US2905601A - Electroplating bright gold - Google Patents

Electroplating bright gold Download PDF

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Publication number
US2905601A
US2905601A US677818A US67781857A US2905601A US 2905601 A US2905601 A US 2905601A US 677818 A US677818 A US 677818A US 67781857 A US67781857 A US 67781857A US 2905601 A US2905601 A US 2905601A
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US
United States
Prior art keywords
gold
liter
bath
base metal
cyanide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US677818A
Inventor
Edwin C Rinker
Duva Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Sel Rex Corp
Original Assignee
Sel Rex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE570261D priority Critical patent/BE570261A/xx
Priority to NL112916D priority patent/NL112916C/xx
Priority to NL230397D priority patent/NL230397A/xx
Application filed by Sel Rex Corp filed Critical Sel Rex Corp
Priority to US677818A priority patent/US2905601A/en
Priority to FR1201185D priority patent/FR1201185A/en
Priority to DES59365A priority patent/DE1111897B/en
Priority to CH6272358A priority patent/CH384972A/en
Priority to GB25764/58A priority patent/GB851973A/en
Application granted granted Critical
Publication of US2905601A publication Critical patent/US2905601A/en
Priority to CH1207160A priority patent/CH445246A/en
Priority to DE19611446043 priority patent/DE1446043C3/en
Anticipated expiration legal-status Critical
Assigned to OXY METAL INDUSTRIES CORPORATION reassignment OXY METAL INDUSTRIES CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). 4-09-74 Assignors: OXY METAL FINISHING CORPORATION
Assigned to HOOKER CHEMICALS & PLASTICS CORP. reassignment HOOKER CHEMICALS & PLASTICS CORP. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: OXY METAL INDUSTRIES CORPORATION
Assigned to OCCIDENTAL CHEMICAL CORPORATION reassignment OCCIDENTAL CHEMICAL CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE MARCH 30, 1982. Assignors: HOOKER CHEMICAS & PLASTICS CORP.
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Definitions

  • acids which may be employed are formic, acetic, citric, tartaric, lactic, kojic, or similar acidsandl mixtures of these acids.
  • the acid should be present in proportions of about 10 to 150 grams per liter and may be partially neutralized with ammonium or alkali hydroxide to give a pH of about 3-5. It is this weak organic acid and the procedure of maintaining the bath within a limited pH range that produces the desired eifect of a gold alloy deposition.
  • the gold may be added as the double cyanide of gold and an alkali metal, potassium gold cyanide for example, and may be present in proportions of about 1 gram per liter to 15 grams per liter of gold.
  • Base metal salts which may be added comprise the sulfates, sulfamates, formates, acetates, citrates, lactates, tartrates, fluoborate-s, borates, phosphates, etc., of nickel, zinc, cobalt, indium, iron, manganese, antimony, copper, etc. These metal salts are added in the proportion of from 1 to 50 grams per liter. Very satisfactory results are obtained when two of such base metal salts are included in the bath. Although the addition of base metal salt is necessary, it does not matter which salt or mixture of salts is added as long as the added salts are soluble and. compatible with all other bath ingredients.
  • the bath may be operated at a current density of l to 100 amperes per square foot. Moderate to rapid agita-- tion improves the operation.
  • the bath may be operatedv at normal room temperature (70 F.) which is advanta-- geous in that no themostatic regulation is necessary but: higher or lower temperatures of from 50 to 120 F.. may be employed.
  • the maximum cathode/anode ratio should be about 4:1.
  • the deposits obtained have a pale yellow color of pure gold, but depending upon which base metal is added the deposit may have a greenish or yellow-orange tinge.
  • The: gold deposits are from about 21 to 23 karat gold.
  • Citric acid plus sodium citrate Gold (as potassium gold cyanide) t 8 Nickel (as nickel sulfamate) 3 Zinc (as zinc acetate) 0.5 Water Remainder
  • The. amount of sodium citrate is adjusted by adding it until the bath has a pH of 4 to 5.
  • a clean and polished steel or other metal body is made the cathode in said bath, at a current density of 10 amperes per square foot, while the bath is maintained at a temperature of about 70 F.
  • the deposit obtained from this bath is hard, corrosionresistant with a uniform, br'lliant, pale yellow-green coloration.
  • the gold deposits assay 23 karat gold. Deposits of thicknesses of 25 to 50 microns are readily obtained from this bath.
  • Example 2 An electrolytic bath is made by dissolving the following components:
  • Example 3 An electrolytic bath is made by dissolving the following components:
  • Citric acid and sodium citrate 80 Gold (as potassium gold cyanide) 8 Indium (as sulfate) 5 Water Remainder The pH of the bath is adjusted to 3-4 by addition of more acid or alkali.
  • the deposit obtained from this bath under conditions such as specified in Example 1 is hard, corrosion-resistant, and uniformly pale yellow in color. The fineness of the deposit is 21 karat.
  • tartaric acid, lactic acid, kojic acid, formic acid or similar organic acids may be substituted for the acetic or citric acid specified.
  • Such baths are brought to the proper pH by the addition of an alkali or the acid in use.
  • a method of electrodepositing bright gold which comprises electrolyzing a solution consisting of 10-150 g./liter of a weak, stable, organic acid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./liter of at least one soluble base metal salt.
  • a method as claimedinclaim 1 in which said base metal salt comprises a mixture of a cobaltsalt and an acid partially neutraliaed with alkalito provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide and l-SOgI/litr bf at least one soluble base metal salt.
  • An electrol yte for depositing bright gold coatings 'witli agreenish tinge consisting of about 80 g./liter of citrate radical neutralized with alkali to proyide apH of 4-5, about 1-15 g./liter of gold as potassium gold cyanide, about 3 g./ liter of nickel as nickel snlfamate, and
  • electrolyte for depositing bright pale yellow gold coatings consisting of about 50 g./liter of weak organic acid radical partially neutralized with alkali to provide a pH of 3-4, 1-15 g./ liter of gold as cyanide gold, about 5 g./ liter of indium as indium sulfate, and about 3 g./ liter of cobalt as cobalt sulfate.
  • a method of electrodepositing bright gold which comprises electrolyzing a solution consisting of -150 g./ liter of citricacid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./liter of at least onesoluble base'metal salt.
  • a method of electrodepositing bright gold which comprises electrolyzing a solution consisting of 10-150 g./liter of acetic' acid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./ liter of at least one soluble base metal salt.
  • An electrolyte for depositing bright gold coatings consisting of 10-150 g./literof citric acid partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide and 1-50 g./ liter of at least one soluble base metal salt.
  • An electrolyte for depositing bright gold coatings consisting of 10-150 g./liter of acetic acid partially neutralized with alkali to provide a pH of 3-5, l-l5 g./liter of gold added as a gold cyanide and 1-50 g./1iter of at least one soluble base metal salt.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

2,905,601 I ELECTROPLATING BRIGHT GOLD Edwin C. Rinker, Morristown, and Robert Duva, Paramus, N.J., assignors to Sel-Rex Corporation, Nutley, N.J., a corporation of New Jersey No Drawing. Application August 13, 1957 Serial No. 677,818
18 Claims. (Cl. 204-43) deposition when the temperature, pH, current density,
agitation or cathode to anode ratio varies somewhat.
These objects and others ancillary thereto are obtained by providing a relatively Weak acid bath containing (1) a. weak, stable, organic acid, (2) gold as a cyanide (potassium gold cyanide, for example), base metal salts soluble in the bath.
Examples of acids which may be employed are formic, acetic, citric, tartaric, lactic, kojic, or similar acidsandl mixtures of these acids. The acid should be present in proportions of about 10 to 150 grams per liter and may be partially neutralized with ammonium or alkali hydroxide to give a pH of about 3-5. It is this weak organic acid and the procedure of maintaining the bath within a limited pH range that produces the desired eifect of a gold alloy deposition.
The gold may be added as the double cyanide of gold and an alkali metal, potassium gold cyanide for example, and may be present in proportions of about 1 gram per liter to 15 grams per liter of gold.
Base metal salts which may be added comprise the sulfates, sulfamates, formates, acetates, citrates, lactates, tartrates, fluoborate-s, borates, phosphates, etc., of nickel, zinc, cobalt, indium, iron, manganese, antimony, copper, etc. These metal salts are added in the proportion of from 1 to 50 grams per liter. Very satisfactory results are obtained when two of such base metal salts are included in the bath. Although the addition of base metal salt is necessary, it does not matter which salt or mixture of salts is added as long as the added salts are soluble and. compatible with all other bath ingredients.
The bath may be operated at a current density of l to 100 amperes per square foot. Moderate to rapid agita-- tion improves the operation. The bath may be operatedv at normal room temperature (70 F.) which is advanta-- geous in that no themostatic regulation is necessary but: higher or lower temperatures of from 50 to 120 F.. may be employed. The maximum cathode/anode ratioshould be about 4:1.
The deposits obtained have a pale yellow color of pure gold, but depending upon which base metal is added the deposit may have a greenish or yellow-orange tinge. The: gold deposits are from about 21 to 23 karat gold.
The invention both as to its organization and its method of operation, together with additional objects and ad-- vantages thereof, will best be understood from the following description of specific embodiments thereof:
and (3) one or more ice 2 Example 1 An electrolytic bath is made by dissolving the following components: I
G./liter Citric acid plus sodium citrate Gold (as potassium gold cyanide) t 8 Nickel (as nickel sulfamate) 3 Zinc (as zinc acetate) 0.5 Water Remainder The. amount of sodium citrate is adjusted by adding it until the bath has a pH of 4 to 5. A clean and polished steel or other metal body is made the cathode in said bath, at a current density of 10 amperes per square foot, while the bath is maintained at a temperature of about 70 F.
The deposit obtained from this bath is hard, corrosionresistant with a uniform, br'lliant, pale yellow-green coloration. The gold deposits assay 23 karat gold. Deposits of thicknesses of 25 to 50 microns are readily obtained from this bath.
Example 2 An electrolytic bath is made by dissolving the following components:
G./liter Acetic acid and sodium acetate 50 Gold (as cyanide) 4 Indium (as sulfamate) 5 Cobalt (as sulfate) 3 Water Remainder An alkali is added to the bath, if necessary, to give a pH of 3 to 4. A deposit obtained from this bath under conditions such as specified in Example 1 is hard, corrosion-resistant, and pale yellow in color. The deposit is 21 karat.
Example 3 An electrolytic bath is made by dissolving the following components:
G./liter Citric acid and sodium citrate 80 Gold (as potassium gold cyanide) 8 Indium (as sulfate) 5 Water Remainder The pH of the bath is adjusted to 3-4 by addition of more acid or alkali. The deposit obtained from this bath under conditions such as specified in Example 1 is hard, corrosion-resistant, and uniformly pale yellow in color. The fineness of the deposit is 21 karat.
In the above examples, tartaric acid, lactic acid, kojic acid, formic acid or similar organic acids may be substituted for the acetic or citric acid specified. Such baths are brought to the proper pH by the addition of an alkali or the acid in use.
The features and principles underlying the invention described above in connection with specific exemplifications will suggest to those skilled in the art many other modifications thereof. It is accordingly desired that the appended claims shall not be limited to any specific feat-ure or details thereof.
I claim:
l. A method of electrodepositing bright gold which comprises electrolyzing a solution consisting of 10-150 g./liter of a weak, stable, organic acid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./liter of at least one soluble base metal salt.
2. A method as claimed in claim 1 in which said base metal salt comprises a nickel salt.
3. A method as claimed in claim 1 in which said base metal salt is a mixture of nickel and zinc salts.
4. Amethod as claimed in claim 1 in which said base metal salt comprises a zinc salt. 5. A method as claimed inclaim 1 in which said base metal salt comprises an indium salt.
6. A method as claimedinclaim 1 in which said base metal salt comprises a mixture of a cobaltsalt and an acid partially neutraliaed with alkalito provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide and l-SOgI/litr bf at least one soluble base metal salt.
8. An electrol yte for depositing bright gold coatings 'witli agreenish tinge consisting of about 80 g./liter of citrate radical neutralized with alkali to proyide apH of 4-5, about 1-15 g./liter of gold as potassium gold cyanide, about 3 g./ liter of nickel as nickel snlfamate, and
'about0.5 gJliter of zinc as zinc acetate.
' 9.'A'n electrolyte for depositing bright pale yellow gold coatings consisting of about 50 g./liter of weak organic acid radical partially neutralized with alkali to provide a pH of 3-4, 1-15 g./ liter of gold as cyanide gold, about 5 g./ liter of indium as indium sulfate, and about 3 g./ liter of cobalt as cobalt sulfate.
10. A method of electrodepositing bright gold which comprises electrolyzing a solution consisting of -150 g./ liter of citricacid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./liter of at least onesoluble base'metal salt.
' 11. A method of electrodepositing bright gold which comprises electrolyzing a solution consisting of 10-150 g./liter of acetic' acid, partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide, and 1-50 g./ liter of at least one soluble base metal salt.
12. An electrolyte for depositing bright gold coatings consisting of 10-150 g./literof citric acid partially neutralized with alkali to provide a pH of 3-5, 1-15 g./liter of gold added as a gold cyanide and 1-50 g./ liter of at least one soluble base metal salt.
13. An electrolyte for depositing bright gold coatings consisting of 10-150 g./liter of acetic acid partially neutralized with alkali to provide a pH of 3-5, l-l5 g./liter of gold added as a gold cyanide and 1-50 g./1iter of at least one soluble base metal salt.
14. Anelectrolyte for depositing bright gold as claimed in claim 7 in which said base metal salt comprises a nickel salt.
15. An electrolyte for depositing bright gold as claimed in claim 7 in which said base'metal salt comprises a mixture of nickel and zinc salts.
16. An electrolyte for depositing bright gold as claimed in claim 7 in which said base metal salt comprises a Zinc'salt.
' 17. An electrolyte for depositing bright gold as claimed in claim 7 in which s'aidbase metal salt comprises an indium salt.
18. An electrolytefor depositing bright gold as claimed in'claim 7 in whichsaid base metal salt comprises a mixture of a cobalt salt and anindium salt."
lieierencesiCited in the file of this patent UNITED STATES PATENTS OTHER REFERENCES Kushner, Products Finishing, January 1941, pages 20-28, Thews Metal Finishing, September, 1951, pages -85.

Claims (1)

1. A METHOD OF ELECTRODEPOSITING BRIGHT GOLD WHICH COMPRISES ELECTROLYZING A SOLUTION CONSISTING OF 10-150 G./LITER OF A WEAK, STABLE ORGANIC CONSISTING OF 10-150 TRALIZED WITH ALKALI TO PROVIDE A PH OF 3-5, 1-15 G./LITER OF GOLD ADDED AS A GOLD CYANIDE, AND 1-50G./LITER OF AT LEAST ONE SOLUBLE BASE SALT.
US677818A 1957-08-13 1957-08-13 Electroplating bright gold Expired - Lifetime US2905601A (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
BE570261D BE570261A (en) 1957-08-13
NL112916D NL112916C (en) 1957-08-13
NL230397D NL230397A (en) 1957-08-13
US677818A US2905601A (en) 1957-08-13 1957-08-13 Electroplating bright gold
FR1201185D FR1201185A (en) 1957-08-13 1958-08-07 Bright gold electroplating process
CH6272358A CH384972A (en) 1957-08-13 1958-08-08 Process for the electrolytic application of a shiny coating made of gold or a gold alloy
DES59365A DE1111897B (en) 1957-08-13 1958-08-08 Bath for the galvanic deposition of shiny gold alloy coatings
GB25764/58A GB851973A (en) 1957-08-13 1958-08-11 Electroplating bright gold
CH1207160A CH445246A (en) 1957-08-13 1960-10-28 Process for the electrolytic application of a shiny coating made of gold or a gold alloy
DE19611446043 DE1446043C3 (en) 1960-07-26 1961-06-19 Bath for galvanic deposition of gold alloys

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US677818A US2905601A (en) 1957-08-13 1957-08-13 Electroplating bright gold

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CH (1) CH384972A (en)
FR (1) FR1201185A (en)
GB (1) GB851973A (en)
NL (2) NL230397A (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
US3104212A (en) * 1959-05-21 1963-09-17 Sel Rex Corp Electroplating smooth ductile gold
US3149057A (en) * 1959-04-27 1964-09-15 Technic Acid gold plating
US3149058A (en) * 1959-12-31 1964-09-15 Technic Bright gold plating process
US3244603A (en) * 1962-06-08 1966-04-05 Gen Electric Electrodeposition of a nickel-manganese alloy
DE1218248B (en) * 1961-05-01 1966-06-02 Sel Rex Corp Acid galvanic gold bath for high-quality gold coatings
US3254992A (en) * 1962-11-08 1966-06-07 Garde Mfg Company Electrically conductive alloy
US3373094A (en) * 1964-08-26 1968-03-12 Sel Rex Corp Gold and gold alloy electroplating
US3380814A (en) * 1965-06-18 1968-04-30 Sel Rex Corp Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof
US3380898A (en) * 1965-06-18 1968-04-30 Sel Rex Corp Electrolyte and method for electrodepositing a pink gold alloy
US3397127A (en) * 1965-04-12 1968-08-13 American Chem & Refining Co Method and bath for electroplating gold
US3475290A (en) * 1965-05-07 1969-10-28 Suwa Seikosha Kk Bright gold plating solution and process
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3893896A (en) * 1973-07-02 1975-07-08 Handy & Harman Gold plating bath and process
US3926748A (en) * 1974-06-28 1975-12-16 Amp Inc Electrodeposition of gold-antimony alloys and compositions therefor
US3929595A (en) * 1973-11-07 1975-12-30 Degussa Electrolytic burnished gold bath with higher rate of deposition
US3978302A (en) * 1973-09-21 1976-08-31 U.S. Philips Corporation Switching element having gold-cobalt contacts
DE2831756A1 (en) * 1977-07-20 1979-02-01 Technic COBALT AND NICKEL ORGANOPHOSPHONATES AS GLOSS FORMS FOR ELECTROPLATING
DE3244092A1 (en) * 1981-12-14 1983-06-23 American Chemical & Refining Co., Inc., 06720 Waterbury, Conn. AQUEOUS BATH FOR GALVANIC DEPOSITION OF GOLD AND METHOD FOR GALVANIC DEPOSIT OF HARD GOLD USING ITS USE
US4411965A (en) * 1980-10-31 1983-10-25 Occidental Chemical Corporation Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US5575900A (en) * 1995-07-03 1996-11-19 Antelman Technologies Ltd. Gold plating solutions
US20080217181A1 (en) * 2006-05-09 2008-09-11 Interuniversitair Microelektronica Centrum (Imec) Free standing single-crystal nanowire growth by electro-chemical deposition
US20110127168A1 (en) * 2008-08-25 2011-06-02 Rie Kikuchi Hard gold-based plating solution
EP2458036A2 (en) 2010-11-25 2012-05-30 Rohm and Haas Electronic Materials LLC Gold plating solution
US20180209058A1 (en) * 2017-01-23 2018-07-26 Nitto Denko Corporation Producing method of wired circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1065308A (en) * 1965-10-19 1967-04-12 Fred I Nobel Improvements in electrodeposition of gold alloys

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2501737A (en) * 1946-09-11 1950-03-28 Jr Ralph W Porter Solution for plating metals with gold
US2724687A (en) * 1952-05-08 1955-11-22 Spreter Victor Baths for the deposit of gold alloys by electroplating
US2754258A (en) * 1951-02-07 1956-07-10 Platers Res Corp Gold alloy plating
US2765269A (en) * 1954-11-19 1956-10-02 Barnet D Ostrow Bath for plating bright gold

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2501737A (en) * 1946-09-11 1950-03-28 Jr Ralph W Porter Solution for plating metals with gold
US2754258A (en) * 1951-02-07 1956-07-10 Platers Res Corp Gold alloy plating
US2724687A (en) * 1952-05-08 1955-11-22 Spreter Victor Baths for the deposit of gold alloys by electroplating
US2765269A (en) * 1954-11-19 1956-10-02 Barnet D Ostrow Bath for plating bright gold

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3149057A (en) * 1959-04-27 1964-09-15 Technic Acid gold plating
US3104212A (en) * 1959-05-21 1963-09-17 Sel Rex Corp Electroplating smooth ductile gold
US3149058A (en) * 1959-12-31 1964-09-15 Technic Bright gold plating process
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
DE1218248B (en) * 1961-05-01 1966-06-02 Sel Rex Corp Acid galvanic gold bath for high-quality gold coatings
DE1222347B (en) * 1961-05-01 1966-08-04 Sel Rex Corp Gold plating bath
US3244603A (en) * 1962-06-08 1966-04-05 Gen Electric Electrodeposition of a nickel-manganese alloy
US3254992A (en) * 1962-11-08 1966-06-07 Garde Mfg Company Electrically conductive alloy
US3373094A (en) * 1964-08-26 1968-03-12 Sel Rex Corp Gold and gold alloy electroplating
US3397127A (en) * 1965-04-12 1968-08-13 American Chem & Refining Co Method and bath for electroplating gold
US3475290A (en) * 1965-05-07 1969-10-28 Suwa Seikosha Kk Bright gold plating solution and process
US3380814A (en) * 1965-06-18 1968-04-30 Sel Rex Corp Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof
US3380898A (en) * 1965-06-18 1968-04-30 Sel Rex Corp Electrolyte and method for electrodepositing a pink gold alloy
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3893896A (en) * 1973-07-02 1975-07-08 Handy & Harman Gold plating bath and process
US3978302A (en) * 1973-09-21 1976-08-31 U.S. Philips Corporation Switching element having gold-cobalt contacts
US3929595A (en) * 1973-11-07 1975-12-30 Degussa Electrolytic burnished gold bath with higher rate of deposition
US3926748A (en) * 1974-06-28 1975-12-16 Amp Inc Electrodeposition of gold-antimony alloys and compositions therefor
DE2831756A1 (en) * 1977-07-20 1979-02-01 Technic COBALT AND NICKEL ORGANOPHOSPHONATES AS GLOSS FORMS FOR ELECTROPLATING
US4411965A (en) * 1980-10-31 1983-10-25 Occidental Chemical Corporation Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
DE3244092A1 (en) * 1981-12-14 1983-06-23 American Chemical & Refining Co., Inc., 06720 Waterbury, Conn. AQUEOUS BATH FOR GALVANIC DEPOSITION OF GOLD AND METHOD FOR GALVANIC DEPOSIT OF HARD GOLD USING ITS USE
US4396471A (en) * 1981-12-14 1983-08-02 American Chemical & Refining Company, Inc. Gold plating bath and method using maleic anhydride polymer chelate
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US5575900A (en) * 1995-07-03 1996-11-19 Antelman Technologies Ltd. Gold plating solutions
US20080217181A1 (en) * 2006-05-09 2008-09-11 Interuniversitair Microelektronica Centrum (Imec) Free standing single-crystal nanowire growth by electro-chemical deposition
US7947162B2 (en) * 2006-05-09 2011-05-24 Imec Free standing single-crystal nanowire growth by electro-chemical deposition
US20110127168A1 (en) * 2008-08-25 2011-06-02 Rie Kikuchi Hard gold-based plating solution
EP2458036A2 (en) 2010-11-25 2012-05-30 Rohm and Haas Electronic Materials LLC Gold plating solution
US20180209058A1 (en) * 2017-01-23 2018-07-26 Nitto Denko Corporation Producing method of wired circuit board
JP2018119211A (en) * 2017-01-23 2018-08-02 日東電工株式会社 Manufacturing method of wiring circuit board
US11091850B2 (en) * 2017-01-23 2021-08-17 Nitto Denko Corporation Producing method of wired circuit board

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FR1201185A (en) 1959-12-29
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NL230397A (en)

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