EP1939329B1 - Kit for the manufacture of a process reactor for forming metallic layers on one or more substrate - Google Patents

Abstract

Kit for building a processing reactor for electrolytic deposition of metals on substrates (2) comprises a reactor vessel (3);#a substrate holder (6) near the vessel outlet (4);#an overflow (8);#a trap (10) for liquid from the overflow and a system for feeding it back into the reactor; and#an anode. In addition it contains one or more a flow guide (S);#an electric field adjusting system;#an auxiliary electrode (H);#a screen (B) for directing the field; and an annular sleeve (R) for reducing the diameter of the reactor. An independent claim is included for a method for electrolytic deposition of metals on substrates using the kit to build the reactor vessel.

Description

The present invention relates to a kit for the production of a process reactor. This process reactor is used to form metallic layers on one or more substrates, wherein the substrates may be, for example, essentially flat semiconductor wafers.

More particularly, the present invention relates to electroplating, which is understood to mean the electrochemical deposition of metallic deposits (coatings) on articles. In this case, electricity is sent through an electrolytic bath. At the positive pole (anode) is the metal to be applied (e.g., copper or nickel), at the negative pole (cathode) is the object to be worked or refined. The electric current dissolves metal ions from the consumable electrode and deposits them by reduction on the substrate. As an alternative to the consumption anode, the use of an inert anode is also possible, the metal ions required for the galvanization then being made available, for example, by addition to the plating solution. In this way, the substrate to be treated is more or less uniformly coated with the metal used. The longer the object is in the bath and the higher the electrical current, the stronger the metal layer becomes.

In general, a distinction is made between functional and decorative electroplating technology, and the present invention is particularly applicable in the field of functional electroplating technology. While the decorative electroplating technique mainly serves the beautification of objects, the functional electroplating technique is mainly used for corrosion protection, Wear protection or used for catalysis and to change or improve the electrical conductivity. The present invention is particularly suitable in the field of semiconductor technology for the known in this context, the method for structured or unstructured application of electrically conductive layers for contacting, rewiring or soldering microelectronic circuits, as well as the structured or unstructured application of functional layers with, for example diffusion-blocking, adhesion-promoting, catalytic, as well as special optical, mechanical, magnetic or heat-conducting properties. The present invention is also suitable for the electroplating of structured mold inserts (so-called mastering) for the molding of microcomponents or optical data carriers (CDs / DVDs), as well as for electrochemical replication.

In the case of the electrochemical variant of electroplating according to the invention, the base materials (called substrates in the present case) are exposed to an electric field. Since an electric field and flow conditions of an electrolytic fluid do not adjust uniformly, but act on differently sized structures to be coated as well as on the edges of the substrate different high field strengths or currents, the deposited layer thicknesses will be different for these locations. These inhomogeneity effects are further enhanced by higher field strengths or flow rates, which in turn would be advantageous for achieving higher deposition rates and thus higher throughput rates in production.

The embodiments set forth in the context of the present invention are basically applicable to a wide range of substrates of different size, number and material quality. For the sake of clarity, however, the present invention is set forth in the preferred example of treating substantially semiconductive substrates, so-called wafers.

The kit for producing a process reactor according to the main claim comprises a reactor housing which can be filled with fluid and has two ends. The reactor housing is designed such that it flows through the fluid from one end to the other. Furthermore, in the region of the outflow from the reactor housing, a device for receiving the substrate (s) is preferably arranged such that it can rotate relative to the reactor housing about its central longitudinal axis. The process reactor is designed as a so-called overflow reactor. This means that the fluid flows through the interior of the reactor housing, for example from the lower end to the upper end, and leaves via an overflow, from where it is returned to the reactor housing of the process reactor via a collecting vessel by means of defined means. According to an alternative preferred embodiment, the reactor housing can be made obliquely, horizontally or even reversed at any angle, so that the fluid can flow in accordance with the inclination of the reactor instead of from bottom to top in accordance with any angle. The invention is illustrated below using the example of the vertical flow from bottom to top, wherein it is expressly pointed out that the individual elements of the kit according to the invention are independent of the angle of inclination of the reactor housing or the fluid flow and are applicable accordingly in arbitrarily inclined process reactor housings.

Furthermore, the process reactor comprises at least one anode with a positive potential, whereas the substrate is at the negative pole (cathode) and therefore has a negative potential. According to the invention, it is possible to change the polarities of the electrodes involved. This means that the original anode has a negative potential and the original cathode has a positive potential. Furthermore, the setting of different potential sizes is conceivable.

In the prior art so-called overflow process reactors are known which comprise a reactor housing in which a fluid flow is generated. The fluid is enriched by a self-dissolving anode (consumable electrode) with the desired metal ions, which are deposited due to the potential differences within the process reactor on the substrate to be coated and there a more or less homogeneous, i. train equally strong layer.

From the prior art, the use of so-called inert anodes is known, which are used in place of the dissolving consumption anodes. The metal ions required for the galvanization are added to the fluid in some other way, e.g. provided by addition.

In the US 5,000,827 describes a process reactor for the application of contact points on microelectric circuits. This reactor comprises a reactor housing, in the lower end of which a fluid is introduced by means of a pump. Due to its introduction, the fluid flows in the direction of the substrate to be coated. Between the substrate and the upper end of the reactor housing, a distance is provided, so that an annular gap is formed, which is formed as an overflow. Due to the conventional reactor types own flow characteristics and the resulting or the concomitant occurrence of different field strengths on the substrate usually arise and in particular in its edge areas elevations, since the present there parameters of electroplating such as the ion concentration of the fluid or the resistance favor a material deposition in these areas. The device presented in the prior art describes means for preventing accumulation of material in these edge regions, which is to enable obtaining a uniform layer thickness. In particular, flow-related measures are proposed by which, especially in the overflow area, a different flow quality is to be generated.

A disadvantage of the prior art is that it focuses on the provision of rigid devices that are applicable only to a fixed size of a substrate and only a galvanotechnische application. For the desired processing of differently dimensioned substrates, which are, for example, larger or comprise a plurality of elements, it is therefore necessary to provide another, larger diameter reactor. Furthermore, the process reactors known in the prior art do not allow for alternative, kit-like formations, with which one can configure the reactor easily and flexibly with respect to different requirements of the possible applications.

The object of the invention is therefore to provide a kit for the production of a process reactor for the formation of metallic layers on one or more substrates, with which the mentioned disadvantages of the prior art are overcome.

To achieve the object, the kit according to the invention is provided according to the main claim.

Preferred embodiments of the process reactor are set forth in the subclaims as well as in the present description.

One of the essential advantages of the kit according to the invention is that it can be completely and flexibly adapted to the particular intended application, both with regard to the desired type of processing and with respect to the dimensioning of a substrate to be processed. In the present case, therefore, a process reactor in a defined size, preferably in a standard size, proposed, which can be optimized by simple measures, so that differently dimensioned such. Small, medium and large substrates can be processed with the same process reactor.

Another important advantage of the invention is the possibility of homogeneous, ie uniform deposits with substantially uniform layer thickness on the respective substrates. The means of the process reactor according to the invention which are also provided for this purpose alternatively or in combination relate, for example, to flow control devices for establishing or controlling a directed or directed fluid flow within the reactor housing, as well as field adjusting devices with which the electric field to be established or constructed within the reactor housing is controlled or influenced. can be optimized. Furthermore, in preferred embodiments diaphragms are provided with which both the fields and the flows can be shaded so that, in particular, no elevations of the applied layer occur in the edge region of the substrate to be coated. The preferred use of ring elements is the possibly desired reduction of the inner diameter of the standardized process reactor and thus allows its adaptation to the substrate to be coated.

Other means described below serve the further or alternative optimization of the coating process. All means can be used individually, repeatedly or in combination with each other and in modular form, depending on the specific application.

The flow adjustment devices provided according to the invention serve to form or influence the flow within the reactor housing from its lower end (an) to the substrate. If, for example, it has been recognized during processing that an accumulation of material takes place in the substrate edge areas, which could lead to an uneven layer thickness, then the flow in these areas can be purposefully reduced. The ability to variably and flexibly adjust the flow that impinges on or passes the substrate offers advantages in adapting the reactor to a variety of applications.

For the adjustment of the flow within the process reactor different means are provided, which can be used according to the invention individually or in combination both in singular and in a plurality. These agents have the common property of influencing the fluid flow from one end, for example, the lower end of the process reactor, to the other, such as, for example, the upper end of the process reactor. The changes in the fluid flow (for example volume and / or speed) may be uniform over the cross-section of the process reactor and / or uniformly over its longitudinal extent, or the fluid flow may be influenced such that segmentwise, ie within defined ranges over the Cross-section and / or longitudinal parameters of the fluid flow are present.

A preferred means of a flow adjuster is a diffuser. The diffuser is disc-shaped and preferably extends over the cross section of the reactor housing. The diffuser has the property of changing both directional and non-directional flow in such a way that, downstream of the diffuser, a fluid flow arises in the direction of flow which is no longer oriented in a direction-oriented manner. Another alternative or additional feature of the diffuser is that one can make the flow parameters (volume and / or velocity) different across the cross section.

Another inventively preferred means of flow adjustment is a so-called nozzle array. It is a disk-like formation, which preferably extends over the cross section of the process reactor. Regularly or irregularly distributed over the cross-section of the array, one or more passage openings are provided, each with the same or different diameter. The axes of the passage openings are preferably perpendicular to the substrate to be coated and are thus aligned parallel to the longitudinal axis of the reactor housing.

In a particularly preferred embodiment, it is provided that the individual passage openings can be opened or closed.

The nozzle array according to the main claim has the property that each passage opening with other parameters of the fluid flow (volume and speed) can be applied.

A further preferred embodiment of a flow adjustment device according to the invention relates to the arrangement of tubular or annular tube-like formations in the longitudinal extent of the reactor housing, the individual formations having different cross sections. Also, due to the flow occurring within these tubes, different qualities can be achieved at the surface of the substrate. This is due to the different speeds that can be achieved within the tubes due to their different diameters.

One embodiment provides for the tubes to be arranged next to one another so that, seen in cross-section, a type of honeycomb construction is created. Another embodiment provides that the tubes are arranged inside each other, starting from a small diameter to a large diameter. The tubes can be arranged either coaxially or offset to one another. Preferably, the tubes extend from the bottom (one) end of the process reactor to the region of the top (other) end of the process reactor.

Thus, the purpose of the flow adjustment device is to modulate the flow within the reactor housing in such a way that a flow characteristic is produced by which a substantially homogeneous or uniform thickness or thickness of the coating can be ensured. The modulation can be configured such that certain areas of the substrate come into different contact with the fluid flow. As a result, an uneven deposition on the substrate can be specifically counteracted so that a homogeneous, uniform layer is achieved over the entire longitudinal extension of the substrate.

Furthermore, the device according to the invention advantageously comprises field setting devices. Within the process reactor, between the one e.g. lower end and the other e.g. constructed an electric field at the upper end of the reactor housing. In general, the substrate forms the cathode, while the anode is arranged in the opposite region of the reactor housing.

The electric field existing within the reactor housing may be defined, for example, by one or more field adjusters located within the reactor housing, e.g. be adjusted by auxiliary electrodes or controlled or changed. The term "auxiliary electrode" used herein is to be understood as an umbrella term for auxiliary anode and auxiliary cathode, wherein an auxiliary anode is characterized by a positive and an auxiliary cathode by a negative potential.

The use of auxiliary electrodes within the reactor housing, which are preferably introduced into the housing at any position and / or arranged displaceably, supports the production of the uniform coating pursued according to the invention. The position of one or more auxiliary electrodes may extend over the entire cross section of the process reactor housing. As a rule, a coated electrode is used as auxiliary anode, so that deposits are avoided on this.

Alternative preferred embodiments relate to the use of so-called anode arrays. These are segmented auxiliary anodes, which extend over the entire cross section of the process reactor, with each individual auxiliary anode can be assigned to a respective potential. The segmentation makes it possible to obtain different field strengths and different potentials, whereby the procedure can be further optimized. In addition, passages are provided in the anode array, which allow the fluid flow to pass from one end to the other end of the process reactor. Alternatively, it is also provided to replace the auxiliary anodes either partially or completely by auxiliary cathodes.

A particularly preferred embodiment provides that auxiliary electrodes are provided, in particular in the outlet or overflow region. By this arrangement, an electric field is generated, with the help of which, depending on the selected potential, an accumulation of deposited metal ions, in particular in the edge region, can be avoided or promoted.

A further alternative embodiment provides that the auxiliary electrodes may, if appropriate, additionally be arranged on baffles, which can be positioned annularly in the reactor housing. In this case, the auxiliary electrodes are arranged at the upper end of the reactor housing, preferably in the region of the overflow and on the opposite side, namely in the receiving device for the substrate. Again, the desired potential can be selected depending on the desired result targeted.

A particularly preferred embodiment relates to the combined use of nozzle array and anode array. In this case, the passage openings provided in the case of an anode array are individually controlled with defined parameters of a fluid flow.

The formation of the desired product properties can be positively influenced by inventively proposed diaphragms for selective shading within the established flow or the electric field.

If a smaller in size than a standard size substrate or a substrate, the structures to be coated are only partially distributed over the substrate to be processed, then the presently mentioned ring elements and / or so-called Blendrohre can be used to reduce the inner diameter of the reactor housing , By this measure, a selective shading of the electric field and the flow is again effected with respect to the substrate.

A further advantageous embodiment of the reactor housing provides that in the flow direction, i. in the direction of the substrate to be coated, a diaphragm is arranged. This diaphragm is attached directly to the substrate or to the receiving device for the substrate. It serves to hide the field lines built up between anode and cathode, so that an uneven coating can be prevented or a uniformity of the coating can be brought about. The diaphragm, referred to as a flat diaphragm, serves, in particular, to compensate for any asymmetries of the substrate, as encountered, for example, in the case of a wafer flat.

In order to reduce or enlarge the inner diameter of the reactor housing ring segments are provided according to the invention, which take in their height or length only part of the interior of the reactor housing and the inner diameter is smaller than that of the reactor housing. By means of this, the interior of the reactor housing can be reduced in a segment-like manner, wherein this reduction can be formed in the same way or differently both stepwise and homogeneously over the entire longitudinal extent. Furthermore, the segment-like design offers the advantage that after inserting the respective segments further auxiliary elements such as auxiliary anodes or auxiliary cathodes or even diffusers arranged or inserted can be. These embodiments also show that the kit according to the invention can meet a wide variety of requirements at a high quality level in a reproducible manner, without having to exchange or replace the main body of the device according to the invention.

Advantageously, a control circuit is further provided and preferably designed such that the layer thickness during the coating process, if desired, can be measured continuously, whereby any irregularities detected and control functions can be triggered by which the flow setting and / or the field control devices according to the requirements activated, deactivated or can be regulated in any other way. Alternatively, the control loop can also be designed so that the coating result is measured separately after the deposition has taken place and, based on the measurement result, the control functions described above for the subsequent coating are triggered or adjusted.

Another alternative embodiment provides that, instead of an overflow region, a fluid channel is provided so that the fluid can only escape at a certain point. Due to the rotation of the substrate relative to the reactor housing, a uniform distribution is achieved, and the auxiliary anode preferably arranged in the fluid channel contributes to avoiding an accumulation of material, in particular in the edge regions of the substrate.

A further preferred embodiment relates to the equipment of the reactor housing with an adjusting device, by which the distance of the substrate to the reactor housing can be controlled.

According to another preferred embodiment, the at least one anode (auxiliary anode) can rotate orthogonally to the substrate to be coated. The apertures described above can either rotate with or are fixed.

A preferably provided quick-release closure allows a rapid replacement of the substrate having a receiving device, so that the process cycles can be shortened accordingly. Advantageously, the substrates for this are already fixed outside of the process reactor on or on the receiving device, so that a continuous processing can be ensured by the simple replacement of correspondingly loaded recording devices with extremely low cycle times.

Further advantageous embodiments will become apparent from the following description, the drawings and the claims.

drawings

Fig. 1

eine schematische Darstellung eines Prozessreaktors mit erfindungsgemäßen Bauelementen;

Fig. 2

eine schematische Darstellung eines Prozessreaktors, im Wesentlichen bestehend aus Hilfselektrode und Diffusor;

Fig. 3

eine weitere Ausführungsform des Prozessreaktors mit Blendrohren;

Fig. 4

ein weiteres Ausführungsbeispiel einer Ausbildung eines Prozessreaktors mit einem ausgebildeten Fluidkanal im Bereich des Überlaufs;

Fig. 5

eine weitere alternative Ausführung des Prozessreaktors mit einer alternativen Überlauf- einrichtung und im Überlaufbereich angeordneten Hilfselektroden;

Fig. 6

eine schematische Darstellung eines Düsenarrays in Draufsicht;

Fig. 7A

eine schematische Darstellung eines Anodenarrays in Draufsicht;

Fig. 7B

eine schematische Darstellung der Anordnung des Anodenarrays gemäß Fig. 7A in einem Prozessreaktor (nur teilweise dargestellt), im Schnitt;

Fig. 8A

eine schematische Darstellung eines Ausführungs- beispiels eines Prozessreaktors mit einer Ausführung einer Strömungseinstelleinrichtung;

Fig. 8B

eine schematische Draufsicht auf die Strömungs- einstelleinrichtung gemäß Fig. 8A;

Fig. 9

eine schematische Darstellung eines Prozessreaktors mit einer Flat-Blende, die im Bereich des Substrats angeordnet ist.

Show it:

Fig. 1

a schematic representation of a process reactor with components according to the invention;

Fig. 2

a schematic representation of a process reactor, consisting essentially of auxiliary electrode and diffuser;

Fig. 3

a further embodiment of the process reactor with glare tubes;

Fig. 4

a further embodiment of an embodiment of a process reactor with a formed fluid channel in the region of the overflow;

Fig. 5

a further alternative embodiment of the process reactor with an alternative overflow device and arranged in the overflow area auxiliary electrodes;

Fig. 6

a schematic representation of a nozzle array in plan view;

Fig. 7A

a schematic representation of an anode array in plan view;

Fig. 7B

a schematic representation of the arrangement of the anode array according to Fig. 7A in a process reactor (only partially shown), in section;

Fig. 8A

a schematic representation of an embodiment of a process reactor with an embodiment of a flow adjustment;

Fig. 8B

a schematic plan view of the flow adjusting according to Fig. 8A ;

Fig. 9

a schematic representation of a process reactor with a flat diaphragm, which is arranged in the region of the substrate.

Description of the embodiments

In Fig. 1 a standard version of a process reactor 1 is shown. As a rule, the process reactor 1 for coating a substrate 2 comprises a reactor housing 3. The reactor housing 3 has an upper end 4 and a lower end 5. On the opposite side of the lower end 5, a device 6 for receiving the substrate 2 is provided. The receiving device 6 rotates in the embodiment shown here with respect to the fixed reactor housing 3 about its longitudinal axis. The Receiving device 6 is arranged in the region of the upper end 4 relative to the reactor housing 3 such that a distance 7 is formed which forms an overflow 8. The overflow 8 is overflowed in the direction of arrow 9 by a fluid F, which is caused to flow within the reactor housing 3. The overflowing fluid F passes into a collecting container 10 which at least partially surrounds the reactor housing 3, where it is returned by appropriate means 11 back into the reactor housing 3. A pump 12 ensures that the circuit is maintained in the direction of arrow 9. Between the pump 12 and the lower end 5 of the reactor housing 3, a supply line 13 is provided. However, the lower region 5 can also be designed differently. For example, it can be provided that the lower region 5 is funnel-shaped, wherein the funnel widens toward the walls of the reactor housing 3.

Furthermore, a power supply 14 is provided, with which the one anode 15 and the substrate 2 to be coated (as the cathode) are subjected to a potential.

The anode 15 can be configured differently; For example, it may be an inert anode or even a dissolving anode, such a consumption electrode must be renewed at regular intervals.

• eine Strömungseinstelleinrichtung S,
• eine Feldeinstelleinrichtung E,
• mindestens eine Hilfselektrode H,
• mindestens ein Ringelement R,
• mindestens eine Blende B.

In order to optimize the coating of the substrate 2, the kit according to the invention optionally provides at least one of the following components in one or even a plurality, if desired also in combination:

• a flow adjuster S,
• a field setting device E,
• at least one auxiliary electrode H,
• at least one ring element R,
• at least one aperture B.

Hereinafter, the individually selected components and combinations thereof will be described with reference to various non-limiting embodiments. It serves the in Fig. 1 as a process reactor 1 illustrated standardized reactor type as a basic pattern.

In Fig. 1 In addition to the basic pattern, at least one ring element R defined as a flow setting device S and a field setting device E is provided. Such a previously mentioned ring element R is used to reduce the inner diameter 3 _{i of} the reactor housing 3. Preferably, a plurality of segments of ring elements R are inserted into the interior of the reactor housing 3. As a result, the interior of the original inner diameter 3 _{i is} reduced to the inner diameter R _i , which is predetermined by the inner diameter of the smallest ring element R. As a result, the interior of the reactor housing 3 is reduced in a segment-like manner, wherein this reduction can be designed to be the same or different both stepwise and homogeneously over the entire longitudinal extent. Between the individual ring elements R, a flow adjustment device S, for example a diffuser or other desired means such as an auxiliary electrode, an anode array and / or a nozzle array can be inserted.

In Fig. 2 In addition to the basic pattern, at least one auxiliary anode 16 defined as a field setting device E is provided. This auxiliary anode 16, which is shown only schematically in the drawings, has passage openings through which fluid F (arrows 17) can pass. The fluid F thus flows from the anode 15 through passage openings of the auxiliary anode 16 in the direction of the substrate 2.

In the embodiment shown here, the substrate 2 has a negative potential and thus forms the cathode.

The auxiliary anode 16 may be formed such that the cross section of the preferably disk-like auxiliary anode 16 is segmented, wherein segments with positive potential (anode) and segments are provided with openings. The number, the arrangement and the assignment with different parameters depend on the desired coating result. The passage openings can be acted upon either with uniform or different fluid flows.

Furthermore, in the exemplary embodiment illustrated here, a diffuser 19 defined as a flow setting device S is provided. It is arranged in the lower region 5 of the reactor housing 3 and ensures that a flow distributed uniformly over the cross-section of the reactor housing is formed in the flow direction behind it.

A development of the auxiliary anode 16 provides that it can be positioned within the reactor housing 3 in and against the arrow 18 direction.

In Fig. 3 In addition to the basic pattern, at least one dazzling tube 20 defined as a flow setting device S and a field setting device E is provided. In Fig. 3 an embodiment is shown in which the substrate to be processed 2 in its dimensions is smaller than the diameter of the reactor housing 3. By introducing a cylindrical baffle tube 20, the relevant for the flowing fluid within the reactor housing 3 diameter is brought to the desired size. Preferably, auxiliary electrodes 21 are provided on the free ends of the blending tubes 20 pointing toward the substrate 2. In a further education can additional auxiliary electrodes 26 may be disposed on the receiving device 6 on the opposite side. By generating an electric field between the auxiliary electrodes 21, it is achieved that in particular in the edge regions of the substrate 2 no material accumulation takes place and so uniformly coated substrates 2 can be produced. The auxiliary electrodes 21 in this embodiment preferably have a negative potential, which is why they can also be referred to as auxiliary cathodes.

In Fig. 4 a further modification of the basic pattern is shown. It comprises a fluid channel 22 defined as flow setting means S. In contrast to Fig. 1 is in the embodiment provided here, no circumferential overflow 8 in the region of the upper end 4 of the reactor housing 3 is provided. In the exemplary embodiment of the process reactor 1 shown here, a fluid channel 22 is formed, which preferably produces a fluid connection between the interior of the reactor housing 3 and the collecting container 10 in a radially outward direction only. Again, at least one auxiliary electrode 23 is provided in the region of the overflow 8 within the fluid channel 22, wherein the arrangement of two respectively opposing auxiliary electrodes 23 is particularly preferred. By generating an electric field between the auxiliary electrodes 23 it is achieved that in particular in the edge regions of the substrate 2 no material accumulation takes place and substrates 2 can be produced with a substantially uniform coating. The auxiliary electrodes 23 preferably have a negative potential, which is why they can also be referred to as auxiliary cathodes.

Fig. 5 shows a further alternative embodiment of the defined basic pattern of the process reactor 1. In contrast to the FIGS. 1 to 3 runs the flow direction of the Fluid F within the reactor housing 3 is not initially perpendicular to the top and then parallel to the substrate 2, but the flow is constant in the longitudinal extension of the reactor housing 3. For this purpose, one or more passage openings 24 or an annular passage opening 24 are provided laterally on the receiving device 6. Advantageously, 24 auxiliary electrodes 25 are provided in the areas of the passage opening. The auxiliary electrodes 25 or further auxiliary electrodes can also be arranged in the receiving device 6.

In Fig. 6 is as Strömungseinstelleinrichtung S a defined nozzle array 30 is provided. The nozzle array 30 is preferably designed disk-shaped and dimensioned so that it extends over the entire cross-section of the reactor housing 3. It can be arranged at any point of the reactor housing 3.

A preferred embodiment of this nozzle array 30 provides that on the disc-like configuration, a plurality of passage openings 31 are provided, wherein the remaining part of the enclosure 32 of the passage openings 31 is formed. The passage openings 31 are arranged uniformly and have the same size.

A further embodiment provides that the individual passage openings 31 are individually controllable. This means that each passage opening 31 or a matrix of passage openings 31, ie a plurality of interconnected passage openings 31, can control the fluid flow separately and independently of one another. Thus, different fluid streams encounter the substrate 2, which in turn causes the coatings to be applied differently. The choice of parameters is made such that the coating is uniform and homogeneous.

In Figs. 7A and 7B is provided as a field setting E a defined anode array 33. The anode array 33, as in Fig. 7A is shown in plan view, is disc-shaped or circular and has essentially two different features. The first feature of the disc relates to the passage openings 34, through which the fluid F the interior of the reactor housing 3 in the direction of arrow 9 (FIG. Fig. 1 ) can flow through. The further feature is that areas are provided which can assume a corresponding potential. In the embodiment shown here, these anodes 35 are shown flat (dark).

The distribution of passages 34 and anodes 35 can be arbitrary or according to a defined pattern.

In Fig. 7B is shown in sectional view, the arrangement of the anode array 33 within a basic pattern of the process reactor 1. It can be seen that the anode array has 33 discrete areas with anodes 35 and discrete areas with openings 34. Through the passage openings 34, the fluid flows in the direction of arrow 17th

In Figs. 8A and 8B are provided as flow adjustment S one or more flow tubes 28. In the longitudinal extension of the reactor housing 3 flow tubes 28 are provided with different cross-sections. Due to the prevailing flow within these tubes different coating qualities can be achieved on the surface of the substrate. This is caused by the different flow velocities (shown in Fig. 8A by differently shaped flow arrows (arrow 9)), which are generated within the tubes due to the different diameters.

Fig. 8B shows a plan view of these flow tubes 28. It can be seen that the flow tubes 28 different Have diameters or distances from each other, whereby different flow velocities and thus also different ion accumulations in the region of the substrate 2 can be realized.

In Fig. 9 are provided as field adjuster E a flat panel 29. The flat diaphragm 29 is arranged directly on the receiving device 6 and can be adjusted at an angle to the receiving device or to the substrate 2. As a result, a corresponding shading on the substrate is achieved, whereby the field strength is reduced in this area and thus a lower ion deposition can be achieved.

All of the measures described above for achieving the most homogeneous possible coating result can be used both individually and combined with one another. The combination is not limited to already illustrated embodiments. Rather, each component can be combined to achieve the invention desired achievement of a uniform coating with one or more other components. The components are designed such that they are designed as a kit and therefore depending on the requirement profile either individually or in combination with each other can be used to form a basic pattern of a process reactor.

LIST OF REFERENCE NUMBERS

1.

process reactor

Second

substratum

Third

reactor housing

4th

Upper (one) end / range of outflow

5th

Lower (other) end / range of inflow

6th

recording device

7th

distance

8th.

overflow

9th

Arrow direction (the flow direction)

10th

receptacle

11th

medium

12th

pump

13th

Supply line to the lower (other) end / to the area of inflow

14th

power supply

15th

auxiliary electrode

16th

auxiliary anode

17th

Arrow (flow)

18th

Arrow direction (position of auxiliary anode)

19th

diffuser

20th

blend pipe

21st

auxiliary electrode

22nd

fluid channel

23rd

auxiliary electrode

24th

Through opening

25th

auxiliary electrode

26th

Through opening

27th

- -

28th

flow tube

29th

Flat-panel

30th

nozzle array

31st

Through opening

32nd

version

33rd

anode array

34th

Through opening

35th

anode

Ri

Inner diameter ring element

R

ring element

3i

Inner diameter reactor housing 3

S

flow adjustment

H

auxiliary electrode

B

cover

e

Feldeinstelleinrichtung

F

fluid

Claims (14)

1. Kit for the fabrication of a process reactor for the formation of metallic layers on one or more substrates (2), wherein the layers are produced on the substrates by deposition of metal ions present within a fluid (F), and wherein the process reactor (1) essentially comprises the following components:

   - a reactor housing (3) with two ends (4; 5), wherein the interior of the reactor housing can be streamed through by a fluid from one end to the other;

   - a device (6) for the reception of the substrate that is arranged in the region of the outflow (4) from the reactor housing (3);

   - at least one overflow (8) in the region of the outflow (4) from the reactor housing (3), over which the fluid (F) that streams in direction of the substrate (2) can exit from the reactor housing (3);

   - a catchment tank (10) for reception of the fluid (F) that exits over the overflow (8);

   - means for recirculation of the collected fluid into the reactor housing (3);

   - at least one anode (15); as well as

   - at least one adjustment device (S and/or E) for the specific control of the stream of the fluid (F) and/or the electric field within the reactor housing (3);

   characterized in that the at least one adjustment device is designed either as nozzle array (30) whose passage openings (31) can individually and independently from each other be exposed to different parameters of the fluid stream, as flow tube (28), and/or as a blind tube (20), and/or that the process reactor as adjustment device further comprises at least one auxiliary electrode (H) which can either take a positive or a negative potential and which is arranged between the substrate (2) to be coated and the opposite end (5) of the reactor housing (3) either as an auxiliary anode (16) which can be moved along the longitudinal extension of the reactor housing (3), or as an anode array (33) with a disc-like design which comprises segments with anodes (35) and segments with passage openings (34).
2. Kit according to claim 1, characterized in that the anodes (35) of the anode array (33) can be exposed to different potentials.
3. Kit according to claim 1 or 2, characterized in that the passage openings (34) of the anode array (33) can individually and independently from each other be exposed to different parameters of the fluid stream.
4. Kit according to any of the preceding claims, characterized in that the at least one blind tube (20) has an auxiliary electrode (21) on that side which points towards the substrate (2).
5. Kit according to claim 4, characterized in that further auxiliary electrodes are arranged opposite to the auxiliary electrode (21) in the region of the reception device (6).
6. Kit according to any of the preceding claims, characterized in that at least one auxiliary electrode (21; 23; 25) is arranged as adjustment device in the region of the overflow (8).
7. Kit according to any of the preceding claims, characterized in that the auxiliary electrode (15; 21; 23; 25) is coated.
8. Kit according to any of the preceding claims, characterized in that several flow tubes (28) of different diameters are nested into each other.
9. Kit according to any of the preceding claims, characterized in that means for adjustment of the strength of the electrical field in dependence of the layer thickness detected on the substrate (2) are provided as adjustment device.
10. Kit according to any of the preceding claims, characterized in that a flat-blind (29) is arranged at the reception device (6) in the region of the substrate (2).
11. Kit according to any of the preceding claims, characterized in that the reception device (6) is exchangeable by means of a quick-clamping device.
12. Kit according to any of the preceding claims, characterized in that the overflow (8) has at least one fluid channel (22).
13. Kit according to any of the preceding claims, characterized in that the position of the substrate (2) is changeable relative to the reactor housing (3).
14. Kit according to any of the preceding claims, characterized in that the process reactor (1) further comprises at least one ring element (R) for the reduction of the inner diameter (Ri) of the reactor housing (3).

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