CN106471162A - Clamp for electric plating - Google Patents
Clamp for electric plating Download PDFInfo
- Publication number
- CN106471162A CN106471162A CN201580033875.4A CN201580033875A CN106471162A CN 106471162 A CN106471162 A CN 106471162A CN 201580033875 A CN201580033875 A CN 201580033875A CN 106471162 A CN106471162 A CN 106471162A
- Authority
- CN
- China
- Prior art keywords
- chip
- clamp
- fastener
- plating
- coating member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
The present invention provide clamp for electric plating, can easily carry out chip pick and place and electroplate liquid is difficult to remain in inside.Clamp for electric plating (10) involved in the present invention possesses：Keep pedestal (12), there is holding Base body (121) and multiple fastener (122), described holding Base body (121) is abutted with the face of the side as the chip (7) being plated base material, multiple described fasteners (122) are independent with holding Base body (121), can be moved parallel to respect to the face of chip (7)；And coating member (13), there are coating member main body (131) and multiple engaged part (132), described coating member main body (131) is abutted with the outer rim in the face of the opposing party of chip (7), and multiple described engaged parts (132) are from coating member main body (131) towards protruding outside.Make multiple fasteners (122) mobile to engage multiple engaged parts (132), chip (7) is clipped between holding pedestal (12) and coating member (13) and is kept.
Description
Technical field
The present invention relates to can easily carry out chip pick and place and be prevented from electroplate liquid remain in inside plating
Use fixture.
Background technology
Copper facing is for example implemented to the surface of the chip using as the substrate installing quasiconductor.Specifically, use in plating
Fixture installs chip, will be provided with the mass-impregnation of the clamp for electric plating of chip in the copper plating bath being stored in electroplating bath, thus
Electroplating processes are carried out to the surface of chip.
For example can keep partly leading between the first holding member and the second holding member patent document 1 discloses that one kind
The semiconductor wafer electroplating clamp of body chip.In patent documentation 1, jut is made by the retainer ring of rotational circle ring-type
(fastener) is engaged with inverted L-shaped pawl (engaged part), is allowed in this condition impregnated in the electroplate liquid in electroplating bath, half-and-half
Conductor chip is electroplated.
Patent documentation 1：Japanese Unexamined Patent Publication 2007-169792 publication
However, retainer ring is in circular, therefore need larger to make fastener engage with engaged part by rotation
Power, there are the problem points being difficult to successfully be dismounted.Further, since being attached with circular, so cannot be according to card
To adjust intrusion during locking, there are the problem points that possibility cracks in semiconductor wafer in stop position.
And, retainer ring is in circular, and therefore electroplate liquid is trapped in the inner side of retainer ring, electroplate liquid to take quantitative change out of many.
Therefore, also there are the problem points that electroplating processes expense may be led to increase.In addition, configuration is fixed on the second holding member
The upper surface of ring, therefore retainer ring becomes big with the distance of the electroplating surface of semiconductor wafer, and the thickness of electroplating clamp becomes big, therefore also
There are the problem points that possibly cannot be sufficiently stirred for electroplate liquid during electroplating processes.In addition, circular retainer ring is arranged on the second guarantor
Holding on part, if therefore also exist not unloading retainer ring and the second holding member both sides when taking out chip, cannot take out
The problem points of chip.
Content of the invention
The present invention completes in light of this situation, its object is to provide and a kind of can easily carry out taking of chip
Put and electroplate liquid is difficult to remain in the clamp for electric plating of inside.
To achieve these goals, clamp for electric plating involved in the present invention is characterised by possessing：Keep pedestal, should
Keep pedestal to have a holding Base body and multiple fastener, described holding Base body with as the chip being plated base material
The face of one side abuts, and multiple described fasteners are independent with this holding Base body, can with respect to the face of above-mentioned chip abreast
Mobile；And coating member, this coating member has coating member main body and a multiple engaged part, described coating member main body with
The outer rim in the face of the opposing party of above-mentioned chip abuts, multiple described engaged parts from this coating member main body towards protruding outside,
Make multiple above-mentioned fasteners mobile engaging multiple above-mentioned engaged parts, by above-mentioned wafer clamp in above-mentioned holding pedestal and above-mentioned
Kept between coating member.
In said structure, make multiple fasteners mobile to engage multiple engaged parts, thus wafer clamp is being kept base
Kept between seat and coating member, therefore, it is possible to be configured with the fine position of multiple engaged parts for each to suitable
Highly, can be with respect to the uniformly applied power of chip it is thus possible to reduce the crackle of chip.In addition, making contact electricity during energising
Resistance uniformly, thus enables that electroplating thickness is uniform.
In addition, clamp for electric plating involved in the present invention is preferred：Above-mentioned holding pedestal also has multiple guide members, and this draws
Row constraint is entered in the action leading part direction vertical with respect to the face of above-mentioned chip to above-mentioned fastener respectively.
In said structure, pedestal is kept also to have multiple guide members, this guide member is relative to fastener respectively
Row constraint is entered in action in the vertical direction in the face of chip, therefore, it is possible to suitably carry out the locking to engaged part for the fastener.
In addition, clamp for electric plating involved in the present invention is preferred：In the state of maintaining above-mentioned chip, in above-mentioned chip
Plating object surface along in the case of vertical setting, multiple above-mentioned fasteners configure with respect to above-mentioned chip
The center of the object surface of above-mentioned plating the symmetrical position of plumb line, in the situation keeping above-mentioned chip or discharge above-mentioned crystalline substance
In the case of piece, adjacent above-mentioned fastener mutually moves round about.
In said structure, the vertical at the center of object surface in the plating with respect to chip for multiple fastener configurations
The symmetrical position of line, in the case of the situation keeping chip or releasing wafer, makes adjacent fastener mutually to phase negative side
To movement.Thus, the power making fastener movement is homogeneously dispersed in multiple fasteners, can be held or be discharged by less trying hard to keep
Chip.In addition, making adjacent fastener mutually move round about, therefore, it is possible to increase between adjacent engaged part away from
From it can be ensured that being sufficient for the peristome picking and placeing to chip for the chip supply arm.
In addition, clamp for electric plating involved in the present invention is preferred：In the state of maintaining above-mentioned chip, in above-mentioned chip
Plating object surface along in the case of vertical setting, above-mentioned fastener and above-mentioned engaged part configure on passing through
Position beyond stating on the plumb line at the center of the object surface of above-mentioned plating of chip, by the center of the object surface of above-mentioned plating
Plumb line on be in open state.
In said structure, in the state of maintaining chip, set along vertical in the object surface of the plating of chip
In the case of putting, fastener and engaged part configuration on the plumb line at the center of the object surface by the plating of chip beyond
Position, by plating object surface center plumb line on be in open state, therefore electroplate liquid is difficult to remain in inside,
The drag-out of electroplate liquid can be suppressed to Min..
In addition, clamp for electric plating involved in the present invention is preferred：Above-mentioned holding pedestal possesses the multiple above-mentioned cards of restriction respectively
Multiple stop parts of the movement of stop, multiple above-mentioned fasteners are abutted with above-mentioned stop part, thus configure by above-mentioned chip
The plumb line at the center of the object surface of above-mentioned plating on beyond position.
In said structure, multiple fasteners are abutted with a stop part in the case of keeping chip, in releasing wafer
In the case of abuts with other adjacent stop parts, therefore, it is possible to be reliably formed open state, electroplate liquid is difficult to remain in interior
The drag-out of electroplate liquid can be suppressed to Min. by portion.
In addition, clamp for electric plating involved in the present invention is preferred：By the above-mentioned holding parallel with respect to the face of above-mentioned chip
As datum level, above-mentioned fastener is arranged on the position higher than above-mentioned engaged part, above-mentioned locking in the face of one side of Base body
The upper surface of the bottom surface in portion or above-mentioned engaged part tilts, and above-mentioned engaged part is clipped in above-mentioned holding Base body and above-mentioned locking
It is locked between portion.
In said structure, using the face of a side of holding Base body parallel for the face with respect to chip as datum level,
Fastener is arranged on the position higher than engaged part, and the upper surface of the bottom surface of fastener or engaged part tilts, and engaged part presss from both sides
Keeping between Base body and fastener being locked.Thereby, it is possible to reliably to be engaged by card by making fastener movement
Stop, can reliably keep chip.
In addition, clamp for electric plating involved in the present invention is preferred：By the above-mentioned holding parallel with respect to the face of above-mentioned chip
As datum level, the upper surface of above-mentioned fastener is arranged on the upper surface of above-mentioned coating member main body in the face of one side of Base body
Height position below.
In said structure, fastener is arranged on the height position below of the upper surface of coating member main body, thus, it is possible to
, close to the object surface of the plating of chip, the object surface that can fully stir plating is attached for the stirring paddle enough making to be arranged in electroplating bath
Near electroplate liquid.
According to said structure, by making multiple fasteners mobile to engage multiple engaged parts, wafer clamp is being kept base
Kept between seat and coating member, therefore, it is possible to be configured with the fine position of multiple engaged parts for each to suitable
Highly, make contact resistance during energising uniform, thus enable that electroplating thickness is uniform.
Brief description
Fig. 1 is for carrying out to the summary of the electroplanting device using the clamp for electric plating involved by embodiments of the present invention
The schematic diagram illustrating.
Fig. 2 is the axonometric chart of the use state illustrating the clamp for electric plating involved by embodiments of the present invention.
Fig. 3 is the side view of the electroplanting device using the clamp for electric plating involved by embodiments of the present invention.
Fig. 4 is the axonometric chart of the structure illustrating the clamp for electric plating involved by embodiments of the present invention.
Fig. 5 is the solid of the structure during wafer-carrying illustrating the clamp for electric plating involved by embodiments of the present invention
Figure.
Fig. 6 be illustrate the coating member of the clamp for electric plating involved by embodiments of the present invention install before structure vertical
Body figure.
Fig. 7 is the vertical of structure when illustrating that the coating member of the clamp for electric plating involved by embodiments of the present invention is installed
Body figure.
Fig. 8 A be illustrate engage embodiments of the present invention involved by the coating member of clamp for electric plating, keep chip when
Structure axonometric chart.
Fig. 8 B is the partial sectional view illustrating the clamp for electric plating involved by embodiments of the present invention.
Fig. 8 C is bottom surface and the engaged part of the fastener illustrating the clamp for electric plating involved by embodiments of the present invention
The locking state of upper surface partial sectional view.
Fig. 9 is the schematic diagram of the configuration example of the fastener illustrating the clamp for electric plating involved by embodiments of the present invention.
Figure 10 A is the fastener of the clamp for electric plating involved by the other embodiment illustrating the present invention to coating member
The partial top view of locking state.
Figure 10 B is the fastener of the clamp for electric plating involved by the other embodiment illustrating the present invention to coating member
The partial top view of locking state.
Figure 11 is showing of the structure of the guide member of the clamp for electric plating involved by the other embodiment illustrating the present invention
Meaning sectional view and diagrammatic top view.
Specific embodiment
Hereinafter, referring to the drawings embodiments of the present invention are described in detail.Fig. 1 is for using the present invention
The schematic diagram that the summary of the electroplanting device of the clamp for electric plating involved by embodiment illustrates.As shown in figure 1, using this reality
The electroplanting device 1 applying the clamp for electric plating 10 involved by mode stores electroplate liquid 40 in electroplating bath 30.
Electroplating bath 30 is provided with anode electrode 20, picks and places plating folder with respect to the electroplating bath 30 storing electroplate liquid 40
Tool 10, this clamp for electric plating 10 maintains as the chip 7 being plated base material.The positive pole of DC source 50 is with anode electrode 20 even
Connect, negative pole is connected with clamp for electric plating 10, supply DC current, thus in the Surface Creation electroplating film of chip 7.
Fig. 2 is the axonometric chart illustrating the use state of clamp for electric plating 10 involved by embodiments of the present invention.As Fig. 2
Shown, for the clamp for electric plating 10 involved by present embodiment, handle part 11 is held in supply unit (not shown), is moved
Surface to electroplating bath 30.Then, so that clamp for electric plating 10 is declined in the direction of the arrow, the holding pedestal 12 of chip 7 will be kept
Impregnate to the electroplate liquid 40 being stored within electroplating bath 30, thus execute the electroplating processes to chip 7 surface.
Electroplating bath 30 is provided with multiple in an electroplanting device 1.Fig. 3 is using the electricity involved by embodiments of the present invention
The plating side view of the electroplanting device 1 of fixture 10.As shown in figure 3, electroplanting device 1 is provided with from multiple tops from electroplating bath 30
Pick and place the electroplating bath 30 of the clamp for electric plating 10 maintaining chip 7.
For electroplanting device 1, electroplating bath 30 is observed from top and is configured in column-like manner in row, and is made up of multiple electroplating baths 30
Electroplating bath group is adjacently provided with the rinsing bowl 31 washing power down plating solution with water and dry slot (not shown).In electroplating processes, will
The clamp for electric plating 10 keeping chip 7 impregnated in an electroplating bath 30, is energized the stipulated time, thus executes electroplating processes.Holding
Went after electroplating processes, clamp for electric plating 10 was lifted and mobile to rinsing bowl 31.In the electroplate liquid to attachment for the rinsing bowl 31
After being washed, it is allowed to move to dry slot, exclusion is attached to the water droplet on surface.
Fig. 4 is the axonometric chart illustrating the structure of clamp for electric plating 10 involved by embodiments of the present invention.As Fig. 4 institute
Show, the clamp for electric plating 10 involved by present embodiment by above-mentioned handle part 11 and keeps pedestal 12 to constitute, described holding pedestal
12 is plate-shaped, is formed by insulating materials such as synthetic resin.Keep pedestal 12 be provided with holding Base body 121 and with guarantor
Hold multiple fasteners 122 that Base body 121 is independent and can move.Additionally, fastener 122 is latch for printed circuit 112 (reference picture
Part 8B), refers to the actual part with engaged part 132 locking.
In the example in fig. 4, clamp for electric plating 10 is to carry discoideus chip 7, in keeping Base body 121
Centre part possesses the workbench 123 of corresponding shape.Multiple fasteners 122 are arranged to surround workbench 123.More specifically,
Multiple fasteners 122 are arranged on the position comparing coating member 13 described later in the outer part, in the state of maintaining chip 7,
In the case that object surface T of the plating of chip 7 is arranged along vertical, in the object surface of the plating with respect to chip 7
The symmetrical position of plumb line at center be respectively configured with 2.
In addition, keeping Base body 121 to be provided with multiple guide members 135, above-mentioned multiple guide members 135 with multiple
Fastener 122 corresponds to respectively.Base body 121 is being kept to be formed with circular groove 121a, fastener 122 can be along groove
121a is moved parallel to respect to the face of chip 7.But, the thickness direction of fastener 122 is (vertical with respect to the face of chip 7
Direction) action guided member 135 constrain.The front of the moving direction of fastener 122 is provided with stop part 137, so that
Fastener 122 is not excessively mobile.
In workbench 123, along with clamp for electric plating 10, the moving direction identical direction of electroplating bath 30 is provided with 2
Arm escape groove 124.Chip 7 is mounted in workbench 123 by the chip supply arm (not shown) along arm escape groove 124 movement
On.
Fig. 5 is the vertical of structure when illustrating that the chip 7 of the clamp for electric plating 10 involved by embodiments of the present invention carries
Body figure.As shown in figure 5, discoideus chip 7 is equipped on the surface of the workbench 123 of corresponding shape.As described above, chip
7 are mounted on workbench 123 by chip supply arm.
Next, pressing chip 7 using coating member 13.Fig. 6 is the plating illustrating involved by embodiments of the present invention
The axonometric chart of the structure before being installed with the coating member 13 of fixture 10.As shown in fig. 6, from being mounted in workbench 123 with chip 7
The contrary side in face of side cover the coating member 13 of frame-shaped, thus press chip 7.Coating member 13 is by coating member master
Body 131 is constituted with multiple engaged parts 132, and the outer rim of described coating member main body 131 and object surface T of the plating of chip 7 is supported
Connect and press chip 7, described engaged part 132 is from coating member main body 131 towards protruding outside.Inner edge in coating member 13
Seal member (not shown) can be provided between portion 131a and chip 7.
Fig. 7 is structure when illustrating that the coating member 13 of the clamp for electric plating 10 involved by embodiments of the present invention is installed
Axonometric chart.As shown in fig. 7, coating member 13 to be configured at the inner side of multiple fasteners 122, make the inner edge portion of coating member 13
131a is abutted with the outer rim of object surface T of the plating of chip 7, so that chip 7 is close to workbench 123.Covering covering part
In the case of part 13, cover into and make engaged part 132 not overlapping with fastener 122.Specifically, cover into and make to be locked
Portion 132 enters the recess 125 of fastener 122.In addition, coating member 13 is by restriction sites such as alignment pins (not shown), to block
Not with respect to holding Base body 121 rotational slide when only.
When covering coating member 13, the face keeping a side of Base body 121 (is put down with respect to the face of chip 7
The face of row) as datum level, the bottom surface of the fastener 122 contacting with engaged part 132 is located at the upper surface than engaged part 132
High position.Thus, fastener 122 can move (in rotary moving) to cover engaged part 132.
And, by fastener 122 in rotary moving make the locking action of engaged part 132 and fastener 122 locking by
Seal between inner edge portion 131a of the outer rim of chip 7 and coating member 13.Fig. 8 A is involved by locking embodiments of the present invention
The coating member 13 of clamp for electric plating 10, keep chip 7 when structure axonometric chart, Fig. 8 B is embodiments of the present invention institute
The partial sectional view of the clamp for electric plating 10 being related to.As shown in Figure 8A and 8B, by the multiple fastener 122 of movement (rotation)
Fastener 122 is covered on engaged part 132, engaged part 132 can be engaged.Thereby, it is possible to chip 7 is clipped in holding
Kept between pedestal 12 and coating member 13.
As described above, according to present embodiment, move multiple fasteners 122 to engage multiple engaged parts 132, thus
By chip 7 be clipped in holding pedestal 12 and coating member 13 between kept, therefore, it is possible to for each be configured with multiple by card
The fine position of stop 132, to suitable height, makes contact resistance during energising uniform, thus enables that electroplating thickness is uniform.
Furthermore it is preferred that the upper surface u of the bottom surface b of fastener 122 or engaged part 132 tilts.This is because：By movement
Fastener 122 can change the exposure level of the bottom surface b of fastener 122 and the upper surface u of engaged part 132, can be firmer
The engaged part 132 of ground locking coating member 13 is such that it is able to more reliably keep chip 7.
Fig. 8 C be illustrate the bottom surface of fastener 122 of the clamp for electric plating 10 involved by embodiments of the present invention with by card
The partial sectional view of the locking state of the upper surface of stop 132.The inclined bottom surface of fastener 122, in the example of Fig. 8 C, is shown
The situation of gradually step-down on the contrary direction of the moving direction of Cheng Yu fastener 122.
In this case, as shown in (a) of Fig. 8 C, the high direction engaged part 132 of the height from bottom surface for the fastener 122
Close.Then, as shown in (b) of Fig. 8 C, the upper surface of engaged part 132 is contacted with the bottom surface of fastener 122, thus limits card
The movement of stop 122, and by being firmly pressed into, the bottom surface of fastener 122 is increased with the frictional force of the upper surface of engaged part 132
Greatly, engaged part 132 can reliably be engaged.
In addition, in the case of keeping chip 7 or releasing wafer 7, making adjacent fastener 122 as shown in the arrow of Fig. 8 A
Mutually move round about like that.Thus, compared with situation about being engaged using a rotary part, mobile (rotation)
Power is scattered in multiple fasteners 122, therefore as overall, can be held or releasing wafer 7 by less trying hard to keep.In addition, making neighbour
The fastener 122 connecing mutually moves round about it is thus possible to increase the distance between adjacent engaged part 132.Therefore, example
If readily insuring that the peristome M (with reference to Fig. 4) picking and placeing being sufficient for chip supply arm (not shown) to chip 7.
In the present embodiment, in the state of maintaining chip 7, chip 7 plating object surface along vertical side
To in the case of setting, fastener 122 and engaged part 132 configure the center of object surface in the plating by chip 7
Position beyond on plumb line, by being open state on the plumb line at the center of the object surface of plating.Fig. 9 is to illustrate the present invention
The configuration example of the fastener 122 of the clamp for electric plating 10 involved by embodiment schematic diagram.
As shown in figure 9, by carry chip 7 workbench 123 center O centrage (by the plating of chip 7
The plumb line at the center of object surface) do not configure fastener 122 on 91.And, join in the position symmetrical with respect to centrage 91 line
Put fastener 122.By configuring like this, can reliably keep chip 7, and the center in the lower direction keeping pedestal 12
Fastener 122 is not configured on line 91, therefore electroplate liquid is difficult to remain in inside.
And, keep Base body 121 to possess multiple stop parts 137 of the movement limiting multiple fasteners 122 respectively.Many
Individual fastener 122 is abutted with stop part 137, thus configures on the plumb line at the center of object surface in the plating by chip 7
Position in addition.Specifically, multiple fasteners 122 are abutted with a stop part 137 in the case of keeping chip 7, are releasing
Abut with other adjacent stop parts 137 in the case of putting chip 7.Thereby, it is possible to be reliably formed open state, electroplate liquid 40
It is difficult to remain in inside, the drag-out of electroplate liquid 40 can be suppressed to Min..
Additionally, it is preferred that using the face of the side keeping Base body 121 as datum level S, the upper surface u2 of fastener 122 sets
Put the height position below (highly) of the upper surface u1 in coating member main body 131.By fastener 122 is arranged on covering
The height position below of the upper surface of article body 131, can make the stirring paddle being arranged in electroplating bath 30 as far as possible close to brilliant
Object surface T of the plating of piece 7, can fully stir the electroplate liquid 40 near object surface T of plating.Therefore, it is possible to make plating
Being more evenly distributed of thickness.In addition, can thinning clamp for electric plating 10 thickness of itself, therefore can also reduce electroplating bath 30.
Figure 10 A and Figure 10 B is the fastener of the clamp for electric plating 10 involved by the other embodiment illustrating the present invention
The partial top view of the locking state of 122 pairs of coating members 13, Figure 11 is involved by the other embodiment illustrating the present invention
The schematic sectional view of the structure of guide member 135 of clamp for electric plating 10 and diagrammatic top view.As Figure 10 A and Figure 10 B institute
Show, be formed with the slit 126 of arc-shaped in fastener 122.In addition, as shown in Figure 11 (a), in the slit 126 of fastener 122
Insert the guiding pin 130 taken the lead, guiding pin 130 is fixed on holding Base body 121.And, such as shown in Figure 11 (b), fastener
122 move in a rotational direction, the end abutment in guiding pin 130 and slit 126, thus limit the action of fastener 122.
Thus, for example, in the state of maintaining chip 7, arrange along vertical in the object surface of the plating of chip 7
In the case of, the lead at the center of object surface to the plating by chip 7 will not be moved in fastener 122 and engaged part 132
Position on vertical line, therefore electroplate liquid are difficult to remain in inside, the drag-out of electroplate liquid can be limited to Min..
But, guide member 135 is not limited to be arranged on the drawing of pin-and-hole 127 keeping Base body 121 by being inserted into
The situation that pilot pin 130 is constituted with slit 126, as long as the structure of the movement of fastener 122 that can move can be limited,
It is not particularly limited.
In addition, above-mentioned embodiment can be changed certainly without departing from the spirit and scope of the invention.Example
Configuration as fastener 122 and engaged part 132 is not limited to above-described embodiment, if configuration multiple so as to reliable
Ground keeps chip 7.Therefore, number is also not particularly limited.
Wherein, description of reference numerals is as follows：
1：Electroplanting device；7：Chip；10：Clamp for electric plating；12：Keep pedestal；13：Coating member；121：Keep pedestal
Main body；122：Fastener；131：Coating member main body；132：Engaged part；135：Guide member；137：Stop part.
Claims (7)
1. a kind of clamp for electric plating it is characterised in that
Described clamp for electric plating possesses：
Keep pedestal, this holding pedestal has a holding Base body and multiple fastener, described holding Base body with as quilt
The face of one side of the chip of plating substrate abuts, and multiple described fasteners are independent with this holding Base body, can be with respect to institute
The face stating chip is moved parallel to；And
Coating member, this coating member has coating member main body and a multiple engaged part, described coating member main body with described
The outer rim in the face of the opposing party of chip abuts, multiple described engaged parts from this coating member main body towards protruding outside,
Make multiple described fasteners mobile to engage multiple described engaged parts, described wafer clamp is kept pedestal and institute described
State and kept between coating member.
2. clamp for electric plating according to claim 1 it is characterised in that
Described holding pedestal also has multiple guide members,
Row constraint is entered in the action in this guide member direction vertical with respect to the face of described chip to described fastener respectively.
3. clamp for electric plating according to claim 1 and 2 it is characterised in that
In the state of maintaining described chip, situation about arranging along vertical in the object surface of the plating of described chip
Under, the plumb line at the center of the object surface of the described plating with respect to described chip for multiple described fastener configurations is symmetrical
Position,
In the situation keeping described chip or in the case of discharging described chip, make adjacent described fastener mutually to contrary
Direction is moved.
4. clamp for electric plating according to any one of claim 1 to 3 it is characterised in that
In the state of maintaining described chip, situation about arranging along vertical in the object surface of the plating of described chip
Under, described fastener and the configuration of the described engaged part vertical at the center of the object surface by the described plating of described chip
Position beyond on line, the plumb line by the center of the object surface of described plating is in open state.
5. clamp for electric plating according to claim 4 it is characterised in that
The described multiple stop parts keeping pedestal to possess the movement limiting multiple described fasteners respectively,
Multiple described fasteners are abutted with described stop part, thus configure in the object surface by the described plating of described chip
Position beyond on the plumb line at center.
6. clamp for electric plating according to any one of claim 1 to 5 it is characterised in that
Using the face of a side of the described holding Base body parallel with respect to the face of described chip as datum level, described fastener
It is arranged on the position higher than described engaged part,
The upper surface of the bottom surface of described fastener or described engaged part tilts,
Described engaged part is clipped between described holding Base body and described fastener and is locked.
7. clamp for electric plating according to any one of claim 1 to 6 it is characterised in that
Using the face of a side of the described holding Base body parallel with respect to the face of described chip as datum level, described fastener
Upper surface be arranged on described coating member main body upper surface height position below.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014131070 | 2014-06-26 | ||
| JP2014-131070 | 2014-06-26 | ||
| PCT/JP2015/067951 WO2015199047A1 (en) | 2014-06-26 | 2015-06-23 | Plating jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106471162A true CN106471162A (en) | 2017-03-01 |
| CN106471162B CN106471162B (en) | 2018-09-25 |
Family
ID=54938129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580033875.4A Active CN106471162B (en) | 2014-06-26 | 2015-06-23 | Clamp for electric plating |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6315092B2 (en) |
| KR (1) | KR101871624B1 (en) |
| CN (1) | CN106471162B (en) |
| WO (1) | WO2015199047A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108022869A (en) * | 2017-12-29 | 2018-05-11 | 上海新阳半导体材料股份有限公司 | Wafer hanger |
| TWI641079B (en) * | 2018-04-11 | 2018-11-11 | 姜力 | Wafer fixture for electroplating equipment |
| CN110387571A (en) * | 2018-04-17 | 2019-10-29 | 姜力 | Wafer jig for electroplating device |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| CN112626592A (en) * | 2019-10-07 | 2021-04-09 | 上村工业株式会社 | Holding jig |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435701A (en) * | 2016-12-14 | 2017-02-22 | 陕西宝光真空电器股份有限公司 | Plating hanger with equalizing resistance values |
| KR102038875B1 (en) * | 2018-02-09 | 2019-10-31 | 코리아테크노주식회사 | Device and method for transporting wafer ring using supporting wafer |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0165860U (en) * | 1987-10-22 | 1989-04-27 | ||
| EP1099781A2 (en) * | 1999-11-12 | 2001-05-16 | Applied Materials, Inc. | Conductive biasing member for metal layering |
| JP2002294495A (en) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | Liquid treatment apparatus |
| CN1509348A (en) * | 2001-04-05 | 2004-06-30 | Workpiece wet processing | |
| CN1550033A (en) * | 2002-06-21 | 2004-11-24 | ������������ʽ���� | Substrate holder and plating apparatus |
| CN1831209A (en) * | 2005-02-25 | 2006-09-13 | 株式会社山本镀金试验器 | Electroplating apparatus |
| JP2007291463A (en) * | 2006-04-26 | 2007-11-08 | Fujikura Ltd | Method and system for plating electronic circuit board |
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| CN102888647A (en) * | 2010-10-21 | 2013-01-23 | 株式会社荏原制作所 | Plating device and plating method |
| CN103225099A (en) * | 2012-01-30 | 2013-07-31 | 株式会社荏原制作所 | Substrate holder and plating apparatus |
| CN103361695A (en) * | 2012-03-27 | 2013-10-23 | 株式会社荏原制作所 | Plating method and apparatus |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4037504B2 (en) * | 1998-01-09 | 2008-01-23 | 株式会社荏原製作所 | Semiconductor wafer plating jig |
| JP2000150421A (en) * | 1998-11-13 | 2000-05-30 | Ebara Corp | Device and method for plating substrate |
| EP2017374A3 (en) * | 2000-03-17 | 2011-04-27 | Ebara Corporation | Plating apparatus and method |
| JP2003171791A (en) * | 2001-12-03 | 2003-06-20 | Hitachi Kyowa Engineering Co Ltd | Automatic plating method, and apparatus thereof |
| JP3778281B2 (en) * | 2002-03-26 | 2006-05-24 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
| JP4162440B2 (en) * | 2002-07-22 | 2008-10-08 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
| JP4463286B2 (en) | 2007-02-05 | 2010-05-19 | 株式会社荏原製作所 | Semiconductor wafer plating jig, jig mounting device, semiconductor wafer plating device |
| US8286929B2 (en) * | 2008-04-01 | 2012-10-16 | Texas Instruments Incorporated | Clam shell two-pin wafer holder for metal plating |
| JP5766048B2 (en) * | 2010-08-19 | 2015-08-19 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
-
2015
- 2015-06-23 JP JP2016529582A patent/JP6315092B2/en active Active
- 2015-06-23 KR KR1020167035904A patent/KR101871624B1/en active IP Right Grant
- 2015-06-23 WO PCT/JP2015/067951 patent/WO2015199047A1/en active Application Filing
- 2015-06-23 CN CN201580033875.4A patent/CN106471162B/en active Active
-
2018
- 2018-03-27 JP JP2018059538A patent/JP6489259B2/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0165860U (en) * | 1987-10-22 | 1989-04-27 | ||
| EP1099781A2 (en) * | 1999-11-12 | 2001-05-16 | Applied Materials, Inc. | Conductive biasing member for metal layering |
| JP2002294495A (en) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | Liquid treatment apparatus |
| CN1509348A (en) * | 2001-04-05 | 2004-06-30 | Workpiece wet processing | |
| CN1550033A (en) * | 2002-06-21 | 2004-11-24 | ������������ʽ���� | Substrate holder and plating apparatus |
| CN1831209A (en) * | 2005-02-25 | 2006-09-13 | 株式会社山本镀金试验器 | Electroplating apparatus |
| JP2007291463A (en) * | 2006-04-26 | 2007-11-08 | Fujikura Ltd | Method and system for plating electronic circuit board |
| US8236151B1 (en) * | 2009-10-30 | 2012-08-07 | Cypress Semiconductor Corporation | Substrate carrier for wet chemical processing |
| CN102888647A (en) * | 2010-10-21 | 2013-01-23 | 株式会社荏原制作所 | Plating device and plating method |
| CN103225099A (en) * | 2012-01-30 | 2013-07-31 | 株式会社荏原制作所 | Substrate holder and plating apparatus |
| CN103361695A (en) * | 2012-03-27 | 2013-10-23 | 株式会社荏原制作所 | Plating method and apparatus |
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108022869A (en) * | 2017-12-29 | 2018-05-11 | 上海新阳半导体材料股份有限公司 | Wafer hanger |
| TWI641079B (en) * | 2018-04-11 | 2018-11-11 | 姜力 | Wafer fixture for electroplating equipment |
| CN110387571A (en) * | 2018-04-17 | 2019-10-29 | 姜力 | Wafer jig for electroplating device |
| CN110387571B (en) * | 2018-04-17 | 2021-07-30 | 颀中科技（苏州）有限公司 | Wafer clamp for electroplating equipment |
| CN110528041A (en) * | 2019-08-13 | 2019-12-03 | 广州兴森快捷电路科技有限公司 | For the electroplating processing method of wafer, wafer and wiring board |
| CN112626592A (en) * | 2019-10-07 | 2021-04-09 | 上村工业株式会社 | Holding jig |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106471162B (en) | 2018-09-25 |
| KR20170008299A (en) | 2017-01-23 |
| WO2015199047A1 (en) | 2015-12-30 |
| KR101871624B1 (en) | 2018-06-26 |
| JP6315092B2 (en) | 2018-04-25 |
| JP6489259B2 (en) | 2019-03-27 |
| JP2018090912A (en) | 2018-06-14 |
| JPWO2015199047A1 (en) | 2017-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106471162A (en) | Clamp for electric plating | |
| US10316425B2 (en) | Substrate holder, plating apparatus, and plating method | |
| US9506162B2 (en) | Electrochemical deposition method | |
| CN106337199B (en) | For reducing the integrated elastomer lip seal and bottom of a cup of chip adhesion | |
| CN205893421U (en) | Chuck assembly and chuck assembly who is arranged in wafer electroplating system | |
| US8864965B2 (en) | Substrate holder and plating apparatus | |
| TWI627312B (en) | Microelectronic substrate electro processing system | |
| KR20140109319A (en) | Plating apparatus | |
| TW201615902A (en) | Substrate holder and plating apparatus | |
| KR20180007664A (en) | Substrate holder and plating apparatus using the same | |
| US9593430B2 (en) | Electrochemical deposition method | |
| US20140251814A1 (en) | Electro-Plating and Apparatus for Performing the Same | |
| CN101372754A (en) | Conducting belt for use with anode holder and anode holder | |
| US6365020B1 (en) | Wafer plating jig | |
| CN106460223B (en) | Electroplanting device | |
| JP6815817B2 (en) | Anode unit and plating equipment equipped with the anode unit | |
| US10954603B2 (en) | Substrate holder, plating apparatus, plating method, and electric contact | |
| TW201604330A (en) | Substrate processing method | |
| JP6204832B2 (en) | Plating apparatus and plating method | |
| JP6216652B2 (en) | Plating apparatus with substrate holder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |