CN103469271A - Hanging tool for wafer electroplating - Google Patents
Hanging tool for wafer electroplating Download PDFInfo
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- CN103469271A CN103469271A CN2013104125389A CN201310412538A CN103469271A CN 103469271 A CN103469271 A CN 103469271A CN 2013104125389 A CN2013104125389 A CN 2013104125389A CN 201310412538 A CN201310412538 A CN 201310412538A CN 103469271 A CN103469271 A CN 103469271A
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- upper cover
- hanger
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Abstract
The invention discloses a hanging tool for wafer electroplating. The hanging tool comprises an upper cover, a lower plate and a metal conductive ring, wherein an inner thread is arranged on the inner wall of the upper cover, a wafer groove is formed in the lower plate, an electroplating hole is formed in the middle of the wafer groove, and an outer thread engaged with the inner thread is arranged on the outer wall of the wafer groove; a platform is arranged between the inner wall of the wafer groove and the electroplating hole; the metal conductive ring is arranged on the platform. The upper cover of the hanging tool for the wafer electroplating is locked in a rotary mode, and the need of manually disassembling screws is eliminated, so that the hanging tool is convenient to operate, uniform in force, good in electrical conductivity and sealing performance and uniform in water coating, thereby greatly saving the manpower and reducing the wafer scrapping risk.
Description
Technical field
The present invention relates to the Wafer electroplating device of semi-conductor electricity coating apparatus, particularly relate to the hanger that a kind of wafer is electroplated.
Background technology
Wafer Electropolating hangers in semi-conductor electricity coating apparatus in the market makes to be screwed, have following shortcoming: one, schedule of operation is comparatively complicated, when using a wafer hanger of installation, first must turn on all firmly screws and just can open the hanger upper cover, after wafer is installed, must again repeat above work, wafer could be seal-installed in hanger; If two, existing hanger is installed badly, directly have influence on homogeneity, the electroconductibility of crystal column surface coating, and the screw material requirements that the hanger surface is used is very high, the cost increase is very large; Each toward the interior wafer of installing of hanger during execute-in-place, necessary each screw of manual locking, this has greatly increased workload and working routine concerning the worker, has wasted a large amount of time.
Electropolating hangers all belongs to matured product in hardware industry, PCB industry, but high to the uniformity requirement of plated item coating in the wafer level packaging industry, and common hanger can't meet the coating uniformity requirement at all.
There is technology to disclose a kind of wafer convex point producing hanging fixture, be mounted in and electroplate on the trough rim conductive fixture, this hanger is fixing by fastening plastics screw and metal rib-loop cover, this kind operates in handling more loaded down with trivial details, and the bad grasp of dynamics when the handling screw, degree of tightness can produce very large difference to the conductivity of hanger, directly has influence on the in uneven thickness of coating, and causes scrapping of wafer.
Summary of the invention
Based on this, be necessary for the problems referred to above, provide a kind of easy to operate, dynamics is even, electroconductibility, good seal performance, gained wafer coating is even, greatly saves the hanger of the wafer plating of manpower and wafer loss risk.
For achieving the above object, the present invention has taked following technical scheme:
The hanger that a kind of wafer is electroplated, comprise upper cover, lower plate, metallic conduction ring, and described upper cover inwall is provided with internal thread;
Described lower plate is provided with wafer slot, and the middle part of described wafer slot offers electroplating hole;
The outer wall of described wafer slot is provided with outside screw, with described internal thread engagement;
Be provided with platform between the inwall of described wafer slot and described electroplating hole, described metallic conduction ring is arranged on this platform.
The hanger that wafer of the present invention is electroplated is by being respectively arranged with at described wafer slot outer wall and described upper cover inwall the outer internal thread cooperatively interacted, described upper cover and described wafer slot cell wall are locked by spiral way, easy to operate, save time, and can not install because of hanger not in place, and cause crystal column surface uneven coating one, the adverse consequences of poor electric conductivity, prior art fixes mainly with several screws, screw is artificial knob, different screws is stressed may be not of uniform size, cause wafer make electric currents different from the pressure of each point of contact not wait, and electric current is the principal element that affects electrolytic coating thickness, thereby cause the electrolytic coating thickness of wafer each several part to there is otherness, electrolytic coating is in uneven thickness., by screwed upper cover and lower plate integral locking, there is not the situation of unbalance stress in the present invention, can make wafer and conducting ring uniform contact, by each point of contact electric current relatively unanimously guaranteed coating evenly, and only need to rotate upper cover and just operate and put in place.The metallic conduction ring contacts with wafer (plating object) surface lines, plays electric action, thereby can make crystal column surface be electroplated.The design of metallic conduction ring annular more meets the integral body contact of wafer outer ring conducting metal, the wafer top layer is electroplated more even.
In some embodiment, the hanger that above-mentioned wafer is electroplated also comprises seal assembly therein, and described seal assembly comprises silica gel pad, annular boss and pressing plate, and described annular boss is arranged on described platform, and the inwall of close described wafer slot;
Described silica gel pad is arranged between described metallic conduction ring and described platform;
Described pressing plate is arranged on described annular boss, and the shape of described pressing plate matches with described annular boss.
In some embodiment, be provided with at least one electrode and at least one feet on described metallic conduction ring therein;
Offer the breach corresponding with described electrode and feet on described annular boss;
Described silica gel pad is provided with the pad protuberance matched with described breach.
Above-mentioned seal assembly better fixing metal conducting ring is set, and play good sealing function: flexibility and elasticity that wherein silica gel pad has, when screwing upper cover, the protuberance of upper cover lower surface extruding wafer, wafer extruding silica gel pad reaches sealing effectiveness.
Be provided with the pad protuberance matched with the breach of annular boss on described silica gel pad, feet on the metallic conduction ring is also corresponding with the position of breach with electrode, such structure is fixing metal conducting ring and silica gel pad better, makes it be not easy to slide.
The electrode arranged on the metallic conduction ring is connected with the electric wire on lower plate, can be by foreign current be sent to uniformly crystal column surface.
Shape and the annular boss of above-mentioned pressing plate cooperatively interact, and can further play the effect of sealing, prevent that electroplate liquid from infiltrating the hanger inside that wafer is electroplated.
In some embodiment, the inwall of described silica gel pad upwards is provided with projection therein, and described metallic conduction ring set is located at described projection.The effect of above-mentioned projection is the position of fixing metal conducting ring better.Prevent from when upper cover from screwing sliding.The convex design of silica gel pad in addition, can when screwing, upper cover bring better sealing effectiveness by stressed extruding, prevent the hole place that plating solution infiltration wafer and hanger may exist, cause sealing not good, may cause the liquid medicine infiltration, be difficult to clean, can cause the detrimentally affects such as crossed contamination in a plurality of electroplating work procedures.
In some embodiment, be provided with the first pilot hole on described annular boss therein, be provided with the second corresponding with described the first pilot hole pilot hole on described pressing plate.
The first pilot hole and the second pilot hole can be fixed together pressing plate and annular boss by screw, further fixedly silica gel pad and metallic conduction ring.
In some embodiment, the lower surface of described upper cover is provided with the protuberance matched with described annular boss internal diameter therein.Raised part is mainly used in extruding wafer when upper cover locking, reaches better sealing property.
In some embodiment, described pressing plate is made by transparent material therein.
Above-mentioned pressing plate is made by transparent material, can know the connection of seeing each parts and circuit under pressing plate.
In some embodiment, the upper surface of described upper cover is provided with at least two recesses therein.
The setting of above-mentioned recess is for more convenient locking or unclamps upper cover.
In some embodiment, the inwall top of described upper cover is provided with the upper cover sealing-ring therein.Above-mentioned upper cover sealing-ring has elasticity, and when upper cover and the locking of wafer slot cell wall, the upper cover sealing-ring drops on the end face of wafer slot cell wall, has prevented that electroplate liquid from entering the inside of wafer Electropolating hangers, reaches the front sealing effectiveness.The wafer slot cell wall also plays the effect of front secondary seal, and electroplate liquid is completely cut off in the outside of wafer slot cell wall, the usage period of more effective assurance wafer Electropolating hangers internals, extends hanger work-ing life.
The present invention compared to the beneficial effect of prior art is:
1, locking mode is more simple and convenient than conventional screw locking, and locking force is stronger; The hanger that above-mentioned wafer is electroplated effectively reduces schedule of operation in each use procedure, opens upper cover only with rotation, by screw-threaded coupling, reduces costs, and saves time.Prior art fixes mainly with several screws, screw is artificial knob, and different screws is stressed may be not of uniform size, causes wafer make electric currents different from the pressure of each point of contact not wait, and electric current is the principal element that affects thickness of coating, thereby electric current does not wait and causes thickness of coating to have otherness., by being threaded the upper cover integral locking, there is not the situation of unbalance stress in the present invention, can make product wafer and conducting ring uniform contact, has relatively unanimously guaranteed the homogeneity of thickness of coating by each point of contact electric current.
2, the design of metallic conduction ring contacts more evenly with wafer, and the top layer coating homogeneity of wafer is better;
3, stopping property is stronger, and liquid medicine is difficult for infiltrating into wafer electroless plating face, and the ingehious design of stopping property makes the wafer electroplating quality improve, and can not cause the crossed contamination of liquid medicine in a plurality of electroplating work procedures, makes to electroplate the wafer quality more excellent.
The accompanying drawing explanation
The explosive view that Fig. 1 is the hanger that in embodiment 1, wafer is electroplated;
The vertical view that Fig. 2 is the hanger that in embodiment 1, wafer is electroplated;
The A that Fig. 3 is Fig. 2 is to sectional view;
The A that Fig. 4 is Fig. 2 is to local amplification profile;
The bottom surface structure view of the upper cover that Fig. 5 is the hanger that in embodiment 1, wafer is electroplated;
The topology view of the metallic conduction ring that Fig. 6 is the hanger that in embodiment 1, wafer is electroplated;
The bottom surface structure view of the pressing plate that Fig. 7 is the hanger that in embodiment 1, wafer is electroplated;
The plan structure view of the lower plate that Fig. 8 is the hanger that in embodiment 1, wafer is electroplated;
Fig. 9 be hanger that in embodiment 1, wafer is electroplated the topology view of silica gel pad;
Figure 10 is wafer electrolytic coating thickness measuring point position view.
Description of reference numerals: 100: upper cover; 110: protuberance; 120: the upper cover sealing-ring; 130: recess; 200: lower plate; 210: silica gel pad; 211; The pad protuberance; 212: projection; 220: the metallic conduction ring; 221: electrode; 222: feet; 230: pressing plate; 231: the second pilot holes; 240: the wafer slot cell wall; 250: annular boss; 251: breach; 252: the first pilot holes; 260: electroplating hole; 280: suspension part; 300: conductive copper plate; 310: the conductive copper board slot; 400: wire way; 500: wafer.
Embodiment
Further illustrate the present invention below in conjunction with embodiment and accompanying drawing.
The hanger that the present embodiment 1 provides a kind of wafer to electroplate, as shown in Fig. 1-9, it comprises upper cover 100, lower plate 200, upper cover 100 also is provided with upper cover sealing-ring 120; Be provided with wafer slot, wafer slot cell wall 240, seal assembly, metallic conduction ring 220, conductive copper plate 300, conductive copper board slot 310, wire way 400, electroplating hole 260, suspension part 280 etc. on lower plate 200.
The middle part of wafer slot offers electroplating hole 260.
Be provided with platform between wafer slot inwall and electroplating hole 260, metallic conduction ring 220 is arranged on this platform.Be provided with electrode 221 and a feet 222(4 electrode 221 and 12 feets 222 on metallic conduction ring 220), the number of electrode 221 and feet 222 can change according to practical situation, wherein the number of electrode 221 can affect the homogeneity of coating, what the present embodiment adopted is 4 electrodes 221, can meet the homogeneity of distribution of current, (in Table 1 test result).Metallic conduction ring 220 is thinner, in order to prevent distortion, is provided with feet 222 and fixes, and number comes specifically to arrange as required.Electrode 221 is connected with the electric wire in being arranged on lower plate wire way 400, electric wire again be arranged on lower plate 200 on conductive copper plate 300 be connected.
Seal assembly comprises silica gel pad 210, pressing plate 230, annular boss 250.Annular boss 250 is arranged on described platform, and the inwall of close wafer slot, offers the breach 251 corresponding with electrode 221 and feet 222 on annular boss 250.
Also offer the first pilot hole 252 on annular boss 250, pressing plate 230 is provided with second pilot hole 231 corresponding with the first pilot hole 252, the first pilot hole 252 and the second pilot hole 231 can be fixed together pressing plate 230 and annular boss 250 by screw, further fixedly silica gel pad 210 and metallic conduction ring 220.
Silica gel pad 210 is arranged between metallic conduction ring 220 and described platform, be provided with the pad protuberance 211 matched with the breach 251 of annular boss 250 on silica gel pad 210, feet 222 on metallic conduction ring 220 is also corresponding with the position of breach 251 with electrode 221, such structure is fixing metal conducting ring 220 and silica gel pad 210 better, makes it be not easy to slide.
The shape of pressing plate 230 and annular boss 250 cooperatively interact, and can further play the effect of sealing, prevent that electroplate liquid from infiltrating the hanger inside that wafer is electroplated.Pressing plate 230 is made for transparent material, can conveniently see the link condition of its lower line.
Above-mentioned seal assembly better fixing metal conducting ring 220 is set, and play good sealing function: flexibility and elasticity that wherein silica gel pad 210 has, when screwing upper cover 100, the protuberance 110 extruding wafers 500 of upper cover 100 lower surfaces, wafer 500 extruding silica gel pads 210 reach sealing effectiveness.
The upper surface of upper cover 100 is provided with recess 130(4), the number of recess 130 can increase or reduce according to practical situation.4 recesses 130 of upper cover 100 upper surface settings be lock for convenience and unclamp upper cover 100 and the design handle.
Upper cover sealing-ring 120 is arranged on the top of upper cover 100 inwalls.Upper cover sealing-ring 120 has elasticity, and when upper cover 100 and 240 locking of wafer slot cell wall, upper cover sealing-ring 100 drops on the end face of wafer slot cell wall 240, has prevented that electroplate liquid from entering the inside of hanger, reaches the front sealing effectiveness.Wafer slot cell wall 240 also plays the effect of front secondary seal, and electroplate liquid is completely cut off in the outside of wafer slot cell wall 240, the usage period of more effective assurance hanger internals, extends hanger work-ing life.
The operation steps that the described wafer Electropolating hangers of the present embodiment carries out electroplating activity is as follows: upper cover 100 is turned in rotation, wafer 500 is erected on the platform between annular boss 250 and electroplating hole 260, wafer 500 is contacted with silica gel pad 210 and metallic conduction ring 220, then by upper cover 100 rotational locks, finally the wafer Electropolating hangers is hung over to electrolytic plating pool by suspension part 280 and carry out electroplating work procedure.Whole electroplating work procedure is very easy, easy to operate, and the interaction of each parts brings better sealing effectiveness, and the coating of wafer is even, greatly saves manpower and wafer loss risk.
Take the electro-coppering post as example, and the electrolytic coating thickness of the wafer that table 1 is produced for the present embodiment 1 Electropolating hangers contrasts with the electrolytic coating thickness results of the wafer that uses prior art Electropolating hangers (screw fixed cover) to produce.Figure 10 is asked for an interview in the position of wafer electrolytic coating test point: wafer is got four diameter lines, every adjacent diameter line angle is 45 degree, get respectively the two ends of every line, and the point in the middle of two end points and central point is tested, test point is altogether 17, test the electrolytic coating thickness of each point, the results are shown in Table 1.
Table 1 embodiment 1 and Comparative Examples 1 Electropolating hangers are electroplated the contrast of gained wafer electrolytic coating thickness measuring result
As can be seen from Table 1, the wafer electrolytic coating thickness maximum deviation of Comparative Examples 1 is in ± 4.7 μ m scopes, and the electrolytic coating thickness of each point of the wafer that embodiment 1 electroplates is all in standard-required scope (100.0 ± 5.0 μ m), and be no more than ± 2.3 μ m of maximum deviation, successful is better than the effect of standard-required and Comparative Examples 1.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. the hanger that wafer is electroplated, is characterized in that, comprise upper cover, lower plate, metallic conduction ring, described upper cover inwall is provided with internal thread;
Described lower plate is provided with wafer slot, and the middle part of described wafer slot offers electroplating hole;
The outer wall of described wafer slot is provided with outside screw, with described internal thread engagement;
Be provided with platform between the inwall of described wafer slot and described electroplating hole, described metallic conduction ring is arranged on this platform.
2. the hanger that wafer according to claim 1 is electroplated is characterized in that also comprise seal assembly, described seal assembly comprises silica gel pad, annular boss and pressing plate, and described annular boss is arranged on described platform, and the inwall of close described wafer slot;
Described silica gel pad is arranged between described metallic conduction ring and described platform;
Described pressing plate is arranged on described annular boss, and the shape of described pressing plate matches with described annular boss.
3. the hanger that wafer according to claim 2 is electroplated, is characterized in that, is provided with at least one electrode and at least one feet on described metallic conduction ring;
Offer the breach corresponding with described electrode and feet on described annular boss;
Described silica gel pad is provided with the pad protuberance matched with described breach.
4. the hanger that wafer according to claim 3 is electroplated is characterized in that the inwall of described silica gel pad upwards is provided with projection, and described metallic conduction ring set is located at described projection.
5. the hanger that wafer according to claim 3 is electroplated, is characterized in that, is provided with the first pilot hole on described annular boss, is provided with the second corresponding with described the first pilot hole pilot hole on described pressing plate.
6. the hanger of electroplating according to the described wafer of claim 1-5 any one is characterized in that the lower surface of described upper cover is provided with the protuberance matched with described annular boss internal diameter.
7. the hanger of electroplating according to the described wafer of claim 2-5 any one is characterized in that described pressing plate is made by transparent material.
8. the hanger of electroplating according to the described wafer of claim 1-5 any one is characterized in that the upper surface of described upper cover is provided with at least two recesses.
9. the hanger of electroplating according to the described wafer of claim 1-5 any one is characterized in that the inwall top of described upper cover is provided with the upper cover sealing-ring.
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| CN201310412538.9A CN103469271B (en) | 2013-09-11 | 2013-09-11 | The hanger of wafer plating |
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|---|---|---|---|
| CN201310412538.9A CN103469271B (en) | 2013-09-11 | 2013-09-11 | The hanger of wafer plating |
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| CN103469271A true CN103469271A (en) | 2013-12-25 |
| CN103469271B CN103469271B (en) | 2016-02-17 |
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| CN105648509A (en) * | 2014-11-12 | 2016-06-08 | 中国科学院苏州纳米技术与纳米仿生研究所 | Electroplating clamp compatible with single wafers of multiple sizes |
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| CN105696042A (en) * | 2016-03-15 | 2016-06-22 | 南通市申海工业技术科技有限公司 | Galvanizing tool for tightening wheel cap of automobile engine |
| CN106207745B (en) * | 2016-08-17 | 2018-11-27 | 青岛海信宽带多媒体技术有限公司 | A kind of method and wafer improving chip metal electroplating current on-state rate |
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