GB1453174A - Electroless plating - Google Patents

Electroless plating

Info

Publication number
GB1453174A
GB1453174A GB3580274A GB3580274A GB1453174A GB 1453174 A GB1453174 A GB 1453174A GB 3580274 A GB3580274 A GB 3580274A GB 3580274 A GB3580274 A GB 3580274A GB 1453174 A GB1453174 A GB 1453174A
Authority
GB
United Kingdom
Prior art keywords
substrate
electroless plating
plating
oxide
aug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3580274A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB1453174A publication Critical patent/GB1453174A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Abstract

1453174 Electroless plating with Ni or Co E I DU PONT DE NEMOURS & CO 14 Aug 1974 [15 Aug 1973] 35802/74 Heading C7F In the Ni or Co electroless plating of a substrate which is: Cu, stainless steel, Fe-Ni-Co alloys, Ag, sintered fritted oxide powders and a metal selected from Au, Ag, Pt, tin oxide and antimony oxide, and a sintered mixture of Mo and manganese oxide, the substrate is contacted with an alkali metal borohydride, an alkali metal cyanoborohydride or an amine borane, prior to plating. The substrate may be first contacted with ammonium persulphate. In Examples the plating solutions may comprise (g./l.) 50 nickel acetate, 25 lactic acid, 25 sodium citrate, 0.1 thiodiglycolic acid, 2.5 dimethylamine borane, 0.1 wetting agent, and 30 nickel chloride hexahydrate, 60 ethylenediamine, 40 NaOH, 0.3 sodium borohydride, and 50 thallium sulphate.
GB3580274A 1973-08-15 1974-08-14 Electroless plating Expired GB1453174A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38864873A 1973-08-15 1973-08-15

Publications (1)

Publication Number Publication Date
GB1453174A true GB1453174A (en) 1976-10-20

Family

ID=23534947

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3580274A Expired GB1453174A (en) 1973-08-15 1974-08-14 Electroless plating

Country Status (10)

Country Link
JP (1) JPS5050235A (en)
AT (1) AT333564B (en)
BE (1) BE818613A (en)
DE (1) DE2439075A1 (en)
ES (1) ES429298A1 (en)
FR (1) FR2240961B1 (en)
GB (1) GB1453174A (en)
IT (1) IT1019985B (en)
NL (1) NL7410936A (en)
SE (1) SE7410276L (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2854403A1 (en) * 1978-12-16 1980-06-26 Licentia Gmbh Reactivating and recoating of nickel or nickel:phosphorus layers - by immersion in hypophosphite soln. followed by chemical or electrolytic coating, esp. in mfg. thin film resistors
GB2192197A (en) * 1986-05-19 1988-01-06 Harima Chemicals Inc A method of forming a metal film on the surface of a substrate metal
US5403650A (en) * 1982-04-27 1995-04-04 Baudrand; Donald W. Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4232060A (en) * 1979-01-22 1980-11-04 Richardson Chemical Company Method of preparing substrate surface for electroless plating and products produced thereby

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2854403A1 (en) * 1978-12-16 1980-06-26 Licentia Gmbh Reactivating and recoating of nickel or nickel:phosphorus layers - by immersion in hypophosphite soln. followed by chemical or electrolytic coating, esp. in mfg. thin film resistors
US5403650A (en) * 1982-04-27 1995-04-04 Baudrand; Donald W. Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
US5565235A (en) * 1982-04-27 1996-10-15 Baudrand; Donald W. Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate
GB2192197A (en) * 1986-05-19 1988-01-06 Harima Chemicals Inc A method of forming a metal film on the surface of a substrate metal
GB2192197B (en) * 1986-05-19 1991-02-06 Harima Chemicals Inc Method of forming a metal film on the surface of a substrate metal

Also Published As

Publication number Publication date
NL7410936A (en) 1975-02-18
AT333564B (en) 1976-11-25
IT1019985B (en) 1977-11-30
DE2439075A1 (en) 1975-03-06
FR2240961B1 (en) 1978-06-09
BE818613A (en) 1975-02-10
ATA667574A (en) 1976-03-15
SE7410276L (en) 1975-02-17
FR2240961A1 (en) 1975-03-14
ES429298A1 (en) 1976-08-16
JPS5050235A (en) 1975-05-06

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee