GB872785A - Immersion plating with noble metals - Google Patents
Immersion plating with noble metalsInfo
- Publication number
- GB872785A GB872785A GB37489/57A GB3748957A GB872785A GB 872785 A GB872785 A GB 872785A GB 37489/57 A GB37489/57 A GB 37489/57A GB 3748957 A GB3748957 A GB 3748957A GB 872785 A GB872785 A GB 872785A
- Authority
- GB
- United Kingdom
- Prior art keywords
- specified
- alloys
- silver
- nickel
- buffering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
An aqueous immersion plating solution contains a soluble salt of a noble metal (Au, Ag, Pt, Pd, Rh, Ru, Os, Ir), an ammonium buffering and complexing agent, and a chelating agent. Specified noble metal salts are sodium and potassium gold cyanide, potassium silver cyanide, silver acetate, and palladium and platinum diamino nitrites. Specified buffering and complexing agents are ammonium hydroxide, citrate, borate and tartrate. Specified chelating agents are urea, ethylenedinitrilo tetraacetic acid and its tetrasodium salt, acetamide, cyanoacetamide, dicyandiamide, sulphosalicylic acid, ethylenediamine and ethyl acetoacetate. Materials which may be plated are nickel, nickel-plated brass, copper, copper alloys, cadmium, zinc, aluminium, aluminium alloys, silver alloys, steel, tungsten, diecast metals, solders, pewter, and metallized plastics. The plating may alternatively serve as an intermediate layer for a second metal coating.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US872785XA | 1957-04-17 | 1957-04-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB872785A true GB872785A (en) | 1961-07-12 |
Family
ID=22204208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB37489/57A Expired GB872785A (en) | 1957-04-17 | 1957-12-02 | Immersion plating with noble metals |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB872785A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3266929A (en) * | 1962-12-17 | 1966-08-16 | Shipley Co | Gold plating by immersion |
US3364064A (en) * | 1962-08-08 | 1968-01-16 | Philips Corp | Method of improving the solderability of a nickel surface |
DE1298826B (en) * | 1963-02-05 | 1969-07-03 | Siemens Ag | Acid bath solution containing palladium (ó�) ions for the germination of surfaces of metallic or non-metallic bodies preactivated with tin (ó�) chloride |
WO1999018253A2 (en) * | 1997-10-08 | 1999-04-15 | Atotech Deutschland Gmbh | Method and solution for producing gold coating |
AU763373B2 (en) * | 1998-05-04 | 2003-07-17 | BWXT ITG Canada, Inc. | Production of palladium-103 |
EP1416065A1 (en) * | 2002-08-30 | 2004-05-06 | Shipley Company LLC | Plating method |
-
1957
- 1957-12-02 GB GB37489/57A patent/GB872785A/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3364064A (en) * | 1962-08-08 | 1968-01-16 | Philips Corp | Method of improving the solderability of a nickel surface |
US3266929A (en) * | 1962-12-17 | 1966-08-16 | Shipley Co | Gold plating by immersion |
DE1298826B (en) * | 1963-02-05 | 1969-07-03 | Siemens Ag | Acid bath solution containing palladium (ó�) ions for the germination of surfaces of metallic or non-metallic bodies preactivated with tin (ó�) chloride |
WO1999018253A2 (en) * | 1997-10-08 | 1999-04-15 | Atotech Deutschland Gmbh | Method and solution for producing gold coating |
WO1999018253A3 (en) * | 1997-10-08 | 1999-10-07 | Atotech Deutschland Gmbh | Method and solution for producing gold coating |
US6336962B1 (en) | 1997-10-08 | 2002-01-08 | Atotech Deutschland Gmbh | Method and solution for producing gold coating |
AU763373B2 (en) * | 1998-05-04 | 2003-07-17 | BWXT ITG Canada, Inc. | Production of palladium-103 |
EP1416065A1 (en) * | 2002-08-30 | 2004-05-06 | Shipley Company LLC | Plating method |
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