryl sulphate as tensio-active agent, and concentration range is 1 ~ 3g/L.
3. plating solution as claimed in claim 1, is characterized in that: also comprise the bath stability agent that concentration range is 0.05 ~ 5mg/L, for preventing described hypophosphite Auto-decomposition.
4. plating solution as claimed in claim 3, is characterized in that: described bath stability agent is selected from the inorganic salt containing zine ion, lead ion, tin ion, cadmium ion or bismuth ion, thiocarbamide, Sulfothiorine, iodate, and one or more in molybdate, and concentration range is 0.1 ~ 2mg/L.
5. plating solution as claimed in claim 1, it is characterized in that: describedly the additive of release formaldehyde can be selected from Sodium hydroxymethyl glycinate, Imidurea, diazonium Imidurea, 1,3-dihydroxymethyl-5, one or more in 5-T10,2-bromo-2-nitro-1,3-propylene glycol and chlorination 3-chlorallyl vulkacit H.
6. plating solution as claimed in claim 1, it is characterized in that: described hypophosphite is selected from the one in sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite, and concentration range is 10 ~ 40g/L.
7. plating solution as claimed in claim 1, it is characterized in that: described nickel salt is selected from the one in single nickel salt, nickel acetate, nickelous nitrate, and concentration range is 5 ~ 15g/L.
8. plating solution as claimed in claim 1, is characterized in that: described complexing agent be selected from organic acid at least containing a carboxyl and sodium salt thereof, sylvite, ammonium salt one or more, and concentration range is 5 ~ 50g/L.
9. plating solution as claimed in claim 8, it is characterized in that: the described organic acid at least containing a carboxyl comprises acetic acid, propanedioic acid, succinic acid, citric acid, oxyacetic acid, lactic acid, tartrate, oxysuccinic acid, 2,3-dihydroxysuccinic acids, glycine, 2-amido propionic acid, halfcystine and ethylenediamine tetraacetic acid (EDTA).
10. a method for chemical plating nickel-phosphorus alloy, in order at flexible circuit board electroless nickel-phosphorus alloy plating layer on surface, is characterized in that, comprises and flexible circuit board is immersed the step of carrying out electroless plating in plating solution as described in any one of claim 1 to 11.
11. methods as claimed in claim 10, is characterized in that, comprise the following steps:
S1, pickling and activation: before plating, described flexible circuit board is immersed in acidic cleaner and clean, then immerse in sulphuric acid soln and carry out microetch activation;
S2, displacement: the described flexible circuit board after activation is immersed acid containing in the solution of palladium, to displace the crystal seed of the palladium with catalytic at copper wire surface;
S3, plating: in the plating solution described in the described flexible circuit board after step S2 process is immersed.
12. methods as claimed in claim 10, it is characterized in that: described step S3 also comprises pH value and regulates, be specially: in described plating solution, add pH value buffer reagent in reaction process, to ensure that the pH value of described plating solution maintains 3 ~ 6, described buffer concentrations range is 1 ~ 25g/L.
13. methods as claimed in claim 12, it is characterized in that: described pH value buffer reagent is acetic acid, boric acid, sodium hydroxide, potassium hydroxide, ammoniacal liquor or carbonic acid, and concentration range is 3 ~ 18g/L, to keep the pH value of described plating solution for 4 ~ 4.5 in reaction process.
14. methods as claimed in claim 10, it is characterized in that: in described step S3, described bath temperature is 45 ~ 90 DEG C, and described flexible circuit board to immerse in described plating solution 1 ~ 60 minute.
15. 1 kinds of ni-p alloy coatings, are plated on the surface of flexible circuit board, it is characterized in that: adopt the plating solution as described in any one of claim 1 to 9 to carry out obtained by electroless plating.
16. ni-p alloy coatings as claimed in claim 15, is characterized in that: thickness of coating is 0.5 ~ 5 μm, and wherein the content of phosphorus is between 3 ~ 12wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410317528.1A CN104561951A (en) | 2014-07-04 | 2014-07-04 | Method and plating solution for chemical plating of nickel phosphorus alloy, and nickel phosphorus alloy layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410317528.1A CN104561951A (en) | 2014-07-04 | 2014-07-04 | Method and plating solution for chemical plating of nickel phosphorus alloy, and nickel phosphorus alloy layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104561951A true CN104561951A (en) | 2015-04-29 |
Family
ID=53079005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410317528.1A Pending CN104561951A (en) | 2014-07-04 | 2014-07-04 | Method and plating solution for chemical plating of nickel phosphorus alloy, and nickel phosphorus alloy layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104561951A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105018904A (en) * | 2015-07-31 | 2015-11-04 | 珠海斯美特电子材料有限公司 | Chemical nickel plating solution for flexible printed circuit board and plating construction method thereof |
| CN108265512A (en) * | 2017-01-02 | 2018-07-10 | 罗奕兵 | A kind of nickel-phosphor non-crystaline amorphous metal composite fibre and preparation method thereof |
| CN108265243A (en) * | 2017-01-02 | 2018-07-10 | 罗奕兵 | A kind of iron-nickel-phosphor non-crystaline amorphous metal composite fibre and preparation method thereof |
| CN109137489A (en) * | 2017-06-28 | 2019-01-04 | 罗奕兵 | A kind of Fe-P/ is polymer composite fibrous and preparation method |
| CN109136891A (en) * | 2017-06-18 | 2019-01-04 | 罗奕兵 | A kind of nickel-phosphor amorphous alloy composite fibre and preparation method |
| CN109136890A (en) * | 2017-06-28 | 2019-01-04 | 罗奕兵 | A kind of Fe-P amorphous alloy catalytic reactor and production method |
| CN109136888A (en) * | 2017-06-28 | 2019-01-04 | 罗奕兵 | A kind of Fe-Ni-P amorphous alloy catalytic reactor and production method |
| CN109576686A (en) * | 2019-01-11 | 2019-04-05 | 江门市德商科佐科技实业有限公司 | A kind of additive enhancing chemical nickel-plating solution stability |
| CN110983309A (en) * | 2019-12-26 | 2020-04-10 | 广东东硕科技有限公司 | Application of 2-thiohydantoin compound or salt thereof |
| CN111763932A (en) * | 2020-06-01 | 2020-10-13 | 东莞市斯坦得电子材料有限公司 | Nickel plating process for flexible printed circuit board |
| CN111962052A (en) * | 2020-08-07 | 2020-11-20 | 浙江集工阀门有限公司 | Composite plating process for nickel-based alloy |
| CN114774897A (en) * | 2022-06-21 | 2022-07-22 | 西安欧中材料科技有限公司 | Preparation method of high-phosphorus boron GH4169 powder for SLM |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301881A (en) * | 1999-12-29 | 2001-07-04 | 上海雅驰科技发展有限公司 | Chemical nickel-plating solution and its preparation and using method |
| CN1896308A (en) * | 2005-07-11 | 2007-01-17 | 佛山市顺德区汉达精密电子科技有限公司 | Chemical nickeling liquid and its process |
| CN101314848A (en) * | 2008-07-16 | 2008-12-03 | 中山大学 | Non-ammonia type plating solution for chemical nickel plating |
| CN101760731A (en) * | 2008-12-23 | 2010-06-30 | 三星电机株式会社 | Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof |
| CN102268658A (en) * | 2011-07-22 | 2011-12-07 | 深圳市精诚达电路有限公司 | Chemical nickel-plating solution and chemical nickel-plating process |
| WO2013120660A1 (en) * | 2012-02-16 | 2013-08-22 | Atotech Deutschland Gmbh | Method for electroless nickel-phosphorous alloy deposition onto flexible substrates |
| CN103668134A (en) * | 2013-09-18 | 2014-03-26 | 沈阳工业大学 | Diacid complexing agent method for chemically plating nickel on carbon fiber surface |
-
2014
- 2014-07-04 CN CN201410317528.1A patent/CN104561951A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301881A (en) * | 1999-12-29 | 2001-07-04 | 上海雅驰科技发展有限公司 | Chemical nickel-plating solution and its preparation and using method |
| CN1896308A (en) * | 2005-07-11 | 2007-01-17 | 佛山市顺德区汉达精密电子科技有限公司 | Chemical nickeling liquid and its process |
| CN101314848A (en) * | 2008-07-16 | 2008-12-03 | 中山大学 | Non-ammonia type plating solution for chemical nickel plating |
| CN101760731A (en) * | 2008-12-23 | 2010-06-30 | 三星电机株式会社 | Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof |
| CN102268658A (en) * | 2011-07-22 | 2011-12-07 | 深圳市精诚达电路有限公司 | Chemical nickel-plating solution and chemical nickel-plating process |
| WO2013120660A1 (en) * | 2012-02-16 | 2013-08-22 | Atotech Deutschland Gmbh | Method for electroless nickel-phosphorous alloy deposition onto flexible substrates |
| CN103668134A (en) * | 2013-09-18 | 2014-03-26 | 沈阳工业大学 | Diacid complexing agent method for chemically plating nickel on carbon fiber surface |
Non-Patent Citations (1)
| Title |
|---|
| 杨丁: "《表面处理化学品技术手册》", 31 January 2010 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105018904A (en) * | 2015-07-31 | 2015-11-04 | 珠海斯美特电子材料有限公司 | Chemical nickel plating solution for flexible printed circuit board and plating construction method thereof |
| CN108265512A (en) * | 2017-01-02 | 2018-07-10 | 罗奕兵 | A kind of nickel-phosphor non-crystaline amorphous metal composite fibre and preparation method thereof |
| CN108265243A (en) * | 2017-01-02 | 2018-07-10 | 罗奕兵 | A kind of iron-nickel-phosphor non-crystaline amorphous metal composite fibre and preparation method thereof |
| CN109136891A (en) * | 2017-06-18 | 2019-01-04 | 罗奕兵 | A kind of nickel-phosphor amorphous alloy composite fibre and preparation method |
| CN109136888A (en) * | 2017-06-28 | 2019-01-04 | 罗奕兵 | A kind of Fe-Ni-P amorphous alloy catalytic reactor and production method |
| CN109136890A (en) * | 2017-06-28 | 2019-01-04 | 罗奕兵 | A kind of Fe-P amorphous alloy catalytic reactor and production method |
| CN109137489A (en) * | 2017-06-28 | 2019-01-04 | 罗奕兵 | A kind of Fe-P/ is polymer composite fibrous and preparation method |
| CN109576686A (en) * | 2019-01-11 | 2019-04-05 | 江门市德商科佐科技实业有限公司 | A kind of additive enhancing chemical nickel-plating solution stability |
| CN110983309A (en) * | 2019-12-26 | 2020-04-10 | 广东东硕科技有限公司 | Application of 2-thiohydantoin compound or salt thereof |
| CN110983309B (en) * | 2019-12-26 | 2023-01-03 | 广东东硕科技有限公司 | Application of 2-thiohydantoin compound or salt thereof |
| CN111763932A (en) * | 2020-06-01 | 2020-10-13 | 东莞市斯坦得电子材料有限公司 | Nickel plating process for flexible printed circuit board |
| CN111962052A (en) * | 2020-08-07 | 2020-11-20 | 浙江集工阀门有限公司 | Composite plating process for nickel-based alloy |
| CN114774897A (en) * | 2022-06-21 | 2022-07-22 | 西安欧中材料科技有限公司 | Preparation method of high-phosphorus boron GH4169 powder for SLM |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104561951A (en) | Method and plating solution for chemical plating of nickel phosphorus alloy, and nickel phosphorus alloy layer | |
| TWI260351B (en) | Electroless gold plating solution | |
| EP2809825B1 (en) | Electroless nickel plating bath | |
| CN101705482A (en) | Alkyl sulfonic acid chemical tinning solution and chemical tinning solution based tinning process | |
| CN106191825B (en) | Based on SO42-Replacement-reduction electroless palladium plating solution of system | |
| CN101403112A (en) | Chemical tin plating liquor for copper and copper alloy | |
| JP2010261082A (en) | Electroless palladium plating solution | |
| CN102912329A (en) | Chemical nickel and palladium plating process used for circuit boards | |
| CN109207971B (en) | Chemical rapid reduction gold plating solution and application thereof | |
| CN106521464B (en) | A kind of reduction chemical gold plating liquid and NiPdAu gold plating method | |
| CN108342717B (en) | Low-temperature chemical nickel plating solution, nickel plating process, nickel plating layer and flexible printed circuit board | |
| WO2014042829A1 (en) | Direct electroless palladium plating on copper | |
| WO2023050980A1 (en) | Plating solution for electroplating gold on nickel plating, method for electroplating gold on nickel plating, and gold-plated item | |
| CN102212805A (en) | Cyanogen-free gold leaching liquid and cyanogen-free gold leaching process | |
| CN113005437B (en) | Chemical gold-precipitating liquid for printed circuit board | |
| CN106987829B (en) | Apply the formula for chemical plating nickel in FPC chemical nickel plating porpezite coating | |
| JP2017525851A (en) | Copper circuit, copper alloy circuit, and method for reducing light reflectivity of touch screen devices | |
| KR102311483B1 (en) | Electroless nickel plating bath | |
| CN105018908A (en) | Chemical ruthenium plating solution for circuit board surface treatment and circuit board surface treatment method | |
| KR102474143B1 (en) | Method for forming metal film on polyimide resin | |
| CN116083890A (en) | Substrate surface treatment method and application thereof | |
| CN105051254A (en) | Method for activating a copper surface for electroless plating | |
| US20120009350A1 (en) | Electroless autocatalytic tin plating solution and electroless autocatalytic tin plating method using the same | |
| JP5214719B2 (en) | Plating solution for forming tin alloy and method for forming tin alloy film using the same | |
| CN112609172B (en) | Chemical palladium plating solution for wafer packaging field and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150429 |
|
| RJ01 | Rejection of invention patent application after publication |