CN103132123A - Fixture for fixing soft material plated piece substrate - Google Patents
Fixture for fixing soft material plated piece substrate Download PDFInfo
- Publication number
- CN103132123A CN103132123A CN2011103880300A CN201110388030A CN103132123A CN 103132123 A CN103132123 A CN 103132123A CN 2011103880300 A CN2011103880300 A CN 2011103880300A CN 201110388030 A CN201110388030 A CN 201110388030A CN 103132123 A CN103132123 A CN 103132123A
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- China
- Prior art keywords
- base
- cover plate
- plating piece
- soft material
- fixture
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110388030.0A CN103132123B (en) | 2011-11-29 | 2011-11-29 | A kind of stationary fixture of soft material plating piece matrix |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110388030.0A CN103132123B (en) | 2011-11-29 | 2011-11-29 | A kind of stationary fixture of soft material plating piece matrix |
Publications (2)
Publication Number | Publication Date |
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CN103132123A true CN103132123A (en) | 2013-06-05 |
CN103132123B CN103132123B (en) | 2015-08-26 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201110388030.0A Active CN103132123B (en) | 2011-11-29 | 2011-11-29 | A kind of stationary fixture of soft material plating piece matrix |
Country Status (1)
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CN (1) | CN103132123B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105734564A (en) * | 2016-03-28 | 2016-07-06 | 北京鼎臣超导科技有限公司 | Novel multi-substrate large-area single-face or double-face superconducting thin film substrate clamp |
CN105862113A (en) * | 2016-05-10 | 2016-08-17 | 东莞劲胜精密组件股份有限公司 | Electroplating jig and electroplating process |
CN109763166A (en) * | 2019-03-07 | 2019-05-17 | 苏州热工研究院有限公司 | Device suitable for metal sample electrobrightening |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
JPH0959795A (en) * | 1995-08-24 | 1997-03-04 | Nec Kansai Ltd | Plating jig |
JP2006016649A (en) * | 2004-06-30 | 2006-01-19 | Fujikura Ltd | Plating fixture |
CN1908247A (en) * | 2005-06-20 | 2007-02-07 | 株式会社山本镀金试验器 | Electroplating jig |
CN101220491A (en) * | 2007-10-08 | 2008-07-16 | 四川长虹电器股份有限公司 | Partially plating method for plastic parts |
CN101220500A (en) * | 2007-08-29 | 2008-07-16 | 中国电子科技集团公司第二研究所 | Wafer convex point producing hanging fixture |
CN201459271U (en) * | 2009-05-19 | 2010-05-12 | 上海新阳半导体材料股份有限公司 | Clamp for electroplating wafer |
-
2011
- 2011-11-29 CN CN201110388030.0A patent/CN103132123B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
JPH0959795A (en) * | 1995-08-24 | 1997-03-04 | Nec Kansai Ltd | Plating jig |
JP2006016649A (en) * | 2004-06-30 | 2006-01-19 | Fujikura Ltd | Plating fixture |
CN1908247A (en) * | 2005-06-20 | 2007-02-07 | 株式会社山本镀金试验器 | Electroplating jig |
CN101220500A (en) * | 2007-08-29 | 2008-07-16 | 中国电子科技集团公司第二研究所 | Wafer convex point producing hanging fixture |
CN101220491A (en) * | 2007-10-08 | 2008-07-16 | 四川长虹电器股份有限公司 | Partially plating method for plastic parts |
CN201459271U (en) * | 2009-05-19 | 2010-05-12 | 上海新阳半导体材料股份有限公司 | Clamp for electroplating wafer |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105734564A (en) * | 2016-03-28 | 2016-07-06 | 北京鼎臣超导科技有限公司 | Novel multi-substrate large-area single-face or double-face superconducting thin film substrate clamp |
CN105734564B (en) * | 2016-03-28 | 2018-06-26 | 北京鼎臣世纪超导科技有限公司 | Multi-disc large area single or double superconducting thin film substrate fixture |
CN105862113A (en) * | 2016-05-10 | 2016-08-17 | 东莞劲胜精密组件股份有限公司 | Electroplating jig and electroplating process |
CN109763166A (en) * | 2019-03-07 | 2019-05-17 | 苏州热工研究院有限公司 | Device suitable for metal sample electrobrightening |
Also Published As
Publication number | Publication date |
---|---|
CN103132123B (en) | 2015-08-26 |
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C06 | Publication | ||
PB01 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100088, 2, Xinjie street, Beijing, Beijing, Xicheng District Co-patentee after: Youyan Powder New Materials Co.,Ltd. Patentee after: GENERAL Research Institute FOR NONFERROUS METALS Address before: 100088, 2, Xinjie street, Beijing, Beijing, Xicheng District Co-patentee before: GRIPM ADVANCED MATERIALS Co.,Ltd. Patentee before: General Research Institute for Nonferrous Metals |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190729 Address after: 101407 Beijing city Huairou District Yanqi Yanqi Economic Development Zone South four Street No. 12 Patentee after: Youyan Powder New Materials Co.,Ltd. Address before: 100088, 2, Xinjie street, Beijing, Beijing, Xicheng District Co-patentee before: Youyan Powder New Materials Co.,Ltd. Patentee before: General Research Institute for Nonferrous Metals |
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TR01 | Transfer of patent right |