CN106471162B - Clamp for electric plating - Google Patents
Clamp for electric plating Download PDFInfo
- Publication number
- CN106471162B CN106471162B CN201580033875.4A CN201580033875A CN106471162B CN 106471162 B CN106471162 B CN 106471162B CN 201580033875 A CN201580033875 A CN 201580033875A CN 106471162 B CN106471162 B CN 106471162B
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- Prior art keywords
- chip
- clamp
- fastener
- plating
- coating member
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
The present invention provide clamp for electric plating, can easily be done chip pick and place and electroplate liquid is difficult to remain in inside.Clamp for electric plating (10) according to the present invention has：Keep pedestal (12), with holding Base body (121) and multiple fasteners (122), the holding Base body (121) abuts with the face of the side as the chip (7) for being plated base material, multiple fasteners (122) can independently be moved parallel to Base body (121) is kept relative to the face of chip (7)；And coating member (13), with coating member main body (131) and multiple engaged parts (132), the coating member main body (131) abuts with the outer rim in the face of another party of chip (7), and multiple engaged parts (132) protrude outward from coating member main body (131).Keep multiple fasteners (122) mobile to engage multiple engaged parts (132), chip (7) is clipped in and keeps keeping between pedestal (12) and coating member (13).
Description
Technical field
The present invention relates to the plating picked and placeed and can prevent electroplate liquid from remaining in inside that can easily be done chip
Use fixture.
Background technology
For example implement copper facing in the surface of chip to being used as the substrate of installation semiconductor.Specifically, being used in plating
Fixture installs chip, by the mass-impregnation for the clamp for electric plating for being equipped with chip in the copper plating bath being stored in electroplating bath, thus
Electroplating processes are carried out to the surface of chip.
Such as it discloses one kind in patent document 1 and can keep partly leading between the first holding member and the second holding member
The semiconductor wafer electroplating clamp of body chip.In patent document 1, protrusion is made by the cricoid fixed ring of rotational circle
(fastener) is engaged with inverted L-shaped pawl (engaged part), is allowed to the electroplate liquid being impregnated in electroplating bath in this state, half-and-half
Conductor chip is electroplated.
Patent document 1：Japanese Unexamined Patent Publication 2007-169792 bulletins
However, fixed ring is in circular therefore larger in order to be needed by so that fastener is engaged with engaged part by rotation
Power, there is the problem of being difficult to successfully be dismounted.In addition, due to being attached with annular shape, so can not be according to card
Stop position adjusts intrusion when locking, and there are possibility the problem of semiconductor wafer cracks.
Also, fixed ring is trapped in the inside of fixed ring in annular shape, therefore electroplate liquid, electroplate liquid to take quantitative change out of more.
Therefore, there is also may cause electroplating processes expense to increase.It is fixed in addition, being configured on the second holding member
Ring, therefore the upper surface of fixed ring becomes larger at a distance from the electroplating surface of semiconductor wafer, the thickness of electroplating clamp becomes larger, therefore also
There are may be unable to fully stirring electroplate liquid when electroplating processes.In addition, circular fixed ring setting is protected second
It holds on component, therefore there is also can not be taken out when taking out chip, if not unloading fixed ring and the second holding member both sides
The problem of chip.
Invention content
The present invention is to complete in light of this situation, can easily be done taking for chip its purpose is to provide a kind of
It puts and electroplate liquid is difficult to remain in internal clamp for electric plating.
To achieve the goals above, clamp for electric plating according to the present invention is characterized in that having：Pedestal is kept, it should
Keep pedestal with holding Base body and multiple fasteners, the holding Base body and as the chip for being plated base material
The face of one side abuts, and multiple fasteners and the holding Base body are independent, can relative to above-mentioned chip face parallelly
It is mobile；And coating member, the coating member have coating member main body and multiple engaged parts, the coating member main body with
The outer rim in the face of another party of above-mentioned chip abuts, and multiple engaged parts are protruded outward from the coating member main body,
Multiple above-mentioned fasteners movements are made to engage multiple above-mentioned engaged parts, by above-mentioned wafer clamp in above-mentioned holding pedestal and above-mentioned
It is kept between coating member.
In said structure, so that multiple fastener movements is engaged multiple engaged parts, wafer clamp is thus being kept into base
It is kept between seat and coating member, therefore can be directed to and each be configured with the fine position of multiple engaged parts to appropriate
It highly, can be relative to the uniformly applied power of chip, it is thus possible to reduce the crackle of chip.In addition, contact electricity when making energization
Resistance is uniform, thus enables that electroplating thickness is uniform.
In addition, clamp for electric plating according to the present invention is preferred：Above-mentioned holding pedestal also has multiple guide members, this draws
The action for leading the component vertical direction in the face relative to above-mentioned chip to above-mentioned fastener respectively constrains.
In said structure, keep pedestal that also there are multiple guide members, the guide member is respectively to the opposite of fastener
Action in the vertical direction in the face of chip is constrained, therefore can suitably carry out locking of the fastener to engaged part.
In addition, clamp for electric plating according to the present invention is preferred：In the state of maintaining above-mentioned chip, in above-mentioned chip
Plating object surface be arranged along vertical direction in the case of, multiple above-mentioned fasteners configurations are with respect to above-mentioned chip
Above-mentioned plating object surface center the symmetrical position of vertical, the case where keeping above-mentioned chip or the above-mentioned crystalline substance of release
In the case of piece, adjacent above-mentioned fastener mutually moves round about.
In said structure, the vertical at the center of object surface of multiple fastener configurations in the plating with respect to chip
Symmetrical position makes adjacent fastener mutually to phase negative side the case where keeping chip or in the case of releasing wafer
To movement.So that the power that fastener moves is homogeneously dispersed in multiple fasteners as a result, can hold or discharge by smaller trying hard to keep
Chip.In addition, adjacent fastener is made mutually to move round about, thus can increase between adjacent engaged part away from
From, it can be ensured that it is sufficient for the opening portion that picks and places of the chip supply arm to chip.
In addition, clamp for electric plating according to the present invention is preferred：In the state of maintaining above-mentioned chip, in above-mentioned chip
Plating object surface be arranged along vertical direction in the case of, above-mentioned fastener and above-mentioned engaged part configuration by upper
Position other than stating on the plumb line at the center of the object surface of the above-mentioned plating of chip, passes through the center of the object surface of above-mentioned plating
Plumb line on be in open state.
In said structure, it in the state of maintaining chip, is set along vertical direction in the object surface of the plating of chip
In the case of setting, fastener and engaged part configuration on the plumb line by the center of the object surface of the plating of chip other than
Position, by being in open state on the plumb line at the center of the object surface of plating, therefore electroplate liquid is difficult to remain in inside,
The drag-out of electroplate liquid can be suppressed to minimum limit.
In addition, clamp for electric plating according to the present invention is preferred：Above-mentioned holding pedestal has the multiple above-mentioned cards of limitation respectively
Multiple stop parts of the movement of stop, multiple above-mentioned fasteners are abutted with above-mentioned stop part, are thus configured by above-mentioned chip
Above-mentioned plating object surface center plumb line on other than position.
In said structure, multiple fasteners are abutted in the case where keeping chip with a stop part, in releasing wafer
In the case of abutted with other adjacent stop parts, therefore open state can be reliably formed, in electroplate liquid is difficult to remain in
The drag-out of electroplate liquid can be suppressed to minimum limit by portion.
In addition, clamp for electric plating according to the present invention is preferred：By the above-mentioned holding parallel relative to the face of above-mentioned chip
As reference plane, above-mentioned fastener is arranged in the position higher than above-mentioned engaged part, above-mentioned locking in the face of one side of Base body
The upper surface of the bottom surface in portion or above-mentioned engaged part tilts, and above-mentioned engaged part is clipped in above-mentioned holding Base body and above-mentioned locking
It is locked between portion.
In said structure, using the face of a side of the parallel holding Base body in the face relative to chip as reference plane,
Fastener is arranged in the position higher than engaged part, and the bottom surface of fastener or the upper surface of engaged part tilt, engaged part folder
It is keeping being locked between Base body and fastener.Thereby, it is possible to reliably be engaged by card by making fastener movement
Stop can reliably keep chip.
In addition, clamp for electric plating according to the present invention is preferred：By the above-mentioned holding parallel relative to the face of above-mentioned chip
The face of one side of Base body is arranged as reference plane, the upper surface of above-mentioned fastener in the upper surface of above-mentioned coating member main body
Height position below.
In said structure, the height position below in the upper surface of coating member main body is arranged in fastener, thus, it is possible to
Enough make the agitating paddle being arranged in electroplating bath close to the object surface of the plating of chip, the object surface that can fully stir plating is attached
Close electroplate liquid.
According to above structure, multiple engaged parts are engaged by making multiple fastener movements, wafer clamp is being kept into base
It is kept between seat and coating member, therefore can be directed to and each be configured with the fine position of multiple engaged parts to appropriate
Highly, make contact resistance when energization uniform, thus enable that electroplating thickness is uniform.
Description of the drawings
Fig. 1 is the summary progress for the electroplanting device to using the clamp for electric plating involved by embodiments of the present invention
The schematic diagram of explanation.
Fig. 2 is the stereogram for the use state for showing the clamp for electric plating involved by embodiments of the present invention.
Fig. 3 is the side view using the electroplanting device of the clamp for electric plating involved by embodiments of the present invention.
Fig. 4 is the stereogram for the structure for showing the clamp for electric plating involved by embodiments of the present invention.
Fig. 5 is the solid of structure when showing the wafer-carrying of the clamp for electric plating involved by embodiments of the present invention
Figure.
Fig. 6 is to show standing for the structure before the coating member installation of the clamp for electric plating involved by embodiments of the present invention
Body figure.
Structure when Fig. 7 is the coating member installation for showing the clamp for electric plating involved by embodiments of the present invention it is vertical
Body figure.
When Fig. 8 A are the coating member for showing the clamp for electric plating involved by locking embodiments of the present invention, holding chip
Structure stereogram.
Fig. 8 B are the partial sectional views for showing the clamp for electric plating involved by embodiments of the present invention.
Fig. 8 C are the bottom surface and engaged part for the fastener for showing the clamp for electric plating involved by embodiments of the present invention
Upper surface locking state partial sectional view.
Fig. 9 is the schematic diagram of the configuration example for the fastener for showing the clamp for electric plating involved by embodiments of the present invention.
Figure 10 A are to show the fastener of the clamp for electric plating involved by the other embodiment of the present invention to coating member
The partial top view of locking state.
Figure 10 B are to show the fastener of the clamp for electric plating involved by the other embodiment of the present invention to coating member
The partial top view of locking state.
Figure 11 is showing for the structure for the guide member for showing the clamp for electric plating involved by the other embodiment of the present invention
Meaning sectional view and diagrammatic top view.
Specific implementation mode
Hereinafter, with reference to attached drawing, the embodiment of the present invention will be described in detail.Fig. 1 is for using the present invention
The schematic diagram that the summary of the electroplanting device of clamp for electric plating involved by embodiment illustrates.As shown in Figure 1, using this reality
The electroplanting device 1 for applying the clamp for electric plating 10 involved by mode stores electroplate liquid 40 in electroplating bath 30.
Electroplating bath 30 is provided with anode electrode 20, plating folder is picked and placeed relative to the electroplating bath 30 for storing electroplate liquid 40
Tool 10, which maintains as the chip 7 for being plated base material.The anode of DC power supply 50 connects with anode electrode 20
It connects, cathode is connect with clamp for electric plating 10, DC current is supplied, thus in the Surface Creation electroplating film of chip 7.
Fig. 2 is the stereogram for the use state for showing the clamp for electric plating 10 involved by embodiments of the present invention.Such as Fig. 2
Shown, for the clamp for electric plating 10 involved by present embodiment, handle part 11 is held in supply unit (not shown), is moved
To the surface of electroplating bath 30.Then, so that clamp for electric plating 10 is declined in the direction of the arrow, the holding pedestal 12 of chip 7 will be kept
It is impregnated to the electroplate liquid 40 being stored in inside electroplating bath 30, thus executes the electroplating processes to 7 surface of chip.
Electroplating bath 30 is provided with multiple in an electroplanting device 1.Fig. 3 is using the electricity involved by embodiments of the present invention
The side view of the electroplanting device 1 of plating fixture 10.As shown in figure 3, electroplanting device 1 is provided with from multiple from the top of electroplating bath 30
Pick and place the electroplating bath 30 for the clamp for electric plating 10 for maintaining chip 7.
For electroplanting device 1, electroplating bath 30 configures from top in row in column-like manner, and is made of multiple electroplating baths 30
Electroplating bath group is adjacently provided with the rinsing bowl 31 that electroplate liquid is washed off with water and dry slot (not shown).It, will in electroplating processes
It keeps the clamp for electric plating 10 of chip 7 to be impregnated in an electroplating bath 30, is powered the stipulated time, thus executes electroplating processes.It is holding
It went after electroplating processes, clamp for electric plating 10 is lifted and is moved to rinsing bowl 31.In rinsing bowl 31 to the electroplate liquid of attachment
It after being washed, is allowed to move to dry slot, excludes the water droplet for being attached to surface.
Fig. 4 is the stereogram for the structure for showing the clamp for electric plating 10 involved by embodiments of the present invention.Such as Fig. 4 institutes
Show, the clamp for electric plating 10 involved by present embodiment is by above-mentioned handle part 11 and pedestal 12 is kept to constitute, the holding pedestal
12 is plate-like, is formed by electrical insulating materials such as synthetic resin.Keep pedestal 12 be provided with keep Base body 121 and with guarantor
Hold multiple fasteners 122 that Base body 121 is independent and can move.In addition, fastener 122 is (the reference figure of latch for printed circuit 112
Part 8B) refers to the part that reality is engaged with engaged part 132.
In the example in fig. 4, clamp for electric plating 10 is in order to carry disk-shaped chip 7, in keeping Base body 121
Centre part has the workbench 123 of corresponding shape.Multiple fasteners 122 are arranged to surround workbench 123.More specifically,
Multiple fasteners 122 are arranged in the position compared to aftermentioned coating member 13 in the outer part, in the state of maintaining chip 7,
In the case that the object surface T of the plating of chip 7 is arranged along vertical direction, in the object surface of the plating with respect to chip 7
Center the symmetrical position of vertical respectively be configured with 2.
In addition, keeping Base body 121 to be provided with multiple guide members 135, above-mentioned multiple guide members 135 with it is multiple
Fastener 122 corresponds to respectively.Base body 121 is being kept to be formed with circular slot 121a, fastener 122 can be along slot
121a is moved parallel to relative to the face of chip 7.But (face relative to chip 7 is vertical for the thickness direction of fastener 122
Direction) action guided member 135 constrain.Stop part 137 is provided in front of the moving direction of fastener 122, so that
Fastener 122 does not move excessively.
In workbench 123, direction identical with the moving direction of clamp for electric plating 10 to electroplating bath 30 is provided with 2
Arm escape groove 124.Chip 7 is mounted in workbench 123 by the chip supply arm (not shown) moved along arm escape groove 124
On.
Fig. 5 is show structure when the chip 7 of the clamp for electric plating 10 involved by embodiments of the present invention carries vertical
Body figure.As shown in figure 5, disk-shaped chip 7 is equipped on the surface of the workbench 123 of corresponding shape.As described above, chip
7 are mounted in by chip supply arm on workbench 123.
Next, pressing chip 7 using coating member 13.Fig. 6 is the plating shown involved by embodiments of the present invention
The stereogram of structure before being installed with the coating member 13 of fixture 10.As shown in fig. 6, being mounted on workbench 123 from chip 7
Side face it is opposite side covering frame-shaped coating member 13, thus press chip 7.Coating member 13 is by coating member master
Body 131 is constituted with multiple engaged parts 132, and the coating member main body 131 and the outer rim of the object surface T of the plating of chip 7 are supported
Chip 7 is connect and presses, the engaged part 132 is protruded outward from coating member main body 131.In the inner edge of coating member 13
Seal member (not shown) can be provided between portion 131a and chip 7.
Fig. 7 is the structure shown when the coating member 13 of the clamp for electric plating 10 involved by embodiments of the present invention is installed
Stereogram.As shown in fig. 7, coating member 13 to be configured to the inside of multiple fasteners 122, make the inner edge portion of coating member 13
131a is abutted with the outer rim of the object surface T of the plating of chip 7, and chip 7 is thus made to be close to workbench 123.In covering covering part
In the case of part 13, covering is at making engaged part 132 not Chong Die with fastener 122.Specifically, covering is to be locked
Portion 132 enters the recess portion 125 of fastener 122.In addition, coating member 13 is by restriction sites such as positioning pins (not shown), so as to card
Not relative to holding 121 rotational slide of Base body when only.
At the time of covering coating member 13, the face of a side of Base body 121 will be kept (to put down in the face relative to chip 7
Capable face) it is used as reference plane, the bottom surface of the fastener 122 contacted with engaged part 132 to be located at the upper surface than engaged part 132
High position.Fastener 122 can move (moving in rotation) to cover engaged part 132 as a result,.
It will moreover, making engaged part 132 be acted with the locking that fastener 122 engages by moving in rotation fastener 122
It is sealed between the outer rim of chip 7 and the inner edge portion 131a of coating member 13.Fig. 8 A are involved by locking embodiments of the present invention
Clamp for electric plating 10 coating member 13, keep chip 7 when structure stereogram, Fig. 8 B are embodiments of the present invention institutes
The partial sectional view for the clamp for electric plating 10 being related to.As shown in Figure 8A and 8B, pass through the multiple fasteners of movement (rotation) 122
Fastener 122 is covered on engaged part 132, engaged part 132 can be engaged.Thereby, it is possible to chip 7 is clipped in holding
It is kept between pedestal 12 and coating member 13.
As described above, according to the present embodiment, multiple fasteners 122 are moved to engage multiple engaged parts 132, thus
Chip 7 is clipped in and keeps keeping between pedestal 12 and coating member 13, therefore can be directed to each configured with multiple by card
The fine position of stop 132 keeps contact resistance when energization uniform, thus enables that electroplating thickness is uniform to height appropriate.
Furthermore it is preferred that the bottom surface b of fastener 122 or the upper surface u of engaged part 132 are tilted.This is because：Pass through movement
Fastener 122 can change the exposure level of the bottom surface b of fastener 122 and the upper surface u of engaged part 132, can be firmer
Ground engages the engaged part 132 of coating member 13, so as to more reliably keep chip 7.
Fig. 8 C be the fastener 122 for showing the clamp for electric plating 10 involved by embodiments of the present invention bottom surface with by card
The partial sectional view of the locking state of the upper surface of stop 132.In the example of Fig. 8 C, the inclined bottom surface of fastener 122 is shown
The case where being gradually lower on the opposite direction of the moving directions of Cheng Yu fasteners 122.
In this case, as shown in (a) of Fig. 8 C, the high direction engaged part 132 of the height of fastener 122 from bottom surface
It is close.Then, as shown in (b) of Fig. 8 C, the upper surface of engaged part 132 is contacted with the bottom surface of fastener 122, thus limitation card
The movement of stop 122, and by being firmly pressed into, the bottom surface of fastener 122 and the frictional force of the upper surface of engaged part 132 increase
Greatly, engaged part 132 can reliably be engaged.
In addition, in the case where keeping chip 7 or releasing wafer 7, make adjacent fastener 122 as shown in the arrow of Fig. 8 A
It mutually moves round about like that.As a result, compared with the case where being engaged using a rotary part, mobile (rotation)
Power is scattered in multiple fasteners 122, therefore as a whole, can be held by smaller trying hard to keep or releasing wafer 7.In addition, making neighbour
The fastener 122 connect mutually moves round about, it is thus possible to increase the distance between adjacent engaged part 132.Therefore, example
It can such as readily insure that the opening portion M picked and placeed for being sufficient for chip supply arm (not shown) to chip 7 (with reference to Fig. 4).
In the present embodiment, in the state of maintaining chip 7, chip 7 plating object surface along vertical side
In the case of setting, fastener 122 and the configuration of engaged part 132 are at the center of the object surface of the plating by chip 7
Position other than on plumb line, by being open state on the plumb line at the center of the object surface of plating.Fig. 9 is to show the present invention
Embodiment involved by clamp for electric plating 10 fastener 122 configuration example schematic diagram.
As shown in figure 9, the center line in the center O of the workbench 123 by carrying chip 7 (passes through the plating of chip 7
The plumb line at the center of object surface) fastener 122 is not configured on 91.Moreover, matching relative to 91 symmetrical position of center line
Set fastener 122.By configuring like this, chip 7 can be reliably kept, and at the center in the lower direction for keeping pedestal 12
Fastener 122 is not configured on line 91, therefore electroplate liquid is difficult to remain in inside.
Also, Base body 121 is kept to have the multiple stop parts 137 for the movement for limiting multiple fasteners 122 respectively.It is more
A fastener 122 is abutted with stop part 137, is thus configured on the plumb line at the center of the object surface of the plating by chip 7
Position in addition.Specifically, multiple fasteners 122 are abutted in the case where keeping chip 7 with a stop part 137, releasing
It is abutted with other adjacent stop parts 137 in the case of putting chip 7.Thereby, it is possible to be reliably formed open state, electroplate liquid 40
It is difficult to remain in inside, the drag-out of electroplate liquid 40 can be suppressed to minimum limit.
Additionally, it is preferred that the face of a side of Base body 121 will be kept to be set as reference plane S, the upper surface u2 of fastener 122
It sets in the height position below (height) of the upper surface u1 of coating member main body 131.By the way that the setting of fastener 122 is being covered
The height position below of the upper surface of article body 131 can make the agitating paddle being arranged in electroplating bath 30 as possible close to crystalline substance
The object surface T of the plating of piece 7 can fully stir the electroplate liquid 40 near the object surface T of plating.Therefore, it is possible to make plating
Thickness is more evenly distributed.In addition, clamp for electric plating 10 thickness of itself can be thinned, therefore electroplating bath 30 can also be reduced.
Figure 10 A and Figure 10 B are the fasteners for showing the clamp for electric plating 10 involved by the other embodiment of the present invention
The partial top view of the locking state of 122 pairs of coating members 13, Figure 11 are shown involved by the other embodiment of the present invention
The schematic sectional view and diagrammatic top view of the structure of the guide member 135 of clamp for electric plating 10.Such as Figure 10 A and Figure 10 B institutes
Show, the slit 126 of arc-shaped is formed in fastener 122.In addition, as shown in Figure 11 (a), in the slit 126 of fastener 122
It is inserted into the guiding pin 130 taken the lead, guiding pin 130, which is fixed on, keeps Base body 121.Moreover, as shown in Figure 11 (b), fastener
122 move in a rotational direction, thus guiding pin 130 and the end abutment in slit 126 limit the action of fastener 122.
As a result, for example in the state of maintaining chip 7, it is arranged along vertical direction in the object surface of the plating of chip 7
In the case of, fastener 122 and engaged part 132 will not be moved to the lead at the center of the object surface of the plating by chip 7
Position on vertical line, therefore electroplate liquid is difficult to remain in inside, can the drag-out of electroplate liquid be limited to minimum limit.
But guide member 135 is not limited to kept for drawing for the pin hole 127 of Base body 121 by being inserted into be arranged
The case where guide pin 130 is constituted with slit 126, as long as the structure of the movement for the fastener 122 that can be moved can be limited,
It is not particularly limited.
In addition to this, the above embodiment can change without departing from the spirit and scope of the invention certainly.Example
If the configuration of fastener 122 and engaged part 132 is not limited to above-described embodiment, as long as configuration is multiple so as to reliable
Ground keeps chip 7.Therefore, number is also not particularly limited.
Wherein, the reference numerals are as follows：
1：Electroplanting device；7：Chip；10：Clamp for electric plating；12：Keep pedestal；13：Coating member；121：Keep pedestal
Main body；122：Fastener；131：Coating member main body；132：Engaged part；135：Guide member；137：Stop part.
Claims (7)
1. a kind of clamp for electric plating, which is characterized in that
The clamp for electric plating has：
Pedestal is kept, the holding pedestal is with holding Base body and multiple fasteners, the holding Base body and as quilt
The face of one side of the chip of plating substrate abuts, and multiple fasteners and the holding Base body are independent, can be relative to institute
The face for stating chip is moved parallel to；And
Coating member, the coating member have coating member main body and multiple engaged parts, the coating member main body with it is described
The outer rim in the face of another party of chip abuts, and multiple engaged parts are protruded outward from the coating member main body,
Multiple fastener movements are made to engage multiple engaged parts, by the wafer clamp in the holding pedestal and institute
It states and is kept between coating member.
2. clamp for electric plating according to claim 1, which is characterized in that
The holding pedestal also has multiple guide members,
The action in the guide member vertical direction in the face relative to the chip to the fastener respectively constrains.
3. clamp for electric plating according to claim 1 or 2, which is characterized in that
In the state of maintaining the chip, the case where the object surface of the plating of the chip is arranged along vertical direction
Under, plumb line of multiple fastener configurations at the center of the object surface of the plating with respect to the chip is symmetrical
Position,
The case where keeping the chip or in the case of discharging the chip, make the adjacent fastener mutually to opposite
It moves in direction.
4. clamp for electric plating according to claim 1 or 2, which is characterized in that
In the state of maintaining the chip, the case where the object surface of the plating of the chip is arranged along vertical direction
Under, the fastener and the engaged part configure the vertical at the center of the object surface of the plating by the chip
Position other than on line, by being in open state on the plumb line at the center of the object surface of the plating.
5. clamp for electric plating according to claim 4, which is characterized in that
The multiple stop parts for keeping pedestal to have the movement for limiting multiple fasteners respectively,
Multiple fasteners are abutted with the stop part, thus configure the object surface in the plating by the chip
Position other than on the plumb line at center.
6. clamp for electric plating according to claim 1 or 2, which is characterized in that
Using the face of a side of the holding Base body parallel relative to the face of the chip as reference plane, the fastener
It is arranged in the position higher than the engaged part,
The upper surface of the bottom surface of the fastener or the engaged part tilts,
The engaged part is clipped between the holding Base body and the fastener and is locked.
7. clamp for electric plating according to claim 1 or 2, which is characterized in that
Using the face of a side of the holding Base body parallel relative to the face of the chip as reference plane, the fastener
Upper surface be arranged in the height position below of the upper surface of the coating member main body.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014131070 | 2014-06-26 | ||
| JP2014-131070 | 2014-06-26 | ||
| PCT/JP2015/067951 WO2015199047A1 (en) | 2014-06-26 | 2015-06-23 | Plating jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106471162A CN106471162A (en) | 2017-03-01 |
| CN106471162B true CN106471162B (en) | 2018-09-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201580033875.4A Active CN106471162B (en) | 2014-06-26 | 2015-06-23 | Clamp for electric plating |
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| Country | Link |
|---|---|
| JP (2) | JP6315092B2 (en) |
| KR (1) | KR101871624B1 (en) |
| CN (1) | CN106471162B (en) |
| WO (1) | WO2015199047A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435701A (en) * | 2016-12-14 | 2017-02-22 | 陕西宝光真空电器股份有限公司 | Plating hanger with equalizing resistance values |
| CN108022869A (en) * | 2017-12-29 | 2018-05-11 | 上海新阳半导体材料股份有限公司 | Wafer hanger |
| KR102038875B1 (en) * | 2018-02-09 | 2019-10-31 | 코리아테크노주식회사 | Device and method for transporting wafer ring using supporting wafer |
| TWI641079B (en) * | 2018-04-11 | 2018-11-11 | 姜力 | Wafer fixture for electroplating equipment |
| CN110387571B (en) * | 2018-04-17 | 2021-07-30 | 颀中科技（苏州）有限公司 | Wafer clamp for electroplating equipment |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| JP7421302B2 (en) * | 2019-10-07 | 2024-01-24 | 上村工業株式会社 | Holding jig |
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- 2015-06-23 JP JP2016529582A patent/JP6315092B2/en active Active
- 2015-06-23 WO PCT/JP2015/067951 patent/WO2015199047A1/en active Application Filing
- 2015-06-23 KR KR1020167035904A patent/KR101871624B1/en active IP Right Grant
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2018
- 2018-03-27 JP JP2018059538A patent/JP6489259B2/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6489259B2 (en) | 2019-03-27 |
| JP6315092B2 (en) | 2018-04-25 |
| WO2015199047A1 (en) | 2015-12-30 |
| KR20170008299A (en) | 2017-01-23 |
| JP2018090912A (en) | 2018-06-14 |
| JPWO2015199047A1 (en) | 2017-04-27 |
| CN106471162A (en) | 2017-03-01 |
| KR101871624B1 (en) | 2018-06-26 |
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