US3362895A - Electrodeposition of silver - Google Patents
Electrodeposition of silver Download PDFInfo
- Publication number
- US3362895A US3362895A US413353A US41335364A US3362895A US 3362895 A US3362895 A US 3362895A US 413353 A US413353 A US 413353A US 41335364 A US41335364 A US 41335364A US 3362895 A US3362895 A US 3362895A
- Authority
- US
- United States
- Prior art keywords
- silver
- acid
- bath
- deposits
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Definitions
- This invention relates to the electrodeposition of metals and specifically to a method of and solutions for electroplating silver.
- a further object of this invention is to plate silver deposits which are bright.
- a silver plating bath useful for plating objects with a basis material or parts that are more or less sensitive to alkaline baths.
- Another object of the invention is to provide silver plating baths in the acid range with exceptionally good stability.
- Another phase of this invention is based on the discovery that the addition of relatively small amounts of an alkali metal or ammonium thiocyanate will stabilize silver plating baths, in the acid range so that plating can be carried out on a commercial scale.
- Deposits from the acid bath just described are not bright but they are smooth and the solution is easy to rinse ofi the parts as compared to the conventional high cyanide baths or the high thiocyanate solutions described in copending application Ser. No. 404,518, filed Oct. 16, 1964.
- Among other objects of the invention is to provide silver plating baths in the acid range which produce bright silver platings.
- Still another phase of the invention is based on the discovery that the addition of even small amounts of nickel salts (the complex nickel tetraethylenepentamine compound is especially useful) as Well as cobalt, copper, iron, zinc, indium, arsenic, antimony, and bismuth will refine the grain size of the deposits to give in many instances fully bright deposits.
- nickel salts the complex nickel tetraethylenepentamine compound is especially useful
- cobalt copper, iron, zinc, indium, arsenic, antimony, and bismuth
- maleic acid plus one or more salts of maleic acid have been found to serve as a particularly good bufier in the pH range of 6 to 7.
- any acid-salt combination buffering in this particular region will serve to stabilize the bath and at the same time maintain the cyanide build-up to a low value, minimizing rinsing and waste disposal problems.
- alkali in addition to neutralizing the acid content of the bath to the proper pH provides conductivity salts for the bath.
- alkali will be understood to include ammonia, ammonium hydroxide, the alkaline reacting amines as well as the lithium, sodium, potassium hydroxides.
- the additional metal called for means a metal different from the metals already specified, namely different from silver and the alkali metals.
- Any acid can be added to provide the final acidity, but there must be suificient amount of weak acid (anionic) ions present to provide a substantial buffering action in the range of pH 6 to 7.
- Any of the acids known as weak acids it added as acids or as salts act as bufiering agents.
- a weak acid to be effective at a pH of 6.5 to 7.5 should have a K (K K or K of approximately 2.6x 10- or more.
- Any weak acid with a greater K constant can be neutralized to the desired pH.
- Typical acids with suitable ionization constants include maleic, malonic, phosphoric, phosphorous and sulfanilic.
- Example 1 A bath was prepared by dissolving the following in- Brass panels were plated in this bath at room temperature, at a current density of 1.0 amp./dm. Smooth matte deposits were obtained.
- Example 2 To the bath described under Example 1 was added 45 g./l. (instead of 30 g./l.) of potassium silver cyanide. Deposits were obtained similar to those described above, but the current density could be raised to 2.5 amp./dm. The addition of 5 g./l. of methylene bis naphthalene sulfonate (Na or K) provided deposits which were semibright and not grainy in appearance.
- methylene bis naphthalene sulfonate Na or K
- Example 3 A bath was prepared by dissolving the following ingredients in water:
- Example 4 A bath was made by dissolving the following ingredients in water:
- Example A bath was prepared by dissolving the following ingredients in water:
- Aqueous electrolyte solutions as claimed in claim 1 in which the additional ionic metal is added in sufficient quantity to produce bright deposits.
- Aqueous electrolyte solutions as claimed in claim 1 in which ionic nickel is added as the additional ionic metal in sufiicient quantity to produce bright electrodeposits.
- a process for electrodepositing silver comprising making an object having a conducting surface the cathode in an aqueous bath comprising G./l.
- Alkali metal silver cyanide (calc. as Ag) 475 Acid plus anionic buffering agent 2100
- Thiocyanate selected from the group consisting of alkali metal and ammonium thiocyanates 2-20 Additional ionic metal 0-100 Alkali to provide a pH of 6 to 7.5.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US413353A US3362895A (en) | 1964-11-23 | 1964-11-23 | Electrodeposition of silver |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US413353A US3362895A (en) | 1964-11-23 | 1964-11-23 | Electrodeposition of silver |
GB3972967A GB1177166A (en) | 1967-08-30 | 1967-08-30 | Electrodeposition of Silver |
NL6711997A NL6711997A (en) | 1967-08-30 | 1967-08-31 | |
DES0111718 | 1967-09-07 | ||
CH1338567A CH476113A (en) | 1967-08-30 | 1967-09-22 | Process of electrolytic silver plating and aqueous bath for the implementation of this process |
Publications (1)
Publication Number | Publication Date |
---|---|
US3362895A true US3362895A (en) | 1968-01-09 |
Family
ID=27509472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US413353A Expired - Lifetime US3362895A (en) | 1964-11-23 | 1964-11-23 | Electrodeposition of silver |
Country Status (1)
Country | Link |
---|---|
US (1) | US3362895A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
US4155817A (en) * | 1978-08-11 | 1979-05-22 | American Chemical And Refining Company, Inc. | Low free cyanide high purity silver electroplating bath and method |
US4177114A (en) * | 1977-09-02 | 1979-12-04 | Hitachi, Ltd. | Silver-electroplating process |
US4246077A (en) * | 1975-03-12 | 1981-01-20 | Technic, Inc. | Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds |
US4465564A (en) * | 1983-06-27 | 1984-08-14 | American Chemical & Refining Company, Inc. | Gold plating bath containing tartrate and carbonate salts |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2110792A (en) * | 1936-03-23 | 1938-03-08 | Int Silver Co | Process for electrodeposition of silver and products obtained therefrom |
US2812299A (en) * | 1949-05-05 | 1957-11-05 | Birle & Co K G | Electrolytic deposition of gold and gold alloys |
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
US3174918A (en) * | 1961-01-24 | 1965-03-23 | Sel Rex Corp | Bright gold electroplating |
-
1964
- 1964-11-23 US US413353A patent/US3362895A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2110792A (en) * | 1936-03-23 | 1938-03-08 | Int Silver Co | Process for electrodeposition of silver and products obtained therefrom |
US2812299A (en) * | 1949-05-05 | 1957-11-05 | Birle & Co K G | Electrolytic deposition of gold and gold alloys |
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
US3174918A (en) * | 1961-01-24 | 1965-03-23 | Sel Rex Corp | Bright gold electroplating |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
US4246077A (en) * | 1975-03-12 | 1981-01-20 | Technic, Inc. | Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds |
US4177114A (en) * | 1977-09-02 | 1979-12-04 | Hitachi, Ltd. | Silver-electroplating process |
US4155817A (en) * | 1978-08-11 | 1979-05-22 | American Chemical And Refining Company, Inc. | Low free cyanide high purity silver electroplating bath and method |
US4465564A (en) * | 1983-06-27 | 1984-08-14 | American Chemical & Refining Company, Inc. | Gold plating bath containing tartrate and carbonate salts |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3475292A (en) | Gold plating bath and process | |
US4428802A (en) | Palladium-nickel alloy electroplating and solutions therefor | |
US2318592A (en) | Electrodeposition | |
US3458409A (en) | Method and electrolyte for thick,brilliant plating of palladium | |
US3666640A (en) | Gold plating bath and process | |
US3637474A (en) | Electrodeposition of palladium | |
GB718574A (en) | Bath for the deposit of gold alloys by electroplating | |
US2451426A (en) | Bright zinc plating | |
US2812299A (en) | Electrolytic deposition of gold and gold alloys | |
US2737485A (en) | Electrodeposition of copper | |
US3238112A (en) | Electroplating of metals using mercapto-metal complex salts | |
GB1272536A (en) | Electroplating solutions and process for electroplating using such solutions | |
US3362895A (en) | Electrodeposition of silver | |
US3174918A (en) | Bright gold electroplating | |
US4184929A (en) | Trivalent chromium plating bath composition and process | |
US3776822A (en) | Gold plating electrolyte | |
US3440151A (en) | Electrodeposition of copper-tin alloys | |
US4048023A (en) | Electrodeposition of gold-palladium alloys | |
EP0225422A1 (en) | Alkaline baths and methods for electrodeposition of palladium and palladium alloys | |
US2859159A (en) | Bright copper plating bath containing mixtures of metal compounds | |
US4297179A (en) | Palladium electroplating bath and process | |
US2599178A (en) | Electrodeposition of alloys of molybdenum with cobalt, nickel, and iron | |
JPS585983B2 (en) | Method and apparatus for stably producing metal complexes for electroless metal deposition | |
ES435660A1 (en) | Zinc-copper alloy electroplating baths | |
US1536859A (en) | Electroplating |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
AS | Assignment |
Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
|
AS | Assignment |
Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |