AU2002216953A1 - Method for electroless nickel plating - Google Patents

Method for electroless nickel plating

Info

Publication number
AU2002216953A1
AU2002216953A1 AU2002216953A AU1695302A AU2002216953A1 AU 2002216953 A1 AU2002216953 A1 AU 2002216953A1 AU 2002216953 A AU2002216953 A AU 2002216953A AU 1695302 A AU1695302 A AU 1695302A AU 2002216953 A1 AU2002216953 A1 AU 2002216953A1
Authority
AU
Australia
Prior art keywords
substrates
nickel plating
electroless nickel
treated
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002216953A
Inventor
Mariola Brandes
Brigitte Dyrbusch
Herman Middeke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of AU2002216953A1 publication Critical patent/AU2002216953A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Abstract

A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.
AU2002216953A 2000-11-01 2001-10-04 Method for electroless nickel plating Abandoned AU2002216953A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10054544A DE10054544A1 (en) 2000-11-01 2000-11-01 Process for the chemical metallization of surfaces
DE10054544 2000-11-01
PCT/EP2001/011468 WO2002036853A1 (en) 2000-11-01 2001-10-04 Method for electroless nickel plating

Publications (1)

Publication Number Publication Date
AU2002216953A1 true AU2002216953A1 (en) 2002-05-15

Family

ID=7662047

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002216953A Abandoned AU2002216953A1 (en) 2000-11-01 2001-10-04 Method for electroless nickel plating

Country Status (11)

Country Link
US (1) US6902765B2 (en)
EP (1) EP1343921B1 (en)
JP (1) JP3929399B2 (en)
CN (1) CN1314835C (en)
AT (1) ATE291106T1 (en)
AU (1) AU2002216953A1 (en)
CA (1) CA2425575A1 (en)
DE (2) DE10054544A1 (en)
ES (1) ES2237615T3 (en)
TW (1) TWI253481B (en)
WO (1) WO2002036853A1 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4143385B2 (en) * 2002-03-05 2008-09-03 株式会社大和化成研究所 Pretreatment liquid for imparting catalyst for electroless plating, pretreatment method using the liquid, electroless plating film and / or plating coating produced using the method
JP3881614B2 (en) * 2002-05-20 2007-02-14 株式会社大和化成研究所 Circuit pattern forming method
US7166152B2 (en) * 2002-08-23 2007-01-23 Daiwa Fine Chemicals Co., Ltd. Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
US7407689B2 (en) 2003-06-26 2008-08-05 Atotech Deutschland Gmbh Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
US20050274445A1 (en) * 2004-06-01 2005-12-15 Paul Chang Method for manufacturing decoration of imitation metal
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
DE102005051632B4 (en) * 2005-10-28 2009-02-19 Enthone Inc., West Haven Process for pickling non-conductive substrate surfaces and for metallizing plastic surfaces
US7297373B2 (en) * 2005-11-18 2007-11-20 Noble Fiber Technologies, Llc Conductive composites
KR100717909B1 (en) * 2006-02-24 2007-05-14 삼성전기주식회사 Substrate comprising nickel layer and its manufacturing method
US20070235876A1 (en) * 2006-03-30 2007-10-11 Michael Goldstein Method of forming an atomic layer thin film out of the liquid phase
US8193087B2 (en) * 2006-05-18 2012-06-05 Taiwan Semiconductor Manufacturing Co., Ltd. Process for improving copper line cap formation
US20080003366A1 (en) * 2006-06-30 2008-01-03 Dubin Valery M Method of forming a conducting layer on a conducting and non-conducting substrate
US20080175986A1 (en) * 2007-01-24 2008-07-24 Kenneth Crouse Second surface metallization
KR101058635B1 (en) * 2008-12-23 2011-08-22 와이엠티 주식회사 Electroless Nickel Plating Solution Composition, Flexible Printed Circuit Board and Manufacturing Method Thereof
EP2270255A1 (en) * 2009-07-03 2011-01-05 Enthone, Inc. Beta-amino acid comprising electrolyte and method for the deposition of a metal layer
KR101635661B1 (en) 2009-07-03 2016-07-01 엔쏜 인코포레이티드 Beta-amino acid comprising electrolyte and method for the deposition of a metal layer
FR2958944B1 (en) 2010-04-19 2014-11-28 Pegastech METHOD FOR COATING A SURFACE OF A SUBSTRATE OF NON-METALLIC MATERIAL WITH A METAL LAYER
MY166049A (en) * 2010-09-03 2018-05-22 Omg Electronic Chemicals Llc Electroless nickel alloy plating bath and process for depositing thereof
US9327348B2 (en) 2010-11-22 2016-05-03 Junping Zhang Nanowire preparation methods, compositions, and articles
US20120126181A1 (en) * 2010-11-22 2012-05-24 Whitcomb David R Nanowire preparation methods, compositions, and articles
US8613888B2 (en) 2010-11-23 2013-12-24 Carestream Health, Inc. Nanowire preparation methods, compositions, and articles
DE102011000138A1 (en) 2011-01-14 2012-07-19 Lpkf Laser & Electronics Ag Method for the selective metallization of a substrate and a circuit carrier produced by this method
US20130084395A1 (en) * 2011-09-29 2013-04-04 Roshan V. Chapaneri Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media
EP2610365B1 (en) * 2011-12-31 2020-02-26 Rohm and Haas Electronic Materials LLC Electroless plating method
US20130209689A1 (en) * 2012-02-15 2013-08-15 Mark Wojtaszek Sulfonation of Plastic and Composite Materials
EP2657367B1 (en) 2012-04-24 2015-11-25 Enthone Inc. Pre-etching composition and etching process for plastic substrates
LT6070B (en) * 2012-12-07 2014-09-25 Atotech Deutschland Gmbh Preparation of plastic surface for chemical metallization process
DE102012112550A1 (en) 2012-12-18 2014-06-18 Lpkf Laser & Electronics Ag Method for metallizing a workpiece and a layer structure of a workpiece and a metal layer
WO2017016965A1 (en) 2015-07-30 2017-02-02 Basf Se Process for metallizing plastic surfaces
CN108138323B (en) 2015-07-30 2020-08-04 巴斯夫欧洲公司 Method for pretreating metallized plastic surfaces
US10772218B2 (en) * 2017-10-03 2020-09-08 The University Of Western Ontario React-on-demand (ROD) fabrication method for high performance printed electronics
CZ308348B6 (en) 2018-11-06 2020-06-10 Bochemie A.S. Process for continuously metallizing a textile material, the apparatus for carrying out the process, metallized textile material and its use
JP7360155B2 (en) 2019-11-18 2023-10-12 奥野製薬工業株式会社 Electroless nickel plating film and pretreatment method for forming the electroless nickel plating film

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE292869C (en)
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US4035227A (en) * 1973-09-21 1977-07-12 Oxy Metal Industries Corporation Method for treating plastic substrates prior to plating
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
IT1107840B (en) * 1978-07-25 1985-12-02 Alfachimici Spa CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4582729A (en) * 1983-06-30 1986-04-15 Learonal, Inc. Process for electro-magnetic interference shielding
DE3523957A1 (en) * 1985-07-04 1987-01-08 Licentia Gmbh METHOD OF METALIZING CERAMICS
JPS62205284A (en) * 1986-03-06 1987-09-09 Nippon Mining Co Ltd Catalytic solution for electroless plating
FI95816C (en) * 1989-05-04 1996-03-25 Ad Tech Holdings Ltd Antimicrobial article and method of making the same
DE69434619T2 (en) 1993-03-18 2006-08-17 Atotech Deutschland Gmbh Self-accelerating and self-refreshing process for dip coating without formaldehyde, as well as the corresponding composition
JP2737599B2 (en) * 1993-04-27 1998-04-08 上村工業株式会社 Electroless plating method on copper circuit pattern of printed wiring board
US5935706A (en) * 1996-05-30 1999-08-10 E. I. Dupont De Nemours & Comp Thermally stable metal coated polymeric monofilament or yarn
JP3826544B2 (en) 1998-02-27 2006-09-27 奥野製薬工業株式会社 Catalyst composition for electroless plating
JPH11335858A (en) * 1998-05-27 1999-12-07 Yuji Shikamata Formation of silver plating surface and solution used therefor

Also Published As

Publication number Publication date
CN1314835C (en) 2007-05-09
CN1473207A (en) 2004-02-04
DE60109486D1 (en) 2005-04-21
JP2004513229A (en) 2004-04-30
DE60109486T2 (en) 2006-04-06
DE10054544A1 (en) 2002-05-08
EP1343921A1 (en) 2003-09-17
US20040086646A1 (en) 2004-05-06
WO2002036853A1 (en) 2002-05-10
ATE291106T1 (en) 2005-04-15
EP1343921B1 (en) 2005-03-16
US6902765B2 (en) 2005-06-07
CA2425575A1 (en) 2002-05-10
JP3929399B2 (en) 2007-06-13
TWI253481B (en) 2006-04-21
ES2237615T3 (en) 2005-08-01

Similar Documents

Publication Publication Date Title
AU2002216953A1 (en) Method for electroless nickel plating
CA2866786C (en) Process for metallizing nonconductive plastic surfaces
US9551073B2 (en) Method for depositing a first metallic layer onto non-conductive polymers
US20120305406A1 (en) Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface
EP2825690B1 (en) Process for metallizing nonconductive plastic surfaces
CN111472030A (en) Manganese zinc ferrite chemical coarsening electroplating process
IL139422A0 (en) Method for metal coating of substrates
KR19980703108A (en) A method for selectively or partially electrolytic metallizing a substrate surface made of non-conductive material
US20040132300A1 (en) Procedure for activation of substrates for plastic galvanizing
WO2013182590A1 (en) Process for metallizing nonconductive plastic surfaces
WO2011035921A1 (en) Process for applying a metal coating to a non-conductive substrate
US20100215840A1 (en) METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH HOLE COPPER PLATED PWBs FINISHED WITH AN IMMERSION METAL COATING SUCH AS Ag OR Sn
TWI255825B (en) Method for electroless metallisation of polymer substrate
UA91995C2 (en) Methods for application of metal coating on substrate by autocatalytic deposition, bath for implementation of methods and article with applied coating
JP4357901B2 (en) Palladium catalyst solution for electroless plating and catalytic treatment method
CN103014680A (en) Surface chemical nickel-plating no-palladium activation method of magnesium alloy micro-arc oxidation ceramic layer and application
CA2355260A1 (en) Double-dip pd/sn crosslinker
EP0079975A1 (en) Copper colloid and method of activating insulating surfaces for subsequent electroplating
WO2002053801A3 (en) Electroless copper plating of ferrous metal substrates
WO2002066701A3 (en) Process for depositing a metal coating containing nickel and boron
US20130344235A1 (en) Autocatalytic electroless copper using hypophosphite reducer
WO1983001794A1 (en) Copper colloid and method of activating insulating surfaces for subsequent electroplating
JPH06128751A (en) Electroless gold plating method
KR20120087911A (en) Composition and process for improved zincating magnesium and magnesium alloy substrates