US3380814A - Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof - Google Patents
Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof Download PDFInfo
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- US3380814A US3380814A US465181A US46518165A US3380814A US 3380814 A US3380814 A US 3380814A US 465181 A US465181 A US 465181A US 46518165 A US46518165 A US 46518165A US 3380814 A US3380814 A US 3380814A
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- gold
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Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000011248 coating agent Substances 0.000 title claims description 4
- 238000000576 coating method Methods 0.000 title claims description 4
- FYULRWLBQGQQBB-UHFFFAOYSA-N [Sb][Cu][Au] Chemical compound [Sb][Cu][Au] FYULRWLBQGQQBB-UHFFFAOYSA-N 0.000 title description 3
- 229910001245 Sb alloy Inorganic materials 0.000 title description 2
- 239000002140 antimony alloy Substances 0.000 title description 2
- 239000003792 electrolyte Substances 0.000 title description 2
- 239000010931 gold Substances 0.000 claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- 229910052787 antimony Inorganic materials 0.000 claims description 8
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004615 ingredient Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 description 16
- 239000010949 copper Substances 0.000 description 11
- 150000003839 salts Chemical class 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 229910001020 Au alloy Inorganic materials 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- -1 alkali metal gold cyanide Chemical class 0.000 description 4
- 239000002738 chelating agent Substances 0.000 description 4
- 239000003353 gold alloy Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000004699 copper complex Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- SZXAQBAUDGBVLT-UHFFFAOYSA-H antimony(3+);2,3-dihydroxybutanedioate Chemical compound [Sb+3].[Sb+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O SZXAQBAUDGBVLT-UHFFFAOYSA-H 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 2
- 235000019796 monopotassium phosphate Nutrition 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 2
- 229910001112 rose gold Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000007836 KH2PO4 Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical class [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- BDKZHNJTLHOSDW-UHFFFAOYSA-N [Na].CC(O)=O Chemical compound [Na].CC(O)=O BDKZHNJTLHOSDW-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910000960 colored gold Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000016337 monopotassium tartrate Nutrition 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- KYKNRZGSIGMXFH-ZVGUSBNCSA-M potassium bitartrate Chemical compound [K+].OC(=O)[C@H](O)[C@@H](O)C([O-])=O KYKNRZGSIGMXFH-ZVGUSBNCSA-M 0.000 description 1
- 229940081543 potassium bitartrate Drugs 0.000 description 1
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/926—Thickness of individual layer specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/927—Decorative informative
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
Definitions
- This invention relates to an electroplating process and bath for the production of pink gold deposits consisting essentially of a copper-gold-antimony alloy.
- Among the objects of the invention is to provide an improved electroplating bath and process for the production of. bright pink gold deposits.
- Acid gold plating baths for the deposition of gold operating at a pH of between 3 and 5 or 6.5 are known. It is also known that bright, hard gold deposits are obtained when base metal ions capable of-codepositing with the gold are added to such baths. See, for example, US. 2,905,601.
- Prefen'ed Gold (added as alkali metal gold cyanide), g./l 1*8 4 Copper (as a copper complex), g./l 10 5 Antimony (added as Sb salt such as the taitrate), 1 5
- the copper complex is a copper salt of any suitable Chelating or complexing agent having a negative logarithm of stability constant for copper of about 17 or less.
- Such complexing agents include ethylenediaminetetraacetic acid (EDTA), diethylenetriaminopentaacetic acid, N-hydroxyethylethylenediaminetriacetic acids or the sodium or other alkali metal salts thereof.
- EDTA ethylenediaminetetraacetic acid
- diethylenetriaminopentaacetic acid diethylenetriaminopentaacetic acid
- N-hydroxyethylethylenediaminetriacetic acids or the sodium or other alkali metal salts thereof.
- the excess chelating agent is the same type of compound.
- Specular bright deposits are obtained from such baths at thicknesses of 25 microns and over so that the gold layer is thick enough to provide corrosion resistance as well as the pink decoration.
- the weak acid is one, as defined in the literature, which has a pK value of over about 3 and such weak acids include the organic acids and phosphoric acid.
- the acid employed is polybasic, the partially neutralized acid salts or mixtures thereof may be employed in place of the acid and salt.
- KH PO.-,, or corresponding salt of sodium, lithium or ammonium may be employed in the above bath as the weak acid and salt.
- the monopotassium salt of citric acid may be employed as the acid and salt combination.
- the antimony as the tartrate
- it can also be added as other salts which are soluble in the bath.
- the antimony is also essential for the production of pink coloration and specular efiects with the acid gold baths disclosed herein.
- the alloy deposits obtained from baths as described above consist essentially of to gold, 14 to 24% copper and 0.5 to 1.5% antimony.
- the alloy has a Knoop hardness of about 230280 kg./mm. with a 25 g. load.
- Example A bath is prepared from the following ingredients:
- the deposit has a hardness of about 240-250 Vickers.
- the deposits contain about 80% of Au, about 18.9% Cu and 1% of antimony.
- Process for electrodepositing bright, hard gold-copper alloys having a pink coloration which comprises electrolyzing an aqueous solution comprising the following ingredients:
- G./l. Gold (added as alkali metal gold cyanide) 18 Copper (added as a copper complex) 2-10 Antimony (added as a salt) 0.5-l0 Chelating agent (in addition to that complexed with the copper) 5-60 Weak acid and salt thereof, and in proportion to provide a pH of 4.5-6,
- G./l. Gold (added as alkali metal gold cyanide) About 4-8 Copper salt of Na EDTA (calc. as Cu) About 5 Antimony tartrate (calc. at Sb) About 1.5 Na EDTA About 20 KI'I2PO4 About said bath being operated at a pH of about 5.3, a temperature of about 50 C. and a current density of about amps/dmF.
- An aqueous bath for plating hard, specularly bright 4.
- An aqueous bath for plating hard, specularly bright copper gold alloy consisting essentially of the following:
- Y i G./l. Gold (added as potassium gold cyanide) About 4 Copper salt of Na EDTA (calc. as Cu) About 5 Antimony tartrate (calc. as Sb) About 1.5 Na EDTA About 20 KH2PO4 About adjusted to pH to about 5.3.
- Pritchard, Alfred K., Jr. Deposition of Pink Gold, Metal Industry, vol. 31, No. 12, p. 408, 1933.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
United States Patent ELECTROLYTE AND METHOD FOR COATING AR- TICLES WITH A GOLD-COPPER-ANTIMONY AL- LOY AND ARTICLE THEREOF Ren Cathrein and Marius Danemark, Geneva, Switzerland, assignors to Sel-Rex Corporation, Nutley, N.J., a corporation of New Jersey No Drawing. Filed June 18, 1965, Ser. No. 465,181
Claims. (Cl. 29-1835) This invention relates to an electroplating process and bath for the production of pink gold deposits consisting essentially of a copper-gold-antimony alloy.
Among the objects of the invention is to provide an improved electroplating bath and process for the production of. bright pink gold deposits.
Acid gold plating baths for the deposition of gold operating at a pH of between 3 and 5 or 6.5 are known. It is also known that bright, hard gold deposits are obtained when base metal ions capable of-codepositing with the gold are added to such baths. See, for example, US. 2,905,601.
One of the most difficult colors to obtain by the acid gold plating processes is a bright gold deposit with a pink coloration. This is difiicult because copper is the main metal ion producing pink coloration and with copper ions the bath is sensitive to changes in concentration, etc., so that uniformly reproducible, copper-gold alloy deposits can be obtained only by careful regulation of the bath components and of the conditions of operation. Also, after a time, a slight haze develops in deposits obtained from such baths, the haze becoming more important as the bath or solution ages.
Among the objects of this invention is to provide a uniformly reproducible bright, hard, copper-gold alloy deposit with a pinkish coloration.
The objects of the invention are attained by providing an acid gold alloy bath having the ingredients listed below and plating a basis metal therewith under conditions of operation which are also listed below:
Range Prefen'ed Gold (added as alkali metal gold cyanide), g./l 1*8 4 Copper (as a copper complex), g./l 10 5 Antimony (added as Sb salt such as the taitrate), 1 5
Additional chelating agent, g Weak acid and salt thereof, g./l 60 pHadjust to 4. 5-6 5. 3 Current density, ampJdmfl- A 52. 0 1. 5 Temperature, C -60 The copper complex is a copper salt of any suitable Chelating or complexing agent having a negative logarithm of stability constant for copper of about 17 or less. Such complexing agents include ethylenediaminetetraacetic acid (EDTA), diethylenetriaminopentaacetic acid, N-hydroxyethylethylenediaminetriacetic acids or the sodium or other alkali metal salts thereof. The excess chelating agent is the same type of compound.
Specular bright deposits are obtained from such baths at thicknesses of 25 microns and over so that the gold layer is thick enough to provide corrosion resistance as well as the pink decoration.
The weak acid is one, as defined in the literature, which has a pK value of over about 3 and such weak acids include the organic acids and phosphoric acid. Where the acid employed is polybasic, the partially neutralized acid salts or mixtures thereof may be employed in place of the acid and salt. Thus KH PO.-,, or corresponding salt of sodium, lithium or ammonium, may be employed in the above bath as the weak acid and salt. Similarly the monopotassium salt of citric acid may be employed as the acid and salt combination.
Although it is preferred to add the antimony as the tartrate, it can also be added as other salts which are soluble in the bath.
Although copper is an essential alloying metal for obtaining a pink coloration in alkali gold cyanide baths, and is sufiicient by itself for the production of pink coloration in such baths, the antimony, as disclosed in this specification, is also essential for the production of pink coloration and specular efiects with the acid gold baths disclosed herein. The alloy deposits obtained from baths as described above consist essentially of to gold, 14 to 24% copper and 0.5 to 1.5% antimony. The alloy has a Knoop hardness of about 230280 kg./mm. with a 25 g. load.
The following example is given to illustrate in detail a preferred bath and method of operating the same. It is to be understood that the specific details given in the example is not to be considered as limiting the scope of the invention.
Example A bath is prepared from the following ingredients:
Brass panels plated to a thickness of 25 microns with the bath at a temperature of 50 C. and at a density of about 1.5 amps/dm. (amperes per square decimeter) have a pink coloration and are similarly bright. The deposit has a hardness of about 240-250 Vickers. The deposits contain about 80% of Au, about 18.9% Cu and 1% of antimony.
In other experiments tetra sodium pyrophosphate and/ or tripolyphosphoric acid, neutralized to a pH of 5.0, was substituted for the potassium dihydrogen phosphate, with substantially the same results. In some of the experiments the acid was as low as 20 g./l., in others as high as g./l. Weak organic acids, partially neutralized to a pH 4.5 to 6.0 produce substantially the same results. When citric acid is employed the brilliance of the deposit is not as great as for the inorganic acids, but the deposit is quite attractive. Tartaric acid, partially neutralized with sodium hydroxide is also satisfactory, although some precipitation of potassium bitartrate occurs when gold is added as the potassium gold cyanide. Baths containing acetic acid-sodium or potassium acetate are satisfactory.
The features and principles underlying the invention described above in connection with specific exemplifications will suggest to those skilled in the art many other modifications thereof. It is accordingly desired that the appended claims shall not be limited to any specific feature or details thereof.
We claim:
1. Process for electrodepositing bright, hard gold-copper alloys having a pink coloration which comprises electrolyzing an aqueous solution comprising the following ingredients:
G./l. Gold (added as alkali metal gold cyanide) 18 Copper (added as a copper complex) 2-10 Antimony (added as a salt) 0.5-l0 Chelating agent (in addition to that complexed with the copper) 5-60 Weak acid and salt thereof, and in proportion to provide a pH of 4.5-6,
maintaining said bath at a temperature of 40 to 60 C. and regulating the current density to a value of 0.5 to 2.0 amps/dmfi.
2. The process as set forth in claim 1 wherein the bath contains the following ingredients:
G./l. Gold (added as alkali metal gold cyanide) About 4-8 Copper salt of Na EDTA (calc. as Cu) About 5 Antimony tartrate (calc. at Sb) About 1.5 Na EDTA About 20 KI'I2PO4 About said bath being operated at a pH of about 5.3, a temperature of about 50 C. and a current density of about amps/dmF.
3. An aqueous bath for plating hard, specularly bright 4. An aqueous bath for plating hard, specularly bright copper gold alloy consisting essentially of the following:
Y i G./l. Gold (added as potassium gold cyanide) About 4 Copper salt of Na EDTA (calc. as Cu) About 5 Antimony tartrate (calc. as Sb) About 1.5 Na EDTA About 20 KH2PO4 About adjusted to pH to about 5.3.
5. As an article of manufacture a substrate having a conducting surface which is electroplated to a thickness of at least microns with a coating consisting essentially of an alloy of to 85% gold, 14 to 24% copper and 0.5 to 1.0% of antimony.
References Cited UNITED STATES PATENTS 2,724,687 11/1955 Speter et a] 204-43 2,905,601 9/1959 Rinker et a1. 204--44 XR 2,967,135 1/1961 Ostrow et al 204--46 XR 3,020,217 2/1962 Rinker 20446 XR OTHER REFERENCES Thews, Edmund R.: The Production of Colored Gold Finishes, Metal Finishing, pp. 85, September 1951.
Pritchard, Alfred K., Jr.: Deposition of Pink Gold, Metal Industry, vol. 31, No. 12, p. 408, 1933.
HOWARD S. WILLIAMS, Primary Examiner.
G. KAPLAN, Assistant Examiner.
Claims (2)
1. A PROCESS FOR ELECTRODEPOSITING BRIGHT, HARD GOLD-COPPER ALLOYS HAVING A PINK COLORATION WHICH COMPRISES ELECTROLYZING AN AQUEOUS SOLUTION COMPRISING THE FOLLOWING INGREDIENTS:
5. AS AN ARTICLE OF MANUFACTURE A SUBSTRATE HAVING A CONDUCTING SURFACE WHICH IS ELECTROPLATED TO A THICKNESS OF AT LEAST 25 MICRONS WITH A COATING CONSISTING ESSENTIALLY OF AN ALLOY OF 75 TO 85% GOLD, 14 TO 24% COPPER AND 0.5 TO 1.0% OF ANTIMONY.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US465181A US3380814A (en) | 1965-06-18 | 1965-06-18 | Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US465181A US3380814A (en) | 1965-06-18 | 1965-06-18 | Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof |
| DES0114477 | 1968-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3380814A true US3380814A (en) | 1968-04-30 |
Family
ID=25998853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US465181A Expired - Lifetime US3380814A (en) | 1965-06-18 | 1965-06-18 | Electrolyte and method for coating articles with a gold-copper-antimony alloy and article thereof |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3380814A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3926748A (en) * | 1974-06-28 | 1975-12-16 | Amp Inc | Electrodeposition of gold-antimony alloys and compositions therefor |
| US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
| US6576114B1 (en) | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
| US20060283714A1 (en) * | 2005-06-02 | 2006-12-21 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| EP1815031A1 (en) * | 2004-10-20 | 2007-08-08 | Metalor Technologies International SA | Gold alloy |
| US20090104463A1 (en) * | 2006-06-02 | 2009-04-23 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
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|---|---|---|---|---|
| US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
| US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
| US3020217A (en) * | 1956-10-19 | 1962-02-06 | Sel Rex Precious Metals Inc | Mirror bright gold alloy electroplating |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
| US3020217A (en) * | 1956-10-19 | 1962-02-06 | Sel Rex Precious Metals Inc | Mirror bright gold alloy electroplating |
| US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3926748A (en) * | 1974-06-28 | 1975-12-16 | Amp Inc | Electrodeposition of gold-antimony alloys and compositions therefor |
| US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
| US6576114B1 (en) | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
| EP1815031A1 (en) * | 2004-10-20 | 2007-08-08 | Metalor Technologies International SA | Gold alloy |
| US20060283714A1 (en) * | 2005-06-02 | 2006-12-21 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| US7465385B2 (en) | 2005-06-02 | 2008-12-16 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| US8142637B2 (en) | 2005-06-02 | 2012-03-27 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| US20090104463A1 (en) * | 2006-06-02 | 2009-04-23 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
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