JPS63206494A - Bright copper-zinc-tin alloy electroplating bath containing no cyanide compound - Google Patents
Bright copper-zinc-tin alloy electroplating bath containing no cyanide compoundInfo
- Publication number
- JPS63206494A JPS63206494A JP3859487A JP3859487A JPS63206494A JP S63206494 A JPS63206494 A JP S63206494A JP 3859487 A JP3859487 A JP 3859487A JP 3859487 A JP3859487 A JP 3859487A JP S63206494 A JPS63206494 A JP S63206494A
- Authority
- JP
- Japan
- Prior art keywords
- salt
- zinc
- bath
- copper
- salts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 cyanide compound Chemical class 0.000 title claims abstract description 23
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 20
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000009713 electroplating Methods 0.000 title claims abstract description 16
- 150000003839 salts Chemical class 0.000 claims abstract description 29
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 150000001879 copper Chemical class 0.000 claims abstract description 15
- 150000003751 zinc Chemical class 0.000 claims abstract description 14
- 239000002253 acid Substances 0.000 claims abstract description 13
- 150000001413 amino acids Chemical class 0.000 claims abstract description 12
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical class OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims description 11
- 229920000137 polyphosphoric acid Polymers 0.000 claims description 9
- 229940005657 pyrophosphoric acid Drugs 0.000 claims description 9
- 150000007513 acids Chemical class 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 48
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract description 8
- 239000008139 complexing agent Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000002244 precipitate Substances 0.000 abstract description 2
- 239000002341 toxic gas Substances 0.000 abstract description 2
- 239000010949 copper Substances 0.000 description 13
- 239000011701 zinc Substances 0.000 description 10
- 235000001014 amino acid Nutrition 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 229910001297 Zn alloy Inorganic materials 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- FFRBMBIXVSCUFS-UHFFFAOYSA-N 2,4-dinitro-1-naphthol Chemical compound C1=CC=C2C(O)=C([N+]([O-])=O)C=C([N+]([O-])=O)C2=C1 FFRBMBIXVSCUFS-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 239000002932 luster Substances 0.000 description 4
- 150000002825 nitriles Chemical class 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 3
- RSEBUVRVKCANEP-UHFFFAOYSA-N 2-pyrroline Chemical compound C1CC=CN1 RSEBUVRVKCANEP-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 235000011180 diphosphates Nutrition 0.000 description 2
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 description 2
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 159000000001 potassium salts Chemical class 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229940048084 pyrophosphate Drugs 0.000 description 2
- ZVJHJDDKYZXRJI-UHFFFAOYSA-N pyrroline Natural products C1CC=NC1 ZVJHJDDKYZXRJI-UHFFFAOYSA-N 0.000 description 2
- 229940079864 sodium stannate Drugs 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- IBZGBXXTIGCACK-UHFFFAOYSA-N 6,7,9,11-tetrahydroxy-9-(2-hydroxyacetyl)-4-methoxy-8,10-dihydro-7h-tetracene-5,12-dione Chemical compound C1C(O)(C(=O)CO)CC(O)C2=C1C(O)=C1C(=O)C(C=CC=C3OC)=C3C(=O)C1=C2O IBZGBXXTIGCACK-UHFFFAOYSA-N 0.000 description 1
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- CANRESZKMUPMAE-UHFFFAOYSA-L Zinc lactate Chemical compound [Zn+2].CC(O)C([O-])=O.CC(O)C([O-])=O CANRESZKMUPMAE-UHFFFAOYSA-L 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000001371 alpha-amino acids Chemical class 0.000 description 1
- 235000008206 alpha-amino acids Nutrition 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- ZQLBQWDYEGOYSW-UHFFFAOYSA-L copper;disulfamate Chemical compound [Cu+2].NS([O-])(=O)=O.NS([O-])(=O)=O ZQLBQWDYEGOYSW-UHFFFAOYSA-L 0.000 description 1
- 229940076286 cupric acetate Drugs 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 239000011641 cupric citrate Substances 0.000 description 1
- 235000019855 cupric citrate Nutrition 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229940111695 potassium tartrate Drugs 0.000 description 1
- 235000011005 potassium tartrates Nutrition 0.000 description 1
- WSHYKIAQCMIPTB-UHFFFAOYSA-M potassium;2-oxo-3-(3-oxo-1-phenylbutyl)chromen-4-olate Chemical compound [K+].[O-]C=1C2=CC=CC=C2OC(=O)C=1C(CC(=O)C)C1=CC=CC=C1 WSHYKIAQCMIPTB-UHFFFAOYSA-M 0.000 description 1
- 244000144977 poultry Species 0.000 description 1
- 239000001476 sodium potassium tartrate Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- STDMRMREKPZQFJ-UHFFFAOYSA-H tricopper;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O STDMRMREKPZQFJ-UHFFFAOYSA-H 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229960000314 zinc acetate Drugs 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011576 zinc lactate Substances 0.000 description 1
- 235000000193 zinc lactate Nutrition 0.000 description 1
- 229940050168 zinc lactate Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229960001296 zinc oxide Drugs 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- OMSYGYSPFZQFFP-UHFFFAOYSA-J zinc pyrophosphate Chemical compound [Zn+2].[Zn+2].[O-]P([O-])(=O)OP([O-])([O-])=O OMSYGYSPFZQFFP-UHFFFAOYSA-J 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
良1」」久B也立
本発明は、シアン化合物を含まない光沢銅−亜鉛−錫合
金電気めっき浴(以下「電気めっき浴」を単に「めつき
浴」という)に関する。[Detailed Description of the Invention] Good 1" Hisashi B Yatatsu The present invention provides a bright copper-zinc-tin alloy electroplating bath (hereinafter "electroplating bath" is simply referred to as "plating bath") that does not contain cyanide compounds. Regarding.
従来の技術とその問題点
銅−亜鉛−錫合金めつぎは、代用金めつきとも呼ばれて
おり、金属製品、プラスチック製品、セラミックス製品
等に黄金色の金属光沢及び色調を付与するための装飾め
っきとして広く使用されている。銅−亜鉛合金めっきも
同様の目的に使用されるが、黄緑がかった所謂真鍮色の
めつきになる場合が多い。そこで、24にの金めつぎに
近い色調が要望される場合には、銅−亜鉛合金めっき浴
に錫を添加した銅−亜鉛−錫合金めっき浴が用いられて
いる。しかし、現在、工業的に広く用いられている銅−
亜鉛−錫合金めっき浴は、全て、シアン化合物を多聞に
含んだ銅−亜鉛合金めっき浴に錫酸ナトリウム、錫酸カ
リウム等を添加したものであり、その毒性が大きな問題
となっている。Conventional technology and its problems Copper-zinc-tin alloy metal plating, also called substitute gold plating, is a decoration method used to impart a golden metallic luster and color tone to metal products, plastic products, ceramic products, etc. Widely used as plating. Copper-zinc alloy plating is also used for the same purpose, but often results in a so-called brass-colored plating with a yellow-green tint. Therefore, when a color tone similar to that of No. 24 gold plating is desired, a copper-zinc-tin alloy plating bath in which tin is added to a copper-zinc alloy plating bath is used. However, copper, which is currently widely used industrially,
All zinc-tin alloy plating baths are made by adding sodium stannate, potassium stannate, etc. to a copper-zinc alloy plating bath containing a large amount of cyanide, and their toxicity is a major problem.
シアン化合物を含まない銅−亜鉛合金めっき浴或いは銅
−亜鉛一錫めっき浴に関しては数多くの報告が成されて
いるが、何れも実用に至っていない。Although many reports have been made regarding copper-zinc alloy plating baths or copper-zinc monotin plating baths that do not contain cyanide compounds, none of them have been put to practical use.
例えば、ピロリン酸カリウムを錯化剤とする鍍金箔につ
いてのティ・エル・ラマチャーの研究〔エレクトロプレ
イティング・アンド・メタル・フィニツシング、12,
326 (1959))は署名であるが、このピロリン
酸カリウム浴には、得られる銅−亜鉛合金めっきの金色
の光沢範囲が狭い、陽極が不動態化し易い等の欠点があ
る。越浦らは、ピロリン酸カリウム浴にアルカノールポ
リアミンどエピハロヒドリンとのm合物を添加すること
によって上記の欠点を解消し、更に錫酸塩を添加するこ
とによってシアン化合物を含まない銅−亜鉛−錫合金め
っき浴を開発した(特開昭59−215492号)。し
かしながら、この方法は、析出する合金の金属比がCu
:Zn=7〜8:3〜2であるのに対し、めっき浴中の
金属濃度比はCu:Zn=約1:9であるので、安定し
た連続作業を行なうための陽極の選定が困難になるとい
う欠点を有している。For example, T. L. Ramachar's research on plating foil using potassium pyrophosphate as a complexing agent [Electroplating and Metal Finishing, 12,
326 (1959)), but this potassium pyrophosphate bath has drawbacks such as a narrow golden luster range of the resulting copper-zinc alloy plating and easy passivation of the anode. Koshiura et al. solved the above drawbacks by adding a mixture of alkanol polyamine and epihalohydrin to a potassium pyrophosphate bath, and further added stannate to prepare a cyanide-free copper-zinc-tin solution. Developed an alloy plating bath (Japanese Patent Application Laid-Open No. 59-215492). However, in this method, the metal ratio of the precipitated alloy is Cu.
:Zn=7-8:3-2, whereas the metal concentration ratio in the plating bath is Cu:Zn=approximately 1:9, making it difficult to select an anode for stable continuous operation. It has the disadvantage of being
問題点を解決するための手
本発明者は、上記従来技術の問題点に鑑みて鋭意研究を
Φねた結果、銅塩、!II!鉛塩及び錫塩とともに、錯
化剤としてのピロリン酸のアルカリ金属塩又はポリリン
酸のアルカリ金属塩及びオキシカルボン酸又はその塩、
並びにアミノ酸又はその塩を含有し、シアン化合物を含
まない無毒性の浴を使用することによって、極めて優れ
た光沢を右し、装飾価値の高い黄金色の銅−亜鉛−錫合
金めっき皮膜を幅広い電流密度範囲で得られることを見
い出しを、本発明を完成した。A method for solving the problems The inventor of the present invention has conducted intensive research in view of the problems of the above-mentioned prior art, and as a result, has found that copper salt! II! Alkali metal salts of pyrophosphoric acid or alkali metal salts of polyphosphoric acid and oxycarboxylic acids or salts thereof as complexing agents, together with lead salts and tin salts;
By using a non-toxic bath that contains amino acids or their salts and does not contain cyanide compounds, a golden copper-zinc-tin alloy plating film with extremely high gloss and high decorative value can be coated with a wide range of electrical currents. The present invention has been completed with the discovery that a range of densities can be obtained.
即ち本発明は、a)銅塩、亜鉛塩及び錫塩、b)ピロリ
ン酸のアルカリ金属塩及びポリリン酸のアルカリ金属塩
から選ばれた少くとも1種、c)オキシカルボン酸及び
その塩から選ばれた少くど51種並びにd)アミノ酸及
びその塩から選ばれた少くとも1種を含有することを特
徴とする、シアン化合物を含まない光沢銅−亜鉛−錫合
金電気めっき浴に係る。That is, the present invention provides at least one selected from a) copper salts, zinc salts and tin salts, b) alkali metal salts of pyrophosphoric acid and alkali metal salts of polyphosphoric acid, and c) oxycarboxylic acids and their salts. The present invention relates to a bright copper-zinc-tin alloy electroplating bath that does not contain cyanide compounds and is characterized by containing at least one selected from d) amino acids and salts thereof.
本発明では、銅塩、亜鉛塩及び錫塩とともに、錯化剤と
してのピロリン酸又はポリリン酸のアルカリ金属塩及び
オキシカルボン酸又はその塩、並びにアミノ酸又はその
塩の3種の化合物を併用する場合にのみ、本発明の所期
の効果を達成できる。In the present invention, three types of compounds, namely, an alkali metal salt of pyrophosphoric acid or polyphosphoric acid as a complexing agent, an oxycarboxylic acid or a salt thereof, and an amino acid or a salt thereof, are used together with a copper salt, a zinc salt, and a tin salt. Only then can the desired effects of the present invention be achieved.
銅塩、亜鉛塩、錫塩及びピロリン酸のアルカリ金属塩又
はポリリン酸のアルカリ金属塩のみからなる浴を使用す
ると、得られるめっき皮膜は、低電流密度では銅が優先
的に析出して赤銅色になり、8電流密度ではヤケが生じ
る。その間の電流密度、即ち浴の組成によって決まる最
″1affi流密度士0、IA/dm2稈度の非常に狭
い範囲では、黄金色のめっき皮膜が得られるが、ガス跡
が激しく、その光沢は不充分である。銅塩、亜鉛塩、錫
塩及びオキシカルボン酸又はその塩からなる浴では、め
っき皮膜が暗緑色となり、黄金色のめっき皮膜は得られ
ない。銅塩、亜に1塩、錫塩及び上記2種の化合物を含
むめっき浴ぐは、低電流vIi度での銅の優先的な析出
がなくなり、かなり広い電流密度範囲で、光沢のある銅
−亜鉛−錫合金めっきを得ることができる。しかしなが
ら、その色調は、電流密度の上昇に従って、黄緑→黄金
色と変化し、色ムラを生じるため、装飾めっきとしての
実用化には不充分である。それに対し、銅J−1亜鉛塩
及び錫塩とともに、前記2種の錯化剤としての化合物並
びにアミノ酸又はその塩を添加すると、非常に広い電流
密度で、完全に均質な24に金色の色調を有する光沢銅
−亜鉛−錫合金めっき皮膜を得ることができる。本発明
では、浴組成を適宜変更することによって、0.05〜
5△/dm2程度の箸るしく広い電流密度範囲において
、均質な色調の24に黄金色の銅−亜鉛−錫合金めっき
皮膜を得ることができる。If a bath consisting only of copper salts, zinc salts, tin salts, and alkali metal salts of pyrophosphoric acid or alkali metal salts of polyphosphoric acid is used, the resulting plating film will have a red copper color due to preferential precipitation of copper at low current density. At a current density of 8, discoloration occurs. In a very narrow range of current density between that range, that is, the maximum current density determined by the bath composition, a golden yellow plating film is obtained, but the gas traces are intense and the luster is poor. It is sufficient. In a bath consisting of copper salt, zinc salt, tin salt, and oxycarboxylic acid or its salt, the plating film becomes dark green and a golden plating film cannot be obtained. Copper salt, subsalt, tin The plating bath containing the salt and the above two types of compounds eliminates the preferential precipitation of copper at low current vIi degrees, making it possible to obtain a bright copper-zinc-tin alloy plating over a fairly wide current density range. However, as the current density increases, the color tone changes from yellow-green to golden yellow, causing color unevenness, making it insufficient for practical use as a decorative plating.On the other hand, copper J-1 zinc Addition of the two compounds as complexing agents and amino acids or their salts together with salts and tin salts produces a bright copper-zinc-tin alloy with a completely homogeneous 24-degree golden hue over a very wide current density. A plating film can be obtained.In the present invention, by appropriately changing the bath composition, a plating film of 0.05 to
A copper-zinc-tin alloy plating film with a homogeneous color tone and a golden yellow color can be obtained in an extremely wide current density range of about 5Δ/dm2.
銅塩としては、公知のものが何れも使用でき、例えば、
ピロリンMti4、硫′Fti銅、塩化第2銅、スルフ
ァミン酸銅、シュウ耐用、酢酸第2銅、i!2基性炭酸
銅、臭化第2銅、ギ酸銅、水酸化銅、酸化第2銅、リン
耐用、ケイフッ化銅、ステアリン酸銅、クエン酸第2銅
等を挙げることができる。Any known copper salt can be used, for example,
Pyrroline Mti4, Fti copper sulfate, cupric chloride, copper sulfamate, sulfur resistance, cupric acetate, i! Examples include dibasic copper carbonate, cupric bromide, copper formate, copper hydroxide, cupric oxide, phosphorus-resistant, copper fluorosilicate, copper stearate, cupric citrate, and the like.
亜鉛塩としては、公知のものが何れも使用でき例えば、
ピロリン酸亜鉛、i耐亜鉛、塩化亜鉛、スルフ1ミン酎
亜鉛、酸化亜鉛、酢酸亜鉛、臭化亜鉛、FA雄性炭酸亜
鉛、シュウ酸亜鉛、リン酸亜鉛、ケイフッ化亜鉛、ステ
アリン酸亜鉛、乳酸亜鉛等を挙げることができる。Any known zinc salt can be used, for example,
Zinc pyrophosphate, i-resistant zinc, zinc chloride, zinc sulfamine, zinc oxide, zinc acetate, zinc bromide, FA male zinc carbonate, zinc oxalate, zinc phosphate, zinc silicofluoride, zinc stearate, zinc lactate etc. can be mentioned.
′gj塩としては、公知のものが何れも使用でき、例え
ば、錫酸ナトリウム、錫酸カリウム等を挙げることがで
きる。本発明では、銅塩、亜鉛塩及び錫塩は、夫々2種
以上を併用してもかまわない。As the 'gj salt, any known salt can be used, such as sodium stannate, potassium stannate, and the like. In the present invention, two or more of the copper salts, zinc salts, and tin salts may be used in combination.
ピロリン酸のアルカリ金属塩及びポリリン酸のアルカリ
金属塩としては、公知のものが何れも使用でき、例えば
、そのナトリウム塩、カリウム塩等を挙げることができ
る。Any known alkali metal salts of pyrophosphoric acid and alkali metal salts of polyphosphoric acid can be used, and examples thereof include sodium salts and potassium salts thereof.
オキシカルボン酸としては、公知のものが何れも使用で
き、例えば、グリコール酸、乳酸、リンゴ酸、クエン酸
、酒石酸、グルコン酸、グルコヘプトン酸等を挙げるこ
とができる。またその塩と、 しては、リチウム塩、
ナトリウム塩、カリウム塩、カルシウム塩等を挙げるこ
とができる。更に、酒石W1塩としては、前記塩以外に
も、吐酒石(酒石酸アンデモニルカリウム)、臼ツシI
ル塩(酒石酸ナトリウムカリウム)等をも使用できる。Any known oxycarboxylic acid can be used, and examples thereof include glycolic acid, lactic acid, malic acid, citric acid, tartaric acid, gluconic acid, and glucoheptonic acid. Also, the salt and lithium salt,
Examples include sodium salts, potassium salts, calcium salts, and the like. Furthermore, as the tartarite W1 salt, in addition to the above-mentioned salts, tartarite (andemonyl potassium tartrate), Usutushi I
Salt (sodium potassium tartrate), etc. can also be used.
またアミノ酸としては、公知のものが何れら使用でき、
例えば、グリシン、7ラニン、グルタミン酸、アスパラ
ギン酸、1−レA゛ニン、セリン、プロリン、トリプト
フアン、ヒスチジン等のα−アミノ酸もしくはその[f
塩、ナトリウム塩等を挙げることができる。本発明では
、上記ピロリン酸のアルカリ金属塩及びポリリン酸のア
ルカリ金属塩、オキシカルボン酸及びその塩、並びにア
ミノ酸及びその塩についても、夫々2種以上併用しても
かまわない。In addition, as the amino acid, any known amino acid can be used,
For example, α-amino acids or their [f
Examples include salts, sodium salts, and the like. In the present invention, two or more of the alkali metal salts of pyrophosphoric acid, alkali metal salts of polyphosphoric acid, oxycarboxylic acids and salts thereof, and amino acids and salts thereof may be used in combination.
本発明浴における上記各成分の配合量は特に制限されず
、適宜選択すればよいが、工業的な取り扱いの容易さを
考Iiiすると、銅塩を銅分換粋で2〜40 g/Q程
度、亜鉛塩を亜鉛分換算で0.5〜30 g/ Q P
i!度、錫塩を錫分換粋で0.1〜5g/QWia、ピ
ロリン酸のアルカリ金属塩及び/又はポリリン酸のアル
カリ金属塩を150〜400g/q程度、オキシカルボ
ン酸及び/又はその塩を50〜400g/Q程度及びア
ミノ酸及び/又はその塩を0.5〜50 ’J / Q
程度配合すればよい。めっき浴中のCuとznとの濃度
比(Cu:Zn)は特にiIl+限されず適宜選択でき
るが、通常9〜1:1程度とすればよく、これによって
黄金色のめっき皮膜を1町することができる。但し、安
定した連続作業を行うことを考慮に入れると、銅塩を銅
分換nで5〜15g/Q程度、亜鉛塩を亜鉛分換qで1
〜109/Q程度添加し、濃度比を5〜1,5:1程度
とすることが好ましい。The blending amount of each of the above components in the bath of the present invention is not particularly limited and may be selected as appropriate, but considering the ease of industrial handling, the copper salt should be about 2 to 40 g/Q in terms of copper content. , zinc salt 0.5 to 30 g/Q P in terms of zinc content
i! 0.1 to 5 g/QWia of tin salt, 150 to 400 g/q of alkali metal salt of pyrophosphoric acid and/or alkali metal salt of polyphosphoric acid, and oxycarboxylic acid and/or its salt. About 50-400g/Q and amino acid and/or its salt 0.5-50'J/Q
It is sufficient to mix them to a certain extent. The concentration ratio of Cu and Zn (Cu:Zn) in the plating bath is not particularly limited and can be selected as appropriate, but it is usually about 9 to 1:1, and this will produce a golden yellow plating film. be able to. However, taking into consideration stable continuous operation, the copper salt should be used at a copper conversion rate of 5 to 15 g/Q, and the zinc salt should be used at a zinc conversion rate of 1
It is preferable to add about 109/Q to make the concentration ratio about 5 to 1,5:1.
1lFAは、亜鉛塩のmr!1以下という歩出の添加で
めっき皮膜の色調を均一にし、且つ24に黄金色に近づ
ける働きを有している。また、銅塩、亜鉛塩としてピロ
リン酸塩を使用りる場合には、このピロリン酸塩をも含
めた全ピロリンM塩a度が上記範囲に入るようにしても
よい。1lFA is mr of zinc salt! The addition of 1 or less has the effect of making the color tone of the plating film uniform and making it closer to a golden yellow color. Further, when a pyrophosphate is used as the copper salt or zinc salt, the total pyrroline M salinity including this pyrophosphate may be within the above range.
本発明浴を使用して、光沢銅−亜鉛−錫合金めっきを施
すに当っては、通常の電気めっき方法が何れも採用でき
、例えば被めっき体を、浴温10〜50℃程度、浴のp
H10,0〜14.0程度、陰極電流密度0.1〜5A
/dm2程度のめっき条件で、無撹拌下或いは機械撹拌
下又は空気撹拌下に電気めっきすればよい。この際陽極
としては、通常の銅−亜鉛−錫合金の電気、めっきに用
いられるものが何れも使用できる。被めっき体には、電
気めっきを行う前に常法に従ってパフFfl摩、鋭脂、
希酸浸漬等の前処理を施してもよく、或いは光沢ニッケ
ルめっき等の下地めっきを施してもよい。When applying bright copper-zinc-tin alloy plating using the bath of the present invention, any ordinary electroplating method can be used. p
H10, about 0-14.0, cathode current density 0.1-5A
Electroplating may be carried out under plating conditions of approximately /dm2 without stirring, mechanical stirring, or air stirring. In this case, as the anode, any one used in ordinary electroplating of copper-zinc-tin alloy can be used. Before electroplating, the body to be plated is coated with puff Ffl, sharp grease, etc. in accordance with the conventional method.
Pretreatment such as dipping in dilute acid may be performed, or base plating such as bright nickel plating may be performed.
まためっき後には、水洗、湯洗、乾燥等の通常行なわれ
ている操作を行ってもよく、更に必要に応じて、重クロ
ム酸希薄溶液への浸漬、クリアー塗装等を行ってもにい
。Further, after plating, usual operations such as water washing, hot water washing, drying, etc. may be performed, and if necessary, immersion in a dilute dichromic acid solution, clear coating, etc. may be performed.
本発明では、被めっき体としては特に制限されず、通常
銅−亜鉛−錫合金めっき皮膜を施されるものが何れも使
用でき、例えば、金属製品、プラスチック製品、セラミ
ックス製品等を挙げることができ、これらには、本発明
浴によってめっきを施す前に、常法に従って、下地めつ
ぎを施すのが好ましい。In the present invention, the object to be plated is not particularly limited, and any object to which a copper-zinc-tin alloy plating film is normally applied can be used, such as metal products, plastic products, ceramic products, etc. , It is preferable to apply an undercoating to these according to a conventional method before plating with the bath of the present invention.
発明の効果
本発明浴によれば、極めて優れた光沢を有し、8114
価値の高い黄金色の銅−亜鉛−錫合金めっき皮膜を幅広
い電流密度範囲で得ることができる。Effects of the Invention According to the bath of the present invention, it has extremely excellent gloss and has 8114
A valuable golden copper-zinc-tin alloy plating film can be obtained over a wide current density range.
また、本発明浴は、シアン化合物を含有しないので、有
毒ガス等が発生せず、しかも沈殿物の生成等もなく無害
の安定したものとなっている。陽極に銅−亜鉛合金を用
いた場合には、溶解は均一であり、錫塩の補給のみでめ
っき浴組成は安定に保たれる。更にめつぎ浴中のCu:
Zr11度比がほぼめっき皮膜の組成に近い2〜1.5
:1程度の[囲においても黄金色のめつき皮膜がlr/
られるので、カーボン、白金めつきチタン等の不溶性陽
極を使用した場合にも、銅塩、亜鉛塩及び錫塩の一定組
成の混合物の補給のみで安定した連続作業が可能である
。Furthermore, since the bath of the present invention does not contain cyanide, it does not generate toxic gases or the like, and is harmless and stable without the formation of precipitates. When a copper-zinc alloy is used for the anode, the dissolution is uniform and the plating bath composition can be kept stable simply by replenishing the tin salt. Furthermore, Cu in the pottery bath:
Zr11 degree ratio is 2 to 1.5, which is almost the composition of the plating film
: About 1 [lr/
Therefore, even when using an insoluble anode such as carbon or platinum-plated titanium, stable continuous operation is possible only by replenishing a mixture of copper salt, zinc salt, and tin salt with a constant composition.
実施例
以下実施例及び比較例を掲げて、本発明の特徴をより一
層明らかにする。EXAMPLES Below, Examples and Comparative Examples will be given to further clarify the characteristics of the present invention.
実施例1〜5及び比較例1〜3
第1表(実施例1〜5)及び第2表(比較例1〜3)に
記載のめつぎ浴組成(各成分の添加mは全て9/Q )
並びにめっき条件で電気めっきを行い、得られためっき
皮膜の外観・色調を観察した。Examples 1 to 5 and Comparative Examples 1 to 3 Mock bath compositions listed in Table 1 (Examples 1 to 5) and Table 2 (Comparative Examples 1 to 3) (addition m of each component is all 9/Q )
Electroplating was performed under the same plating conditions, and the appearance and color tone of the resulting plated film was observed.
結果を第3表に示す。尚、第1表及び第2表中、銅塩、
亜鉛塩及び錫塩の項で、()内に示した数値は、夫々の
金属分換算値(’J/Q )である。The results are shown in Table 3. In addition, in Tables 1 and 2, copper salts,
In the terms of zinc salt and tin salt, the values shown in parentheses are the respective metal content equivalent values ('J/Q).
第2表
第 3 表
第3表から、本発明光沢銅−亜鉛〜錫合金めっき浴にお
いては、1)ピロリン酸のアルカリ金属塩及び/又はポ
リリン酸のアルカリ金属塩、2)オキシカルボン酸及び
/又はその塩、並びに3)アミノ酸及び/又はその塩の
3者の相乗作用によって、装鶏価値が高く、極めて優れ
た光沢のある黄金色の銅−亜鉛−錫合金めっき皮膜を、
幅広い電流密度範囲で得られることが判る。Table 2 Table 3 From Table 3, in the bright copper-zinc to tin alloy plating bath of the present invention, 1) an alkali metal salt of pyrophosphoric acid and/or an alkali metal salt of polyphosphoric acid, 2) an oxycarboxylic acid and/or or a salt thereof, and 3) an amino acid and/or a salt thereof. Through the synergistic action of the three components, a golden copper-zinc-tin alloy plating film with high poultry value and an extremely excellent luster is produced.
It can be seen that the current density can be obtained over a wide range of current densities.
(以 上)(that's all)
Claims (1)
ルカリ金属塩及びポリリン酸のアルカリ金属塩から選ば
れた少くとも1種、c)オキシカルボン酸及びその塩か
ら選ばれた少くとも1種並びにd)アミノ酸及びその塩
から選ばれた少くとも1種を含有することを特徴とする
、シアン化合物を含まない光沢銅−亜鉛−錫合金電気め
つき浴。(1) At least one selected from a) copper salts, zinc salts, and tin salts, b) alkali metal salts of pyrophosphoric acid and alkali metal salts of polyphosphoric acid, and c) oxycarboxylic acids and their salts. A cyanide-free bright copper-zinc-tin alloy electroplating bath characterized by containing at least one kind and at least one kind selected from d) amino acids and their salts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3859487A JPS63206494A (en) | 1987-02-20 | 1987-02-20 | Bright copper-zinc-tin alloy electroplating bath containing no cyanide compound |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3859487A JPS63206494A (en) | 1987-02-20 | 1987-02-20 | Bright copper-zinc-tin alloy electroplating bath containing no cyanide compound |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63206494A true JPS63206494A (en) | 1988-08-25 |
JPH0321637B2 JPH0321637B2 (en) | 1991-03-25 |
Family
ID=12529621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3859487A Granted JPS63206494A (en) | 1987-02-20 | 1987-02-20 | Bright copper-zinc-tin alloy electroplating bath containing no cyanide compound |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63206494A (en) |
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1987
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JP2009537997A (en) * | 2006-05-24 | 2009-10-29 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Metal plating composition and method for copper-zinc-tin deposition suitable for manufacturing thin film solar cells |
EP2336394A2 (en) | 2006-05-24 | 2011-06-22 | ATOTECH Deutschland GmbH | Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell |
JP2010053444A (en) * | 2008-07-30 | 2010-03-11 | Bridgestone Corp | Copper-zinc alloy electroplating bath and wire for steel cord |
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WO2013129484A1 (en) * | 2012-02-29 | 2013-09-06 | Ikeda Shigeru | Mixed crystal, method for manufacturing mixed crystal, solar cell, method for manufacturing solar cell, and electrocrystallization bath |
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CN108486623A (en) * | 2018-03-09 | 2018-09-04 | 湘潭大学 | A kind of method that substep pulse electrodeposition after annealing prepares copper-zinc-tin-sulfur solar battery film material |
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