ES399606A1 - Electroless nickel solution - Google Patents

Electroless nickel solution

Info

Publication number
ES399606A1
ES399606A1 ES399606A ES399606A ES399606A1 ES 399606 A1 ES399606 A1 ES 399606A1 ES 399606 A ES399606 A ES 399606A ES 399606 A ES399606 A ES 399606A ES 399606 A1 ES399606 A1 ES 399606A1
Authority
ES
Spain
Prior art keywords
electrolytic
base material
copper
deposit
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES399606A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of ES399606A1 publication Critical patent/ES399606A1/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Abstract

A method of applying a non-electrolytic metal plating coating to an article, the article comprising a base material or substrate and a metallic finish on said base material, said metallic finish including a deposit of electroless nickel-copper-phosphorous alloy with a minimum of 25% copper and a coherent and non-pulverulent structure, and said deposit exhibiting a smooth touch surface and a mirror-like surface appearance, said procedure being characterized by the operations of: preparing the base material for non-electrolytic deposition, catalyzing the same with a noble metal catalyst and depositing the metal in a non-electrolytic way by immersing the base material thus catalyzed in an aqueous solution of non-electrolytic coating that contains a source of nickel ions, hypophosphate as a reducing agent for these and an adjuster pH to provide the required solution pH and cob ions re in an amount capable of providing a nickel-copper-phosphorus alloy electrolytic deposit having a coherent, non-powdery structure and a mirror-like surface appearance. (Machine-translation by Google Translate, not legally binding)
ES399606A 1970-06-03 1972-02-09 Electroless nickel solution Expired ES399606A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4324270A 1970-06-03 1970-06-03

Publications (1)

Publication Number Publication Date
ES399606A1 true ES399606A1 (en) 1975-06-16

Family

ID=21926207

Family Applications (2)

Application Number Title Priority Date Filing Date
ES71390975A Expired ES390975A1 (en) 1970-06-03 1971-05-08 Electroless nickel solution
ES399606A Expired ES399606A1 (en) 1970-06-03 1972-02-09 Electroless nickel solution

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES71390975A Expired ES390975A1 (en) 1970-06-03 1971-05-08 Electroless nickel solution

Country Status (11)

Country Link
JP (1) JPS5317534B1 (en)
BE (1) BE767985A (en)
BR (1) BR7103261D0 (en)
CA (1) CA936305A (en)
DE (2) DE2166060A1 (en)
ES (2) ES390975A1 (en)
FR (1) FR2094006B1 (en)
GB (1) GB1322081A (en)
NL (1) NL7107368A (en)
SE (2) SE383643B (en)
ZA (1) ZA712751B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54160417U (en) * 1978-04-28 1979-11-09
FR2726205B1 (en) * 1994-10-28 1997-09-26 Motorola Inc METHOD FOR REDUCING THE START-UP TIME IN A AUTOCATALYTIC BATH
CN112207276B (en) * 2020-10-16 2023-02-03 西安工程大学 Preparation method of micron nickel-plated aluminum powder

Also Published As

Publication number Publication date
FR2094006A1 (en) 1972-02-04
SE383643B (en) 1976-03-22
ZA712751B (en) 1972-04-26
GB1322081A (en) 1973-07-04
DE2166060A1 (en) 1972-12-28
CA936305A (en) 1973-11-06
JPS5317534B1 (en) 1978-06-09
SE7410415L (en) 1974-08-15
NL7107368A (en) 1971-12-07
SE400094B (en) 1978-03-13
FR2094006B1 (en) 1975-02-21
BE767985A (en) 1971-12-02
DE2122455A1 (en) 1972-01-27
BR7103261D0 (en) 1973-05-17
DE2122455B2 (en) 1976-03-04
ES390975A1 (en) 1974-08-01
DE2166059A1 (en) 1972-12-21

Similar Documents

Publication Publication Date Title
US4269625A (en) Bath for electroless depositing tin on substrates
GB1343211A (en) Treatmetn of resin substrates for the reception of metal deposits
SE7903341L (en) PROCEDURE FOR SUBSTITUTES OF ELECTRO-FREE COPPER PREPARATION ON A SURFACE AND COMPOSITION FOR UTILIZATION IN THE EXERCISE OF THE PROCEDURE
ES392729A1 (en) Solid precious metal sensitizing compositions
GB1149703A (en) Method of forming a metal layer on a substrate
GB1176124A (en) A Method of Metallizing a Polymer Surface.
ES382866A1 (en) Electroless plating solution and process
GB1382101A (en) Electroless plating
GB1006238A (en) Electrical components
GB1348793A (en) Method of electroless deposition of metals with improved sensitizer
US3841881A (en) Method for electroless deposition of metal using improved colloidal catalyzing solution
GB1194625A (en) Boron Containing Composite Metallic Films and Plating Baths for their Electroless Deposition
US3697296A (en) Electroless gold plating bath and process
ES399606A1 (en) Electroless nickel solution
GB1461036A (en) Process and liquid for the catalytic sensitization of non- metallic surfaces for subsequent electroless metallization
GB1242995A (en) Electroless nickel plating on a nonconductive substrate
US3274022A (en) Palladium deposition
CN103233212A (en) Method for plating nickel-copper-phosphorus ternary alloy on wood surface
ES356040A1 (en) Electroless tin plating on electroless nickel
US3547692A (en) Metal coating carbon substrates
GB1346273A (en) Metal plating of plastics materials
GB1198193A (en) Prevention of Skip Plating in an Electroless Nickel Bath
GB1314745A (en) Electroless plating bath for depositing a nickel alloy layer
FR2086188A1 (en) Electroless silver plating soln - giving high density coatings
ES452927A1 (en) Electroless nickel plating