CN220643322U - Wafer electroplating hanger and electroplating tank structure - Google Patents
Wafer electroplating hanger and electroplating tank structure Download PDFInfo
- Publication number
- CN220643322U CN220643322U CN202322214798.7U CN202322214798U CN220643322U CN 220643322 U CN220643322 U CN 220643322U CN 202322214798 U CN202322214798 U CN 202322214798U CN 220643322 U CN220643322 U CN 220643322U
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- hanging plate
- wafer
- conductive contact
- sealing rings
- electroplating
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- 238000009713 electroplating Methods 0.000 title claims abstract description 47
- 238000007789 sealing Methods 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 43
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 60
- 210000005056 cell body Anatomy 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model aims to provide a wafer electroplating hanger and an electroplating bath structure, which comprises a hanging plate, a conductive component and a fixing component, wherein an electroplating hole is formed in the hanging plate, the conductive component comprises a metal hanging plate and a plurality of conductive contact pieces, the metal hanging plate is arranged on one side surface of the hanging plate, each conductive contact piece is arranged on the hanging plate, each conductive contact piece is circumferentially distributed around the electroplating hole and is electrically connected with the metal hanging plate, the fixing component comprises a cover plate, two first sealing rings, two second sealing rings and a plurality of screws, the two first sealing rings are concentrically arranged on the hanging plate relative to the electroplating hole, so that each conductive contact piece is positioned between the two first sealing rings, the two second sealing rings are concentrically arranged on the cover plate, and each screw is used for penetrating through the cover plate and being screwed on the hanging plate, so that the two second sealing rings are aligned with the two first sealing rings one by one and press the wafer together, and the wafer is abutted against each conductive contact piece.
Description
Technical Field
The present utility model relates to wafer electroplating, and more particularly, to a wafer electroplating rack and a plating tank structure.
Background
Wafer electroplating refers to a process of depositing metal pins on transistors of a wafer by an electroplating process.
For example, chinese patent application No. CN201310412538.9 discloses a hanger for electroplating wafers, which comprises an upper cover, a lower plate and a metal conductive ring, wherein the inner wall of the upper cover is provided with internal threads, the lower plate is provided with a wafer groove, the middle part of the wafer groove is provided with an electroplating hole, and the outer wall of the wafer groove is provided with external threads which are engaged with the internal threads. Further, still include seal assembly, seal assembly includes silica gel gasket, annular boss and clamp plate, so, through external screw thread and internal screw thread meshing for upper cover and hypoplastron lock are fixed, thereby make the convex part extrusion wafer of upper cover lower surface, the wafer extrusion silica gel gasket reaches to seal the wafer fixed in the hanger.
However, in the prior art disclosed above, when the upper cover rotates to be fixed or released from the wafer tank, friction is generated between the upper cover and the back surface of the wafer, so that there is a risk of damaging the wafer, and therefore, in order to solve the technical problem, the wafer electroplating rack and the electroplating tank structure of the present application are provided.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide an electroplating hanger and an electroplating bath structure which can prevent wafer friction and reliably fix a wafer.
The aim of the utility model is realized by the following technical scheme:
a wafer plating rack comprising:
the hanging plate is provided with electroplating holes;
the conductive assembly comprises a metal hanging sheet and a plurality of conductive contact sheets, the metal hanging sheet is arranged on one side face of the hanging plate, each conductive contact sheet is arranged on the hanging plate, each conductive contact sheet is circumferentially distributed around the electroplating hole, and each conductive contact sheet is electrically connected with the metal hanging sheet; and
The fixing assembly comprises a cover plate, two first sealing rings, two second sealing rings and a plurality of screws, wherein the two first sealing rings are concentrically arranged on the hanging plate relative to the electroplating hole, so that each conductive contact piece is located between the two first sealing rings, the two second sealing rings are concentrically arranged on the cover plate, each screw is used for penetrating through the cover plate and being screwed on the hanging plate, and the two second sealing rings are aligned with the two first sealing rings one by one and press and clamp the wafer together, so that the wafer is abutted to each conductive contact piece.
In one embodiment, the two first seal rings are divided into an inner ring and an outer ring of different diameters.
In one embodiment, the structure of the two second sealing rings is identical to the structure of the two first sealing rings respectively.
In one embodiment, the first seal ring is a rubber seal ring structure.
In one embodiment, a deformation hole is formed in the first sealing ring.
In one embodiment, the metal hanger plate and each of the conductive contacts are located on the same side of the hanger plate.
In one embodiment, a plurality of wires are disposed on a side surface of the hanging plate away from the metal hanging plate, one end of each wire is penetrated through the hanging plate to be electrically connected with the metal hanging plate together, and the other end of each wire is penetrated through the hanging plate to be electrically connected with each conductive contact plate respectively.
In one embodiment, a side surface of the hanging plate, which is far away from the metal hanging plate, is provided with a plurality of conductive grooves, each wire is correspondingly accommodated in each conductive groove one by one, and each conductive groove is internally provided with an insulating block.
In one embodiment, one end of the conductive contact is disposed on the hanging plate, and the other end of the conductive contact is suspended.
The utility model provides an electroplating bath structure, includes arbitrary wafer electroplating hanger of above-mentioned, still includes inside cell body, outer cell body, holds liquid case and two circulating water pumps, the inside cell body set up in the outer cell body, just the height of inside cell body is less than the height of outer cell body, the link plate set up in the inside cell body, hold the liquid case adjacent the outer cell body sets up, two circulating water pump pass through the pipeline with the inside cell body with hold the liquid case and be linked together respectively.
Compared with the prior art, the utility model has at least the following advantages:
the utility model relates to a wafer electroplating hanger and an electroplating bath structure, which comprises a hanging plate, a conductive component and a fixing component, wherein an electroplating hole is formed in the hanging plate, the conductive component comprises a metal hanging plate and a plurality of conductive contact pieces, the metal hanging plate is arranged on one side surface of the hanging plate, each conductive contact piece is arranged on the hanging plate, each conductive contact piece is circumferentially distributed around the electroplating hole and is electrically connected with the metal hanging plate, the fixing component comprises a cover plate, two first sealing rings, two second sealing rings and a plurality of screws, the two first sealing rings are concentrically arranged on the hanging plate relative to the electroplating hole, so that each conductive contact piece is positioned between the two first sealing rings, the two second sealing rings are concentrically arranged on the cover plate, and each screw is used for penetrating through the cover plate and being screwed on the hanging plate, so that the two second sealing rings are aligned with the two first sealing rings one by one and are jointly pressed to clamp a wafer, and the wafer is abutted against each conductive contact piece. Therefore, when the cover plate is buckled on the hanging plate, the first sealing ring and the second sealing ring clamp the two sides of the wafer together, so that the wafer is prevented from being worn in the loading and unloading process, and the hanging plate is simple in structure and easy to operate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a wafer plating rack according to an embodiment of the present utility model;
FIG. 2 is a schematic cross-sectional view of the wafer plating rack of FIG. 1;
FIG. 3 is a schematic view of the enlarged partial structure of FIG. 2A;
FIG. 4 is a schematic view of a hanging board according to an embodiment of the present utility model;
FIG. 5 is a schematic view of the enlarged partial structure of B in FIG. 1;
fig. 6 is a schematic structural view of a plating tank according to an embodiment of the utility model.
Reference numerals illustrate:
1. plating bath structure; 21. an inner tank body; 22. an outer tank; 23. a liquid storage tank; 10. wafer electroplating hanging tool; 100. a hanging plate; 200. a conductive assembly; 300. a fixing assembly; 110. electroplating holes; 210. a metal hanging piece; 220. a conductive contact; 310. a cover plate; 320. a first seal ring; 330. a second seal ring; 340. a screw; 321. an inner ring; 322. an outer ring; 3211. a deformation hole; 230. a wire; 120. a conductive groove; 130. a receiving groove; 400. and (5) hanging the ear.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model.
As shown in fig. 1 to 3, a wafer plating rack 10 includes a hanging plate 100, a conductive component 200 and a fixing component 300, wherein a plating hole 110 is formed on the hanging plate 100, the conductive component 200 includes a metal hanging plate 210 and a plurality of conductive contacts 220, the metal hanging plate 210 is disposed on a side surface of the hanging plate 100, each conductive contact 220 is disposed on the hanging plate 100, and each conductive contact 220 is circumferentially distributed around the plating hole 110, and each conductive contact 220 is electrically connected with the metal hanging plate 210, the fixing component 300 includes a cover plate 310, two first sealing rings 320, two second sealing rings 330 and a plurality of screws 340, the two first sealing rings 320 are concentrically disposed on the hanging plate 100 relative to the plating hole 110, so that each conductive contact 220 is located between the two first sealing rings 320, the two second sealing rings 330 are concentrically disposed on the cover plate 310, and each screw 340 is used for penetrating through the cover plate 310 and being screwed onto the hanging plate 100, so that the two second sealing rings 330 are aligned with the two first sealing rings 320 and are jointly pressed against the wafer, thereby the wafer 220 is contacted with each wafer.
The plating holes 110 extend from one side surface to the other side surface of the hanging plate 100. The metal hanger 210 is mounted on one side of the hanging plate 100, and the metal hanger 210 and the plating hole 110 are respectively located on opposite ends of the hanging plate 100. In an embodiment, the metal hanger 210 has an inverted U-shaped structure, so that the metal hanger 210 can be quickly plugged into a socket of the plating tank to realize power-on. Each conductive contact 220 is circumferentially distributed around the plating hole 110, and each conductive contact 220 is electrically connected to the metal hanger 210. Further, the two first sealing rings 320 are disposed on the hanging plate 100, and the two first sealing rings 320 are disposed concentrically with the electroplating hole 110, so that each conductive contact 220 is located between the two first sealing rings 320. Further, two second sealing rings 330 are mounted on the cover 310, for example, the cover 310 has a circular plate structure, the two second sealing rings 330 are concentrically disposed with the cover 310, and the two second sealing rings 330 are also concentrically disposed. In this way, after each screw 340 passes through the cover plate 310, it is screwed on the hanging plate 100, so that the cover plate 310 is fastened and fixed on the hanging plate 100, and the two first sealing rings 320 are aligned with the two second sealing rings 330 in a one-to-one correspondence. When the wafer is located between the first seal ring 320 and the second seal ring 330, the two first seal rings 320 are abutted against a side surface of the wafer to be electroplated, and the two first seal rings 320 are abutted against a back side surface of the wafer to be electroplated, so that the clamping force of the first seal ring 320 and the second seal ring 330 on the wafer can be adjusted by the screwing amount of the screws 340, so that the wafer is reliably clamped, and meanwhile, each conductive contact 220 located on the side of the hanging plate 100 is abutted against the to-be-electroplated layer of the wafer, so that preparation is made for the subsequent electroplating process. So, compare in current hanger structure, the wafer electroplating hanger 10 of this application is tight fixed to the wafer clamp through first sealing ring 320 and second sealing ring 330 atress deformation, can avoid the wafer to appear wearing and tearing in last unloading in-process, simple structure moreover, easily operation.
In one embodiment, the screws 340 are plastic screws, and further, the hanging plate 100 and the cover plate 310 are both plastic, so that electrochemical reaction can be avoided.
In an embodiment, two first grooves are concentrically formed on the hanging plate 100 corresponding to the electroplating hole 110, so that the two first sealing rings 320 are correspondingly accommodated in the two first grooves one by one, and thus, the two first sealing rings 320 are reliably and stably fixedly mounted on the hanging plate 100. Further, in an embodiment, two second grooves are also formed on the cover 310, so that the two second sealing rings 330 are respectively accommodated in the two second grooves, and thus the second sealing rings 330 are reliably and stably mounted on the cover 310.
In one embodiment, four screws 340 are provided, and four screws 340 are inserted at equal angles around the cover 310. In addition, it should be noted that the screws 340 are disposed through the cover plate 310 at a position away from the second sealing ring 330, so that the screws 340 are prevented from damaging the sealing area of the back surface of the wafer.
In one embodiment, the conductive contacts 220 are four, and the four conductive contacts 220 are disposed around the plating hole 110 at equal angles. Further, the number of the conductive contacts 220 may be 2, or 3, or 5, or 6, or 7, or 8, etc. according to actual needs.
In one embodiment, as shown in fig. 1, the two first seal rings 320 are divided into an inner ring 321 and an outer ring 322 having different diameters. It should be noted that, the two first seal rings 320 are configured to have different diameters, so that a certain interval is formed between the two first seal rings 320, so that each conductive contact 220 is located at the interval between the two first seal rings 320.
In one embodiment, the two second seal rings 330 are identical to the two first seal rings 320, respectively. For example, the two second seal rings 330 are also divided into inner and outer rings having different diameters, so that the two second seal rings 330 can be aligned with the two first seal rings 320 in a one-to-one correspondence, thereby ensuring that the conductive contacts 220 located between the two first seal rings 320 are in a good sealing environment. Moreover, the two sides of the wafer are pushed by the first sealing ring 320 and the second sealing ring 330 together, so that the wafer can be reliably and stably clamped, and meanwhile, the phenomenon that the wafer is crushed due to different positions of the pressing force experienced by the wafer is avoided.
In one embodiment, the first seal ring 320 is a rubber seal ring structure. Therefore, the rubber structure can be elastically deformed, so that the wafer can be reliably and stably clamped, the wafer is prevented from being damaged due to hard contact, and the conductive contact 220 can be effectively sealed to prevent the conductive contact from being contacted with the electroplating liquid.
As shown in fig. 3, in one embodiment, the first seal ring 320 has a deformation hole 3211 formed therein.
Thus, when the cover plate 310 is fastened to the hanging plate 100, the first sealing ring 320 is pressed by force and deformed, so that the first sealing ring 320 is reliably and tightly attached to the wafer.
In one embodiment, the metal hanger 210 and each conductive contact 220 are located on the same side of the hanging board 100.
It should be noted that, when the cover plate 310 is fastened to the hanging plate 100, the second sealing ring 330 on the side of the cover plate 310 abuts against the back surface of the surface to be plated of the wafer, and the first sealing ring 320 on the side of the hanging plate 100 abuts against the surface to be plated of the wafer, so that the surface to be plated of the wafer is disposed towards the plating hole 110 of the hanging plate 100. By disposing the metal hanger 210 on the same side as the conductive contact 220, i.e., on the same side as the cover plate 310. When the wafer electroplating rack 10 is mounted in the electroplating tank, the metal hanging sheet 210 can be conveniently and rapidly mounted on the wall of the tank of the electroplating tank, so that the surface to be plated of the wafer can be placed in the tank.
In an embodiment, a plurality of wires are disposed on a side of the hanging plate 100 away from the metal hanging plate 210, one end of each wire is disposed through the hanging plate 100 to be electrically connected with the metal hanging plate 210 together, and the other end of each wire is disposed through the hanging plate 100 to be electrically connected with each conductive contact 220 respectively.
The contact positions of the wires with the metal hanger 210 and the conductive contact 220 need to be insulated, and thus the wires are configured to pass through the hanger plate 100 in order to improve insulation. Specifically, one end of the wire passes through the hanging plate 100 to be connected with the metal hanging plate 210, and the other end of the wire passes through the hanging plate 100 to be connected with the conductive contact 220. In this way, the contact positions of the wires, the metal hanger 210 and the conductive contact 220 are glued and fixed by using the insulating glue.
As shown in fig. 4, in an embodiment, a side surface of the hanging plate 100 away from the metal hanging plate 210 is provided with a plurality of conductive grooves 120, each conductive wire is correspondingly accommodated in each conductive groove 120, and an insulating block is disposed in each conductive groove 120.
It should be noted that, in order to enable the wires to be buried in the hanging plate 100, the structure is more concise, and therefore, the hanging plate 100 is provided with the conductive groove 120, so that after the wires are accommodated in the conductive groove 120, the conductive groove 120 is filled with the insulating block. For example, the insulating block is a solid state of insulating glue.
As shown in fig. 1 and 5, in one embodiment, one end of the conductive contact 220 is disposed on the hanging board 100, and the other end of the conductive contact 220 is suspended. In this way, the conductive contact 220 has a certain elastic deformation capability, and when the cover plate 310 is buckled with the hanging plate 100 to clamp the wafer, the conductive contact 220 is reliably abutted against the surface to be plated of the wafer.
As shown in fig. 1 and fig. 5, in an embodiment, a plurality of receiving slots 130 are formed on the hanging board 100, each conductive contact 220 is correspondingly received in each receiving slot 130, and the height of the conductive contact 220 is greater than the depth of the receiving slot 130.
As shown in fig. 1, in an embodiment, two hanging lugs 400 are disposed on an end of the hanging plate 100 near the metal hanging plate 210, and the two hanging lugs 400 are respectively located on two sides of the hanging plate 100.
It should be noted that, before electroplating, a thin metal layer is sputtered on the side to be electroplated, so that the entire to-be-plated layer of the wafer is conductive, and then a metal layer is electroplated on the sputtered layer.
As shown in fig. 6, a plating tank structure 1 includes any of the wafer plating rack 10, and further includes an inner tank 21, an outer tank 22, a liquid storage tank 23, and two circulating water pumps, wherein the inner tank 21 is disposed in the outer tank 22, the height of the inner tank 21 is smaller than that of the outer tank 22, the hanging plate 100 is disposed in the inner tank 21, the liquid storage tank 23 is disposed adjacent to the outer tank 22, and the two circulating water pumps are respectively communicated with the inner tank 21 and the liquid storage tank 23 through pipes.
In order to adjust the temperature of the plating liquid to a predetermined temperature range, a reservoir tank 23 is installed adjacent to the outer tub 22, and a heating pipe is installed in the reservoir tank 23, and then one of the circulating water pumps is used to pump the plating liquid in the reservoir tank 23 into the inner tub 21, and the other circulating water pump is used to pump the plating liquid in the inner tub 21 into the reservoir tank 23. In one embodiment, a filter is further installed on a pipe through which the user communicates with the circulating water pump, and is used for filtering impurities in the electroplating solution.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. A wafer plating rack, comprising:
the hanging plate is provided with electroplating holes;
the conductive assembly comprises a metal hanging sheet and a plurality of conductive contact sheets, the metal hanging sheet is arranged on one side face of the hanging plate, each conductive contact sheet is arranged on the hanging plate, each conductive contact sheet is circumferentially distributed around the electroplating hole, and each conductive contact sheet is electrically connected with the metal hanging sheet; and
The fixing assembly comprises a cover plate, two first sealing rings, two second sealing rings and a plurality of screws, wherein the two first sealing rings are concentrically arranged on the hanging plate relative to the electroplating hole, so that each conductive contact piece is located between the two first sealing rings, the two second sealing rings are concentrically arranged on the cover plate, each screw is used for penetrating through the cover plate and being screwed on the hanging plate, and the two second sealing rings are aligned with the two first sealing rings one by one and press and clamp the wafer together, so that the wafer is abutted to each conductive contact piece.
2. The wafer plating rack of claim 1, wherein the two first seal rings are divided into an inner ring and an outer ring having different diameters.
3. The wafer plating rack of claim 2, wherein the two second seal rings are each identical in structure to the two first seal rings.
4. The wafer plating rack of claim 2, wherein the first seal ring is a rubber seal ring structure.
5. The wafer plating rack of claim 4, wherein a deformation hole is formed in the first seal ring.
6. The wafer plating rack of claim 1, wherein the metal hanger plate and each of the conductive contacts are located on a same side of the hanger plate.
7. The plating rack of claim 6, wherein a side of the hanging plate away from the metal hanging plate is provided with a plurality of wires, one end of each wire is penetrated through the hanging plate to be electrically connected with the metal hanging plate together, and the other end of each wire is penetrated through the hanging plate to be electrically connected with each conductive contact plate respectively.
8. The electroplating hanger of claim 7, wherein a side of said hanging plate away from said metal hanging plate is provided with a plurality of conductive grooves, each of said wires is accommodated in each of said conductive grooves in a one-to-one correspondence, and an insulating block is disposed in each of said conductive grooves.
9. The wafer plating rack of claim 1, wherein one end of the conductive contact is disposed on the hanging plate, and the other end of the conductive contact is suspended.
10. The electroplating bath structure comprises the wafer electroplating hanger according to any one of claims 1 to 9, and is characterized by further comprising an inner groove body, an outer groove body, a liquid storage tank and two circulating water pumps, wherein the inner groove body is arranged in the outer groove body, the height of the inner groove body is smaller than that of the outer groove body, the hanging plate is arranged in the inner groove body, the liquid storage tank is adjacent to the outer groove body, and the two circulating water pumps are respectively communicated with the inner groove body and the liquid storage tank through pipelines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322214798.7U CN220643322U (en) | 2023-08-16 | 2023-08-16 | Wafer electroplating hanger and electroplating tank structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322214798.7U CN220643322U (en) | 2023-08-16 | 2023-08-16 | Wafer electroplating hanger and electroplating tank structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220643322U true CN220643322U (en) | 2024-03-22 |
Family
ID=90284742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322214798.7U Active CN220643322U (en) | 2023-08-16 | 2023-08-16 | Wafer electroplating hanger and electroplating tank structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220643322U (en) |
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2023
- 2023-08-16 CN CN202322214798.7U patent/CN220643322U/en active Active
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