DE2854403A1 - Reactivating and recoating of nickel or nickel:phosphorus layers - by immersion in hypophosphite soln. followed by chemical or electrolytic coating, esp. in mfg. thin film resistors - Google Patents

Reactivating and recoating of nickel or nickel:phosphorus layers - by immersion in hypophosphite soln. followed by chemical or electrolytic coating, esp. in mfg. thin film resistors

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Publication number
DE2854403A1
DE2854403A1 DE19782854403 DE2854403A DE2854403A1 DE 2854403 A1 DE2854403 A1 DE 2854403A1 DE 19782854403 DE19782854403 DE 19782854403 DE 2854403 A DE2854403 A DE 2854403A DE 2854403 A1 DE2854403 A1 DE 2854403A1
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Prior art keywords
nickel
layers
layer
bath
hypophosphite
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DE19782854403
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German (de)
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DE2854403C2 (en
Inventor
Robert Dr Ing Ostwald
Gabriele Voit
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Licentia Patent Verwaltungs GmbH
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Licentia Patent Verwaltungs GmbH
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
    • C23C18/1817—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The layer (I) of Ni or Ni-P is produced by electroless- or electro-plating, and has a passivated surface. Layer (I) is treated in a soln. (B1) contg. hypophosphite, and is then given a coating (II) via a chemical or electroplating bath (B2). Soln. (B1) is pref. heated to max. 100 degrees C and used to decompose the passivated surface catalytically thus reactivating the surface of layer (I). After reactivation, layer (I) is pref. immersed immediately in bath (B2), which is pref. the bath employed initially to obtain layer (I), or another bath, esp. an electroplating bath. Used pref. in the mfr. of Ni-P thin film resistors, where a layer (I) of Ni-P can be locally increased in thickness to reduce its surface resistivity. The invention can also be used in depositing Cu onto Ni-P to make conductor paths; or for the repair of films.

Description

Verfahren zur Reaktivierung und Weiterbeschichtung vonProcess for reactivating and further coating of

Nickel- oder Nickel-Phosphor-Schichten" Die Erfindung betrifft ein Verfahren zur Reaktivierung und Weiterbeschichtung chemisch stromlos oder galvanisch erzeugter Nickel- oder Nickel-Phosphor-Schichten, welche eine passive Oberfläche aufweisen.Nickel or nickel-phosphorus layers "The invention relates to a Process for reactivation and further coating chemically electroless or electroplated generated nickel or nickel-phosphorus layers, which have a passive surface exhibit.

Nickel-Phosphor-Schichten, die nach einem z. B. aus der DT-OS 26 34 232 bekannten Verfahren der chemischen, d. h.Nickel-phosphorus layers, which after a z. B. from DT-OS 26 34 232 known processes of chemical, i.e. H.

der autokatalytischen außenstromlosen Metallabscheidung aus einem Ni ckel-Hgpopho sphitbad hergestellt wurden, bedecken sich bei der Spülung und Trocknung durch Reaktion mit Sauerstoff sehr rasch mit einer Passivschicht, die eine Weiterbeschichtung verhindert. Nickel-Schichten mit einer solchen Passivschicht werden insbesondere in einem alkalischen, bei Raumtemperatur arbeitenden Vernickelungsbad nicht mehr katalytisch. aktiv, so daß die Abscheidung nicht in Gang kommt. Eine wiederholte Abscheidung oder eine Weiterbeschichtung kann immer dann erforderlich sein, wenn die Erstbeschichtung fehlerhaft oder zu dünn ist oder auch wenn eine andere Metallschicht nach dem chemisch stromlosen oder dem galvanischen Verfahren auf der Nickel-Phosphor-Schicht abgeschieden werden soll.the autocatalytic electroless metal deposition from one Ni ckel-Hgpopho sphitbad were produced, cover themselves during rinsing and drying by reacting with oxygen very quickly with a passive layer, which is a further coating prevented. Nickel layers with such a passive layer are in particular no longer in an alkaline nickel-plating bath operating at room temperature catalytic. active so that the separation does not start. One repeated Deposition or further coating may always be necessary if the first coating is defective or too thin or if another metal layer is used using the electroless chemical or galvanic process on the nickel-phosphorus layer should be deposited.

Ein konkreter Fall ist z. B. die Weiterbeschichtung von Nickel-Phosphor-Dünnfilm-Widerstnnden in dem gleichen Nickel-Hypophosphitbad, um durch Erhöhung der Schichtdicke den Flächenwiderstand zu reduzieren. Zur präzisen und re produzierbaren Flächenwiderstandseinstellung darf aber wenn die Schichtdicke der gemessenen Erstbeschichtung durch eine Re akt ivierungsbehandlung unkontrollierbar verändert werden noch darf die Weiterbeschichtung mit unbekannter Verzögerung einsetzen. Ein Reaktivierungsverfahren darf also den Flächenwiderstand der Erstbeschichtung nicht verändern Ein anderer konkreter Fall für eine Weiterbeschichtung von Nickel-Phosphor-Schichten besteht in der Verstärkung dieser Schichten, z.B. mit Kupfer, zur Herstellung von Leiterbahnen.A specific case is e.g. B. the further coating of nickel-phosphorus thin-film resistors in the same nickel-hypophosphite bath to increase the sheet resistance by increasing the layer thickness to reduce. For precise and reproducible surface resistance setting but may if the layer thickness of the measured first coating by a Re act treatment treatment may be changed in an uncontrollable manner, nor may further coating start with an unknown delay. A reactivation process may therefore Do not change the surface resistance of the first coating Another specific case for a further coating of nickel-phosphorus layers consists in reinforcement these layers, e.g. with copper, for the production of conductor tracks.

Die Kupferabscheidung aus einem handelsüblichen chemischstromlosen Kupferbad kommt in der Regel nur auf passivschichtfreien Nickel-Phosphor-Schichten in Gang, indem zuerst Kupfer durch Zementation niedergeschlagen wird. Auch eine optimale Haftung des Kupfers ist nur auf passivschichtfreier Nickel-Phosphor-Schicht gewährleistet.The copper deposition from a commercially available electroless chemical As a rule, the copper bath only comes on top of nickel-phosphorus layers without a passive layer in progress by first depositing copper by cementation. Also one Optimal adhesion of the copper is only possible on a nickel-phosphorus layer without a passive layer guaranteed.

Ein einfaches Abätzen der Passivschicht ist in der Regel ur; geeignet, da meistens die Metallschicht noch stärker angeätzt und häufig ungleichmmäßig angegriffen wird. Außerdem muß das Ätzmedium vor der Weiterbeschichtung sorgfältig von der Oberfläche entfernt werden, wobei die Schicht oberfläche bereits wieder passiv werden kann. Manche Legierungsschichten aus Nickel-Phosphor werden durch Anätzen auf der Oberfläche in ihrer Zusammensetzung so verändert, daß sie nicht mehr autokatalytisch wirksam sind.A simple etching off of the passive layer is usually ur; suitable, because mostly the metal layer is etched even more and is often attacked unevenly will. In addition, the etching medium must be carefully removed from the surface before further coating can be removed, whereby the layer surface can already become passive again. Some nickel-phosphorus alloy layers are etched on the surface changed in their composition so that they are no longer autocatalytically effective are.

Eine mechanische Entfernung der Passivschicht durch Bürsten, Schleifen, Trommeln, Sandstrahlen und dergleichen bedingt ebenfalls einen starken und meist ungleichmäßigen Abtrag der Metallschicht.Mechanical removal of the passive layer by brushing, grinding, Drumming, sandblasting and the like also require a strong and mostly uneven removal of the metal layer.

Eine Belegung mit Fremdkeimen z.B. mit Palladium durch Zementation, ist problematisch, da sowohl eine unkontrollierbare Ätzung der Schichtoberfläche eintritt, als auch bei Erhaltung der Passivschicht keine optimale Haftung der Zweitbeschichtung gewährleistet ist.A contamination with foreign germs, e.g. with palladium Cementation, is problematic as both an uncontrollable etching of the layer surface occurs, and even if the passive layer is retained, there is no optimal adhesion of the second coating is guaranteed.

Der Erfindung lag daher die Aufgabe zugrunde, ein Verfahren der eingangs genannten Art anzugeben, welches eine zuverlåssige Auflösung der Passivschicht, sowie eine gleichmäßige und kontrollierbare Weiterbeschichtung der von der Passivschicht befreiten Schicht gestattet.The invention was therefore based on the object of providing a method of the above specified type, which a reliable dissolution of the passive layer, as well as an even and controllable further coating of the passive layer exempt shift permitted.

Diese Aufgabe wird erfindungsgemäß dadurch gelost, daß die Schichten in einer Hypophosphit-haltigen Lösung behandelt werden und anschließend in einem chemischen oder galvanisc;ien Metallisierungsbad weiterbeschichtet werden.This object is achieved according to the invention in that the layers treated in a hypophosphite-containing solution and then in a chemical or galvanic metallization bath can be further coated.

Der Vorteil des erfindungsgemäßen Verfahrens ist darin zu sehen, daß die llypophosphit-haltige Lösung in der Lage ist, die Passivschicht aufzulösen, ohne die ursprüngliche Nickel-Phosphor-Schicht anzugreifen, d.h. die durch diese Lösung reaktivierten Schichten haben noch den gleichen elektrischen ~ile--stand, wie die unbehandelten Schichten. Die ursprung zieht Schicht kann dabei als dünne Schicht auf einem Substrat ausgebildet sein, oder das Substrat selbst bilden. Die Reektivierung der Nickel-Phosphor-Schichten bzw. die Befreiung çon der Passivschicht gibt sich dadurch zu erkennen, daß die Schicht das Hypophosphit katalytisch zersetzt. Die Schichten werden also so lange in der Hypophosphit-haltigen Lösung behandelt, bis auf diesen eine Wasserstoffentwicklung einsetzt, die den katalysierten Hypophosphitzerfall kennzeichnet.The advantage of the method according to the invention can be seen in the fact that the solution containing llypophosphite is able to dissolve the passive layer, without attacking the original nickel-phosphorus layer, i.e. the one through it Solution reactivated layers still have the same electrical resistance, like the untreated layers. The origin pulls layer can be called thin Layer be formed on a substrate, or form the substrate itself. the Re-activation of the nickel-phosphorus layers or the liberation of the passive layer can be recognized by the fact that the layer catalytically decomposes the hypophosphite. The layers are treated in the hypophosphite-containing solution for as long as except for this, hydrogen evolution begins, which causes the catalyzed fall of hypophosphite indicates.

Ist die Schicht erst dazu fähig, dann kann auf dieser auch die autokatalytische Nickel-Phosphor-Abscheidung fortgesetzt werden. Da die Behandlung zur Reaktivierung mit dem gleichen Reduktionsmittel durchgeführt wird, wie die anschließende Weiterbeschichtung, kann die Nickel-Phosphor-Schicht umittelbar, d. h. ohne Spülung oder eine andere Zwischenbehandlung in das Metallisierungsbad eingetaucht werden. Die Weiterbeschich- tung setzt daraufhin ohne nennenswerte Verzögerung ein, so daß sich die Schichtdickenzunahme bzw. Flächenwiderstandsabnahme durch die Weitermetallisierungszeit präzise steuern läßt. Die Erfindung ist daher insbesondere zur niederohmigeren Einstellung von Nickel-Phosphor Dunnfilm-Widerstanden w verwenden.Once the layer is capable of this, the autocatalytic layer can also be used on it Nickel-phosphorus deposition continues. As the treatment for reactivation is carried out with the same reducing agent as the subsequent further coating, the nickel-phosphorus layer can be immediate, i. H. without rinsing or any other Intermediate treatment to be immersed in the plating bath. The further coating tion thereupon sets in without any appreciable delay, so that the layer thickness increases or precisely control the decrease in surface resistance through the further metallization time leaves. The invention is therefore in particular for setting nickel-phosphorus with a lower resistance Use thin film resistors w.

Das erfindungsgemäße Verfahren ist weiterhin vorzugsweise zur Metallisierung einer Nickel- oder Nickel-Phosphor-Schicht geeignet.The method according to the invention is also preferred for metallization a nickel or nickel-phosphorus layer suitable.

Die Erfidnung soll anhand zweier Ausführungsbeispiele näher erläutert werden: Beispiel 1: Auf einem typischen Leite rkartenbasismaterial , wie z.B mit Glasfasergewebe verstärktem Epoxid, wurde nach geeigneter Oberflächvorbehandlung und einer Bekeimung nach dem altbekannten Zinn-Palladium-Verfahren eine dünne Nickel-Phosphor-Schicht aus einem chemischen Vernickelungsbad folgender Zusammensetzung abgeschieden: Nickelsulfat 15 g/l Citronensäure 17 g/l Borax 15 g/l Natriumhypophosphit 30 g/l Natriumhydroxid für pH - 9 Nach einer Abscheidungszeit von 3 Minuten hat die Beschichtung einen Flächenwiderstand von 100R/Q . Da ein Teil der Beschichtung einen Flächenwiderstand von 30 Q /u haben soll, wird diese partiell mit einem Fotolack abgedeckt und dieser bei 800C gehärtet. Die nicht abgedeckten Schichtpartien werden für eine autokatalytische Weiterbeschichtung in dem ursprünglichen Nickel-Hypophosphitbad zuvor in einer Lösung folgender Zusammensetzung reaktiviert: Natriumhypophosphit 10 g/l NaOR für pH = 6,0 Nach einer Tauchzeit von 5 min in der angegebenen Lösung bei 250C setzt auf den Nickel-Phosphor-Schichten eine Wasserstoffentwicklung ein, welche den reaktivierten Zustand signalisiert.The invention will be explained in more detail using two exemplary embodiments are: Example 1: On a typical circuit board base material, such as with Glass fiber fabric reinforced epoxy, after suitable surface preparation and nucleation using the well-known tin-palladium process, a thin nickel-phosphorus layer deposited from a chemical nickel plating bath of the following composition: nickel sulfate 15 g / l citric acid 17 g / l borax 15 g / l sodium hypophosphite 30 g / l sodium hydroxide for pH - 9 After a deposition time of 3 minutes, the coating has a Sheet resistance of 100R / Q. As part of the coating has a sheet resistance should have of 30 Q / u, this is partially covered with a photoresist and this hardened at 800C. The uncovered parts of the layer are used for an autocatalytic Further coating in the original nickel-hypophosphite bath beforehand in a solution reactivated with the following composition: sodium hypophosphite 10 g / l NaOR for pH = 6.0 After an immersion time of 5 min in the specified solution at 250C sets a hydrogen evolution on the nickel-phosphorus layers, which signals the reactivated state.

Durch Wechsel in das ursprüngliche Yerjiickelungsbad wird die Weiterbeschichtung eingeleitet. Näch einer Beschichtungszeit von 7 Minuten, also einer Gesamtbeschichtungszeit von 10 Minuten haben diese Schichten einen Flächenwiderstand von 30S /0 Beispiel 2: Eine gemäß Beispiels erzeugte Nickel-Phosphor-Widerstandsschicht soll teilweise mit Kupfer zu Leiterbahnen verstärkt werden. Dazu werden die als elektrische Widerstände benötigten Schichtpartien mit einem siebdruckfähigen Epoxd-Lack abgedeckt und dieser bei 1500C susgehärtet. Die freiliegenden mit Kupfer zu verstärkenden Nickel-Phosphor-Schichten werden in einer Lösung folgender Zusammensetzung reaktiviert: Natriumhypophosphit 30 g/l NaOH für pH = 9,0 Nach einer Tauchzeit von ca. 1 Minute in der angegebenen Lösung bei 500C setzt eine Wasserstoffentwicklung ein. Die reaktivierten Schichten werden nach kurzer Spülung in demineralisiertem Wasser sofort in eine typisches chemisches Verkupferungsbad z.B. folgender Zusammensetzung getaucht: Kupfersulfat 8 g/l Kalium-Natriumtartrat 40 g/l Formaldehydlösung 10 ml/l Na0H für pH = 13,2 Die Kupferabscheidung kommt bei einer Bad-Temperatur von 500C sofort in Gang und wird solange fortgesetzt, bis eine Kupferschichtdicke von ca. 20,um erreicht ist.The further coating is carried out by changing to the original coating bath initiated. Next a coating time of 7 minutes, i.e. a total coating time after 10 minutes these layers have a sheet resistance of 30S / 0 example 2: A nickel-phosphorus resistance layer produced according to the example is intended to be partially be reinforced with copper to form conductor tracks. These are called electrical resistors required layer parts covered with a screen printable epoxy varnish and this sus-hardened at 1500C. The exposed nickel-phosphorus layers to be reinforced with copper are reactivated in a solution of the following composition: sodium hypophosphite 30 g / l NaOH for pH = 9.0 after an immersion time of approx. 1 minute in the specified Solution at 500C begins to generate hydrogen. The reactivated layers after a short rinse in demineralized water are immediately converted into a typical chemical copper plating bath, e.g. immersed with the following composition: copper sulphate 8 g / l potassium sodium tartrate 40 g / l formaldehyde solution 10 ml / l NaOH for pH = 13.2 The copper deposition starts immediately at a bath temperature of 500C is continued until a copper layer thickness of approx. 20 μm is reached.

Claims (6)

P a t e n t a n s p r ü c h e 1. Verfahren zur Reaktivierung und Weiterbeschichtung chemisch stromlos oder galvanisch erzeugter Nickel- oder Nickel-Phophor-Schichten, welche eine passive Oberfläche aufweisen dadurch gekennzeichnet, daß die Schichten in einer Hypophosphit-haltigen Lösung behandelt werden und anschließend in einem chemischen oder galvanischen Metallisierungsbad weiterbeschichtet werden.P a t e n t a n s p r ü c h e 1. Process for reactivation and further coating chemically electroless or electroplated nickel or nickel-phosphor layers, which have a passive surface, characterized in that the layers treated in a hypophosphite-containing solution and then in a chemical or galvanic metallization bath can be further coated. Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß die flypophosphit-haltige Lösung erwärmt wird, vorzugsweise bis auf maximal i000C, 3. Verfahren nach Anspruch 1 oder Anspruch 2 dadurch gekenn zeichnet, daß Schichten mit passiver Oberfläche so lange mit der Hypophosphit-haltigen Lösung behandelt werden, bis diese durch die reaktivierte Schicht oberfläche katalytisch zersetzt wird. Process according to Claim 1, characterized in that the flypophosphite-containing Solution is heated, preferably up to a maximum of 1000C, 3. The method according to claim 1 or claim 2 characterized in that layers with a passive surface be treated with the hypophosphite-containing solution until it is through the reactivated layer surface is catalytically decomposed. 4. Verfahren nach einem der Ansprüche 1 bis 3 dadurch gekennzeichnet, daß die reaktivierten Schichten unmittelbaohne Zwischenbehandlung z.B. durch einen Spülvorgang-für eine durch die gewünschte Schichtdickenzunahme vorgegebene Zeit in dem ursprünglichen Bad zur chemisch stromlosen oder galvanischen Erzeugung von Nickel- oder Nickel-Phosphor-Schichten weit erbeschichtet werden.4. The method according to any one of claims 1 to 3, characterized in that that the reactivated layers immediately without intermediate treatment, e.g. by a Rinsing process - for a time specified by the desired increase in layer thickness by doing original bath for chemically electroless or galvanic Generation of nickel or nickel-phosphorus layers are widely coated. 5. Verfahren nach Anspruch 3 dadurch gekennzeichnet, dad die reaktivierten Schichten nach einer kurzen Spülung vorzugsweise in demineralisiertem Wasser in einem Metallisierungsbad weiterbeschichtet werden, welches sich von dem ursprünglichen Bad zur chemisch stromlosen oder galvanischen Erzeugung von Nickel- oder Nickel-Phosphor-Schichten unterscheidet.5. The method according to claim 3, characterized in that the reactivated Layers after a short rinse, preferably in demineralized water a plating bath, which differs from the original Bath for the chemically electroless or galvanic production of nickel or nickel-phosphorus layers differs. 6. Verfahrennacb Anspruch 5 oder Anspruch 4 dadurch gekennzeichnet, daß die reaktivia5ten Schichten in einem galvanischen Metallisierungsbad weiterbeschichtet werden.6. Verfahrennacb claim 5 or claim 4, characterized in that that the reactive layers are further coated in a galvanic metallization bath will.
DE19782854403 1978-12-16 1978-12-16 Process for reactivation and further coating of nickel or nickel-phosphorus layers Expired DE2854403C2 (en)

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DE19782854403 DE2854403C2 (en) 1978-12-16 1978-12-16 Process for reactivation and further coating of nickel or nickel-phosphorus layers

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DE19782854403 DE2854403C2 (en) 1978-12-16 1978-12-16 Process for reactivation and further coating of nickel or nickel-phosphorus layers

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DE2854403A1 true DE2854403A1 (en) 1980-06-26
DE2854403C2 DE2854403C2 (en) 1986-07-03

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DE102007021390A1 (en) 2007-05-04 2008-11-06 Weber-Hydraulik Gmbh Mechanics component and its manufacturing process
DE102008049790A1 (en) 2008-10-03 2010-04-08 Weber Hydraulik Gmbh Hydraulic cylinder and its manufacturing process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577276A (en) * 1966-09-27 1971-05-04 Welwyn Electric Ltd Electrical resistors
GB1453174A (en) * 1973-08-15 1976-10-20 Du Pont Electroless plating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577276A (en) * 1966-09-27 1971-05-04 Welwyn Electric Ltd Electrical resistors
GB1453174A (en) * 1973-08-15 1976-10-20 Du Pont Electroless plating

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