GB1322203A - Method of electroless plating of gold - Google Patents

Method of electroless plating of gold

Info

Publication number
GB1322203A
GB1322203A GB5142970A GB5142970A GB1322203A GB 1322203 A GB1322203 A GB 1322203A GB 5142970 A GB5142970 A GB 5142970A GB 5142970 A GB5142970 A GB 5142970A GB 1322203 A GB1322203 A GB 1322203A
Authority
GB
United Kingdom
Prior art keywords
gold
cyanide
alkali metal
ratio value
cyanide complex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5142970A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1322203A publication Critical patent/GB1322203A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1322203 Electroless plating with Au and Au alloys WESTERN ELECTRIC CO Inc 29 Oct 1970 [30 Oct 1969] 51429/70 Heading C7F A surface is electroless gold plated by contact with a bath comprising (1) a soluble gold cyanide complex in the concentration 0À0002 M to 0À05 M or above, (2) excess free cyanide, the molar ratio free cyanide: gold cyanide complex being within a range of from a minimum ratio value of 0À05:1 for the whole concentration range of gold cyanide complex to a maximum ratio value of between 2000:1 at 0À002M and 20:1 at 0À05 M gold cyanide complex, the maximum ratio value varying linearly with change in the molarity; (3) a reducing agent selected from borohydrides and aliphatic substituted amine boranes, in a concentration of 0À05 to 1M, and (4) an alkaline agent which gives a mole ratio OH<SP>-</SP>: reducing agent of 0À1:1 to 5:1 or above. Preferred sources of the above compounds are (1) alkali metal gold cyanide, e.g. K Au (CN) 2 , (2) alkali metal cyanide, (3) K BH 4 , NaBH 4 or dimethylamine borane and (4) alkali metal hydroxide; the bath may also contain salts of a metal to alloy with the gold e.g. Co, Ni, As, Cu, or Ag; optimum use temperatures are 60-95‹C. Subtrates mentioned are Au, Cu, Ag, Ni, Pt, Pd, and certain Fe alloys, or bodies made catalytic by evaporation thereon of catalytic metal through a mask.
GB5142970A 1969-10-30 1970-10-29 Method of electroless plating of gold Expired GB1322203A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87261069A 1969-10-30 1969-10-30

Publications (1)

Publication Number Publication Date
GB1322203A true GB1322203A (en) 1973-07-04

Family

ID=25359949

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5142970A Expired GB1322203A (en) 1969-10-30 1970-10-29 Method of electroless plating of gold

Country Status (7)

Country Link
JP (1) JPS503743B1 (en)
BE (1) BE758010A (en)
DE (1) DE2052787C3 (en)
FR (1) FR2066598A5 (en)
GB (1) GB1322203A (en)
NL (1) NL164327C (en)
SE (1) SE361056B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0070061A1 (en) * 1981-07-02 1983-01-19 Koninklijke Philips Electronics N.V. A solution for the electroless deposition of gold-alloys onto a substrate
DE4317256A1 (en) * 1993-05-24 1994-12-01 Bayerische Motoren Werke Ag Pipe connection, in particular in an internal-combustion-engine exhaust system
US20140076798A1 (en) * 2010-06-30 2014-03-20 Schauenburg Ruhrkunststoff Gmbh Tribologically Loadable Mixed Noble Metal/Metal Layers

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029785A1 (en) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen ACID GOLD BATH FOR ELECTRIC DEPOSIT OF GOLD
JPS6299477A (en) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd Electroless gold plating solution
CN102605360B (en) * 2011-10-12 2014-11-12 常州大学 Chemical silvering solution based on imidazolium ionic liquid and silvering method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0070061A1 (en) * 1981-07-02 1983-01-19 Koninklijke Philips Electronics N.V. A solution for the electroless deposition of gold-alloys onto a substrate
DE4317256A1 (en) * 1993-05-24 1994-12-01 Bayerische Motoren Werke Ag Pipe connection, in particular in an internal-combustion-engine exhaust system
US20140076798A1 (en) * 2010-06-30 2014-03-20 Schauenburg Ruhrkunststoff Gmbh Tribologically Loadable Mixed Noble Metal/Metal Layers

Also Published As

Publication number Publication date
DE2052787B2 (en) 1978-06-15
NL7015648A (en) 1971-05-04
NL164327C (en) 1980-12-15
SE361056B (en) 1973-10-15
DE2052787A1 (en) 1971-05-06
FR2066598A5 (en) 1971-08-06
NL164327B (en) 1980-07-15
BE758010A (en) 1971-04-26
DE2052787C3 (en) 1979-03-01
JPS503743B1 (en) 1975-02-08

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee