GB1247007A - Improvements in or relating to electroless plating processes - Google Patents

Improvements in or relating to electroless plating processes

Info

Publication number
GB1247007A
GB1247007A GB1629668A GB1629668A GB1247007A GB 1247007 A GB1247007 A GB 1247007A GB 1629668 A GB1629668 A GB 1629668A GB 1629668 A GB1629668 A GB 1629668A GB 1247007 A GB1247007 A GB 1247007A
Authority
GB
United Kingdom
Prior art keywords
electroless plating
substrate
ions
bombarding
relating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1629668A
Inventor
Leslie Edward Collins
Francis Raymond Pontet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UK Atomic Energy Authority
Original Assignee
UK Atomic Energy Authority
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UK Atomic Energy Authority filed Critical UK Atomic Energy Authority
Priority to GB1629668A priority Critical patent/GB1247007A/en
Priority to DE19691916765 priority patent/DE1916765A1/en
Priority to FR6910331A priority patent/FR2005553A1/fr
Priority to NL6905275A priority patent/NL6905275A/xx
Publication of GB1247007A publication Critical patent/GB1247007A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48—Ion implantation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

1,247,007. Activation and electroless plating. UNITED KINGDOM ATOMIC ENERGY AUTHORITY March 24, 1969 [April 4, 1968], No. 16296/68. Heading C7F. A process for electroless plating of a substrate comprises bombarding the substrate with a dosage of ions sufficient to provide an activated but not a coated surface, and subsequently coating with an electroless plating solution. The substrate may be glass, Al 2 O 3 , Si with an oxidized surface, or Cu, and the bombarding ions, of energy 2, to 100 KeV may be of B, Sn, O, Ni, Pd, or H, or possibly of ions which are known to be catalytic in other deposition processes, e.g. Fe, Ni, Co, Al, Ag or Pd. After bombardment, the substrate may be etched to expose the layer of maximum implanted ion density, giving rise to better adhesion of the electroless coating which may be of Ag, from a Rochelle salt bath, or of Ni from a conventional hypophosphite bath which may contain Na citrate.
GB1629668A 1968-04-04 1968-04-04 Improvements in or relating to electroless plating processes Expired GB1247007A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB1629668A GB1247007A (en) 1968-04-04 1968-04-04 Improvements in or relating to electroless plating processes
DE19691916765 DE1916765A1 (en) 1968-04-04 1969-04-01 Non-electrical plating process
FR6910331A FR2005553A1 (en) 1968-04-04 1969-04-03
NL6905275A NL6905275A (en) 1968-04-04 1969-04-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1629668A GB1247007A (en) 1968-04-04 1968-04-04 Improvements in or relating to electroless plating processes

Publications (1)

Publication Number Publication Date
GB1247007A true GB1247007A (en) 1971-09-22

Family

ID=10074766

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1629668A Expired GB1247007A (en) 1968-04-04 1968-04-04 Improvements in or relating to electroless plating processes

Country Status (4)

Country Link
DE (1) DE1916765A1 (en)
FR (1) FR2005553A1 (en)
GB (1) GB1247007A (en)
NL (1) NL6905275A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3791861A (en) * 1971-04-16 1974-02-12 Bell Telephone Labor Inc Method for producing thin film circuits on high purity alumina substrates
DE2916006C2 (en) * 1979-04-20 1983-01-13 Schoeller & Co Elektronik Gmbh, 3552 Wetter Process for the production of firmly adhering metal layers on substrates, in particular made of plastics

Also Published As

Publication number Publication date
FR2005553A1 (en) 1969-12-12
DE1916765A1 (en) 1969-11-13
NL6905275A (en) 1969-10-07

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