GB1314745A - Electroless plating bath for depositing a nickel alloy layer - Google Patents
Electroless plating bath for depositing a nickel alloy layerInfo
- Publication number
- GB1314745A GB1314745A GB3865971A GB3865971A GB1314745A GB 1314745 A GB1314745 A GB 1314745A GB 3865971 A GB3865971 A GB 3865971A GB 3865971 A GB3865971 A GB 3865971A GB 1314745 A GB1314745 A GB 1314745A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroless plating
- depositing
- alloy layer
- plating bath
- moles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1314745 Electroless plating INTERNATIONAL BUSINESS MACHINES CORP 18 Aug 1971 [27 Nov 1970] 38659/71 Heading C7F A Ni-Sn or Ni-Mo alloy is electrolessly deposited on a Cu, Ni or Fe substrate activated with Pd, the bath containing 0À1 moles of Ni catrons, tin salt e.g. SnCl 4 providing 0À1 to 0À4 moles of Sn (OH) 6 anions or molybdenum salt providing 0À1 to 0À5 moles of MoO 4 . The salt may also contain glycine, hypophosphite, tartrate or citrate ions. The pH is about 13À5 and the temperature may be 20 to 40‹C.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9344470A | 1970-11-27 | 1970-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1314745A true GB1314745A (en) | 1973-04-26 |
Family
ID=22238993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3865971A Expired GB1314745A (en) | 1970-11-27 | 1971-08-18 | Electroless plating bath for depositing a nickel alloy layer |
Country Status (5)
Country | Link |
---|---|
US (1) | US3674516A (en) |
CA (1) | CA967705A (en) |
DE (1) | DE2148744A1 (en) |
FR (1) | FR2115164B1 (en) |
GB (1) | GB1314745A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4019910A (en) * | 1974-05-24 | 1977-04-26 | The Richardson Chemical Company | Electroless nickel polyalloy plating baths |
US4632857A (en) * | 1974-05-24 | 1986-12-30 | Richardson Chemical Company | Electrolessly plated product having a polymetallic catalytic film underlayer |
US5190796A (en) * | 1991-06-27 | 1993-03-02 | General Electric Company | Method of applying metal coatings on diamond and articles made therefrom |
RU2374359C2 (en) | 2003-05-09 | 2009-11-27 | Басф Акциенгезельшафт | Compositions for de-energised deposition of triple materials for semiconsuctor industry |
US8585811B2 (en) * | 2010-09-03 | 2013-11-19 | Omg Electronic Chemicals, Llc | Electroless nickel alloy plating bath and process for depositing thereof |
CN102011107B (en) * | 2010-12-24 | 2012-07-11 | 杭州东方表面技术有限公司 | Chemical nickel-phosphorus alloy plating solution capable of obtaining high-solderability plating layer |
-
1970
- 1970-11-27 US US93444A patent/US3674516A/en not_active Expired - Lifetime
-
1971
- 1971-08-18 GB GB3865971A patent/GB1314745A/en not_active Expired
- 1971-09-30 DE DE19712148744 patent/DE2148744A1/en active Pending
- 1971-10-12 FR FR7137574A patent/FR2115164B1/fr not_active Expired
- 1971-11-12 CA CA127,427A patent/CA967705A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2115164A1 (en) | 1972-07-07 |
DE2148744A1 (en) | 1972-06-08 |
FR2115164B1 (en) | 1976-02-13 |
US3674516A (en) | 1972-07-04 |
CA967705A (en) | 1975-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |