CN101220500A - Wafer convex point producing hanging fixture - Google Patents
Wafer convex point producing hanging fixture Download PDFInfo
- Publication number
- CN101220500A CN101220500A CNA2007101393296A CN200710139329A CN101220500A CN 101220500 A CN101220500 A CN 101220500A CN A2007101393296 A CNA2007101393296 A CN A2007101393296A CN 200710139329 A CN200710139329 A CN 200710139329A CN 101220500 A CN101220500 A CN 101220500A
- Authority
- CN
- China
- Prior art keywords
- wafer
- main board
- conductive plate
- flange
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a wafer bump manufacture plating rack which is arranged in a conductive fixture next to an electroplating bath. The invention is used for the growth and manufacture of wafer bumps and solves the problems of complicated structure, high cost and inconvenience in changing wafers of different sizes of the existing wafer plating rack. The plating rack comprises a main board (10) of the plating rack and a conductive plate (12) which is fixedly arranged on the main board (10) and a handle (14); the main board (10) is provided with a round conductive disc (8) which is fixedly connected with the conductive plate (12); the main board (10) around the conductive disc is embedded and sheathed with a threaded sleeve (9); a flange (2) fixes the wafer on the conductive disc (8) on the main board (10) through a fastening plastic screw (1) and the threaded sleeve (9); a seal ring (3) is arranged between the outer ring of the flange (2) and the main board (10), and another seal ring (4) is arranged between the inner ring of the flange and the conductive disc (8). The invention is suitable for manufacturing various wafer bumps.
Description
Technical field
The present invention relates to the fixing utensil of electroplating element in a kind of plating tank, be particularly related to a kind of hanger of employed fixedly wafer when wafer is electroplated, this hanger is used for the growth and the manufacturing of wafer convex point, and this processing procedure is a critical process of wafer level packaging (WLP) process.Hanger is installed in to be electroplated on the trough rim conductive fixture, and whole conducting process does not have lead to connect, and its structure can make the plating salient point can grow quickly and evenly on wafer.
Background technology
Crystal element being carried out in the encapsulation technology, the tool novelty of Wafer-Level Packaging Technology, caught people's attention most, is that encapsulation technology obtains the revolutionary sign of breaking through.Wafer level packaging mainly adopts film redistribution technology, salient point to form two big basic technologies.The former is used for the welding region along the chip circumferential distribution is converted to the salient point welding zone that distributes by the planar array form on chip surface.The latter then is used for making salient point on the salient point welding zone, forms welded ball array.In the salient point forming process, the wafer hanger plays conduction, fixing, connection and sealing function.At present, galvanized R﹠D institution of domestic research wafer and enterprise are few in number, and the hanger of having developed exists many problems mostly, mainly there is complex structure, the cost height can not be suitable for the wafer of different size easily, and the growth precision of wafer convex point is the high-technology problem not.
Summary of the invention
The invention solves existing wafer hanging tool structure complexity, cost height, the different size wafer is changed inconvenient technical problem.
The present invention overcomes the above problems by following scheme:
The present invention includes hanger main board 10, handle 14 that is provided with in the upper fixed of main board 10 and the fixed block 13 above the handle, on described main board 10 and handle 14, be set with conducting plates 12, middle part at the front panel of hanger main board 10 is set with a circular conductive plate 8, conducting plates 12 is fixedlyed connected with conductive plate 8, on the main board 10 around the conductive plate, be nested with metal rib-loop cover 9, flange 2 is fixed on wafer on the conductive plate 8 on the hanger main board 10 by fastening plastic screw 1 and metal rib-loop cover 9, between the outer ring of flange 2 and main board 10, be provided with sealing-ring 3, between the inner ring of flange and conductive plate 8, be provided with sealing-ring 4.
Can be provided with the wafer plane positioning step on the described conductive plate 8.Can be provided with electroconductive elastic sheet 6 on the described conductive plate 8, an end of this electroconductive elastic sheet 6 is fixed on the conductive plate 8 by screw 5, and the other end elastic compression is on wafer.
This hanger provides good conditions and environment for the generation of wafer convex point, and simple in structure, cost is low, can make corresponding hanger size at the different standards wafer size and change, and easy to install, salient point growing height difference can remain on below the 5 μ m.
Description of drawings
Fig. 1 is a deployed configuration synoptic diagram of the present invention
Fig. 2 is a schematic appearance of the present invention
Embodiment
The present invention will be described below in conjunction with accompanying drawing:
Wafer is positioned on the plane, concave station rank of conductive plate 8, and conductive plate 8 is fixing with hanger main board 10 by screw 7, and metal rib-loop cover 9 is nested in the hanger main board 10.Electroconductive elastic sheet 6 acts on wafer peripheral by the snap-in force of screw 5.Sealing-ring 3 effective seal positions are placed on the wafer ragged edge, sealing-ring 4 effective seal positions are placed on the outer of electroconductive elastic sheet 6, tongued and grooved flanges 2 on sealing-ring 3 and sealing-ring 4, can reach good sealing effectiveness thereby make wafer need not galvanized ground by fastening plastic screw 1 and metal threaded cover 9 pressuring actions.Stainless steel conducting strip 12 is connected with conductive plate 8 by two screws, is internal thread on the conductive plate.Handle 14 is fixing with hanger main board 10 by screw 15, makes stainless steel conducting strip 12 realize smooth effect by screw 11.Handle contiguous block 13 is realized being connected with handle 14 by two screws.In galvanized process, the top of handle contiguous block 13 and stainless steel conducting strip 12 links together direct and special-purpose conductive fixture.In electroplating process, electric current arrives conductive plate 8 then along conductive fixture to stainless steel conducting strip 12, again will be directly to wafer UBM layer all round by electroconductive elastic sheet 6 electric currents.Whole conducting process does not have lead and connects, thereby has guaranteed the cathodic current of wafer convex point growth.
Claims (3)
1. wafer convex point producing hanging fixture, comprise hanger main board (10), the handle (14) that is provided with in the upper fixed of main board (10) and the fixed block (13) of handle top, it is characterized in that, on described main board (10) and handle (14), be set with conducting plates (12), middle part at the front panel of hanger main board (10) is set with a circular conductive plate (8), conducting plates (12) is fixedlyed connected with conductive plate (8), on the main board (10) around the conductive plate, be nested with metal rib-loop cover (9), flange (2) is fixed on wafer on the conductive plate (8) on the hanger main board (10) by fastening plastic screw (1) and metal rib-loop cover (9), between the outer ring of flange (2) and main board (10), be provided with sealing-ring (3), between the inner ring of flange (2) and conductive plate (8), be provided with sealing-ring (4).
2. a kind of wafer convex point producing hanging fixture according to claim 1 is characterized in that, described conductive plate (8) is provided with the wafer plane positioning step.
3. a kind of wafer convex point producing hanging fixture according to claim 1 and 2, it is characterized in that, described conductive plate (8) is provided with electroconductive elastic sheet (6), and an end of this electroconductive elastic sheet (6) is fixed on the conductive plate (8) by screw (5), and the other end elastic compression is on wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101393296A CN101220500A (en) | 2007-08-29 | 2007-08-29 | Wafer convex point producing hanging fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101393296A CN101220500A (en) | 2007-08-29 | 2007-08-29 | Wafer convex point producing hanging fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101220500A true CN101220500A (en) | 2008-07-16 |
Family
ID=39630563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101393296A Pending CN101220500A (en) | 2007-08-29 | 2007-08-29 | Wafer convex point producing hanging fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101220500A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103132123A (en) * | 2011-11-29 | 2013-06-05 | 北京有色金属研究总院 | Fixture for fixing soft material plated piece substrate |
| CN103866374A (en) * | 2012-12-12 | 2014-06-18 | 诺发系统公司 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9464361B2 (en) | 2010-07-02 | 2016-10-11 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US9899230B2 (en) | 2013-05-29 | 2018-02-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| CN107988625A (en) * | 2017-12-29 | 2018-05-04 | 合肥矽迈微电子科技有限公司 | A kind of new multiwindow PCB Electropolating hangers |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| CN109321963A (en) * | 2018-11-20 | 2019-02-12 | 吉姆西半导体科技（无锡）有限公司 | Electroplating cathode hanger |
| WO2019040111A1 (en) * | 2017-08-21 | 2019-02-28 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| CN114197021A (en) * | 2021-11-04 | 2022-03-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Double-wafer film coating clamp |
| CN114351224A (en) * | 2021-03-18 | 2022-04-15 | 青岛惠芯微电子有限公司 | Electroplating hanger and electroplating device |
| CN114197021B (en) * | 2021-11-04 | 2024-06-04 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Double-wafer film coating clamp |
-
2007
- 2007-08-29 CN CNA2007101393296A patent/CN101220500A/en active Pending
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10190230B2 (en) | 2010-07-02 | 2019-01-29 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US9464361B2 (en) | 2010-07-02 | 2016-10-11 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| CN103132123B (en) * | 2011-11-29 | 2015-08-26 | 北京有色金属研究总院 | A kind of stationary fixture of soft material plating piece matrix |
| CN103132123A (en) * | 2011-11-29 | 2013-06-05 | 北京有色金属研究总院 | Fixture for fixing soft material plated piece substrate |
| CN103866374A (en) * | 2012-12-12 | 2014-06-18 | 诺发系统公司 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| CN103866374B (en) * | 2012-12-12 | 2017-06-06 | 诺发系统公司 | It is used for the intensifier of the electrolyte flow power of efficient mass transfer in electroplating process |
| US9834852B2 (en) | 2012-12-12 | 2017-12-05 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US10662545B2 (en) | 2012-12-12 | 2020-05-26 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9899230B2 (en) | 2013-05-29 | 2018-02-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| WO2019040111A1 (en) * | 2017-08-21 | 2019-02-28 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| CN107988625A (en) * | 2017-12-29 | 2018-05-04 | 合肥矽迈微电子科技有限公司 | A kind of new multiwindow PCB Electropolating hangers |
| CN109321963A (en) * | 2018-11-20 | 2019-02-12 | 吉姆西半导体科技（无锡）有限公司 | Electroplating cathode hanger |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| CN114351224A (en) * | 2021-03-18 | 2022-04-15 | 青岛惠芯微电子有限公司 | Electroplating hanger and electroplating device |
| CN114351224B (en) * | 2021-03-18 | 2023-08-25 | 青岛惠芯微电子有限公司 | Electroplating hanger and electroplating device |
| CN114197021A (en) * | 2021-11-04 | 2022-03-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Double-wafer film coating clamp |
| CN114197021B (en) * | 2021-11-04 | 2024-06-04 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Double-wafer film coating clamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101220500A (en) | Wafer convex point producing hanging fixture | |
| CN201116311Y (en) | Wafer bump manufacturing hanger | |
| US20230076493A1 (en) | Lipseals and contact elements for semiconductor electroplating apparatuses | |
| US10066311B2 (en) | Multi-contact lipseals and associated electroplating methods | |
| WO2009086257A8 (en) | Susceptor with support bosses | |
| CN103469271A (en) | Hanging tool for wafer electroplating | |
| CN105624754B (en) | Lip seal and contact elements for semi-conductor electricity plating appts | |
| EP2525412A3 (en) | Solar cell and solar cell module | |
| IN2012DN03443A (en) | ||
| EP2363661A3 (en) | Photovoltaic module mounting assembly | |
| CN206418212U (en) | Electroplate framework | |
| CN114351225A (en) | Electroplating hanger and electroplating device | |
| CN205162724U (en) | Heat -preserving cover plate , pot cover and electric rice cooker | |
| CN202482463U (en) | Wafer electroplating conductive sealing ring | |
| CN201080506Y (en) | Fitting interior surface cadmium-plating positioning apparatus | |
| CN114351226A (en) | Electroplating hanger and electroplating device | |
| CN206775029U (en) | Arch loose-leaf fixture | |
| EP2620083A1 (en) | Sealing structure of juice extractor | |
| CN102013407A (en) | Film-coating hook and silicon wafer loader adopting same | |
| CN104611757A (en) | Pitch adjustable electrode and electroplating cathode for electroplating equipment | |
| CN205797288U (en) | Test tube rack teat glass clip | |
| CN209461480U (en) | Solar battery producing line electrical pumping pressing plate | |
| CN205680507U (en) | A kind of antifouling flash insulator device with good fixed performance | |
| CN216355745U (en) | Fastening device is held tightly in photoelectric cable groove | |
| CN206617985U (en) | Induction coil mounting structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080716 |