US3373094A - Gold and gold alloy electroplating - Google Patents
Gold and gold alloy electroplating Download PDFInfo
- Publication number
- US3373094A US3373094A US497454A US49745465A US3373094A US 3373094 A US3373094 A US 3373094A US 497454 A US497454 A US 497454A US 49745465 A US49745465 A US 49745465A US 3373094 A US3373094 A US 3373094A
- Authority
- US
- United States
- Prior art keywords
- gold
- piperazine
- bright
- bath
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- This invention has to do with the electrodeposition of gold and more specifically with the electrodeposition of bright gold.
- Bright gold deposits can be obtained from gold electrolytes containing alkali metal gold cyanide at a pH of about 3.0 to about 5.0 by adding base metal compounds such as nickel citrate, cobalt sulfate, etc., to the bath (see U.S. 2,905,601).
- base metal compounds such as nickel citrate, cobalt sulfate, etc.
- One theory explains that such baths produce bright gold because they provide the base metal in the cathode film in a condition to codeposit with the gold.
- the plating specification calls for 24 karat gold, in other cases the base metal present may be deleterious to a solidstate device to be gold plated.
- Among the objects of the invention is to provide a process and electroplating bath for electroplating bright 24 karat gold without the codeposition of other metals with the gold.
- This invention is based on the discovery that excellent bright gold deposits can be obtained by adding small amounts of piperazine or piperazine substitution compounds to acid electrolytes containing alkali metal gold cyanide even in the absence of codepositing metals.
- substituted piperazine will be understood to include those fairly simple substitution compounds obtained by substituting alkyl groups for one or more of the hydrogens of the piperazine ring so that the compound does not lose its essential piperazine characteristics.
- Conducting salts which are preferably alkali metal or ammonium salts may be added to said baths as such or may be formed in the bath by the addition of the corresponding hydroxide or carbonate, etc., to react with a portion of the acid of said baths.
- Such salts also provide efiective buiiering for the solution, especially when the acids employed are weak acids.
- Table I indicates the acid used, which in each case was neutralized to the pH listed with KOH or NaOH to provide the conducting and buffer salts (since the acids employed in these examples are weak acids).
- citric acid When citric acid is added as the acid preferably 5-150 g./I. is employed.
- Bright panels were obtained in all cases.
- the standard practice being to plate 10 x 2.5 cm. brass panels between two platinum cathodes in a liter beaker.
- Current densities from 0.1 to 5 amp./dm. were used, depending upon the temperature selected and the degree of agitation employed.
- Example 10 A bath containing potassium gold cyanide, 12 g./l.; copper ethylenediamine tetraacetate, 4 g./l.; antimony tartrate, 3 g./l.; potassium dihydrogen phosphate, 50 g./l.; and ethylenediamine tetraacetic acid, 20 g./l.; adjusted to a pH of 5.0, yielded deposits with a slight haze at 15 a.s.f. Upon the addition of dimethyl piperazine the deposits were fully bright.
- An electroplating bath for producing bright gold deposits comprising an aqueous solution of alkali metal gold cyanide and as a brightening agent a compound selected from the group consisting of piperazine and alkyl substituted piperazine in an amount sufficient to produce a bright gold deposit, said bath having a pH below about 6.0.
- An electroplating bath according to claim 1 comprising in addition a suflicient amount of conducting salts to substantially lower the voltage required for deposition of the gold.
- An electroplating bath according to claim 4 in which at least one conducting salt is a buffer and is present in an amount sufficient to maintain a stable pH.
- An electroplating bath according to claim 1 containing in addition base metal compounds of such a nature that at least one base metal is present in the cathode film in the condition necessary to co-deposit with the gold.
- An electroplating bath for producing bright gold deposits comprising an aqueous solution of an alkali metal gold cyanide, at least one water soluble compound selected from the class consisting of alkali metal and ammonium salts of organic and inorganic acids to provide a pH below about 6 and as a brightening agent a compound selected from the group consistinng of piperazine and alkyl substituted piperazine in an amount suflicient to produce a bright gold deposit.
- water-soluble compounds are the alkali metal and ammonium salts selected from the class of acids consisting of weak, stable, organic and inorganic acids.
- a method of electrodepositing bright gold which comprises electrolyzing an aqueous solution consisting essentially of a soluble alkali metal gold cyanide and piperazine in the amount of 0.5 to 5.0 grams per liter, said bath having a pH of about 3.0 to 6.0.
- a method of electrodepositing bright gold which comprises electrolyzing at a current density of 0.1 to 5 I amp./dm. an aqueous solution comprising soluble alkali metal gold cyanide and as a brightening agent a compound selected from the group consisting of piperazine and alkyl substituted piperazine in a amount sutficient to produce a bright gold deposit, said bath having a pH of about 3 to 6.
- a method as claimed in claim 14 wherein said added brightening agent is dimethyl piperazine.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US373094D USB373094I5 (en) | 1964-08-26 | 1965-10-18 | |
US497454A US3373094A (en) | 1964-08-26 | 1965-10-18 | Gold and gold alloy electroplating |
CH1487766A CH468474A (en) | 1964-08-26 | 1966-10-14 | Electrolytic plating process to produce shiny deposits of gold or 24 carat gold alloys, and plating bath for carrying out this process |
DE19661521013 DE1521013A1 (en) | 1964-08-26 | 1966-10-17 | Process and electrolyte solution for gold plating |
NL6614654A NL6614654A (en) | 1964-08-26 | 1966-10-18 | |
BE688412D BE688412A (en) | 1964-08-26 | 1966-10-18 | |
FR976A FR1497810A (en) | 1964-08-26 | 1966-10-18 | Electrolytic plating process to produce brilliant deposits of 24 karat gold, and plating bath for carrying out this process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39228664A | 1964-08-26 | 1964-08-26 | |
US497454A US3373094A (en) | 1964-08-26 | 1965-10-18 | Gold and gold alloy electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
US3373094A true US3373094A (en) | 1968-03-12 |
Family
ID=27013831
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US373094D Pending USB373094I5 (en) | 1964-08-26 | 1965-10-18 | |
US497454A Expired - Lifetime US3373094A (en) | 1964-08-26 | 1965-10-18 | Gold and gold alloy electroplating |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US373094D Pending USB373094I5 (en) | 1964-08-26 | 1965-10-18 |
Country Status (6)
Country | Link |
---|---|
US (2) | USB373094I5 (en) |
BE (1) | BE688412A (en) |
CH (1) | CH468474A (en) |
DE (1) | DE1521013A1 (en) |
FR (1) | FR1497810A (en) |
NL (1) | NL6614654A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180209058A1 (en) * | 2017-01-23 | 2018-07-26 | Nitto Denko Corporation | Producing method of wired circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2355581C3 (en) * | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanic bright gold bath with high deposition rate |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
US2765269A (en) * | 1954-11-19 | 1956-10-02 | Barnet D Ostrow | Bath for plating bright gold |
US2812299A (en) * | 1949-05-05 | 1957-11-05 | Birle & Co K G | Electrolytic deposition of gold and gold alloys |
US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
-
1965
- 1965-10-18 US US373094D patent/USB373094I5/en active Pending
- 1965-10-18 US US497454A patent/US3373094A/en not_active Expired - Lifetime
-
1966
- 1966-10-14 CH CH1487766A patent/CH468474A/en unknown
- 1966-10-17 DE DE19661521013 patent/DE1521013A1/en active Pending
- 1966-10-18 BE BE688412D patent/BE688412A/xx unknown
- 1966-10-18 NL NL6614654A patent/NL6614654A/xx unknown
- 1966-10-18 FR FR976A patent/FR1497810A/en not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2812299A (en) * | 1949-05-05 | 1957-11-05 | Birle & Co K G | Electrolytic deposition of gold and gold alloys |
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
US2765269A (en) * | 1954-11-19 | 1956-10-02 | Barnet D Ostrow | Bath for plating bright gold |
US2905601A (en) * | 1957-08-13 | 1959-09-22 | Sel Rex Corp | Electroplating bright gold |
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180209058A1 (en) * | 2017-01-23 | 2018-07-26 | Nitto Denko Corporation | Producing method of wired circuit board |
US11091850B2 (en) * | 2017-01-23 | 2021-08-17 | Nitto Denko Corporation | Producing method of wired circuit board |
Also Published As
Publication number | Publication date |
---|---|
DE1521013A1 (en) | 1969-08-14 |
FR1497810A (en) | 1967-10-13 |
USB373094I5 (en) | |
CH468474A (en) | 1969-02-15 |
BE688412A (en) | 1967-03-31 |
NL6614654A (en) | 1967-04-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
|
AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |