TW200702498A - Method for electrodeposition of bronzes - Google Patents
Method for electrodeposition of bronzesInfo
- Publication number
- TW200702498A TW200702498A TW095113445A TW95113445A TW200702498A TW 200702498 A TW200702498 A TW 200702498A TW 095113445 A TW095113445 A TW 095113445A TW 95113445 A TW95113445 A TW 95113445A TW 200702498 A TW200702498 A TW 200702498A
- Authority
- TW
- Taiwan
- Prior art keywords
- bronzes
- electrodeposition
- electrolyte
- acid
- plated
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Abstract
A method for electrodeposition of bronzes, with which the substrate to be coated is plated in an acid electrolyte that contains at least tin and copper ions, an alkylsulfonic acid and a wetting agent, and the preparation of such an electrolyte.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/105,947 US20060260948A2 (en) | 2005-04-14 | 2005-04-14 | Method for electrodeposition of bronzes |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200702498A true TW200702498A (en) | 2007-01-16 |
TWI391534B TWI391534B (en) | 2013-04-01 |
Family
ID=37115474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095113445A TWI391534B (en) | 2005-04-14 | 2006-04-14 | Method for electrodeposition of bronzes |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060260948A2 (en) |
EP (1) | EP1874982B1 (en) |
JP (1) | JP2008537017A (en) |
KR (1) | KR101361431B1 (en) |
CN (1) | CN101194049B (en) |
TW (1) | TWI391534B (en) |
WO (1) | WO2006113473A1 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2531163T3 (en) * | 2002-10-11 | 2015-03-11 | Enthone | Procedure and electrolyte for galvanic deposition of bronzes |
DE102004041701A1 (en) * | 2004-08-28 | 2006-03-02 | Enthone Inc., West Haven | Process for the electrolytic deposition of metals |
US7296370B2 (en) * | 2004-09-24 | 2007-11-20 | Jarden Zinc Products, Inc. | Electroplated metals with silvery-white appearance and method of making |
US9263609B2 (en) * | 2006-05-24 | 2016-02-16 | Atotech Deutschland Gmbh | Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell |
DE102011008836B4 (en) * | 2010-08-17 | 2013-01-10 | Umicore Galvanotechnik Gmbh | Electrolyte and method for depositing copper-tin alloy layers |
US8426241B2 (en) | 2010-09-09 | 2013-04-23 | International Business Machines Corporation | Structure and method of fabricating a CZTS photovoltaic device by electrodeposition |
CN102605394B (en) * | 2012-03-07 | 2015-02-18 | 深圳市华傲创表面技术有限公司 | Cyanogen-free acidic cupronickel-tin plating solution |
JP6101510B2 (en) * | 2013-02-18 | 2017-03-22 | 株式会社シミズ | Non-cyanide copper-tin alloy plating bath |
US8945978B2 (en) * | 2013-06-28 | 2015-02-03 | Sunpower Corporation | Formation of metal structures in solar cells |
JP2017504715A (en) | 2013-12-05 | 2017-02-09 | ハネウェル・インターナショナル・インコーポレーテッド | Stannous methanesulfonate solution with controlled pH |
CA2951437C (en) | 2014-07-07 | 2022-03-15 | Honeywell International Inc. | Thermal interface material with ion scavenger |
CA2957587C (en) * | 2014-08-08 | 2019-03-05 | Okuno Chemical Industries Co., Ltd. | Copper-tin alloy plating bath |
US20160298249A1 (en) * | 2014-09-30 | 2016-10-13 | Rohm And Haas Electronic Materials Llc | Cyanide-free electroplating baths for white bronze based on copper (i) ions |
ES2886846T3 (en) | 2014-12-05 | 2021-12-21 | Honeywell Int Inc | High performance thermal interface materials with low thermal impedance |
KR102426521B1 (en) * | 2015-04-20 | 2022-07-27 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | Electrolytic copper plating bath compositions and a method for their use |
BR112017027295A2 (en) | 2015-06-16 | 2018-09-04 | 3M Innovative Properties Co | bronze galvanization on polymer blades |
US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
KR102554661B1 (en) | 2016-03-08 | 2023-07-13 | 허니웰 인터내셔널 인코포레이티드 | phase change material |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
CN108103540B (en) * | 2018-01-24 | 2020-01-07 | 永星化工(上海)有限公司 | Tin alloy electroplating solution |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
WO2020021965A1 (en) * | 2018-07-27 | 2020-01-30 | 三菱マテリアル株式会社 | Tin alloy plating solution |
JP6645609B2 (en) | 2018-07-27 | 2020-02-14 | 三菱マテリアル株式会社 | Tin alloy plating solution |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2854388A (en) * | 1955-03-14 | 1958-09-30 | City Auto Stamping Co | Electrodeposition of copper-tin alloys |
US2916423A (en) * | 1957-06-19 | 1959-12-08 | Metal & Thermit Corp | Electrodeposition of copper and copper alloys |
DE3339541C2 (en) * | 1983-11-02 | 1986-08-07 | Degussa Ag, 6000 Frankfurt | Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings |
DE3934866A1 (en) * | 1989-10-19 | 1991-04-25 | Blasberg Oberflaechentech | METHOD FOR DEPOSITING LEAD AND LEAD-CONTAINING LAYERS, ELECTROLYTE FOR CARRYING OUT THE METHOD AND USE OF SURFACTANTS IN ACID LEAD ELECTROLYTE |
JP2901292B2 (en) * | 1989-12-05 | 1999-06-07 | 住友ゴム工業 株式会社 | Bead wire for rubber coated tire and tire using the same |
DE4336664A1 (en) * | 1993-10-27 | 1995-05-04 | Demetron Gmbh | Workpieces made of non-corrosion-resistant metals with coatings applied using the PVD process |
US5385661A (en) * | 1993-09-17 | 1995-01-31 | International Business Machines Corporation | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition |
SG68083A1 (en) * | 1997-10-30 | 1999-10-19 | Sung Soo Moon | Tin alloy plating compositions |
TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
JP4359907B2 (en) * | 1999-08-11 | 2009-11-11 | 石原薬品株式会社 | Tin-copper alloy plating bath |
JP3433291B2 (en) | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film |
JP2001107287A (en) * | 1999-10-07 | 2001-04-17 | Ebara Udylite Kk | Sn-Cu ALLOY PLATING BATH |
JP2001181889A (en) * | 1999-12-22 | 2001-07-03 | Nippon Macdermid Kk | Bright tin-copper alloy electroplating bath |
JP2001234387A (en) * | 2000-02-17 | 2001-08-31 | Yuken Industry Co Ltd | Agent and method for preventing generation of whisker in electrotinning |
US7179362B2 (en) * | 2000-09-20 | 2007-02-20 | Dr.-Ing. Max Schlotter Gmbh & Co.Kg | Electrolyte and method for depositing tin-copper alloy layers |
CN1407141A (en) * | 2001-03-16 | 2003-04-02 | 希普雷公司 | Tinplating |
JP3876383B2 (en) * | 2002-06-03 | 2007-01-31 | 京都市 | Copper-tin alloy plating bath and copper-tin alloy plating method using the plating bath |
ES2531163T3 (en) * | 2002-10-11 | 2015-03-11 | Enthone | Procedure and electrolyte for galvanic deposition of bronzes |
KR20040073974A (en) * | 2003-02-14 | 2004-08-21 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | Electroplating composition |
-
2005
- 2005-04-14 US US11/105,947 patent/US20060260948A2/en not_active Abandoned
-
2006
- 2006-04-14 WO PCT/US2006/014141 patent/WO2006113473A1/en active Application Filing
- 2006-04-14 TW TW095113445A patent/TWI391534B/en active
- 2006-04-14 EP EP06750231.0A patent/EP1874982B1/en active Active
- 2006-04-14 JP JP2008506756A patent/JP2008537017A/en active Pending
- 2006-04-14 KR KR1020077026291A patent/KR101361431B1/en active IP Right Grant
- 2006-04-14 CN CN2006800208357A patent/CN101194049B/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1874982A1 (en) | 2008-01-09 |
KR20070120600A (en) | 2007-12-24 |
JP2008537017A (en) | 2008-09-11 |
EP1874982A4 (en) | 2011-07-27 |
KR101361431B1 (en) | 2014-02-10 |
US20060260948A2 (en) | 2006-11-23 |
TWI391534B (en) | 2013-04-01 |
CN101194049A (en) | 2008-06-04 |
WO2006113473A1 (en) | 2006-10-26 |
CN101194049B (en) | 2011-12-07 |
EP1874982B1 (en) | 2014-05-07 |
US20050263403A1 (en) | 2005-12-01 |
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