CN109207971B - Chemical rapid reduction gold plating solution and application thereof - Google Patents
Chemical rapid reduction gold plating solution and application thereof Download PDFInfo
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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Abstract
The invention belongs to the technical field of chemical gold plating, and particularly relates to a chemical rapid reduction gold plating solution and application thereof. Comprises the following components in concentration: 0.5-1.5 g/L of water-soluble gold compound (calculated by Au), 5-20 g/L of sodium hypophosphite, 1-5g/L of hydroxylamine sulfate, 25-55 g/L of triammonium citrate, 5-15 g/L of disodium ethylene diamine tetraacetate, 0.1-3.0 g/L of amino acid, 0.001-0.02 g/L of sulfhydryl polyethylene glycol-R, 0.001-0.02 g/L of alkyl pyridine bromide, 0.001-0.005 g/L of lignosulfonate, 0.01-0.1 g/L of dimethylamine borane and 0.01-0.3 g/L of germanium tartrate. The gold plating solution has excellent stability and high deposition rate, and the obtained gold plating layer has a smooth, uniform, bright and compact surface; and has better corrosion resistance and tinning reflux and gold plating linear performance.
Description
Technical Field
The invention belongs to the technical field of chemical gold plating, relates to the technical field of chemical gold plating by applying surface treatment of a printed circuit board, and particularly relates to a chemical rapid reduction gold plating solution and application thereof.
Background
Printed Circuit Boards (PCBs) are the main components of electronic devices, and can be said to be the carrier of the information era. The use of copper substrates in PCBs is currently the best choice, with good conductivity and relatively low cost, but has corrosion problems, and copper oxides have low solderability and unstable solder joint reliability. Gold has a bright color, and has excellent conductivity, oxidation resistance and ductility, and is very suitable for surface coating (plating).
Electroless gold plating has been developed very rapidly, and since 1950, the first patent for electroless gold plating was issued in the united states and put into production after 10 years, it has become a mature research topic and production project nowadays. Gold plating was first carried out directly on copper substrates, and then barrier layers were introduced into the copper and gold, in the course of which the function of the gold layer was also changed. The development of high density (the welding area is smaller and smaller), high frequency or high speed digitization of the PCB needs a more complete coating; meanwhile, the production requirement of the PCB is continuously improved, the production time is shortened, and the competitiveness is improved, so that how to improve the plating speed is also a development trend of maintaining a plating layer with better properties.
Electroless gold plating is a chemical method, in which gold ions in a gold plating solution are deposited on the surface of a plating layer to obtain a high-quality plating layer, and the electroless gold plating can be classified into displacement gold plating and reduction gold plating according to a chemical reaction mechanism. Displacement gold plating displaces gold ions in a gold plating solution by using a standard potential difference between metal and gold in a plating layer, thereby forming a plating layer. However, the displacement reaction slows down as the gold-plating layer gradually forms, and the reaction terminates after the gold layer is completely covered. A thicker gold-plated layer cannot be formed and the occurrence of a displacement reaction is strongly linked to the type of metal being plated, on some more reactive metal substrates, such as copper (Cu)2+Cu: 0.314V), nickel (Ni)2+Ni: -0.257V) or the like with gold (Au)+Au: 1.692V) preferably undergoes a metathesis reaction, such as palladium (Pd)2+Pd: 0.915V) is hardly generated or the quality of the obtained coating is poor. Meanwhile, in the replacement process, the plating layer inevitably has loss, and more active metal ions in the plating solution influence the stability of the gold plating solution and shorten the service life of the gold plating solution.
The gold plating by reduction is that gold ions in gold plating solution are reduced on the surface of a plating layer by a reducing agent to form a gold plating layer, and can also be divided into matrix catalytic reduction and autocatalytic reduction according to the catalytic oxidation type of the reducing agent. The matrix catalysis is that the reducing agent is oxidized under the catalysis of matrix metal to provide electrons for gold ion reduction, and when the matrix material is covered, the catalytic oxidation of the reducing agent is weakened, and the later growth of the plating layer is slow; autocatalysis is to reduce metal ions by a reducing agent, and the reduced metal can catalyze the reduction reaction of the following metal, and the reaction can obtain a thicker coating. But standard electrode potential of gold (Au)+Au: 1.692V), if the deposition rate and the thickness of the gold plating layer are increased, the stability of the gold plating solution is affected in the presence of a reducing agent, and the bath is easy to turn over; and is forced to adopt for maintaining the stability of the gold plating solutionWith weak reducing agents, practical production can limit the deposition rate as well as the deposition thickness.
In addition, due to the existence of the galvanic effect, the surface part of the gold layer has higher electronegativity, so that the problem of the uniformity of the gold layer is caused, and the corrosion resistance of the PCB in the use process is influenced.
In the prior art, the formula of the chemical gold plating solution disclosed in the patent of invention with the publication number of CN106399983A has good stability, but the thickness of the gold plating layer can not meet the current market requirement; as the chemical gold plating solution disclosed in patent publication No. CN105745355A, the formula of the gold plating solution can obtain a flat and uniform plating layer, but the thickness of the gold plating layer cannot meet the current market demand; also, as described in the patent publication No. CN105543816A, the plating thickness obtained by the formulation of the electroless gold plating solution meets the market demand, but sulfite is used as the main complexing agent, the stability of the gold plating solution is questionable, and thiourea as a stabilizer is added to affect the solderability of the gold layer.
Disclosure of Invention
Aiming at the defects of the existing electroless gold plating technology, the invention aims to provide a composite reducing agent rapid reduction gold plating solution which has excellent stability and high gold plating speed and can form a thick gold plating layer with a smooth, bright and compact surface.
A chemical rapid reduction gold plating solution comprises the following components in concentration: 0.5-1.5 g/L of water-soluble gold compound (calculated by Au), 5-20 g/L of sodium hypophosphite, 1-5g/L of hydroxylamine sulfate, 25-55 g/L of triammonium citrate, 5-15 g/L of disodium ethylene diamine tetraacetate, 0.1-3.0 g/L of amino acid, 0.001-0.02 g/L of sulfhydryl polyethylene glycol-R, 0.001-0.02 g/L of alkyl pyridine bromide, 0.001-0.005 g/L of lignosulfonate, 0.01-0.1 g/L of dimethylamine borane and 0.01-0.3 g/L of germanium tartrate.
Preferably, the chemical rapid reduction gold plating solution comprises the following concentration components: 0.5-1.5 g/L of water-soluble gold compound (calculated by Au), 5-20 g/L of sodium hypophosphite, 1-5g/L of hydroxylamine sulfate, 30-50 g/L of triammonium citrate, 5-15 g/L of disodium ethylene diamine tetraacetate, 0.5-1.5 g/L of amino acid, 0.01-0.02 g/L of sulfhydryl polyethylene glycol-R, 0.01-0.02 g/L of alkyl pyridine bromide, 0.001-0.005 g/L of lignosulfonate, 0.01-0.1 g/L of dimethylamine borane and 0.02-0.2 g/L of germanium tartrate.
Preferably, the concentration of the sodium hypophosphite is 8-20 g/L, and the concentration of the hydroxylamine sulfate is 1.5-5 g/L. The preferable concentration of the sodium hypophosphite and the hydroxylamine sulfate can form a composite reduction effect, and the sodium hypophosphite is used as a base catalytic reducing agent, can reduce gold ions on the surfaces of nickel and palladium and simultaneously inhibits the corrosion precipitation of nickel; hydroxylamine sulfate is used as an autocatalytic reducing agent, and can continuously reduce gold ions after the gold layer is formed, so that the thickness of the gold layer is improved. Meanwhile, in the gold plating process, the synergistic effect of sodium hypophosphite and hydroxylamine sulfate greatly improves the gold plating rate and improves the corrosion resistance of the plating layer.
Preferably, the concentration of the dimethylamine borane is 0.01-0.06 g/L. The concentration of the dimethylamine borane is preferably added after the temperature of the gold tank is raised each time, the dimethylamine borane can be decomposed to generate H atoms at the temperature of over 70 ℃, and the H atoms are adsorbed on the substrate to be used as active sites, so that the initial rate of chemical gold plating is improved, and the stability of the gold plating solution is not influenced.
Preferably, the concentration of the triammonium citrate is 35-45 g/L, and the concentration of the disodium ethylene diamine tetraacetate is 5-8 g/L.
Wherein, in the chemical rapid reduction gold plating solution, the amino acids are at least one of amino acids and derivatives thereof; such as glycine, glutamic acid, and the like.
The preferable concentrations of the triammonium citrate, the disodium ethylene diamine tetraacetate and the amino acid are added as a coordination agent, so that the strong coordination effect can be carried out on the gold ions, and the stability of the gold plating solution is improved.
In the chemical rapid reduction gold plating solution, the sulfhydryl polyethylene glycol-R can be at least one of amino, carboxyl and methoxyl. The preferable sulfhydryl polyethylene glycol-R can coordinate with gold ions, and the sulfhydryl can combine with gold particles already deposited on the surface of the coating, thus facilitating the enrichment and ordered deposition of gold ions on the surface, accelerating the deposition rate and improving the surface property.
In the chemical rapid reduction gold plating solution, the alkyl pyridine bromide is selected from dodecyl pyridine bromide or hexadecyl pyridine bromide. Preferably, the concentration of the cetyl pyridine bromide is 0.004-0.01 g/L. The preferable concentration of the hexadecyl pyridine bromide as a cationic surfactant can improve the surface state between a deposition layer and a plating solution, is easier to adsorb on the surface of a substrate with negative potential, inhibits the galvanic effect and improves the uniformity of a gold layer.
Preferably, in the gold plating solution, the concentration of the wood sulfonate is 0.001-0.003 g/L, and the wood sulfonate is at least one selected from wood sodium sulfonate, wood potassium sulfonate, wood calcium sulfonate and the like. The wooden sulfonate is used as a dispersant, can disperse the gold ions in the plating solution, maintains the stability of the plating solution, disperses the gold ions on the deposition surface and achieves uniform and controllable plating thickness.
Preferably, the concentration of the germanium tartrate in the gold plating solution is 0.02-0.08 g/L. The tartaric acid germanium can improve proper germanium ions, perform underpotential deposition on a deposited gold layer and improve the gold plating deposition rate.
Wherein, in the chemical rapid reduction gold plating solution, the pH range of the gold plating solution is between 6.0 and 7.0; preferably 6.3 to 6.8.
The invention also provides the application of the chemical rapid reduction gold plating solution in the aspect of surface treatment of printed circuit boards.
Preferably, in the application, the plating temperature of the gold plating solution is 82-95 ℃ when the surface treatment is carried out on the printed circuit board; preferably 83 to 86 ℃.
The invention has the beneficial effects that:
in the composite reducing agent rapid reduction gold plating solution (short for gold plating solution), various performances of chemical gold plating can be greatly improved through the synergistic cooperation effect of the components with the concentrations, the stability of the gold plating solution is maintained, the gold plating deposition speed is increased, the surface property of a plating layer is improved, and the gold plating layer is brighter, smoother, more compact and more uniform in thickness. In addition, the thick gold plating layer obtained by adopting the chemical rapid reduction gold plating solution has better corrosion resistance, tin plating reflux and gold plating linear performance, and can further improve the reliability and the service life of the circuit board.
Drawings
FIG. 1 is a graph showing the effect of hydroxylamine sulfate, ascorbic acid and hydrazine hydrate on the results of the aging test of gold plating solutions.
FIG. 2 is a graph comparing the gold plating deposition rates of example 2 and comparative example 1.
Fig. 3 is a SEM image of the gold plating layer of the printed circuit board.
Detailed Description
The following examples are intended to further illustrate the present disclosure, but not to limit the scope of the claims, and the invention is further described in detail below with reference to specific examples.
Preparation example
The method comprises the following steps of obtaining a Ni-Pd-Au layer on a printed circuit substrate at one time:
alkali washing (50 ℃, 5min) → water washing (distilled water, normal temperature, 2min) → acid etching cleaning agent (50 ℃, 5min) → hot water washing (distilled water, 45 ℃, 2min) → water washing (distilled water, normal temperature, 2min) → micro etching (sodium persulfate 50g/L, sulfuric acid 40ml/L, normal temperature, 3min) → acid washing (sulfuric acid 100ml/L) → water washing (distilled water, normal temperature, 2min) → activation (activated palladium solution, normal temperature, 2min) → water washing (distilled water, normal temperature, 2min) → nickel plating (80-84 ℃, 20min) → water washing (distilled water, normal temperature, 2min) → palladium plating (50 ℃, 20min) → water washing (distilled water, normal temperature, 2min) → water washing (distilled water, normal temperature, 20min) → water, 86 ℃, 20min) → water washing (distilled water, normal temperature, 2min) → drying.
The gold plating solutions used in gold plating are shown in examples 1 to 6 and comparative examples 1 to 10.
Examples 1 to 6
The compositions of the gold plating solutions of examples 1 to 6 are shown in Table 1.
Table 1 examples 1-6 gold plating bath components
Comparative examples 1 to 10
The compositions of the gold plating solutions of comparative examples 1 to 10 are shown in Table 2.
TABLE 2 comparative examples 1-10 gold plating bath compositions
Example 7
Measuring the thickness of a plating layer by using an XRF thickness gauge; the brightness of the appearance of the gold layer can be obtained through a magnifying glass and visual inspection, the binding force can be measured by a tape method, the brightness and the binding force are divided into 5 grades from 1 to 5, and the more excellent the binding force and the brightness, the higher the grade number; the cycle of the plating solution was evaluated by cyclic plating (cyclic experiment of plating gold on a substrate, in the case of a plating solution having a gold concentration of 0.2g/L, plating in an amount of 0.2g/L of gold deposited on the substrate became 1 MTO); the uniformity of the coating was evaluated by scanning electron microscopy; the corrosion resistance was measured by electrochemical polarization and the porosity was calculated. The test results of examples 1 to 6 are shown in Table 3, and the test results of comparative examples 1 to 10 are shown in Table 4.
Table 3 examples 1-6 test results
TABLE 4 test results of comparative examples 1-10
The results of examples 1, 2, 3, 4, 5 and 6 above were excellent when the gold salt, the reducing agent, the complexing agent, the organic additive and the accelerator were used in a fixed ratio. In combination with comparative examples 1 and 2, it can be seen that the rate of gold plating is reduced when sodium hypophosphite is used alone; if the concentration of the sodium hypophosphite is increased, the stability of the gold plating solution is poor, so that the improvement of the deposition rate by simply increasing the concentration of a single reducing agent is unreliable, and the problem of high deposition rate and unstable plating solution is effectively solved by adding hydroxylamine sulfate and under the composite reduction action of the sodium hypophosphite; comparative examples 2 and 3 show that the concentrations of the gold salt, the reducing agent and the complexing agent must be kept in a certain proportion, when the concentration of the reducing agent is too high, the stability of the plating solution is reduced, the deposition rate is accelerated, the deposition is unreliable, the uniformity of the plating layer is reduced and loosened, the porosity is increased, and the corrosion resistance is reduced; comparative examples 4, 5 and 6 show that organic additives must be used in combination and kept in a certain ratio with gold salt, when no mercaptopolyethyleneglycol methoxy or cetylpyridinium bromide is used, the uniformity of the coating is reduced, the porosity is increased, and the corrosion resistance is reduced, and when the concentration of one organic additive is too large or too small, the uniformity of the coating is reduced, the porosity is increased, and the corrosion resistance is reduced; comparative example 7 it can be seen that the rate of gold plating is slightly reduced when no accelerator is used. In comparative examples 8, 9 and 10, when the components in the gold plating solution exceeded those described in the claims, the gold plating solution and the gold plating layer were both degraded in quality, and no excellent practical results were obtained.
EXAMPLE 8 gold plating solution stability test
The gold plating solution was heated continuously at 90 ℃ for 10 hours, and changes in the plating solution were observed. The gold plating solution basically comprises the following components: 1.0g/L of water-soluble gold compound (calculated by Au), 15g/L of sodium hypophosphite, 40g/L of triammonium citrate, 10g/L of disodium ethylene diamine tetraacetate, 1.0g/L of methionine, 0.008g/L of sulfhydryl polyethylene glycol hydroxyl, 0.007g/L of hexadecyl pyridine bromide, 0.002g/L of lignosulfonate, 0.06g/L of germanium tartrate and 0.03g/L of dimethylamine borane. 1-5g/L of hydroxylamine sulfate, hydrazine hydrate and ascorbic acid are added respectively for heat aging test. The test results are shown in fig. 1.
As can be seen from comparison of FIG. 1, the addition of ascorbic acid makes the plating solution of the above composition yellow and precipitate after the aging test; adding hydrazine hydrate to enable the gold plating solution with the composition to generate black precipitates after an aging experiment; the addition of hydroxylamine sulfate does not change the stability of the gold plating solution with the above composition.
Example 9 deposition Rate testing
The difference between example 2 and comparative example 1 is that hydroxylamine sulfate is not used, and fig. 2 is a graph comparing the deposition rates. As can be seen from the figure, under the composite reducing agent, after plating for 1min, the deposition rate of the composite reducing agent is obviously greater than that under the condition of singly using sodium hypophosphite, the addition of hydroxylamine sulfate obviously plays an accelerating role, and the plating solution has good stability.
In conclusion, the gold plating solution provided by the invention has good stability, uniform and bright surface and excellent bonding force under the concentration of the gold salt and the corresponding concentration of each component, and the gold layer thickness meets the market requirement and has excellent corrosion resistance.
Claims (8)
1. The chemical fast reducing gold plating solution is characterized by comprising the following components in concentration: 0.5-1.5 g/L of water-soluble gold compound (calculated by Au), 5-20 g/L of sodium hypophosphite, 1-5g/L of hydroxylamine sulfate, 25-55 g/L of triammonium citrate, 5-15 g/L of disodium ethylene diamine tetraacetate, 0.1-2.0 g/L of amino acid, 0.001-0.02 g/L of sulfhydryl polyethylene glycol-R, 0.001-0.02 g/L of alkyl pyridine bromide, 0.001-0.005 g/L of lignosulfonate, 0.01-0.1 g/L of dimethylamine borane and 0.01-0.3 g/L of germanium tartrate;
r in the sulfhydryl polyethylene glycol-R is at least one of amino, carboxyl and methoxyl;
the alkyl pyridine bromide is selected from dodecyl pyridine bromide or hexadecyl pyridine bromide.
2. The electroless fast-reducing gold plating solution according to claim 1, wherein the concentration of the sodium hypophosphite is 8-20 g/L, and the concentration of the hydroxylamine sulfate is 1.5-5 g/L.
3. The electroless fast-reducing gold plating solution according to claim 1, wherein the concentration of dimethylamine borane is 0.01 to 0.06 g/L.
4. The chemical rapid reduction gold plating solution according to claim 1, wherein the concentration of triammonium citrate is 35-45 g/L, and the concentration of disodium ethylenediaminetetraacetate is 5-8 g/L.
5. The electroless fast-reducing gold plating solution according to claim 1, wherein the amino acid is at least one of an amino acid and a derivative thereof.
6. The electroless fast-reducing gold plating solution according to claim 1, wherein the concentration of the wood sulfonate is 0.001-0.003 g/L, and the wood sulfonate is at least one selected from the group consisting of sodium wood sulfonate, potassium wood sulfonate and calcium wood sulfonate.
7. The electroless fast-reducing gold plating solution according to claim 1, wherein the pH of the gold plating solution is in the range of 6.0 to 7.0.
8. Use of the electroless fast-reducing gold plating solution according to any one of claims 1 to 7 for surface treatment of printed circuit boards.
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| CN113151814B (en) * | 2021-02-05 | 2022-02-01 | 深圳市联合蓝海黄金材料科技股份有限公司 | Composition for cyanide-free electroless gold plating solution and application thereof, and cyanide-free electroless gold plating solution and application thereof |
| CN113046736B (en) * | 2021-03-02 | 2021-09-28 | 深圳市创智成功科技有限公司 | Cyanide-free chemical gold-precipitating solution for display panel field and process thereof |
| CN114351129A (en) * | 2021-11-22 | 2022-04-15 | 赣州鑫冠科技股份有限公司 | Cyanide-free gold plating solution for loudspeaker frame |
| CN117987815B (en) * | 2024-01-31 | 2024-07-09 | 珠海斯美特电子材料有限公司 | High-stability reduction type electroless gold plating solution and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102191494A (en) * | 2011-04-28 | 2011-09-21 | 中国科学院宁波材料技术与工程研究所 | Treatment solution for reducing oxidation films on surface of copper and copper alloys and treatment method thereof |
| CN104109848A (en) * | 2013-04-22 | 2014-10-22 | 广东致卓精密金属科技有限公司 | Environmentally-friendly chemical gilding liquid |
| CN105349972A (en) * | 2015-11-25 | 2016-02-24 | 广东致卓精密金属科技有限公司 | Reduced-form composite complexing non-cyanide chemical gold plating liquid and method |
| CN105478752A (en) * | 2015-12-14 | 2016-04-13 | 东华大学 | Preparation method of micron polymer-based composite conductive gold balls |
| CN106521464A (en) * | 2016-12-02 | 2017-03-22 | 长沙理工大学 | Method for reduction of chemical gold plating solution and gold plating of nickel palladium gold |
| CN107190251A (en) * | 2017-06-19 | 2017-09-22 | 广东东硕科技有限公司 | A kind of gold plating liquid and preparation method thereof |
-
2018
- 2018-09-26 CN CN201811126948.6A patent/CN109207971B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102191494A (en) * | 2011-04-28 | 2011-09-21 | 中国科学院宁波材料技术与工程研究所 | Treatment solution for reducing oxidation films on surface of copper and copper alloys and treatment method thereof |
| CN104109848A (en) * | 2013-04-22 | 2014-10-22 | 广东致卓精密金属科技有限公司 | Environmentally-friendly chemical gilding liquid |
| CN105349972A (en) * | 2015-11-25 | 2016-02-24 | 广东致卓精密金属科技有限公司 | Reduced-form composite complexing non-cyanide chemical gold plating liquid and method |
| CN105478752A (en) * | 2015-12-14 | 2016-04-13 | 东华大学 | Preparation method of micron polymer-based composite conductive gold balls |
| CN106521464A (en) * | 2016-12-02 | 2017-03-22 | 长沙理工大学 | Method for reduction of chemical gold plating solution and gold plating of nickel palladium gold |
| CN107190251A (en) * | 2017-06-19 | 2017-09-22 | 广东东硕科技有限公司 | A kind of gold plating liquid and preparation method thereof |
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Effective date of registration: 20201130 Address after: 512400 Guangdong city of Shaoguan province Nanxiong City Abas Industrial Park Applicant after: NANXIONG YICHENG CHEMICAL Co.,Ltd. Address before: 410000, Chek Lap Road, Tianxin District, Hunan, Changsha, 45 Applicant before: CHANGSHA University OF SCIENCE AND TECHNOLOGY |
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