JPS5760437B2 - - Google Patents
Info
- Publication number
- JPS5760437B2 JPS5760437B2 JP4039180A JP4039180A JPS5760437B2 JP S5760437 B2 JPS5760437 B2 JP S5760437B2 JP 4039180 A JP4039180 A JP 4039180A JP 4039180 A JP4039180 A JP 4039180A JP S5760437 B2 JPS5760437 B2 JP S5760437B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4039180A JPS56136994A (en) | 1980-03-31 | 1980-03-31 | Gold-tin-copper alloy plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4039180A JPS56136994A (en) | 1980-03-31 | 1980-03-31 | Gold-tin-copper alloy plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56136994A JPS56136994A (en) | 1981-10-26 |
JPS5760437B2 true JPS5760437B2 (en) | 1982-12-20 |
Family
ID=12579351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4039180A Granted JPS56136994A (en) | 1980-03-31 | 1980-03-31 | Gold-tin-copper alloy plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56136994A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2235408A1 (en) | 1995-11-03 | 1997-05-15 | Enthone-Omi, Inc. | Electroplating processes compositions and deposits |
US6126807A (en) * | 1999-04-30 | 2000-10-03 | Lucent Technologies Inc. | Process for making sodium gold sulfite solution |
CA2365749A1 (en) | 2001-12-20 | 2003-06-20 | The Governors Of The University Of Alberta | An electrodeposition process and a layered composite material produced thereby |
CN102433576A (en) * | 2011-12-19 | 2012-05-02 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | Au-Sn alloy electroplating liquid |
CN105177341A (en) * | 2015-08-21 | 2015-12-23 | 无锡桥阳机械制造有限公司 | Au-Sn alloy electroplate liquid |
CN105063691A (en) * | 2015-08-21 | 2015-11-18 | 无锡桥阳机械制造有限公司 | Au-Sn alloy electroplating solution |
-
1980
- 1980-03-31 JP JP4039180A patent/JPS56136994A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56136994A (en) | 1981-10-26 |