JP2014043412A - 4-naphthyl imidazole compound and antioxidant - Google Patents
4-naphthyl imidazole compound and antioxidant Download PDFInfo
- Publication number
- JP2014043412A JP2014043412A JP2012186339A JP2012186339A JP2014043412A JP 2014043412 A JP2014043412 A JP 2014043412A JP 2012186339 A JP2012186339 A JP 2012186339A JP 2012186339 A JP2012186339 A JP 2012186339A JP 2014043412 A JP2014043412 A JP 2014043412A
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- Prior art keywords
- acid
- compound
- copper
- antioxidant
- imidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- -1 4-naphthyl imidazole compound Chemical class 0.000 title claims abstract description 50
- 239000003963 antioxidant agent Substances 0.000 title claims abstract description 30
- 230000003078 antioxidant effect Effects 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims description 18
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 239000002253 acid Substances 0.000 abstract description 7
- XAZKYAUXHDPJFZ-UHFFFAOYSA-N 2-cyclohexyl-5-naphthalen-1-yl-1h-imidazole Chemical compound C1CCCCC1C1=NC=C(C=2C3=CC=CC=C3C=CC=2)N1 XAZKYAUXHDPJFZ-UHFFFAOYSA-N 0.000 abstract description 5
- QSHSRKJVYKZBQI-UHFFFAOYSA-N 2-cyclohexyl-5-naphthalen-2-yl-1h-imidazole Chemical compound C1CCCCC1C1=NC=C(C=2C=C3C=CC=CC3=CC=2)N1 QSHSRKJVYKZBQI-UHFFFAOYSA-N 0.000 abstract description 5
- YFEMQEUTEFSFRV-UHFFFAOYSA-N 4-(5-naphthalen-1-yl-1h-imidazol-2-yl)pyridine Chemical compound N1C(C=2C3=CC=CC=C3C=CC=2)=CN=C1C1=CC=NC=C1 YFEMQEUTEFSFRV-UHFFFAOYSA-N 0.000 abstract description 4
- MMMXUKOIGRBQSW-UHFFFAOYSA-N 5-naphthalen-1-yl-1h-imidazole Chemical compound N1C=NC=C1C1=CC=CC2=CC=CC=C12 MMMXUKOIGRBQSW-UHFFFAOYSA-N 0.000 abstract description 2
- 125000000339 4-pyridyl group Chemical group N1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 abstract 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 abstract 1
- 125000001424 substituent group Chemical group 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- 238000006243 chemical reaction Methods 0.000 description 20
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000000243 solution Substances 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000013078 crystal Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- OQLCVXVVASQZLX-UHFFFAOYSA-N 2-bromo-1-naphthalen-1-ylethanone Chemical compound C1=CC=C2C(C(=O)CBr)=CC=CC2=C1 OQLCVXVVASQZLX-UHFFFAOYSA-N 0.000 description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 238000004809 thin layer chromatography Methods 0.000 description 6
- OZEZGFFRDBWFFC-UHFFFAOYSA-N cyclohexanecarboximidamide;hydrochloride Chemical compound Cl.NC(=N)C1CCCCC1 OZEZGFFRDBWFFC-UHFFFAOYSA-N 0.000 description 5
- QQLIGMASAVJVON-UHFFFAOYSA-N 1-naphthalen-1-ylethanone Chemical class C1=CC=C2C(C(=O)C)=CC=CC2=C1 QQLIGMASAVJVON-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 4
- IONKMFGAXKCLMI-UHFFFAOYSA-N [amino(pyridin-4-yl)methylidene]azanium;chloride Chemical compound [Cl-].NC(=[NH2+])C1=CC=NC=C1 IONKMFGAXKCLMI-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
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- 239000007787 solid Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000004480 active ingredient Substances 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 235000019270 ammonium chloride Nutrition 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- VBWIZSYFQSOUFQ-UHFFFAOYSA-N cyclohexanecarbonitrile Chemical compound N#CC1CCCCC1 VBWIZSYFQSOUFQ-UHFFFAOYSA-N 0.000 description 3
- PBCFZTOCSCULAL-UHFFFAOYSA-N cyclohexanecarboximidamide Chemical compound NC(=N)C1CCCCC1 PBCFZTOCSCULAL-UHFFFAOYSA-N 0.000 description 3
- 238000002330 electrospray ionisation mass spectrometry Methods 0.000 description 3
- 150000002366 halogen compounds Chemical class 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- GPHQHTOMRSGBNZ-UHFFFAOYSA-N pyridine-4-carbonitrile Chemical compound N#CC1=CC=NC=C1 GPHQHTOMRSGBNZ-UHFFFAOYSA-N 0.000 description 3
- BIJRUEBMNUUNIJ-UHFFFAOYSA-N pyridine-4-carboximidamide Chemical compound NC(=N)C1=CC=NC=C1 BIJRUEBMNUUNIJ-UHFFFAOYSA-N 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- XSAYZAUNJMRRIR-UHFFFAOYSA-N 2-acetylnaphthalene Chemical compound C1=CC=CC2=CC(C(=O)C)=CC=C21 XSAYZAUNJMRRIR-UHFFFAOYSA-N 0.000 description 2
- YHXHHGDUANVQHE-UHFFFAOYSA-N 2-bromo-1-naphthalen-2-ylethanone Chemical compound C1=CC=CC2=CC(C(=O)CBr)=CC=C21 YHXHHGDUANVQHE-UHFFFAOYSA-N 0.000 description 2
- OWVMFLLVLFONOO-UHFFFAOYSA-N 3-butoxypropanoic acid Chemical compound CCCCOCCC(O)=O OWVMFLLVLFONOO-UHFFFAOYSA-N 0.000 description 2
- JOOXCMJARBKPKM-UHFFFAOYSA-N 4-oxopentanoic acid Chemical compound CC(=O)CCC(O)=O JOOXCMJARBKPKM-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- YZGQDNOIGFBYKF-UHFFFAOYSA-N Ethoxyacetic acid Chemical compound CCOCC(O)=O YZGQDNOIGFBYKF-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003905 agrochemical Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000012267 brine Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
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- 238000007654 immersion Methods 0.000 description 2
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- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- 235000011181 potassium carbonates Nutrition 0.000 description 2
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- 238000002360 preparation method Methods 0.000 description 2
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- FYRBJJHCFFXENF-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]acetic acid Chemical compound CCOCCOCCOCC(O)=O FYRBJJHCFFXENF-UHFFFAOYSA-N 0.000 description 1
- XJGUMLITIZHCGE-UHFFFAOYSA-N 2-[2-[2-(2-ethoxyethoxy)ethoxy]ethoxy]acetic acid Chemical compound CCOCCOCCOCCOCC(O)=O XJGUMLITIZHCGE-UHFFFAOYSA-N 0.000 description 1
- VYOLNYSIZIEAOP-UHFFFAOYSA-N 2-chloro-1-naphthalen-1-ylethanone Chemical compound C1=CC=C2C(C(=O)CCl)=CC=CC2=C1 VYOLNYSIZIEAOP-UHFFFAOYSA-N 0.000 description 1
- NYJAUILLKSDBMH-UHFFFAOYSA-N 2-chloro-1-naphthalen-2-ylethanone Chemical compound C1=CC=CC2=CC(C(=O)CCl)=CC=C21 NYJAUILLKSDBMH-UHFFFAOYSA-N 0.000 description 1
- YUNLQIAWOVSQCH-UHFFFAOYSA-N 2-iodo-1-naphthalen-1-ylethanone Chemical compound C1=CC=C2C(C(=O)CI)=CC=CC2=C1 YUNLQIAWOVSQCH-UHFFFAOYSA-N 0.000 description 1
- USSYWBMZTAVASW-UHFFFAOYSA-N 2-iodo-1-naphthalen-2-ylethanone Chemical compound C1=CC=CC2=CC(C(=O)CI)=CC=C21 USSYWBMZTAVASW-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- SGUYGLMQEOSQTH-UHFFFAOYSA-N 2-propoxyacetic acid Chemical compound CCCOCC(O)=O SGUYGLMQEOSQTH-UHFFFAOYSA-N 0.000 description 1
- JRXXEXVXTFEBIY-UHFFFAOYSA-N 3-ethoxypropanoic acid Chemical compound CCOCCC(O)=O JRXXEXVXTFEBIY-UHFFFAOYSA-N 0.000 description 1
- HTNUUDFQRYBJPH-UHFFFAOYSA-N 3-methoxypropanehydrazide Chemical compound COCCC(=O)NN HTNUUDFQRYBJPH-UHFFFAOYSA-N 0.000 description 1
- YZLDXPLNKWTMOO-UHFFFAOYSA-N 3-propoxypropanoic acid Chemical compound CCCOCCC(O)=O YZLDXPLNKWTMOO-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- LXGBLFPNMIQSON-UHFFFAOYSA-N 4-(5-naphthalen-2-yl-1H-imidazol-2-yl)pyridine Chemical compound N1C(C=2C=C3C=CC=CC3=CC=2)=CN=C1C1=CC=NC=C1 LXGBLFPNMIQSON-UHFFFAOYSA-N 0.000 description 1
- QCQCHGYLTSGIGX-GHXANHINSA-N 4-[[(3ar,5ar,5br,7ar,9s,11ar,11br,13as)-5a,5b,8,8,11a-pentamethyl-3a-[(5-methylpyridine-3-carbonyl)amino]-2-oxo-1-propan-2-yl-4,5,6,7,7a,9,10,11,11b,12,13,13a-dodecahydro-3h-cyclopenta[a]chrysen-9-yl]oxy]-2,2-dimethyl-4-oxobutanoic acid Chemical compound N([C@@]12CC[C@@]3(C)[C@]4(C)CC[C@H]5C(C)(C)[C@@H](OC(=O)CC(C)(C)C(O)=O)CC[C@]5(C)[C@H]4CC[C@@H]3C1=C(C(C2)=O)C(C)C)C(=O)C1=CN=CC(C)=C1 QCQCHGYLTSGIGX-GHXANHINSA-N 0.000 description 1
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 description 1
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- JQJKWVIUFZWDPH-UHFFFAOYSA-N 5-naphthalen-1-yl-2-phenyl-1h-imidazole Chemical compound N=1C(C=2C3=CC=CC=C3C=CC=2)=CNC=1C1=CC=CC=C1 JQJKWVIUFZWDPH-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N Acetoacetic acid Natural products CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- CANRESZKMUPMAE-UHFFFAOYSA-L Zinc lactate Chemical compound [Zn+2].CC(O)C([O-])=O.CC(O)C([O-])=O CANRESZKMUPMAE-UHFFFAOYSA-L 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229940107816 ammonium iodide Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 235000011116 calcium hydroxide Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 230000002140 halogenating effect Effects 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000026045 iodination Effects 0.000 description 1
- 238000006192 iodination reaction Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229940040102 levulinic acid Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- RMIODHQZRUFFFF-UHFFFAOYSA-N methoxyacetic acid Chemical compound COCC(O)=O RMIODHQZRUFFFF-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940107700 pyruvic acid Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- SUBJHSREKVAVAR-UHFFFAOYSA-N sodium;methanol;methanolate Chemical compound [Na+].OC.[O-]C SUBJHSREKVAVAR-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- WEZYFYMYMKUAHY-UHFFFAOYSA-N tert-butyl 2,4-dibenzylpiperazine-1-carboxylate Chemical compound C1C(CC=2C=CC=CC=2)N(C(=O)OC(C)(C)C)CCN1CC1=CC=CC=C1 WEZYFYMYMKUAHY-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- WGIWBXUNRXCYRA-UHFFFAOYSA-H trizinc;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WGIWBXUNRXCYRA-UHFFFAOYSA-H 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011746 zinc citrate Substances 0.000 description 1
- 235000006076 zinc citrate Nutrition 0.000 description 1
- 229940068475 zinc citrate Drugs 0.000 description 1
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 description 1
- 239000011576 zinc lactate Substances 0.000 description 1
- 235000000193 zinc lactate Nutrition 0.000 description 1
- 229940050168 zinc lactate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
Abstract
Description
本発明は、新規な4−ナフチルイミダゾール化合物及び該イミダゾール化合物を含有する銅又は銅合金の酸化防止剤に関するものである。 The present invention relates to a novel 4-naphthylimidazole compound and an antioxidant for copper or copper alloy containing the imidazole compound.
本発明に類似のイミダゾール化合物として、例えば、特許文献1には、化学式(II)で示される4−(1−ナフチル)−2−フェニルイミダゾール及び化学式(III)で示される4−(2−ナフチル)−2−フェニルイミダゾールが開示されている。しかしながら、この文献には本発明のイミダゾール化合物の開示はない。 As an imidazole compound similar to the present invention, for example, Patent Document 1 discloses 4- (1-naphthyl) -2-phenylimidazole represented by the chemical formula (II) and 4- (2-naphthyl represented by the chemical formula (III). ) -2-Phenylimidazole is disclosed. However, this document does not disclose the imidazole compound of the present invention.
本発明は、新規な4−ナフチルイミダゾール化合物及び該イミダゾール化合物を含有する銅又は銅合金の酸化防止剤を提供することを目的とする。 An object of the present invention is to provide a novel 4-naphthylimidazole compound and an antioxidant for copper or a copper alloy containing the imidazole compound.
本発明者等は、前記の課題を解決するために鋭意検討を重ねた結果、化学式(I)で示される新規な4−ナフチルイミダゾール化合物を合成し得ることを認め、また該イミダゾール化合物が銅又は銅合金表面の酸化防止効果を発揮することを見出し、本発明を完成するに至ったものである。
即ち、第1の発明は化学式(I)で示される4−ナフチルイミダゾール化合物であり、第2の発明は該イミダゾール化合物を含有することを特徴とする銅又は銅合金の酸化防止剤である。
As a result of intensive studies to solve the above-mentioned problems, the present inventors have recognized that a novel 4-naphthylimidazole compound represented by the chemical formula (I) can be synthesized, and that the imidazole compound is copper or The present inventors have found that an effect of preventing oxidation of the copper alloy surface is exhibited, and have completed the present invention.
That is, the first invention is a 4-naphthylimidazole compound represented by the chemical formula (I), and the second invention is an antioxidant for copper or copper alloy containing the imidazole compound.
本発明の4−ナフチルイミダゾール化合物は、金属、特に銅又は銅合金(以下、両者を併せて単に銅と云う)の表面の酸化防止剤や、エポキシ樹脂の硬化剤又は硬化促進剤として、また医農薬分野の中間原料としても有用なものである。また、本発明の4−ナフチルイミダゾール化合物を含有する銅の酸化防止剤は、銅表面をはんだ付けする際のはんだ付け性を良好なものとすることができる。 The 4-naphthylimidazole compound of the present invention is used as an antioxidant on the surface of metals, particularly copper or copper alloys (hereinafter simply referred to as copper), as a curing agent or curing accelerator for epoxy resins, and as a medical agent. It is also useful as an intermediate material in the agricultural chemical field. Moreover, the antioxidant of copper containing the 4-naphthylimidazole compound of the present invention can improve the solderability when soldering the copper surface.
以下、本発明について詳細に説明する。
本発明の4−ナフチルイミダゾール化合物は、
2−シクロヘキシル−4−(1−ナフチル)イミダゾール、
2−シクロヘキシル−4−(2−ナフチル)イミダゾール、
4−(1−ナフチル)−2−(4−ピリジル)イミダゾール及び
4−(2−ナフチル)−2−(4−ピリジル)イミダゾールである。
Hereinafter, the present invention will be described in detail.
The 4-naphthylimidazole compound of the present invention is
2-cyclohexyl-4- (1-naphthyl) imidazole,
2-cyclohexyl-4- (2-naphthyl) imidazole,
4- (1-naphthyl) -2- (4-pyridyl) imidazole and 4- (2-naphthyl) -2- (4-pyridyl) imidazole.
本発明の4−ナフチルイミダゾール化合物は、公知の方法に準拠して合成することが出来る。例えば、反応式(A)に示されるように、2位ハロゲン化アセトナフトン化合物及びアミジン化合物を脱ハロゲン化水素剤の存在下、有機溶媒中で加熱反応をさせることにより合成することができる。 The 4-naphthylimidazole compound of the present invention can be synthesized according to a known method. For example, as shown in the reaction formula (A), the 2-position halogenated acetonaphthone compound and amidine compound can be synthesized by heating in an organic solvent in the presence of a dehydrohalogenating agent.
前述の反応においてアミジン化合物の使用量は、2位ハロゲン化アセトナフトン化合物に対して、0.8〜1.5倍モルが好ましく、より好ましくは0.9〜1.1倍モルの割合とすればよい。脱ハロゲン化水素剤の使用量は、2位ハロゲン化アセトナフトン化合物に対して、1〜10倍当量の割合が好ましい。 In the above reaction, the amount of the amidine compound used is preferably 0.8 to 1.5 times mol, more preferably 0.9 to 1.1 times mol with respect to the 2-position halogenated acetonaphthone compound. Good. The amount of the dehydrohalogenating agent used is preferably a ratio of 1 to 10 times equivalent to the 2-position halogenated acetonaphthone compound.
前記の2位ハロゲン化アセトナフトン化合物としては、2−クロロ−1′−アセトナフトン、2−ブロモ−1′−アセトナフトン、2−ヨード−1′−アセトナフトン、2−クロロ−2′−アセトナフトン、2−ブロモ−2′−アセトナフトン及び2−ヨード−2′−アセトナフトンが挙げられる。 Examples of the 2-position halogenated acetonaphthone compound include 2-chloro-1′-acetonaphthone, 2-bromo-1′-acetonaphthone, 2-iodo-1′-acetonaphthone, 2-chloro-2′-acetonaphthone, and 2-bromo. -2'-acetonaphthone and 2-iodo-2'-acetonaphthone.
これらの2位ハロゲン化アセトナフトン化合物は、アセトナフトン化合物の2位をハロゲン化することにより合成することができる。2位ハロゲン化の内、2位塩素化及び2位ヨウ素化も可能であるが、アセトナフトン化合物1モルに対し、1モルの臭素を反応させる2位臭素化が最も簡便である。 These 2-position halogenated acetonaphthone compounds can be synthesized by halogenating the 2-position of the acetonaphthone compound. Among the 2-position halogenations, 2-position chlorination and 2-position iodination are possible, but 2-position bromination in which 1 mole of bromine is reacted with 1 mole of acetonaphthone compound is the simplest.
前記のアセトナフトン化合物としては、1−アセトナフトン及び2−アセトナフトンが挙げられる。これらは公知の化合物であり、試薬として市販されているものを使用することができる。 Examples of the acetonaphthone compound include 1-acetonaphthone and 2-acetonaphthone. These are known compounds, and those commercially available as reagents can be used.
前記のアミジン化合物は、公知の方法に準拠して合成することができる。すなわち、シクロヘキサンカルボキサミジンは、反応式(B)に示されるように、シクロヘキサンカルボニトリルを塩化水素ガス及びエタノール等の低級アルコールと反応させ、シクロヘキサンイミド酸エステル・塩酸塩に変換し、更にアンモニアと反応させることによって塩酸塩として合成することができる。 The amidine compound can be synthesized according to a known method. That is, as shown in the reaction formula (B), cyclohexanecarboxamidine reacts with cyclohexanecarbonitrile with a lower alcohol such as hydrogen chloride gas and ethanol to convert to cyclohexane imido acid ester / hydrochloride, and further with ammonia. It can synthesize | combine as hydrochloride by making it react.
また、4−ピリジンカルボキサミジンは、反応式(C)に示されるように、ナトリウムメトキシドを触媒として4−ピリジンカルボニトリルをメタノールと反応させ、次いで塩化アンモニウムと反応させることによって塩酸塩として合成することができる。
4-pyridinecarboxamidine is synthesized as a hydrochloride salt by reacting 4-pyridinecarbonitrile with methanol using sodium methoxide as a catalyst and then reacting with ammonium chloride, as shown in reaction formula (C). can do.
4−ナフチルイミダゾール化合物の合成には、上記の反応で得られるシクロヘキサンカルボキサミジン・塩酸塩及び4−ピリジンカルボキサミジン・塩酸塩を使用することができるが、フリー体(シクロヘキサンカルボキサミジン及び4−ピリジンカルボキサミジン)にしたもの及び臭化水素酸塩等の無機酸塩や酢酸塩等の有機酸塩も使用することができる。
また、前記のシクロヘキサンカルボニトリル及び4−ピリジンカルボニトリルは公知の物質であり、試薬として市販されているものを使用することができる。
For the synthesis of the 4-naphthylimidazole compound, cyclohexanecarboxamidine / hydrochloride and 4-pyridinecarboxamidine / hydrochloride obtained by the above reaction can be used, but free forms (cyclohexanecarboxamidine and 4 -Pyridinecarboxamidine) and inorganic acid salts such as hydrobromide and organic acid salts such as acetate can also be used.
Moreover, the said cyclohexane carbonitrile and 4-pyridine carbonitrile are well-known substances, and what is marketed as a reagent can be used.
前記の脱ハロゲン化水素剤としては、公知のものを制限なく使用できる。このような脱ハロゲン化水素剤としては、例えば、水酸化ナトリウム、水酸化カリウム、水酸化カルシウム、炭酸ナトリウム、炭酸カリウム、重炭酸ナトリウム、重炭酸カリウムのような無機アルカリ類、トリエチルアミン、1,8−ジアザビシクロ[5,4,0]−7−ウンデセン(DBU)のような有機塩基類、ナトリウムメトキシド、カリウムtert−ブトキシドのような金属アルコキシド化合物などが挙げられる。 As the dehydrohalogenating agent, known ones can be used without limitation. Examples of such a dehydrohalogenating agent include inorganic alkalis such as sodium hydroxide, potassium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, triethylamine, 1,8 -Organic bases such as diazabicyclo [5,4,0] -7-undecene (DBU), metal alkoxide compounds such as sodium methoxide, potassium tert-butoxide, and the like.
前記の有機溶媒としては、2位ハロゲン化アセトナフトン化合物及びアミジン化合物を溶解することができ、かつ反応に関与しないものであれば公知のものを制限なく使用できる。このような溶媒として、例えば、イソプロピルアルコール、tert−ブチルアルコールなどのアルコール類、ヘキサン、トルエンなどの炭化水素類、クロロホルム、クロロベンゼンなどのハロゲン化炭化水素類、酢酸エチルなどのエステル類、アセトニトリルなどのニトリル類、テトラヒドロフラン、ジオキサン、エチレングリコールジメチルエーテルなどのエーテル類、N,N−ジメチルホルムアミド(DMF)、N,N−ジメチルアセトアミド(DMAC)などのアミド類、ジメチルスルホキシド(DMSO)などが挙げられ、これらの溶媒を組み合わせて使用してもよい。 As said organic solvent, a well-known thing can be used without a restriction | limiting, if a 2-position halogenated acetonaphthone compound and an amidine compound can be melt | dissolved and it does not participate in reaction. Examples of such solvents include alcohols such as isopropyl alcohol and tert-butyl alcohol, hydrocarbons such as hexane and toluene, halogenated hydrocarbons such as chloroform and chlorobenzene, esters such as ethyl acetate, and acetonitrile. Nitriles, tetrahydrofuran, dioxane, ethers such as ethylene glycol dimethyl ether, amides such as N, N-dimethylformamide (DMF) and N, N-dimethylacetamide (DMAC), and dimethyl sulfoxide (DMSO) These solvents may be used in combination.
反応温度については、室温〜還流温度とすることが好ましく、反応時間については、1〜10時間とすることが好ましい。反応は、通常大気圧下で行えばよい。 The reaction temperature is preferably room temperature to reflux temperature, and the reaction time is preferably 1 to 10 hours. The reaction may be usually performed under atmospheric pressure.
以上の反応条件下で生成した4−ナフチルイミダゾール化合物は、通常の後処理によって単離することができる。
例えば、反応終了後の反応混合物を水層と有機溶媒層に分配し、有機溶媒層を水で洗浄することにより結晶として析出する粗製の4−ナフチルイミダゾール化合物を得ることができ、それを再結晶操作等により精製することができる。
The 4-naphthylimidazole compound produced under the above reaction conditions can be isolated by ordinary post-treatment.
For example, the reaction mixture after completion of the reaction is divided into an aqueous layer and an organic solvent layer, and the organic solvent layer is washed with water to obtain a crude 4-naphthylimidazole compound that precipitates as crystals, which is recrystallized. It can be purified by operation or the like.
この4−ナフチルイミダゾール化合物は、水に溶解させて調製される銅の酸化防止剤の有効成分として使用される。該イミダゾール化合物は酸化防止剤中に、0.01〜10重量%の割合、好ましくは0.1〜5重量%の割合で含有される。該イミダゾール化合物の含有割合が0.01重量%より少ないと、銅表面に形成される化成皮膜の膜厚が薄くなり、銅表面の酸化を十分に防止することができない。また、10重量%より多い場合には酸化防止剤中に該イミダゾール化合物が溶け残ったり、あるいは完溶したとしても再析出する虞があり好ましくない。 This 4-naphthylimidazole compound is used as an active ingredient of a copper antioxidant prepared by dissolving in water. The imidazole compound is contained in the antioxidant in a proportion of 0.01 to 10% by weight, preferably in a proportion of 0.1 to 5% by weight. When the content ratio of the imidazole compound is less than 0.01% by weight, the film thickness of the chemical conversion film formed on the copper surface becomes thin, and oxidation of the copper surface cannot be sufficiently prevented. On the other hand, when the amount is more than 10% by weight, the imidazole compound may remain undissolved in the antioxidant or may be reprecipitated even if it is completely dissolved.
本発明の実施において、当該イミダゾール化合物を水に溶解(水溶液化)するに当たっては、一般的には、酸として有機酸又は無機酸を使用するが、少量の有機溶剤を併用しても良い。この際に使用される代表的な有機酸としては、蟻酸、酢酸、プロピオン酸、酪酸、グリオキシル酸、ピルビン酸、アセト酢酸、レブリン酸、ヘプタン酸、カプリル酸、カプリン酸、ラウリン酸、グリコール酸、グリセリン酸、乳酸、グルコン酸、アクリル酸、メトキシ酢酸、エトキシ酢酸、プロポキシ酢酸、ブトキシ酢酸、2−(2−メトキシエトキシ)酢酸、2−[2−(2−エトキシエトキシ)エトキシ]酢酸、2−{2−[2−(2−エトキシエトキシ)エトキシ]エトキシ}酢酸、3−メトキシプロピオン酸、3−エトキシプロピオン酸、3−プロポキシプロピオン酸、3−ブトキシプロピオン酸、安息香酸、パラニトロ安息香酸、パラトルエンスルホン酸、サリチル酸、ピクリン酸、蓚酸、コハク酸、マレイン酸、フマール酸、酒石酸、アジピン酸等が挙げられ、無機酸としては、塩酸、リン酸、硫酸、硝酸等が挙げられる。これらの酸は、酸化防止剤中に0.1〜50重量%の割合、好ましくは1〜30重量%の割合で含有される。 In the practice of the present invention, when the imidazole compound is dissolved in water (in aqueous solution), an organic acid or an inorganic acid is generally used as the acid, but a small amount of an organic solvent may be used in combination. Typical organic acids used in this case include formic acid, acetic acid, propionic acid, butyric acid, glyoxylic acid, pyruvic acid, acetoacetic acid, levulinic acid, heptanoic acid, caprylic acid, capric acid, lauric acid, glycolic acid, Glyceric acid, lactic acid, gluconic acid, acrylic acid, methoxyacetic acid, ethoxyacetic acid, propoxyacetic acid, butoxyacetic acid, 2- (2-methoxyethoxy) acetic acid, 2- [2- (2-ethoxyethoxy) ethoxy] acetic acid, 2- {2- [2- (2-Ethoxyethoxy) ethoxy] ethoxy} acetic acid, 3-methoxypropionic acid, 3-ethoxypropionic acid, 3-propoxypropionic acid, 3-butoxypropionic acid, benzoic acid, paranitrobenzoic acid, para Toluenesulfonic acid, salicylic acid, picric acid, succinic acid, succinic acid, maleic acid, fumaric acid, liquor Acid, and adipic acid. Examples of the inorganic acids, hydrochloric acid, phosphoric acid, sulfuric acid, and nitric acid. These acids are contained in the antioxidant in a proportion of 0.1 to 50% by weight, preferably 1 to 30% by weight.
また、有機溶剤としては、メタノール、エタノール、イソプロピルアルコールなどの低級アルコールあるいはアセトン、N,N−ジメチルホルムアミド、エチレングリコール等の水と自由に混和するものが適している。 As the organic solvent, those which are freely miscible with water such as lower alcohols such as methanol, ethanol and isopropyl alcohol or water such as acetone, N, N-dimethylformamide and ethylene glycol are suitable.
本発明の酸化防止剤には、銅の表面における化成皮膜の形成速度を速めるために銅化合物を添加することができ、また形成された化成皮膜の耐熱性を更に向上させるために亜鉛化合物を添加しても良い。
前記銅化合物の代表的なものとしては、酢酸銅、塩化第一銅、塩化第二銅、臭化第一銅、臭化第二銅、ヨウ化銅、水酸化銅、リン酸銅、硫酸銅、硝酸銅等が挙げられる。
また、前記亜鉛化合物の代表的なものとしては、酸化亜鉛、蟻酸亜鉛、酢酸亜鉛、蓚酸亜鉛、乳酸亜鉛、クエン酸亜鉛、硫酸亜鉛、硝酸亜鉛、リン酸亜鉛等が挙げられ、何れも酸化防止剤中に0.01〜10重量%の割合、好ましくは0.02〜5重量%の割合で含有させれば良い。
To the antioxidant of the present invention, a copper compound can be added in order to increase the formation rate of the chemical conversion film on the surface of copper, and a zinc compound is added to further improve the heat resistance of the formed chemical conversion film. You may do it.
Representative examples of the copper compound include copper acetate, cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, copper iodide, copper hydroxide, copper phosphate, copper sulfate. And copper nitrate.
Representative examples of the zinc compound include zinc oxide, zinc formate, zinc acetate, zinc oxalate, zinc lactate, zinc citrate, zinc sulfate, zinc nitrate, zinc phosphate, etc. What is necessary is just to make it contain in the ratio of 0.01-10 weight% in an agent, Preferably it is a ratio of 0.02-5 weight%.
本発明の酸化防止剤には、化成皮膜の形成速度及び該皮膜の耐熱性を更に向上させるために、ハロゲン化合物を酸化防止剤中に0.001〜1重量%、好ましくは0.01〜0.1重量%の含有割合となるように添加することができる。ハロゲン化合物としては、例えばフッ化ナトリウム、フッ化カリウム、フッ化アンモニウム、塩化ナトリム、塩化カリウム、塩化アンモニウム、臭化ナトリウム、臭化カリウム、臭化アンモニウム、ヨウ化ナトリム、ヨウ化カリウム、ヨウ化アンモニウム等が挙げられる。 In the antioxidant of the present invention, in order to further improve the formation rate of the chemical conversion film and the heat resistance of the film, the halogen compound is added in an amount of 0.001 to 1% by weight, preferably 0.01 to 0% in the antioxidant. .1% by weight can be added. Examples of the halogen compound include sodium fluoride, potassium fluoride, ammonium fluoride, sodium chloride, potassium chloride, ammonium chloride, sodium bromide, potassium bromide, ammonium bromide, sodium iodide, potassium iodide, and ammonium iodide. Etc.
本発明の酸化防止剤を用いて銅の表面を処理する際には、酸化防止剤のpHを調整することが好ましい。このpHは、酸化防止剤の組成(成分の種類と含有量)や後述する処理温度と処理時間に応じて適宜設定される。
pHを下げる場合には、前述の有機酸又は無機酸を使用することができ、pHを上げる場合には、水酸化ナトリウムや水酸化カリウムの他、アンモニアあるいはモノエタノールアミン、ジエタノールアミン、トリエタノールアミンなどのアミン類等の緩衝作用を有する物質が好ましく使用できる。
When treating the surface of copper using the antioxidant of the present invention, it is preferable to adjust the pH of the antioxidant. This pH is appropriately set according to the composition (type and content of components) of the antioxidant and the processing temperature and processing time described below.
When lowering the pH, the above-mentioned organic acid or inorganic acid can be used, and when raising the pH, in addition to sodium hydroxide or potassium hydroxide, ammonia or monoethanolamine, diethanolamine, triethanolamine, etc. Substances having a buffering action such as amines can be preferably used.
本発明の酸化防止剤を用いて銅の表面を処理する際の条件としては、酸化防止剤の液温を10〜70℃、接触時間を1秒〜10分とすることが好ましい。接触方法としては、浸漬、噴霧、塗布等の方法が挙げられる。 As conditions for treating the surface of copper using the antioxidant of the present invention, the liquid temperature of the antioxidant is preferably 10 to 70 ° C., and the contact time is preferably 1 second to 10 minutes. Examples of the contact method include dipping, spraying, and application methods.
以下、本発明を実施例によって具体的に説明するが、本発明はこれらに限定されるものではない。なお、2−ブロモ−1′−アセトナフトン、シクロヘキサンカルボキサミジン塩酸塩及び4−ピリジンカルボキサミジン塩酸塩の合成例を、参考例1〜3に示す。 EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. Reference examples 1 to 3 show synthesis examples of 2-bromo-1'-acetonaphthone, cyclohexanecarboxamidine hydrochloride and 4-pyridinecarboxamidine hydrochloride.
〔参考例1〕
<2−ブロモ−1′−アセトナフトン/トルエン溶液の調製>
1−アセトナフトン51.2g(0.300mol)及びメタノール70gからなる溶液に、18〜24℃にて、臭素48.5g(0.303mol)を1時間かけて滴下した。次いで、反応懸濁液を冷却後、濃縮物が101gになるまで減圧濃縮した。濃縮物をトルエン153g及び食塩水200gに分配し、トルエン層を食塩水200gで洗浄した後、硫酸ナトリウムで乾燥して、淡黄褐色透明の2−ブロモ−1′−アセトナフトン(0.300mol)/トルエン溶液を得た。
[Reference Example 1]
<Preparation of 2-bromo-1'-acetonaphthone / toluene solution>
To a solution consisting of 51.2 g (0.300 mol) of 1-acetonaphthone and 70 g of methanol, 48.5 g (0.303 mol) of bromine was added dropwise at 18-24 ° C. over 1 hour. The reaction suspension was then cooled and concentrated under reduced pressure until the concentrate reached 101 g. The concentrate was distributed between 153 g of toluene and 200 g of brine, and the toluene layer was washed with 200 g of brine and then dried over sodium sulfate to give pale tan transparent 2-bromo-1'-acetonaphthone (0.300 mol) / A toluene solution was obtained.
〔参考例2〕
<シクロヘキサンカルボキサミジン塩酸塩の合成>
シクロヘキサンカルボニトリル69.4g(0.636mol)及び脱水エタノール31.4g(0.682mol)からなる溶液に、冷却下3〜13℃にて、塩化水素ガス34.5g(0.946mol)を1時間45分間かけて吹き込んだ。同温度で6時間撹拌後、4℃/6日間静置し、固化した反応液から、減圧下にて揮発分を除去して、白色結晶性固体のシクロヘキサンイミド酸エチルエステル・塩酸塩124.2g(0.648mol、収率101.9%)を得た。
該固体を粉砕し、氷冷下に振とうしながら、アンモニア18.3g(1.075mol)及び脱水エタノール110.3gからなる溶液を少量ずつ加えた後、氷冷下にて4時間、室温に戻して更に一晩撹拌した。この懸濁液を減圧濃縮し112.3gのウエット結晶を得た。該結晶をヘキサン/ジクロロメタン混合溶剤(1:2体積比)で洗浄後、減圧下に乾燥して、白色結晶状のシクロヘキサンカルボキサミジン塩酸塩102.4g(0.630mol、収率99.0%)を得た。
[Reference Example 2]
<Synthesis of cyclohexanecarboxamidine hydrochloride>
A solution consisting of 69.4 g (0.636 mol) of cyclohexanecarbonitrile and 31.4 g (0.682 mol) of dehydrated ethanol was charged with 34.5 g (0.946 mol) of hydrogen chloride gas for 1 hour at 3-13 ° C. under cooling. Blowed over 45 minutes. The mixture was stirred at the same temperature for 6 hours, and then allowed to stand at 4 ° C. for 6 days. The volatile matter was removed from the solidified reaction solution under reduced pressure, and 124.2 g of white crystalline solid cyclohexane imido acid ethyl ester / hydrochloride was obtained. (0.648 mol, yield 101.9%) was obtained.
The solid was pulverized, and a solution consisting of 18.3 g (1.075 mol) of ammonia and 110.3 g of dehydrated ethanol was added little by little while shaking under ice cooling, and then the mixture was cooled to room temperature for 4 hours under ice cooling. The mixture was returned and stirred overnight. This suspension was concentrated under reduced pressure to obtain 112.3 g of wet crystals. The crystals were washed with a hexane / dichloromethane mixed solvent (1: 2 volume ratio) and then dried under reduced pressure to give 102.4 g (0.630 mol, yield 99.0%) of white crystalline cyclohexanecarboxamidine hydrochloride. )
〔参考例3〕
<4−ピリジンカルボキサミジン塩酸塩の合成>
4−ピリジンカルボニトリル104.2g(1.00mol)及びメタノール750mLからなる溶液に、室温下にて28%ナトリウムメトキシドメタノール溶液19.3g(0.100mol)及びメタノール150mLからなる溶液を加え、15時間撹拌した。次いで、塩化アンモニウム58.8g(1.10mol)を加え、45〜50℃にて1時間45分間撹拌した。その後、21℃まで冷却し、不溶物をろ去して、ろ液を減圧下乾固し、白色固体を得た。該固体を粉砕し、アセトンで洗浄後、減圧下に乾燥して、白色粉末状の4−ピリジンカルボキサミジン塩酸塩145.7g(0.924mol、収率92.4%)を得た。
[Reference Example 3]
<Synthesis of 4-pyridinecarboxamidine hydrochloride>
To a solution consisting of 104.2 g (1.00 mol) of 4-pyridinecarbonitrile and 750 mL of methanol, a solution consisting of 19.3 g (0.100 mol) of a 28% sodium methoxide methanol solution and 150 mL of methanol was added at room temperature. Stir for hours. Subsequently, 58.8 g (1.10 mol) of ammonium chloride was added, and the mixture was stirred at 45 to 50 ° C. for 1 hour and 45 minutes. Then, it cooled to 21 degreeC, the insoluble matter was removed by filtration, and the filtrate was dried under reduced pressure, and white solid was obtained. The solid was pulverized, washed with acetone, and dried under reduced pressure to obtain 145.7 g (0.924 mol, yield 92.4%) of 4-pyridinecarboxamidine hydrochloride as a white powder.
〔実施例1〕
<2−シクロヘキシル−4−(1−ナフチル)イミダゾールの合成>
シクロヘキサンカルボキサミジン塩酸塩48.8g(0.300mol)をN,N−ジメチルアセトアミド121gに45℃にて加温懸濁させ、炭酸カリウム112g(0.810mol)を加えて42〜45℃/1時間撹拌後、参考例1で調製した2−ブロモ−1′−アセトナフトン/トルエン溶液を43〜52℃にて52分間かけて滴下した。滴下終了後、68〜70℃にて2時間30分間撹拌した。
次いで、反応懸濁液を冷却後、水1Lと撹拌し、分液した有機層を水1Lで洗浄した。有機層が約半分の量になるまで減圧濃縮し結晶を析出させた。該結晶をろ取し、トルエンで洗浄した後、減圧下に乾燥して褐色粉末を得た。該粉末をアセトニトリル300mL及びエタノール150mLの混合溶剤より再結晶して、乳白色粉末29.3gを得た。
[Example 1]
<Synthesis of 2-cyclohexyl-4- (1-naphthyl) imidazole>
Cyclohexanecarboxamidine hydrochloride (48.8 g, 0.300 mol) was suspended in N, N-dimethylacetamide (121 g) at 45 ° C., and potassium carbonate (112 g, 0.810 mol) was added. After stirring for a period of time, the 2-bromo-1′-acetonaphthone / toluene solution prepared in Reference Example 1 was added dropwise at 43 to 52 ° C. over 52 minutes. After completion of dropping, the mixture was stirred at 68 to 70 ° C. for 2 hours and 30 minutes.
Next, the reaction suspension was cooled, stirred with 1 L of water, and the separated organic layer was washed with 1 L of water. Crystals were deposited by concentration under reduced pressure until the organic layer was about half the amount. The crystals were collected by filtration, washed with toluene, and dried under reduced pressure to obtain a brown powder. The powder was recrystallized from a mixed solvent of 300 mL of acetonitrile and 150 mL of ethanol to obtain 29.3 g of milky white powder.
得られた粉末の融点、薄層クロマトグラフィーのRf値、1H NMR及びマススペクトルデータは、以下のとおりであった。
・mp192−193℃
・TLC(シリカゲル,アセトン):Rf=0.65
・1H NMR(DMSO-d6):δ=1.06−2.03(m,11H),7.07−8.83(m,8H).
・MS(EI):m/z(%)=276(M+,59),247(19),235(12),221(100),208(43),167(35),152(7),139(14),127(4),110(6).
これらのスペクトルデータから、得られた粉末は、化学式(IV)で示される2−シクロヘキシル−4−(1−ナフチル)イミダゾールであるものと同定した。収率35.3%。
The melting point of the obtained powder, Rf value of thin layer chromatography, 1 H NMR and mass spectrum data were as follows.
・ Mp192-193 ℃
・ TLC (silica gel, acetone): Rf = 0.65
1 H NMR (DMSO-d 6 ): δ = 1.06-2.03 (m, 11H), 7.07-8.83 (m, 8H).
MS (EI): m / z (%) = 276 (M + , 59), 247 (19), 235 (12), 221 (100), 208 (43), 167 (35), 152 (7) , 139 (14), 127 (4), 110 (6).
From these spectrum data, the obtained powder was identified to be 2-cyclohexyl-4- (1-naphthyl) imidazole represented by the chemical formula (IV). Yield 35.3%.
〔実施例2〕
<2−シクロヘキシル−4−(2−ナフチル)イミダゾールの合成>
まず、参考例1の1−アセトナフトンを2−アセトナフトンに代えて、参考例1の方法に準拠して2−ブロモ−2′−アセトナフトン/トルエン溶液を調製した。
実施例1の2−ブロモ−1′−アセトナフトン/トルエン溶液を2−ブロモ−2′−アセトナフトン/トルエン溶液に代えて、実施例1の方法に準拠して合成試験を行い、微黄褐色結晶を得た。
[Example 2]
<Synthesis of 2-cyclohexyl-4- (2-naphthyl) imidazole>
First, 2-bromo-2'-acetonaphthone / toluene solution was prepared according to the method of Reference Example 1 except that 1-acetonaphthone of Reference Example 1 was replaced with 2-acetonaphthone.
The 2-bromo-1′-acetonaphthone / toluene solution of Example 1 was replaced with a 2-bromo-2′-acetonaphthone / toluene solution, and a synthetic test was conducted according to the method of Example 1 to obtain slightly yellowish brown crystals. Obtained.
得られた結晶の融点、薄層クロマトグラフィーのRf値、1H NMR及びマススペクトルデータは、以下のとおりであった。
・mp199−201℃
・TLC(シリカゲル,アセトン):Rf=0.64
・1H NMR(DMSO-d6):δ=1.24−2.00(m,11H),7.35−8.26(m,8H).
・MS(EI):m/z(%)=276(M+,58),247(20),235(12),221(100),208(43),167(12),152(6),139(17),127(4),111(7).
これらのスペクトルデータから、得られた結晶は、化学式(V)で示される2−シクロヘキシル−4−(2−ナフチル)イミダゾールであるものと同定した。収率35.0%。
The melting point of the obtained crystal, Rf value of thin layer chromatography, 1 H NMR and mass spectral data were as follows.
・ Mp199-201 ℃
・ TLC (silica gel, acetone): Rf = 0.64
1 H NMR (DMSO-d 6 ): δ = 1.24-2.00 (m, 11H), 7.35-8.26 (m, 8H).
MS (EI): m / z (%) = 276 (M + , 58), 247 (20), 235 (12), 221 (100), 208 (43), 167 (12), 152 (6) , 139 (17), 127 (4), 111 (7).
From these spectrum data, the obtained crystal was identified to be 2-cyclohexyl-4- (2-naphthyl) imidazole represented by the chemical formula (V). Yield 35.0%.
〔実施例3〕
<4−(1−ナフチル)−2−(4−ピリジル)イミダゾールの合成>
実施例1のシクロヘキサンカルボキサミジン塩酸塩を4−ピリジンカルボキサミジン塩酸塩に代えて、実施例1の方法に準拠して合成試験を行い、ベージュ色粉末を得た。
Example 3
<Synthesis of 4- (1-naphthyl) -2- (4-pyridyl) imidazole>
A synthetic test was conducted in accordance with the method of Example 1 by replacing cyclohexanecarboxamidine hydrochloride of Example 1 with 4-pyridinecarboxamidine hydrochloride to obtain a beige powder.
得られた粉末の融点、薄層クロマトグラフィーのRf値、1H NMR及びマススペクトルデータは、以下のとおりであった。
・mp173−175℃
・TLC(シリカゲル,アセトン):Rf=0.31
・1H NMR(DMSO-d6):δ=7.57−8.71(m).
・MS(EI):m/z(%)=271(M+,100),243(4),167(45),139(22),118(4),105(4).
これらのスペクトルデータから、得られた粉末は、化学式(VI)で示される4−(1−ナフチル)−2−(4−ピリジル)イミダゾールであるものと同定した。収率25.2%。
The melting point of the obtained powder, Rf value of thin layer chromatography, 1 H NMR and mass spectrum data were as follows.
・ Mp173-175 ℃
・ TLC (silica gel, acetone): Rf = 0.31
1 H NMR (DMSO-d 6 ): δ = 7.57-8.71 (m).
MS (EI): m / z (%) = 271 (M + , 100), 243 (4), 167 (45), 139 (22), 118 (4), 105 (4).
From these spectral data, the obtained powder was identified as 4- (1-naphthyl) -2- (4-pyridyl) imidazole represented by the chemical formula (VI). Yield 25.2%.
〔実施例4〕
まず、実施例1〜3において合成した4−ナフチルイミダゾール化合物と、これらとは別に2−フェニルイミダゾール(2PZ、四国化成工業製)を有効成分とする銅の酸化防止剤を各々調製した。次いで、該防止剤に銅を接触させることにより銅の表面に化成皮膜を形成させた。そして、銅に対する溶融半田の濡れ時間を測定して、イミダゾール化合物が作用する銅表面への酸化防止性能を評価した。この場合、溶融半田の濡れ時間が短い程、イミダゾール化合物の酸化防止性能が優れているものと判定される。
評価試験の詳細は、次のとおりである。
(1)酸化防止剤の調製
イミダゾール化合物、酸、金属塩及びハロゲン化合物を、表1記載の組成となるようにイオン交換水に溶解させた後、アンモニア水でpHを調整して酸化防止剤を調製した。
(2)表面処理方法
材質が金属銅の試験片(5mm×50mm×0.3mmの銅版)を脱脂し、次いでソフトエッチングを行い、所定温度の酸化防止剤に所定時間浸漬して、銅の表面に化成皮膜を形成させた後、水洗して乾燥した。
(3)濡れ時間の測定
表面処理を行った試験片を、ポストフラックス(JS−64MSS、弘輝製)に浸漬して、半田濡れ性試験器(SAT−2000、レスカ製)を使用して半田濡れ時間(秒)を測定した。使用した半田は錫−鉛系共晶半田(H63A−B20、千住金属工業製)であり、測定条件は半田温度240℃、浸漬深さ2mm、浸漬スピード16mm/秒とした。
なお、半田濡れ時間を測定した試験片は、(A)表面処理直後のものと、(B)温度40℃、湿度90%RHの恒温恒湿器に入れて96時間放置したものと、(C)さらに200℃で10分間加熱したものである。
得られた試験結果は、表1に示したとおりであった。
Example 4
First, the 4-naphthyl imidazole compound synthesize | combined in Examples 1-3 and the copper antioxidant which uses 2-phenyl imidazole (2PZ, Shikoku Chemical Industries make) as an active ingredient separately from these were prepared, respectively. Next, a chemical conversion film was formed on the surface of copper by bringing the inhibitor into contact with copper. And the wetting time of the molten solder with respect to copper was measured, and the antioxidant performance to the copper surface on which an imidazole compound acts was evaluated. In this case, it is determined that the shorter the wet time of the molten solder, the better the antioxidant performance of the imidazole compound.
The details of the evaluation test are as follows.
(1) Preparation of antioxidant After dissolving an imidazole compound, an acid, a metal salt, and a halogen compound in ion-exchanged water so as to have the composition shown in Table 1, the pH is adjusted with ammonia water to thereby add an antioxidant. Prepared.
(2) Surface treatment method A test piece (copper plate of 5 mm × 50 mm × 0.3 mm) made of metallic copper is degreased, then soft-etched, and immersed in an antioxidant at a predetermined temperature for a predetermined time to obtain a copper surface. After the chemical conversion film was formed on, it was washed with water and dried.
(3) Measurement of wetting time The surface-treated test piece is immersed in post-flux (JS-64MSS, manufactured by Hiroki) and solder wetted using a solder wettability tester (SAT-2000, manufactured by Resuka). Time (seconds) was measured. The solder used was tin-lead eutectic solder (H63A-B20, manufactured by Senju Metal Industry), and the measurement conditions were a solder temperature of 240 ° C., an immersion depth of 2 mm, and an immersion speed of 16 mm / second.
In addition, the test piece which measured the solder wetting time includes (A) a sample immediately after the surface treatment, (B) a sample left in a constant temperature and humidity chamber at a temperature of 40 ° C. and a humidity of 90% RH for 96 hours, and (C ) Further heated at 200 ° C. for 10 minutes.
The test results obtained were as shown in Table 1.
表1に示した試験結果によれば、本願発明の4−ナフチルイミダゾール化合物を有効成分として含有する酸化防止剤は、銅の表面に耐湿性及び耐熱性に優れた化成皮膜を形成させることができるので、銅表面の酸化防止に有用である。 According to the test results shown in Table 1, the antioxidant containing the 4-naphthylimidazole compound of the present invention as an active ingredient can form a chemical conversion film excellent in moisture resistance and heat resistance on the surface of copper. Therefore, it is useful for preventing oxidation of the copper surface.
本発明によれば、金属、特に銅(銅合金を含む)の表面の酸化防止剤や、エポキシ樹脂の硬化剤又は硬化促進剤として、また医農薬分野の中間原料としても有用な4−ナフチルイミダゾール化合物を提供することができる。また、銅表面をはんだ付けする際のはんだ付け性を良好なものとする酸化防止剤を提供することができる。 According to the present invention, 4-naphthylimidazole is useful as an antioxidant on the surface of metals, particularly copper (including copper alloys), as a curing agent or curing accelerator for epoxy resins, and as an intermediate material in the field of medicine and agrochemicals. A compound can be provided. Moreover, the antioxidant which makes the solderability at the time of soldering the copper surface favorable can be provided.
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CN113234062A (en) * | 2021-04-29 | 2021-08-10 | 赣州市贝加尔电子材料有限公司 | Pyrazinylimidazole compound, weldable protective agent, preparation method and application of pyrazinylimidazole compound and weldable protective agent |
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JPS579866A (en) * | 1980-06-20 | 1982-01-19 | Hitachi Ltd | Electroless copper plating solution |
JP2007297685A (en) * | 2006-05-01 | 2007-11-15 | Shikoku Chem Corp | Surface treatment agent for metal, and its utilization |
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CN111057043A (en) * | 2019-11-29 | 2020-04-24 | 深圳市贝加电子材料有限公司 | Imidazole compound, preparation method and application thereof, organic weldable protective agent containing imidazole compound and surface treatment method |
CN111057043B (en) * | 2019-11-29 | 2021-11-02 | 深圳市贝加电子材料有限公司 | Imidazole compound, preparation method and application thereof, organic weldable protective agent containing imidazole compound and surface treatment method |
CN113234062A (en) * | 2021-04-29 | 2021-08-10 | 赣州市贝加尔电子材料有限公司 | Pyrazinylimidazole compound, weldable protective agent, preparation method and application of pyrazinylimidazole compound and weldable protective agent |
CN113234062B (en) * | 2021-04-29 | 2022-07-08 | 赣州市贝加尔电子材料有限公司 | Pyrazinylimidazole compound, weldable protective agent, preparation method and application of pyrazinylimidazole compound and weldable protective agent |
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