EP1939329B1 - Lot de pièces pour la fabrication d'un réacteur de procédé pour la formation de couches métalliques sur un ou plusieurs substrats - Google Patents

Lot de pièces pour la fabrication d'un réacteur de procédé pour la formation de couches métalliques sur un ou plusieurs substrats Download PDF

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Publication number
EP1939329B1
EP1939329B1 EP06027073A EP06027073A EP1939329B1 EP 1939329 B1 EP1939329 B1 EP 1939329B1 EP 06027073 A EP06027073 A EP 06027073A EP 06027073 A EP06027073 A EP 06027073A EP 1939329 B1 EP1939329 B1 EP 1939329B1
Authority
EP
European Patent Office
Prior art keywords
reactor
substrate
reactor housing
kit according
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP06027073A
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German (de)
English (en)
Other versions
EP1939329A1 (fr
Inventor
Dirk Habermann
Ernst Hartmannsgruber
Patrik MÜLLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rena GmbH
Original Assignee
Rena GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena GmbH filed Critical Rena GmbH
Priority to EP06027073A priority Critical patent/EP1939329B1/fr
Priority to AT06027073T priority patent/ATE509144T1/de
Priority to PCT/EP2007/010739 priority patent/WO2008080515A2/fr
Priority to KR1020087023897A priority patent/KR101133085B1/ko
Priority to CN2007800179912A priority patent/CN101448983B/zh
Priority to TW096148749A priority patent/TWI378157B/zh
Publication of EP1939329A1 publication Critical patent/EP1939329A1/fr
Application granted granted Critical
Publication of EP1939329B1 publication Critical patent/EP1939329B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • the present invention relates to a kit for the production of a process reactor.
  • This process reactor is used to form metallic layers on one or more substrates, wherein the substrates may be, for example, essentially flat semiconductor wafers.
  • the present invention relates to electroplating, which is understood to mean the electrochemical deposition of metallic deposits (coatings) on articles.
  • electricity is sent through an electrolytic bath.
  • the metal to be applied e.g., copper or nickel
  • the negative pole cathode
  • the electric current dissolves metal ions from the consumable electrode and deposits them by reduction on the substrate.
  • the use of an inert anode is also possible, the metal ions required for the galvanization then being made available, for example, by addition to the plating solution. In this way, the substrate to be treated is more or less uniformly coated with the metal used. The longer the object is in the bath and the higher the electrical current, the stronger the metal layer becomes.
  • the present invention is particularly applicable in the field of functional electroplating technology.
  • the decorative electroplating technique mainly serves the beautification of objects
  • the functional electroplating technique is mainly used for corrosion protection, Wear protection or used for catalysis and to change or improve the electrical conductivity.
  • the present invention is particularly suitable in the field of semiconductor technology for the known in this context, the method for structured or unstructured application of electrically conductive layers for contacting, rewiring or soldering microelectronic circuits, as well as the structured or unstructured application of functional layers with, for example diffusion-blocking, adhesion-promoting, catalytic, as well as special optical, mechanical, magnetic or heat-conducting properties.
  • the present invention is also suitable for the electroplating of structured mold inserts (so-called mastering) for the molding of microcomponents or optical data carriers (CDs / DVDs), as well as for electrochemical replication.
  • the base materials are exposed to an electric field. Since an electric field and flow conditions of an electrolytic fluid do not adjust uniformly, but act on differently sized structures to be coated as well as on the edges of the substrate different high field strengths or currents, the deposited layer thicknesses will be different for these locations. These inhomogeneity effects are further enhanced by higher field strengths or flow rates, which in turn would be advantageous for achieving higher deposition rates and thus higher throughput rates in production.
  • inventions set forth in the context of the present invention are basically applicable to a wide range of substrates of different size, number and material quality.
  • present invention is set forth in the preferred example of treating substantially semiconductive substrates, so-called wafers.
  • the kit for producing a process reactor comprises a reactor housing which can be filled with fluid and has two ends.
  • the reactor housing is designed such that it flows through the fluid from one end to the other.
  • a device for receiving the substrate (s) is preferably arranged such that it can rotate relative to the reactor housing about its central longitudinal axis.
  • the process reactor is designed as a so-called overflow reactor. This means that the fluid flows through the interior of the reactor housing, for example from the lower end to the upper end, and leaves via an overflow, from where it is returned to the reactor housing of the process reactor via a collecting vessel by means of defined means.
  • the reactor housing can be made obliquely, horizontally or even reversed at any angle, so that the fluid can flow in accordance with the inclination of the reactor instead of from bottom to top in accordance with any angle.
  • the invention is illustrated below using the example of the vertical flow from bottom to top, wherein it is expressly pointed out that the individual elements of the kit according to the invention are independent of the angle of inclination of the reactor housing or the fluid flow and are applicable accordingly in arbitrarily inclined process reactor housings.
  • the process reactor comprises at least one anode with a positive potential, whereas the substrate is at the negative pole (cathode) and therefore has a negative potential.
  • the process reactor comprises at least one anode with a positive potential, whereas the substrate is at the negative pole (cathode) and therefore has a negative potential.
  • the setting of different potential sizes is conceivable.
  • overflow process reactors which comprise a reactor housing in which a fluid flow is generated.
  • the fluid is enriched by a self-dissolving anode (consumable electrode) with the desired metal ions, which are deposited due to the potential differences within the process reactor on the substrate to be coated and there a more or less homogeneous, i. train equally strong layer.
  • inert anodes which are used in place of the dissolving consumption anodes.
  • the metal ions required for the galvanization are added to the fluid in some other way, e.g. provided by addition.
  • a disadvantage of the prior art is that it focuses on the provision of rigid devices that are applicable only to a fixed size of a substrate and only a galvanotechnische application. For the desired processing of differently dimensioned substrates, which are, for example, larger or comprise a plurality of elements, it is therefore necessary to provide another, larger diameter reactor. Furthermore, the process reactors known in the prior art do not allow for alternative, kit-like formations, with which one can configure the reactor easily and flexibly with respect to different requirements of the possible applications.
  • the object of the invention is therefore to provide a kit for the production of a process reactor for the formation of metallic layers on one or more substrates, with which the mentioned disadvantages of the prior art are overcome.
  • the kit according to the invention is provided according to the main claim.
  • kit according to the invention can be completely and flexibly adapted to the particular intended application, both with regard to the desired type of processing and with respect to the dimensioning of a substrate to be processed.
  • a process reactor in a defined size, preferably in a standard size proposed, which can be optimized by simple measures, so that differently dimensioned such. Small, medium and large substrates can be processed with the same process reactor.
  • the means of the process reactor according to the invention which are also provided for this purpose alternatively or in combination relate, for example, to flow control devices for establishing or controlling a directed or directed fluid flow within the reactor housing, as well as field adjusting devices with which the electric field to be established or constructed within the reactor housing is controlled or influenced. can be optimized.
  • diaphragms are provided with which both the fields and the flows can be shaded so that, in particular, no elevations of the applied layer occur in the edge region of the substrate to be coated.
  • the preferred use of ring elements is the possibly desired reduction of the inner diameter of the standardized process reactor and thus allows its adaptation to the substrate to be coated.
  • the flow adjustment devices provided according to the invention serve to form or influence the flow within the reactor housing from its lower end (an) to the substrate. If, for example, it has been recognized during processing that an accumulation of material takes place in the substrate edge areas, which could lead to an uneven layer thickness, then the flow in these areas can be purposefully reduced.
  • the ability to variably and flexibly adjust the flow that impinges on or passes the substrate offers advantages in adapting the reactor to a variety of applications.
  • different means are provided, which can be used according to the invention individually or in combination both in singular and in a plurality.
  • These agents have the common property of influencing the fluid flow from one end, for example, the lower end of the process reactor, to the other, such as, for example, the upper end of the process reactor.
  • the changes in the fluid flow may be uniform over the cross-section of the process reactor and / or uniformly over its longitudinal extent, or the fluid flow may be influenced such that segmentwise, ie within defined ranges over the Cross-section and / or longitudinal parameters of the fluid flow are present.
  • a preferred means of a flow adjuster is a diffuser.
  • the diffuser is disc-shaped and preferably extends over the cross section of the reactor housing.
  • the diffuser has the property of changing both directional and non-directional flow in such a way that, downstream of the diffuser, a fluid flow arises in the direction of flow which is no longer oriented in a direction-oriented manner.
  • Another alternative or additional feature of the diffuser is that one can make the flow parameters (volume and / or velocity) different across the cross section.
  • nozzle array is a disk-like formation, which preferably extends over the cross section of the process reactor. Regularly or irregularly distributed over the cross-section of the array, one or more passage openings are provided, each with the same or different diameter.
  • the axes of the passage openings are preferably perpendicular to the substrate to be coated and are thus aligned parallel to the longitudinal axis of the reactor housing.
  • the individual passage openings can be opened or closed.
  • the nozzle array according to the main claim has the property that each passage opening with other parameters of the fluid flow (volume and speed) can be applied.
  • a further preferred embodiment of a flow adjustment device relates to the arrangement of tubular or annular tube-like formations in the longitudinal extent of the reactor housing, the individual formations having different cross sections. Also, due to the flow occurring within these tubes, different qualities can be achieved at the surface of the substrate. This is due to the different speeds that can be achieved within the tubes due to their different diameters.
  • One embodiment provides for the tubes to be arranged next to one another so that, seen in cross-section, a type of honeycomb construction is created. Another embodiment provides that the tubes are arranged inside each other, starting from a small diameter to a large diameter.
  • the tubes can be arranged either coaxially or offset to one another. Preferably, the tubes extend from the bottom (one) end of the process reactor to the region of the top (other) end of the process reactor.
  • the purpose of the flow adjustment device is to modulate the flow within the reactor housing in such a way that a flow characteristic is produced by which a substantially homogeneous or uniform thickness or thickness of the coating can be ensured.
  • the modulation can be configured such that certain areas of the substrate come into different contact with the fluid flow. As a result, an uneven deposition on the substrate can be specifically counteracted so that a homogeneous, uniform layer is achieved over the entire longitudinal extension of the substrate.
  • the device according to the invention advantageously comprises field setting devices.
  • the substrate forms the cathode, while the anode is arranged in the opposite region of the reactor housing.
  • the electric field existing within the reactor housing may be defined, for example, by one or more field adjusters located within the reactor housing, e.g. be adjusted by auxiliary electrodes or controlled or changed.
  • auxiliary electrode used herein is to be understood as an umbrella term for auxiliary anode and auxiliary cathode, wherein an auxiliary anode is characterized by a positive and an auxiliary cathode by a negative potential.
  • auxiliary electrodes within the reactor housing which are preferably introduced into the housing at any position and / or arranged displaceably, supports the production of the uniform coating pursued according to the invention.
  • the position of one or more auxiliary electrodes may extend over the entire cross section of the process reactor housing.
  • a coated electrode is used as auxiliary anode, so that deposits are avoided on this.
  • Alternative preferred embodiments relate to the use of so-called anode arrays.
  • auxiliary anodes which extend over the entire cross section of the process reactor, with each individual auxiliary anode can be assigned to a respective potential.
  • the segmentation makes it possible to obtain different field strengths and different potentials, whereby the procedure can be further optimized.
  • passages are provided in the anode array, which allow the fluid flow to pass from one end to the other end of the process reactor.
  • a particularly preferred embodiment provides that auxiliary electrodes are provided, in particular in the outlet or overflow region.
  • an electric field is generated, with the help of which, depending on the selected potential, an accumulation of deposited metal ions, in particular in the edge region, can be avoided or promoted.
  • auxiliary electrodes may, if appropriate, additionally be arranged on baffles, which can be positioned annularly in the reactor housing.
  • the auxiliary electrodes are arranged at the upper end of the reactor housing, preferably in the region of the overflow and on the opposite side, namely in the receiving device for the substrate.
  • the desired potential can be selected depending on the desired result targeted.
  • a particularly preferred embodiment relates to the combined use of nozzle array and anode array.
  • the passage openings provided in the case of an anode array are individually controlled with defined parameters of a fluid flow.
  • the formation of the desired product properties can be positively influenced by inventively proposed diaphragms for selective shading within the established flow or the electric field.
  • Blendrohre can be used to reduce the inner diameter of the reactor housing , By this measure, a selective shading of the electric field and the flow is again effected with respect to the substrate.
  • a further advantageous embodiment of the reactor housing provides that in the flow direction, i. in the direction of the substrate to be coated, a diaphragm is arranged.
  • This diaphragm is attached directly to the substrate or to the receiving device for the substrate. It serves to hide the field lines built up between anode and cathode, so that an uneven coating can be prevented or a uniformity of the coating can be brought about.
  • the diaphragm referred to as a flat diaphragm, serves, in particular, to compensate for any asymmetries of the substrate, as encountered, for example, in the case of a wafer flat.
  • the inner diameter of the reactor housing ring segments are provided according to the invention, which take in their height or length only part of the interior of the reactor housing and the inner diameter is smaller than that of the reactor housing.
  • the interior of the reactor housing can be reduced in a segment-like manner, wherein this reduction can be formed in the same way or differently both stepwise and homogeneously over the entire longitudinal extent.
  • the segment-like design offers the advantage that after inserting the respective segments further auxiliary elements such as auxiliary anodes or auxiliary cathodes or even diffusers arranged or inserted can be.
  • a control circuit is further provided and preferably designed such that the layer thickness during the coating process, if desired, can be measured continuously, whereby any irregularities detected and control functions can be triggered by which the flow setting and / or the field control devices according to the requirements activated, deactivated or can be regulated in any other way.
  • the control loop can also be designed so that the coating result is measured separately after the deposition has taken place and, based on the measurement result, the control functions described above for the subsequent coating are triggered or adjusted.
  • Another alternative embodiment provides that, instead of an overflow region, a fluid channel is provided so that the fluid can only escape at a certain point. Due to the rotation of the substrate relative to the reactor housing, a uniform distribution is achieved, and the auxiliary anode preferably arranged in the fluid channel contributes to avoiding an accumulation of material, in particular in the edge regions of the substrate.
  • a further preferred embodiment relates to the equipment of the reactor housing with an adjusting device, by which the distance of the substrate to the reactor housing can be controlled.
  • the at least one anode can rotate orthogonally to the substrate to be coated.
  • the apertures described above can either rotate with or are fixed.
  • a preferably provided quick-release closure allows a rapid replacement of the substrate having a receiving device, so that the process cycles can be shortened accordingly.
  • the substrates for this are already fixed outside of the process reactor on or on the receiving device, so that a continuous processing can be ensured by the simple replacement of correspondingly loaded recording devices with extremely low cycle times.
  • a standard version of a process reactor 1 is shown.
  • the process reactor 1 for coating a substrate 2 comprises a reactor housing 3.
  • the reactor housing 3 has an upper end 4 and a lower end 5.
  • a device 6 for receiving the substrate 2 is provided on the opposite side of the lower end 5.
  • the receiving device 6 rotates in the embodiment shown here with respect to the fixed reactor housing 3 about its longitudinal axis.
  • the Receiving device 6 is arranged in the region of the upper end 4 relative to the reactor housing 3 such that a distance 7 is formed which forms an overflow 8.
  • the overflow 8 is overflowed in the direction of arrow 9 by a fluid F, which is caused to flow within the reactor housing 3.
  • the overflowing fluid F passes into a collecting container 10 which at least partially surrounds the reactor housing 3, where it is returned by appropriate means 11 back into the reactor housing 3.
  • a pump 12 ensures that the circuit is maintained in the direction of arrow 9.
  • a supply line 13 is provided between the pump 12 and the lower end 5 of the reactor housing 3, a supply line 13 is provided.
  • the lower region 5 can also be designed differently. For example, it can be provided that the lower region 5 is funnel-shaped, wherein the funnel widens toward the walls of the reactor housing 3.
  • a power supply 14 is provided, with which the one anode 15 and the substrate 2 to be coated (as the cathode) are subjected to a potential.
  • the anode 15 can be configured differently; For example, it may be an inert anode or even a dissolving anode, such a consumption electrode must be renewed at regular intervals.
  • Fig. 1 serves the in Fig. 1 as a process reactor 1 illustrated standardized reactor type as a basic pattern.
  • a ring element R defined as a flow setting device S and a field setting device E is provided.
  • a previously mentioned ring element R is used to reduce the inner diameter 3 i of the reactor housing 3.
  • a plurality of segments of ring elements R are inserted into the interior of the reactor housing 3.
  • the interior of the original inner diameter 3 i is reduced to the inner diameter R i , which is predetermined by the inner diameter of the smallest ring element R.
  • the interior of the reactor housing 3 is reduced in a segment-like manner, wherein this reduction can be designed to be the same or different both stepwise and homogeneously over the entire longitudinal extent.
  • a flow adjustment device S for example a diffuser or other desired means such as an auxiliary electrode, an anode array and / or a nozzle array can be inserted.
  • auxiliary anode 16 defined as a field setting device E is provided.
  • This auxiliary anode 16 which is shown only schematically in the drawings, has passage openings through which fluid F (arrows 17) can pass. The fluid F thus flows from the anode 15 through passage openings of the auxiliary anode 16 in the direction of the substrate 2.
  • the substrate 2 has a negative potential and thus forms the cathode.
  • the auxiliary anode 16 may be formed such that the cross section of the preferably disk-like auxiliary anode 16 is segmented, wherein segments with positive potential (anode) and segments are provided with openings.
  • segments with positive potential anode
  • the number, the arrangement and the assignment with different parameters depend on the desired coating result.
  • the passage openings can be acted upon either with uniform or different fluid flows.
  • a diffuser 19 defined as a flow setting device S is provided. It is arranged in the lower region 5 of the reactor housing 3 and ensures that a flow distributed uniformly over the cross-section of the reactor housing is formed in the flow direction behind it.
  • auxiliary anode 16 provides that it can be positioned within the reactor housing 3 in and against the arrow 18 direction.
  • a dazzling tube 20 defined as a flow setting device S and a field setting device E is provided.
  • a flow setting device S and a field setting device E is provided.
  • the substrate to be processed 2 in its dimensions is smaller than the diameter of the reactor housing 3.
  • auxiliary electrodes 21 are provided on the free ends of the blending tubes 20 pointing toward the substrate 2.
  • additional auxiliary electrodes 26 may be disposed on the receiving device 6 on the opposite side.
  • auxiliary cathodes 21 By generating an electric field between the auxiliary electrodes 21, it is achieved that in particular in the edge regions of the substrate 2 no material accumulation takes place and so uniformly coated substrates 2 can be produced.
  • the auxiliary electrodes 21 in this embodiment preferably have a negative potential, which is why they can also be referred to as auxiliary cathodes.
  • a further modification of the basic pattern is shown. It comprises a fluid channel 22 defined as flow setting means S.
  • a fluid channel 22 is formed, which preferably produces a fluid connection between the interior of the reactor housing 3 and the collecting container 10 in a radially outward direction only.
  • at least one auxiliary electrode 23 is provided in the region of the overflow 8 within the fluid channel 22, wherein the arrangement of two respectively opposing auxiliary electrodes 23 is particularly preferred.
  • auxiliary cathodes 23 By generating an electric field between the auxiliary electrodes 23 it is achieved that in particular in the edge regions of the substrate 2 no material accumulation takes place and substrates 2 can be produced with a substantially uniform coating.
  • the auxiliary electrodes 23 preferably have a negative potential, which is why they can also be referred to as auxiliary cathodes.
  • Fig. 5 shows a further alternative embodiment of the defined basic pattern of the process reactor 1.
  • the flow direction of the Fluid F within the reactor housing 3 is not initially perpendicular to the top and then parallel to the substrate 2, but the flow is constant in the longitudinal extension of the reactor housing 3.
  • one or more passage openings 24 or an annular passage opening 24 are provided laterally on the receiving device 6.
  • 24 auxiliary electrodes 25 are provided in the areas of the passage opening.
  • the auxiliary electrodes 25 or further auxiliary electrodes can also be arranged in the receiving device 6.
  • nozzle array 30 is provided.
  • the nozzle array 30 is preferably designed disk-shaped and dimensioned so that it extends over the entire cross-section of the reactor housing 3. It can be arranged at any point of the reactor housing 3.
  • a preferred embodiment of this nozzle array 30 provides that on the disc-like configuration, a plurality of passage openings 31 are provided, wherein the remaining part of the enclosure 32 of the passage openings 31 is formed.
  • the passage openings 31 are arranged uniformly and have the same size.
  • a further embodiment provides that the individual passage openings 31 are individually controllable. This means that each passage opening 31 or a matrix of passage openings 31, ie a plurality of interconnected passage openings 31, can control the fluid flow separately and independently of one another. Thus, different fluid streams encounter the substrate 2, which in turn causes the coatings to be applied differently. The choice of parameters is made such that the coating is uniform and homogeneous.
  • Figs. 7A and 7B is provided as a field setting E a defined anode array 33.
  • the anode array 33 as in Fig. 7A is shown in plan view, is disc-shaped or circular and has essentially two different features.
  • the first feature of the disc relates to the passage openings 34, through which the fluid F the interior of the reactor housing 3 in the direction of arrow 9 (FIG. Fig. 1 ) can flow through.
  • the further feature is that areas are provided which can assume a corresponding potential. In the embodiment shown here, these anodes 35 are shown flat (dark).
  • the distribution of passages 34 and anodes 35 can be arbitrary or according to a defined pattern.
  • Fig. 7B is shown in sectional view, the arrangement of the anode array 33 within a basic pattern of the process reactor 1. It can be seen that the anode array has 33 discrete areas with anodes 35 and discrete areas with openings 34. Through the passage openings 34, the fluid flows in the direction of arrow 17th
  • Figs. 8A and 8B are provided as flow adjustment S one or more flow tubes 28.
  • flow tubes 28 are provided with different cross-sections. Due to the prevailing flow within these tubes different coating qualities can be achieved on the surface of the substrate. This is caused by the different flow velocities (shown in Fig. 8A by differently shaped flow arrows (arrow 9)), which are generated within the tubes due to the different diameters.
  • Fig. 8B shows a plan view of these flow tubes 28. It can be seen that the flow tubes 28 different Have diameters or distances from each other, whereby different flow velocities and thus also different ion accumulations in the region of the substrate 2 can be realized.
  • Fig. 9 are provided as field adjuster E a flat panel 29.
  • the flat diaphragm 29 is arranged directly on the receiving device 6 and can be adjusted at an angle to the receiving device or to the substrate 2. As a result, a corresponding shading on the substrate is achieved, whereby the field strength is reduced in this area and thus a lower ion deposition can be achieved.

Claims (14)

  1. Kit de construction d'un réacteur épitaxial pour la formation de couches métalliques sur un ou plusieurs substrats (2), dans lequel les couches se forment par la déposition sur le substrat d'ions métalliques se trouvant dans un fluide (F) et le réacteur épitaxial (1) comprend en substance les éléments suivants:
    - une enceinte du réacteur (3) avec deux extrémités (4,5), dans laquelle l'intérieur de l'enceinte du réacteur peut être traversé par un fluide d'une extrémité à l'autre;
    - un dispositif (6) situé au niveau du flux de sortie (4) hors de l'enceinte du réacteur (3) pour la réception du substrat;
    - au moins un déversoir (8) au niveau du flux de sortie (4) hors de l'enceinte du réacteur (3) par lequel le fluide (F) coulant en direction du substrat (2) peut sortir hors de l'enceinte du réacteur (3);
    - une cuvette de récupération (10) pour réceptionner le fluide (F) sortant par le déversoir (8);
    - un dispositif pour le retour du fluide récupéré dans l'enceinte du réacteur (3);
    - au moins une anode (15); ainsi que
    - au moins un dispositif de réglage (S et/ou E) pour une commande ciblée du flux du fluide (F) et/ou du champ électrique à l'intérieur de l'enceinte du réacteur (3);
    caractérisé en ce que le, au moins un, dispositif de réglage est constitué au choix d'un réseau de tuyères (30) dont les ouvertures (31) sont alimentées individuellement et indépendamment les unes des autres avec d'autres paramètres pour le flux du fluide, de tube modulateur du courant de fluide (28), et/ou de tube déflecteur (20), et/ou le réacteur épitaxial contient de plus au moins une électrode (H) comme dispositif de réglage qui peut adopter au choix un potentiel positif ou négatif et qui est localisée entre le substrat (2) à recouvrir et l'extrémité (5) opposée de l'enceinte du réacteur (3) comme une électrode (16) mobile dans la dimension verticale de l'enceinte du réacteur (3), ou comme un réseau d'anode (33) en forme de disque présentant un segment avec anodes (35) et un segment avec un des ouvertures (34).
  2. Kit de construction selon la revendication 1, caractérisé en ce que les anodes (35) du réseau d'anode (33) sont alimentées avec des potentiels différents.
  3. Kit de construction selon les revendications 1 ou 2, caractérisé en ce que les ouvertures (34) du réseau d'anode sont alimentées (33) individuellement et indépendamment les unes des autres avec d'autres paramètres pour le flux de fluide.
  4. Kit de construction selon une des revendications précédentes, caractérisé en ce que le, au moins un, tube déflecteur (20) possède une électrode (21) sur le coté regardant le substrat (2).
  5. Kit de construction selon la revendication 4, caractérisé en ce que des électrodes supplémentaires sont placées en face de l'électrode (21) au niveau du dispositif de réception (6).
  6. Kit de construction selon une des revendications précédentes, caractérisé en ce que au moins une électrode (21; 23; 25) est placée au niveau du déversoir (8) comme dispositif de réglage.
  7. Kit de construction selon une des revendications précédentes, caractérisé en ce que l'électrode (15; 21; 23; 25) est recouverte.
  8. Kit de construction selon une des revendications précédentes, caractérisé en ce que plusieurs tubes modulateurs de courant de fluide (28) de diamètres différents sont enfilés les uns dans les autres.
  9. Kit de construction selon une des revendications précédentes, caractérisé en ce que des agents comme dispositif de réglage sont prévus pour la régulation de la force du champ électrique en fonction de l'épaisseur de la couche observée sur le substrat (2).
  10. Kit de construction selon une des revendications précédentes, caractérisé en ce qu'une chicane plate (29) est placée au niveau du substrat (2) sur le dispositif de réception (6).
  11. Kit de construction selon une des revendications précédentes, caractérisé en ce que le dispositif de réception (6) est changeable par l'intermédiaire d'un dispositif de serrage rapide.
  12. Kit de construction selon une des revendications précédentes, caractérisé en ce que le déversoir (8) comprend au moins un canal pour l'évacuation du fluide (22).
  13. Kit de construction selon une des revendications précédentes, caractérisé en ce que la position du substrat (2) est modifiable relativement à l'enceinte du réacteur.
  14. Kit de construction selon une des revendications précédentes, caractérisé en ce que le réacteur épitaxial (1) comprend de plus au moins un anneau (R) pour rétrécir le diamètre interne (Ri) de l'enceinte du réacteur (3).
EP06027073A 2006-12-29 2006-12-29 Lot de pièces pour la fabrication d'un réacteur de procédé pour la formation de couches métalliques sur un ou plusieurs substrats Not-in-force EP1939329B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP06027073A EP1939329B1 (fr) 2006-12-29 2006-12-29 Lot de pièces pour la fabrication d'un réacteur de procédé pour la formation de couches métalliques sur un ou plusieurs substrats
AT06027073T ATE509144T1 (de) 2006-12-29 2006-12-29 Bausatz zur herstellung eines prozessreaktors für die ausbildung metallischer schichten auf einem oder auf mehreren substraten
PCT/EP2007/010739 WO2008080515A2 (fr) 2006-12-29 2007-12-10 Ensemble d'éléments pour construire un réacteur de processus pour la réalisation de couches métalliques sur un ou plusieurs substrats
KR1020087023897A KR101133085B1 (ko) 2006-12-29 2007-12-10 하나 이상의 기판상에 금속층들을 형성하기 위한 공정 반응기의 조립용 키트 및 이를 이용한 방법
CN2007800179912A CN101448983B (zh) 2006-12-29 2007-12-10 用于制造在一个或多个基板上形成金属层所用的处理反应器的组件
TW096148749A TWI378157B (en) 2006-12-29 2007-12-19 Kit for the assembly of a process reactor for the formation of metallic layers on one or more substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06027073A EP1939329B1 (fr) 2006-12-29 2006-12-29 Lot de pièces pour la fabrication d'un réacteur de procédé pour la formation de couches métalliques sur un ou plusieurs substrats

Publications (2)

Publication Number Publication Date
EP1939329A1 EP1939329A1 (fr) 2008-07-02
EP1939329B1 true EP1939329B1 (fr) 2011-05-11

Family

ID=38284079

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06027073A Not-in-force EP1939329B1 (fr) 2006-12-29 2006-12-29 Lot de pièces pour la fabrication d'un réacteur de procédé pour la formation de couches métalliques sur un ou plusieurs substrats

Country Status (6)

Country Link
EP (1) EP1939329B1 (fr)
KR (1) KR101133085B1 (fr)
CN (1) CN101448983B (fr)
AT (1) ATE509144T1 (fr)
TW (1) TWI378157B (fr)
WO (1) WO2008080515A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103688145B (zh) 2011-03-03 2020-03-17 恩光码公司 多频带色觉滤波器和使用线性程序解算器优化的方法
KR101643276B1 (ko) * 2015-05-12 2016-08-02 강구일 전기분해를 이용한 수소발생장치
KR102639119B1 (ko) * 2018-12-31 2024-02-20 엘지디스플레이 주식회사 전기 도금 장치 및 이를 이용한 전기 도금 방법
US20220298667A1 (en) * 2019-09-03 2022-09-22 Lam Research Corporation Low angle membrane frame for an electroplating cell
JP7356401B2 (ja) * 2020-05-12 2023-10-04 株式会社荏原製作所 プレート、めっき装置、及びプレートの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US6103085A (en) * 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
EP1031647A3 (fr) * 1999-02-19 2002-03-06 Solid State Equipment Corporation Dispositif et procédé pour le placage d'une plaquette semiconductrice
JP3255145B2 (ja) * 1999-04-06 2002-02-12 日本電気株式会社 めっき装置
US20050284751A1 (en) * 2004-06-28 2005-12-29 Nicolay Kovarsky Electrochemical plating cell with a counter electrode in an isolated anolyte compartment
JP2002097598A (ja) * 2000-09-25 2002-04-02 Mitsubishi Electric Corp 電解メッキ装置
US6964792B1 (en) * 2000-11-03 2005-11-15 Novellus Systems, Inc. Methods and apparatus for controlling electrolyte flow for uniform plating
TWM240034U (en) * 2002-02-19 2004-08-01 Advanced Semiconductor Eng Electric field adjustment device of electroplating tank
EP1391540A3 (fr) * 2002-08-08 2006-10-04 Texas Instruments Incorporated Méthodes et appareil pour un meilleur contrôle de la densité de courant et du remplissage de motifs dans des réacteurs ECD
TWI240766B (en) * 2003-09-09 2005-10-01 Ind Tech Res Inst Electroplating device having rectification and voltage detection function
US20060102467A1 (en) * 2004-11-15 2006-05-18 Harald Herchen Current collimation for thin seed and direct plating
US20060163058A1 (en) * 2005-01-26 2006-07-27 Kiyonori Watanabe Apparatus for plating a semiconductor wafer and plating solution bath used therein
TW200641189A (en) * 2005-02-25 2006-12-01 Applied Materials Inc Counter electrode encased in cation exchange membrane tube for electroplating cell

Also Published As

Publication number Publication date
EP1939329A1 (fr) 2008-07-02
ATE509144T1 (de) 2011-05-15
TWI378157B (en) 2012-12-01
WO2008080515A2 (fr) 2008-07-10
CN101448983B (zh) 2012-11-07
TW200842210A (en) 2008-11-01
CN101448983A (zh) 2009-06-03
KR101133085B1 (ko) 2012-04-24
KR20080102266A (ko) 2008-11-24
WO2008080515A3 (fr) 2008-09-12

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