WO2006053062A3 - Tin alloy electroplating system - Google Patents

Tin alloy electroplating system Download PDF

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Publication number
WO2006053062A3
WO2006053062A3 PCT/US2005/040624 US2005040624W WO2006053062A3 WO 2006053062 A3 WO2006053062 A3 WO 2006053062A3 US 2005040624 W US2005040624 W US 2005040624W WO 2006053062 A3 WO2006053062 A3 WO 2006053062A3
Authority
WO
WIPO (PCT)
Prior art keywords
tin alloy
electroplating bath
tin
plating
cathode
Prior art date
Application number
PCT/US2005/040624
Other languages
French (fr)
Other versions
WO2006053062A2 (en
Inventor
George Bokisa
William E Eckles
Original Assignee
Taskem Inc
George Bokisa
William E Eckles
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taskem Inc, George Bokisa, William E Eckles filed Critical Taskem Inc
Publication of WO2006053062A2 publication Critical patent/WO2006053062A2/en
Publication of WO2006053062A3 publication Critical patent/WO2006053062A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Disclosed are systems and methods of plating a tin alloy in an efficient economical, and environmentally friendly manner. The system for plating a tin alloy contains an electrochemical cell containing an anode, the cathode, and an electroplating bath. The electroplating bath contains water, an acid, at least one nitrogen-containing heterocyclic complexing agent, an ionic alloy metal, and ionic tin. The methods involve applying a current to the electroplating bath whereby a tin alloy forms on the cathode.
PCT/US2005/040624 2004-11-10 2005-11-09 Tin alloy electroplating system WO2006053062A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/985,194 US20060096867A1 (en) 2004-11-10 2004-11-10 Tin alloy electroplating system
US10/985,194 2004-11-10

Publications (2)

Publication Number Publication Date
WO2006053062A2 WO2006053062A2 (en) 2006-05-18
WO2006053062A3 true WO2006053062A3 (en) 2007-01-11

Family

ID=36315194

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/040624 WO2006053062A2 (en) 2004-11-10 2005-11-09 Tin alloy electroplating system

Country Status (2)

Country Link
US (1) US20060096867A1 (en)
WO (1) WO2006053062A2 (en)

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US8852417B2 (en) * 1999-04-13 2014-10-07 Applied Materials, Inc. Electrolytic process using anion permeable barrier
US8236159B2 (en) 1999-04-13 2012-08-07 Applied Materials Inc. Electrolytic process using cation permeable barrier
DE602007004334D1 (en) * 2006-06-08 2010-03-04 Eveready Battery Inc INTERCONNECTED ANODE HOUSINGS FOR ALKALI BATTERIES
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
JP4632186B2 (en) * 2007-08-01 2011-02-16 太陽化学工業株式会社 Tin electrolytic plating solution for electronic parts, tin electrolytic plating method for electronic parts and tin electrolytic plated electronic parts
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US20090286383A1 (en) * 2008-05-15 2009-11-19 Applied Nanotech Holdings, Inc. Treatment of whiskers
US9730333B2 (en) * 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US20100000762A1 (en) * 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
EP2412007B1 (en) 2009-03-27 2020-07-22 Ishihara Chemical Co., Ltd. Buffer layer to enhance photo and/or laser sintering
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
JP2011179085A (en) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd Pretreatment agent and pretreatment method for electroplating and electroplating method
JP6060972B2 (en) * 2012-07-05 2017-01-18 株式会社ニコン Method for producing zinc oxide thin film, method for producing thin film transistor, and method for producing transparent oxide wiring
WO2014011578A1 (en) 2012-07-09 2014-01-16 Applied Nanotech Holdings, Inc. Photosintering of micron-sized copper particles
CN104471108B (en) * 2012-07-09 2020-05-05 四国化成工业株式会社 Copper coating forming agent and method for forming copper coating
JP6022922B2 (en) * 2012-12-13 2016-11-09 株式会社荏原製作所 Sn alloy plating apparatus and method
US10633754B2 (en) * 2013-07-05 2020-04-28 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
US9918389B2 (en) * 2013-09-04 2018-03-13 Rohm And Haas Electronic Materials Llc Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts
JP5938426B2 (en) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 Electroplating cell and metal film manufacturing method
US11686007B2 (en) * 2017-12-18 2023-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
US20210156043A1 (en) * 2019-11-25 2021-05-27 The Boeing Company Method for plating a metallic material onto a titanium substrate
US11280014B2 (en) * 2020-06-05 2022-03-22 Macdermid Enthone Inc. Silver/tin electroplating bath and method of using the same
WO2023088795A1 (en) * 2021-11-22 2023-05-25 Basf Se Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant

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US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US20030188974A1 (en) * 2002-04-03 2003-10-09 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
WO2004011698A1 (en) * 2002-07-25 2004-02-05 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
US20050184369A1 (en) * 2002-07-25 2005-08-25 Sinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

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DE19719020A1 (en) * 1997-05-07 1998-11-12 Km Europa Metal Ag Method and device for regenerating tinning solutions
JP3433291B2 (en) * 1999-09-27 2003-08-04 石原薬品株式会社 Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film
US6706418B2 (en) * 2000-07-01 2004-03-16 Shipley Company L.L.C. Metal alloy compositions and plating methods related thereto

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating
US20030188974A1 (en) * 2002-04-03 2003-10-09 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
WO2004011698A1 (en) * 2002-07-25 2004-02-05 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
US20050184369A1 (en) * 2002-07-25 2005-08-25 Sinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

Also Published As

Publication number Publication date
WO2006053062A2 (en) 2006-05-18
US20060096867A1 (en) 2006-05-11

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