WO2010106072A3 - Electrolyte and surface-active additives for the galvanic deposition of smooth, dense aluminum layers from ionic liquids - Google Patents
Electrolyte and surface-active additives for the galvanic deposition of smooth, dense aluminum layers from ionic liquids Download PDFInfo
- Publication number
- WO2010106072A3 WO2010106072A3 PCT/EP2010/053397 EP2010053397W WO2010106072A3 WO 2010106072 A3 WO2010106072 A3 WO 2010106072A3 EP 2010053397 W EP2010053397 W EP 2010053397W WO 2010106072 A3 WO2010106072 A3 WO 2010106072A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrolyte
- smooth
- ionic liquids
- aluminum layers
- active additives
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
Abstract
The invention relates to a method for the electrochemical deposition of aluminum, whereby mat or glossy dense aluminum layers can be obtained. The method comprises the following steps: (a) making an electrolytic device available, said device comprising at least one anode and at least one cathode in an electrolytic chamber, (b) electrochemically depositing the aluminum on the at least one cathode of the electrolytic device from an ionic liquid which contains anions and cations, as well as one or more metal salt(s), and one or more additive(s), a current density of at least 50 A/m2 being applied to the at least one cathode.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/257,092 US20120006688A1 (en) | 2009-03-18 | 2010-03-16 | Electrolyte and surface-active additives for the electrochemical deposition of smooth, dense aluminum layers from ionic liquids |
EP10708571A EP2419551A2 (en) | 2009-03-18 | 2010-03-16 | Electrolyte and surface-active additives for the galvanic deposition of smooth, dense aluminum layers from ionic liquids |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09155495.6 | 2009-03-18 | ||
EP09155495 | 2009-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010106072A2 WO2010106072A2 (en) | 2010-09-23 |
WO2010106072A3 true WO2010106072A3 (en) | 2011-09-01 |
Family
ID=42200026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/053397 WO2010106072A2 (en) | 2009-03-18 | 2010-03-16 | Electrolyte and surface-active additives for the galvanic deposition of smooth, dense aluminum layers from ionic liquids |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120006688A1 (en) |
EP (1) | EP2419551A2 (en) |
WO (1) | WO2010106072A2 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120095470A (en) | 2009-12-15 | 2012-08-28 | 바스프 에스이 | Thiazole compounds as additives in electrolyte solutions in electrochemical cells and batteries |
DE102011007566A1 (en) | 2010-04-19 | 2012-01-19 | Basf Se | Preparing composition of aluminum trihalide and solvent, useful for electrochemical coating of substrate with aluminum, comprises e.g. dissolving or suspending aluminum trihalide in cycloaliphatic solvent and adding required solvent |
HUE033209T2 (en) | 2010-10-06 | 2017-11-28 | Glaxosmithkline Llc | Benzimidazole derivatives as pi3 kinase inhibitors |
US9340884B2 (en) | 2010-12-15 | 2016-05-17 | Basf Se | Process for the electrochemical fluorination of organic compounds |
CN102888631B (en) * | 2011-07-20 | 2016-04-27 | 中国科学院过程工程研究所 | A kind of ionic liquid low-temperature electro-deposition prepares the method for Al-Bi alloy or plating Al-Bi alloy |
CN102888630B (en) * | 2011-07-20 | 2015-11-18 | 中国科学院过程工程研究所 | A kind of ionic liquid/additive system Low-temperature electro-deposition prepares the method for nano aluminum or nano aluminum coating |
DE102011055911B3 (en) | 2011-12-01 | 2012-11-29 | Volkmar, Prof. Dr. Neubert | Process for the electrodeposition of at least one metal or semiconductor |
US20130299355A1 (en) * | 2012-05-14 | 2013-11-14 | United Technologies Corporation | Surface cleaning and activation for electrodeposition in ionic liquids |
US10190227B2 (en) | 2013-03-14 | 2019-01-29 | Xtalic Corporation | Articles comprising an electrodeposited aluminum alloys |
WO2014150508A1 (en) * | 2013-03-15 | 2014-09-25 | United Technologies Corporation | Sacrificial coating and procedure for electroplating aluminum on aluminum alloys |
WO2015003948A1 (en) * | 2013-07-09 | 2015-01-15 | Basf Se | Electrochemical deposition of aluminum from ionic liquid compositions |
US9368284B2 (en) | 2013-09-02 | 2016-06-14 | Litronik Entwicklungs Gmbh | Anode electrode for aluminum electrolytic capacitor and respective production method |
US9903034B2 (en) | 2013-11-22 | 2018-02-27 | Sikorsky Aircraft Corporation | Methods and materials for electroplating aluminum in ionic liquids |
WO2015157441A1 (en) | 2014-04-09 | 2015-10-15 | Nulwala Hunaid B | Ionic liquid solvent for electroplating process |
US9758888B2 (en) | 2014-05-06 | 2017-09-12 | Apple Inc. | Preparation of metal substrate surfaces for electroplating in ionic liquids |
WO2016004189A1 (en) | 2014-07-03 | 2016-01-07 | Nulwala Hunaid B | Selected compositions for aluminum processes and devices |
US9752242B2 (en) * | 2014-09-17 | 2017-09-05 | Xtalic Corporation | Leveling additives for electrodeposition |
CN104694984B (en) * | 2015-02-13 | 2017-02-01 | 浙江大学 | Room-temperature molten salt aluminum plating device and method for inner wall of stainless steel tube |
EP3088571B1 (en) * | 2015-04-28 | 2021-06-02 | The Boeing Company | Environmentally friendly aluminum coatings as sacrificial coatings for high strength steel alloys |
CN106086959B (en) * | 2016-08-03 | 2018-06-12 | 南京理工大学 | A kind of method that electrochemical reduction deposition of aluminum prepares thermite |
US10530864B2 (en) * | 2017-02-15 | 2020-01-07 | Dell Products, L.P. | Load balancing internet-of-things (IOT) gateways |
US20180320282A1 (en) | 2017-05-05 | 2018-11-08 | Hamilton Sundstrand Corporation | Method of making aluminum-coated metal |
US11661665B2 (en) | 2020-04-30 | 2023-05-30 | The Boeing Company | Aluminum and aluminum alloy electroplated coatings |
Citations (7)
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---|---|---|---|---|
EP0404188A1 (en) * | 1989-06-23 | 1990-12-27 | Nisshin Steel Co., Ltd. | Non-aqueous electrolytic aluminum plating bath composition |
US20040249177A1 (en) * | 2003-06-04 | 2004-12-09 | Shipley Company, L.L.C. | Leveler compounds |
US20050189231A1 (en) * | 2004-02-26 | 2005-09-01 | Capper Lee D. | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
DE102005017733A1 (en) * | 2005-04-15 | 2006-10-19 | Basf Ag | Solubility of cellulose in ionic liquids with the addition of amine base |
WO2006108476A2 (en) * | 2005-04-12 | 2006-10-19 | Dr.-Ing. Max Schlötter Gmbh & Co. Kg | Electrolyte and method for depositing tin bismuth alloy layers |
WO2008096855A1 (en) * | 2007-02-09 | 2008-08-14 | Dipsol Chemicals Co., Ltd. | ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME |
EP1983592A1 (en) * | 2007-04-17 | 2008-10-22 | Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO | Method for manufacturing an electrode |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3202265A1 (en) | 1982-01-25 | 1983-07-28 | Siemens AG, 1000 Berlin und 8000 München | ELECTROLYTE FOR GALVANIC DEPOSITION OF ALUMINUM |
US4981564A (en) * | 1988-07-06 | 1991-01-01 | Technic Inc. | Additives for electroplating compositions and methods for their use |
US5433797A (en) * | 1992-11-30 | 1995-07-18 | Queen's University | Nanocrystalline metals |
DE10108893C5 (en) | 2001-02-23 | 2011-01-13 | Rolf Prof. Dr. Hempelmann | Process for the production of metals and their alloys |
US7371467B2 (en) * | 2002-01-08 | 2008-05-13 | Applied Materials, Inc. | Process chamber component having electroplated yttrium containing coating |
US20030234181A1 (en) * | 2002-06-25 | 2003-12-25 | Gino Palumbo | Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
JP5080097B2 (en) * | 2007-02-09 | 2012-11-21 | ディップソール株式会社 | Molten salt electroplating bath and plating method using the same |
-
2010
- 2010-03-16 WO PCT/EP2010/053397 patent/WO2010106072A2/en active Application Filing
- 2010-03-16 EP EP10708571A patent/EP2419551A2/en not_active Withdrawn
- 2010-03-16 US US13/257,092 patent/US20120006688A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0404188A1 (en) * | 1989-06-23 | 1990-12-27 | Nisshin Steel Co., Ltd. | Non-aqueous electrolytic aluminum plating bath composition |
US20040249177A1 (en) * | 2003-06-04 | 2004-12-09 | Shipley Company, L.L.C. | Leveler compounds |
US20050189231A1 (en) * | 2004-02-26 | 2005-09-01 | Capper Lee D. | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
WO2006108476A2 (en) * | 2005-04-12 | 2006-10-19 | Dr.-Ing. Max Schlötter Gmbh & Co. Kg | Electrolyte and method for depositing tin bismuth alloy layers |
DE102005017733A1 (en) * | 2005-04-15 | 2006-10-19 | Basf Ag | Solubility of cellulose in ionic liquids with the addition of amine base |
WO2008096855A1 (en) * | 2007-02-09 | 2008-08-14 | Dipsol Chemicals Co., Ltd. | ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME |
US20100285322A1 (en) * | 2007-02-09 | 2010-11-11 | Dipsol Chemicals Co., Ltd. | Electric Al-Zr Alloy Plating Bath Using Room Temperature Molten Salt Bath and Plating Method Using the Same |
EP1983592A1 (en) * | 2007-04-17 | 2008-10-22 | Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO | Method for manufacturing an electrode |
Non-Patent Citations (2)
Title |
---|
NATTER H ET AL: "Nanocrystalline metals prepared by electrodeposition", ZEITSCHRIFT FUER PHYSIKALISCHE CHEMIE, OLDENBOURG, MUENCHEN, DE, vol. 222, 1 January 2008 (2008-01-01), pages 319 - 354, XP008133912, ISSN: 0044-3336, DOI: DOI:10.1524/ZPCH.2008.222.2-3.319 * |
PAUNOVIC, M AND SCHLESINGER, M: "Fundamentals of electrochemical deposition", 1 January 2006, WILEY-INTERSCIENCE, pages: 177 - 198, XP002632133 * |
Also Published As
Publication number | Publication date |
---|---|
WO2010106072A2 (en) | 2010-09-23 |
EP2419551A2 (en) | 2012-02-22 |
US20120006688A1 (en) | 2012-01-12 |
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