JP4463286B2 - Semiconductor wafer plating jig, jig mounting device, semiconductor wafer plating device - Google Patents

Description

  The present invention relates to a semiconductor wafer plating jig and a semiconductor wafer plating apparatus. The semiconductor wafer plating jig is for holding a semiconductor wafer when the semiconductor wafer is electrolytically plated.

  When electrolytic plating is performed on a semiconductor wafer, the plating jig is configured such that the energizing pins are in contact with the conductive film of the semiconductor wafer while holding the semiconductor wafer. Then, the plating jig holding the semiconductor wafer is immersed in the electrolytic plating solution in the plating tank, and an electrolytic plating is performed by passing an electric current through the plating solution and the energizing pins to the semiconductor wafer.

  In the conventional plating jig, as a method of sealing the energizing pins, a seal packing that extends over both the semiconductor wafer surface and the holding member that holds the semiconductor wafer is used, and the seal packing is tightened with a plurality of bolts. Sealed with evenly applied surface pressure. However, the method of sealing the energizing pins by uniformly applying a surface pressure by tightening with a plurality of bolts is not workable. In addition, since it is difficult to equalize the force applied to each bolt, the electrolytic plating solution may permeate when the force is not uniform.

  Therefore, the first aspect of the present invention has been made in view of the above points, and is a semiconductor wafer that can be easily tightened with seal packing and can uniformly apply a tightening force in the vicinity of the outer periphery of the seal packing. A first object is to provide a plating jig.

  According to the present invention, there is provided a semiconductor wafer plating jig comprising: a first holding member; a second holding member; a fixing ring movable to a fixing position and an open position and having a locking portion. The semiconductor wafer can be detachably held between the first holding member and the second holding member, and either the first holding member or the second holding member can be engaged with the fixing ring. A locking portion that can be detachably locked to the locking portion is provided, and when the fixing ring is in a fixed position, the locking portion of the fixing ring and the locking portion can be engaged and disengaged. The first holding member and the second holding member are fixed by being locked to each other, and when the fixing ring is in the open position, the semiconductor wafer is interposed between the first holding member and the second holding member. Or the semiconductor wafer can be placed on the first So that it can be removed from between the the support member second holding member, the plating jig of the semiconductor wafer fixed in the first holding member and the second holding member is released is provided.

  A jig mounting apparatus for mounting a semiconductor wafer on a semiconductor wafer plating jig according to the present invention, the locking apparatus for removably locking the semiconductor wafer to the plating jig, and the locking apparatus. There is also provided a jig mounting device including a drive shaft that is pivotably supported in a vertically movable manner.

  Furthermore, according to the present invention, the semiconductor wafer can be stored in the plating jig from the wafer cassette storing the semiconductor wafer, and the semiconductor wafer can be stored in the wafer cassette from the plating jig storing the semiconductor wafer. A loading / unloading station capable of immersing the plating jig containing the semiconductor wafer in a plating solution in a plating tank to plate the semiconductor wafer; and the plating jig containing the semiconductor wafer A semiconductor wafer plating apparatus comprising: a transfer device that transfers the substrate between the load / unload station and the plating tank section. It is preferable that the jig mounting device of the present invention is disposed at the load / unload station.

Preferred embodiment

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, a semiconductor wafer plating jig will be described as a reference example of the present invention. 1, 2, 3A and 3B show one embodiment of a semiconductor wafer plating jig of a reference example. 7A, 7B, 8, 9 and 10 show an embodiment of a semiconductor wafer plating jig according to the first aspect of the present invention.

  FIG. 1 is a perspective view showing an external configuration of a semiconductor wafer plating jig of a reference example. As shown in the drawing, the plating jig 10 is a plate-shaped first insulating member 11 made of an electrically insulating material (for example, a synthetic resin material) and a plate-shaped electrically insulating material (for example, a synthetic resin material) provided with an annular seal packing 13. A second holding member 12 made of a resin material, and the second holding member 12 is connected to the first holding member 11 via a hinge mechanism 14. A handle 15 is provided at the end of the first holding member 11 on the side opposite to the hinge mechanism 14.

  The upper surface of the first holding member 11 is formed with a wafer accommodating recess that is substantially the same shape as the semiconductor wafer 16 that accommodates the semiconductor wafer 16, and a plurality of (four in the figure) outer peripheral portions of the wafer accommodating recess. The first current-carrying members 17 are provided at equal intervals and the upper surface thereof is substantially coincident with the upper surface of the first holding member 11. In addition, the second holding member 12 is formed with a hole 12a having an inner diameter slightly smaller than that of the semiconductor wafer 16 at the center, and the annular seal packing 13 is provided on the peripheral edge of the upper surface.

  The seal packing 13 has an inverted U-shaped cross section. One end portion 13 a of the inverted U shape is in contact with the upper surface of the first holding member 11, and the other end portion 13 b is in contact with the surface of the semiconductor wafer 16. It is such a width dimension. Further, the front end of the seal packing 13 protrudes from the upper surface of the second holding member 12 by a predetermined dimension. In addition, a plurality (four in the figure) of energizing member accommodation holes 13c are formed at predetermined intervals so as to fit between the tip end portion 13a and the tip end portion 13b of the seal packing 13, and the energization member accommodation holes 13c will be described later. The 2nd electricity supply member 18 is accommodated.

  In the semiconductor wafer plating jig 10 having the above structure, after the semiconductor wafer 16 is received in the wafer storage recess of the first holding member 11, the second holding member 12 is placed on the first holding member 11 via the hinge mechanism 14. By overlapping, one tip portion 13 a of the seal packing 13 is in contact with the upper surface of the first holding member 11, and the other tip portion 13 b is in contact with the surface of the semiconductor wafer 16, so that the semiconductor is between the first holding member 11. The peripheral edge of the wafer 16 is held and held. Further, the surface of the semiconductor wafer 16 is exposed in the hole 12 a of the second holding member 12.

  FIG. 2 is a view showing the positional relationship between the first energizing member 17 and the seal packing 13 when the second holding member 12 is stacked on the first holding member 11. As shown in the drawing, one tip portion 13 a of the seal packing 13 is in contact with the upper surface of the first holding member 11, and the other tip portion 13 b is in contact with the upper surface of the semiconductor wafer 16. The second energizing member 18 is cylindrical and has a concave groove 18 a formed at the front end surface thereof, and has a reverse U-shaped cross section. One end portion 18 b is a conductive film exposed on the upper surface of the semiconductor wafer 16. It is attached to the second holding member 12 via the spring member 19 so that the other tip end portion 18c is in contact with the upper surface of the first energizing member 17. The first energization member 17 is connected to an external electrode terminal (not shown) through the conductive member 20 penetrating the first holding member 11.

  3A and 3B are views showing a state in which the second holding member 12 is stacked on the first holding member 11. 3A is a front view and FIG. 3B is a side view. As shown in the drawing, the second holding member 12 is stacked on the first holding member 11, and the side opposite to the hinge mechanism 14 is clamped by the clamp 21. As a result, the semiconductor wafer 16 is held between the first holding member 11 and the seal packing 13 as described above, and the conductive member 20 is connected to the semiconductor wafer 16 via the first energizing member 17 and the second energizing member 18. It is surely conducted to the conductive film on the upper surface. Thereby, the conductive film on the upper surface of the semiconductor wafer 16 is connected to the external electrode terminal.

  FIG. 4 is a diagram showing a schematic configuration of an electrolytic plating apparatus using the plating jig 10 having the above structure. In the figure, reference numeral 30 denotes a plating solution tank, and the plating jig 10 holding the anode electrode 31 and the semiconductor wafer 16 is set in the plating solution tank 30. The electrolytic plating solution is sent into the plating solution tank 30 through the pump 35 and the filter 32, and the electrolytic plating solution is overflowed from the plating solution tank 30 and circulated. On the other hand, by connecting a positive terminal and a negative terminal of a DC power source 34 to the anode electrode 31 and the external electrode terminal 33 connected to the conductive member 20 of the plating jig 10 and supplying a DC current, An electrolytic plating film is formed on the surface.

  As described above, the present plating jig attaches the current-carrying member to the first holding member 11 and the second holding member 12 (as the first current-carrying member 17 and the second current-carrying member 18), and attaches the semiconductor wafer to the first holding member 11. Since the conductive member 20 is attached as a recess and wiring for accommodating 16 and the second holding member 12 is provided with only the second energizing member 18 as energizing pins, the mounting operation of the semiconductor wafer 16 is facilitated. Further, the cross section of the second energizing member 18 serving as the energizing pin is formed in an inverted U shape, and is attached to the second holding member via the spring member 19, and the tip of the inverted U shape is connected to the first energizing member 17 and the semiconductor. Since the configuration is such that both the conductive films of the wafer 16 are in contact with each other, for example, as shown in FIG. 5, even when there is a step between the upper surface of the semiconductor wafer 16 and the upper surface of the first current-carrying member 17, the semiconductor wafer 16. It is possible to reliably energize the conductive film.

  FIG. 6 is a view showing an example of the hinge mechanism 14. A hinge joint 14 a is attached to the first holding member 11, and a hinge pin 14 b that engages with the hinge joint 14 a is attached to the second holding member 12.

  In the plating jig 10 having the structure described above, the second energizing member 18 is configured to be attached to the second holding member via the spring member 19, but is not limited to the spring member 19, and may be an elastic member. I just need it.

  7A, 7B, and 8 are perspective views showing the external configuration of the semiconductor wafer plating jig of the present invention. As shown in the figure, the plating jig 110 includes a plate-like first holding member 111, a second holding member 112 to which a ring-shaped seal packing 113 is attached, and a fixing ring (clamping ring) 114. It is a configuration.

  The first holding member 111 is made of an electrically insulating material (for example, a synthetic resin material), and is a rectangular plate-like body as shown in the drawing. A wafer housing recess for housing the semiconductor wafer 116 is formed at the center thereof, and the wafer In the vicinity of the outer periphery of the housing recess, a plurality (eight in the figure) of first energizing members 117 are provided at equal intervals and the upper surface thereof substantially coincides with the upper surface of the first holding member 111. In addition, a plurality (eight in the figure) of inverted L-shaped claws 120 are provided at equal intervals on the outside of the first energization member 117.

  The second holding member 112 is made of an electrically insulating material (for example, a synthetic resin material), and as illustrated, an annular ring portion 112a and a linear support portion 112b are integrally formed. The seal packing 113 is made of an electrically insulating material made of an elastic body such as a rubber material having a reverse U-shaped cross section, and is attached to one surface of the ring portion 112a of the second holding member 112 as shown in the figure. Further, a plurality (eight in the figure) of energizing member accommodating holes 113a are provided at equal intervals between both ends of the seal packing 113 having an inverted U-shaped cross section, and the energizing member accommodating holes 113a will be described later. Thus, the second energizing member 118 is accommodated (see FIG. 7B).

  A plurality (eight in the drawing) of protrusions 114b are formed on the outer periphery of the fixing ring (clamping ring) 114 at a predetermined interval, and a plurality (three in the drawing) of rotation guide grooves at a predetermined interval are formed on the upper surface. 114a is formed. The rotation guide groove 114a is provided on the upper surface of the ring portion 112a of the second holding member 112 at equal intervals, and the ring holding member 119 passes therethrough. Thereby, the fixing ring (clamping ring) 114 can rotate (slide) the upper surface of the second holding member 112. That is, the fixing ring (clamping ring) 114 is guided by a plurality of (three in the figure) ring holding members 119 penetrating the rotation guide groove 114a and can move a predetermined amount on the upper surface of the ring portion 112a. . Further, one end of the support portion 112 b of the second holding member 112 is rotatably connected to the end portion of the first holding member 111 by a hinge mechanism 115.

  In the plating jig 110 having the above-described configuration, the second holding member 112 is rotated via the hinge mechanism 115 and is superposed on the first holding member 11 in which the semiconductor wafer 116 is accommodated in the wafer accommodating recess, and a fixing ring (clamping) By pushing the ring 114 in the direction of arrow A, the fixing ring 114 (clamping ring) 114 is moved by a predetermined amount, and the projection 114b slides inside the inverted L-shaped claw 120 to hold the first holding member 111 and the second holding member. The members 112 are clamped together.

  The second holding member 112 is rotated through the hinge mechanism 115 so as to be superimposed on the first holding member 111 and tightened by a fixing ring (clamping ring) 114, and as shown in FIG. One inverted U-shaped tip portion 13b contacts the upper surface of the edge of the semiconductor wafer housed in the recess of the first holding member 111, and the other tip portion 113c contacts the upper surface of the first holding member 111 outside. Touch.

  The second energizing member 118 is a cylindrical body made of a conductive material, and has a shape in which a groove 118a is provided at the front end thereof to have an inverted U-shaped cross section, and the rear end of the second energizing member 118 via the spring member 121 or the 2 It is attached to the holding member 112. In the state where the second holding member 112 is overlaid on the first holding member 11 as described above, one end portion 18b of the second energizing member 118 contacts the conductive film on the upper surface of the semiconductor wafer 116 as shown in FIG. The other tip 18c is configured to abut against the first energizing member 117. The first energizing member 117 is connected to a conductor 22 that penetrates the inside of the first holding member 111, and the conductor 22 is connected to an external electrode (not shown).

  As described above, the plating jig of this embodiment forms the projections 114b at predetermined intervals on the outer periphery of the fixing ring (clamping ring) 114, and rotates the fixing ring (clamping ring) 114, thereby rotating the first. Since the projection 114b is slid into the inside of the inverted L-shaped claw 120 integrally attached to the holding member 111 and the first holding member 111 and the second holding member 112 are fixed (tightened), the seal A surface pressure is evenly applied to the packing 113 and the sealing performance is improved. The first energizing member 117 is connected to a conductor 22 that penetrates the inside of the first holding member 111, and the conductor 22 is connected to an external electrode (not shown).

  In the embodiment of FIG. 10, in a state where the second holding member 112 is superimposed on the first holding member 111, the one end portion 118 b of the second energizing member 118 is in contact with the conductive film on the upper surface of the semiconductor wafer 116. The other tip 118c is configured to abut on the first energizing member 117.

  However, the first energizing member 117 provided on the first holding member 111 may be removed. As shown in FIG. 11, the energization member 123 is configured to contact only the conductive film on the upper surface of the semiconductor wafer 116, the conductor 122 connected to the external electrode is provided on the second holding member 112, and the conductor 122 is You may make it connect so that it may connect to the electricity supply member 123 via the spring member 121. FIG.

  7A, 7B, 8 and 9 can also be used in the plating apparatus shown in FIG.

  The semiconductor wafer plating jig of the present invention can be suitably used in a semiconductor wafer plating apparatus.

  In a dip type semiconductor plating apparatus, it is necessary to mount a semiconductor wafer on a jig, but this has been done manually. When the wafer size is increased, manual work becomes extremely difficult. Therefore, a fully automatic semiconductor plating apparatus is demanded from an 8-inch compatible plating apparatus. In a semiconductor plating apparatus, a wafer cassette containing a wafer is placed at a predetermined position, and a wafer is automatically plated by simply pressing a start button, and the wafer is stored in the original wafer cassette.

  FIG. 12 and FIG. 13 show an embodiment of a semiconductor plating apparatus in which the semiconductor wafer plating jig of the present invention can be suitably used. In FIG. 12, a semiconductor plating apparatus 200 includes a loading port 201 for loading a wafer cassette containing a semiconductor wafer, a control panel 202 for controlling a load / unload station, a plating tank section, and the like, a signal tower. 203 and an electrical box 204 electrically connected to the control panel 202.

  In FIG. 13, the semiconductor plating apparatus includes a load / unload station 210 and a plating tank 240. In the load / unload station 210, the semiconductor wafer can be taken out from the wafer cassette containing the semiconductor wafer, and can be detachably fixed to the plating jig, and the semiconductor wafer can be removed from the plating jig on which the semiconductor wafer is detachably fixed. Can be taken out and stored in a wafer cassette. By using the plating jig of the present invention, such a load / unload station 210 can be realized. On the other hand, in the plating tank 240, the semiconductor wafer can be plated by immersing a plating jig containing the semiconductor wafer in a plating solution in the plating tank.

  That is, in the third aspect of the present invention, a semiconductor wafer can be stored in a plating jig from a wafer cassette storing a semiconductor wafer, and a semiconductor wafer is stored in a wafer cassette from a plating jig storing a semiconductor wafer. A loading / unloading station capable of performing; a plating tank section capable of plating the semiconductor wafer by immersing the plating jig storing the semiconductor wafer in a plating solution in the plating tank; A plating apparatus is provided.

  The load / unload station 210 may be provided with a table unit 212 on which a wafer cassette containing wafers can be placed, a wafer transfer robot 216, a wafer centering device 218, and a spin drying device 219. The table unit 212 is preferably provided with a sensor device 214 for detecting the presence of a wafer in the wafer cassette. The sensor device has a sensor for detecting the presence or absence of a wafer at a predetermined position inside the wafer cassette, and a drive device for moving the sensor. Typically, the sensor moves up and down. The wafer transfer robot 216 can take out the wafer from the wafer cassette and transfer it to the jig mounting table. The wafer transfer robot 216 can transfer a wafer from a jig mounting table and store it in a wafer cassette. The wafer transfer robot 216 is preferably movable in the rotational direction. The spin drying device 219 can dry the plated semiconductor wafer.

  The load / unload station 210 may include a table 220 on which one or a plurality of wafer attachment / detachment tables 222a and 222b are arranged. Wafer attach / detach tables 222a and 222b can be moved to the positions of wafer attach / detach tables 222b and 222c, respectively. A jig mounting device for mounting the wafer on the jig is disposed on the upper part of the wafer attaching / detaching table 222b. One embodiment of the jig mounting apparatus is described in FIGS. 14A and 14B. The load / unload station 210 is preferably provided with an energization confirmation device (not shown) for confirming whether or not the wafer and the jig are electrically connected.

  The semiconductor plating apparatus 200 may be provided with a jig stocker 230 for housing the jig 232. In the embodiment of FIG. 13, the jig stocker 230 can store two jigs 232 vertically and 13 pieces in each row. The jig stocker 230 preferably has a sensor for determining the presence or absence of a jig.

  A plating tank 250, a water washing tank 260, and a drying tank 270 may be disposed in the plating tank unit 240. The plating tank 250 preferably has a plurality of compartments 252. In each of the compartments, one jig containing one wafer is immersed in a plating solution and plated. In other words, each section is preferably provided with a jig insertion portion, a current supply device to the jig, and an anode. The exposed surface of the anode facing the wafer is preferably concentric with the wafer. About the stirring apparatus 258, you may stir a some division with one stirring apparatus. For example, the stirring rod may be driven in parallel with the wafer surface, for example, the driving rod may be driven in two sections. Further, the moving speed of the stirring rod may be variable.

  In the rinsing tank 260, it is preferable to clean the jig and the wafer plating surface inside the jig since pure water is not flowed from the bottom in the upper flow. Furthermore, it is preferable to provide a quick dump function to enhance the cleaning effect.

  In the drying tank 270, it is preferable to dry the jig taken out from the washing tank 260 and the wafer inside the jig. In the drying tank 270, for example, a gas may be blown into a jig to drop a water droplet.

  Next, the jig is transferred to the jig attachment / detachment tables 222a and 222b, the wafer is taken out of the jig, and the wafer is stored in the wafer cassette.

  The jig can be transported between the load / unload station 210 and the plating tank 240 by the jig transport robot moving on the transport path 280.

  It is preferable to provide a HEPA filter (not shown) on the ceiling of the load / unload station 210 so that clean air flows in a down flow. As a result, the vapor evaporated from the plating tank 250 can be prevented from coming to the load / unload station 210.

  When an abnormality occurs, it is preferable that the semiconductor plating apparatus automatically stops after outputting an alarm signal and displaying an abnormality. However, if the abnormality is mild, it is preferable to continue energization until the end of plating.

  The operation method of the semiconductor wafer plating apparatus is as follows. First, the wafer is taken out from the wafer cassette in which the wafer is stored and mounted on the plating jig. This includes a step of taking out the wafer from the wafer cassette and a step of transporting the jig 232 from the jig stocker 230 to the wafer attaching / detaching table 222b.

  More specifically, the wafer cassette is set at a predetermined position on the load station. When the start button is pressed, a jig transport robot (not shown) takes out the jig 232 from the jig stocker 230 and places it on the wafer attachment / detachment table 222b. On the other hand, the wafer transfer robot 216 takes out the wafer from the wafer cassette and places it on the jig of the wafer removal table 222b.

  Next, the jig mounting apparatus sets the wafer on the jig on the wafer attaching / detaching table 222b. Next, the wafer detachment table 222b on which the jig on which the wafer is mounted is moved to the wafer detachment table 222a. Next, a jig transport robot (not shown) transports the jig on which the wafer on the wafer detachment table 222a is mounted to the section 252 in the plating tank 250 and energizes it for a predetermined time for plating.

  When plating is completed, the jig is transported to the water washing tank 260 by the jig conveying robot, and after being washed with water, gas is blown in the drying tank 270 to take out water droplets.

  Next, the jig is transferred to the jig mounting table by the jig transfer robot, and the wafer is removed from the jig by the jig mounting table. Then, the wafer is transferred to a spin drying tank in the spin dryer 219. On the other hand, the jig is conveyed to the stocker 230 and stored. The wafer is rotated while being rinsed in a spin drying tank, and finally is rotated at a high speed to be dried. The dried wafer is stored in the original wafer cassette, and when all the wafers have been processed, an end buzzer sounds and the apparatus enters a standby state.

  FIG. 14A shows an embodiment of the jig mounting device. The jig mounting device 300 is capable of reciprocating in the axial direction with a driving device (not shown), a rotatable shaft 302, a disk 304 fixed to the shaft 302, and a disk 304. And a disk 306. The disk 306 is provided with a locking device for removably locking the plating jig. In this embodiment, a plurality of pins 310a and 310b are provided as locking devices.

  As shown in FIG. 14B, when the shaft 302 is moved downward by the driving device, the pins 310a and 310b are inserted into the recesses 322a and 322b of the plating jig 320, respectively. When the shaft 302 is rotated clockwise or counterclockwise by a fixed angle by the driving device, the pins 310a and 310b rotate the plating jig 320 by a fixed angle, and the plating jig 320 is moved to the inside thereof. Tighten and fix the semiconductor wafer. Then, the shaft 302 is moved upward by the driving device, and the pins 310a and 310b are removed from the plating jig.

  For example, when the plating jig 320 is in the embodiment of FIG. 8, when the shaft of the jig mounting device 300 moves downward, the pins 310 a and 310 b are inserted into the grooves where the ring holding members 119 are disposed. To be inserted. When the pins 310a and 310b rotate by a certain angle, the pins 310a and 310b rotate the ring holding member 119 to tighten the fixing ring (clamping ring) 114 and fix the semiconductor wafer.

  By reversing this operation, the jig mounting device 300 can be used to rotate the fixing ring (clamping ring) 114 of the plating jig 320 in the opposite direction to open the closed ring 114.

  As described above, according to the present invention, the following excellent effects can be obtained.

  In the reference example, the mounting operation of the semiconductor wafer 16 is facilitated.

  Further, the seal packing has an inverted U-shaped cross section, one of the inverted U-shaped tips is in contact with the surface of the first holding member, the other tip is in contact with the semiconductor wafer surface, A hole for accommodating the second current-carrying member is formed between them, and the second current-carrying member is attached to the second holding member via the elastic member, so that the structure is simple and the current-carrying contact portion is completely sealed with seal packing. Sealed.

  Further, the second energizing member has an inverted U-shaped side surface, and the inverted U-shaped tip is a conductive film exposed to the first energizing member provided on the first holding member and the held semiconductor wafer surface. Since it is set as the structure attached to the 2nd holding member through the elastic body member so that it may straddle, it can energize reliably to the electrically conductive film of a semiconductor wafer.

  In the present invention, since the second holding member is pressed against the first holding member by the fixing ring (tightening ring), the surface pressure is evenly applied to the seal packing and the sealing performance is improved.

  Further, the use of a claw having an inverted L-shaped projection makes the work for sealing extremely easy.

  Further, since the hinge mechanism can be opened and closed around the center, the first holding member and the front second holding member can be easily aligned.

  Furthermore, the fixing ring (clamping ring) can be rotated by a predetermined dimension on the second holding member, so that the positioning of the fixing ring (clamping ring) and the claw is easy and workability is good.

FIG. 1 is a perspective view showing an appearance of a semiconductor wafer plating jig according to an embodiment of a reference example. FIG. 2 is a cross-sectional explanatory view showing the positional relationship between the first energization member and the seal packing when the second holding member of the semiconductor wafer plating jig of one embodiment of the reference example is overlaid on the first holding member. is there. FIG. 3A is a front view of a semiconductor wafer plating jig according to an embodiment of a reference example. FIG. 3B is a side view of a semiconductor wafer plating jig according to an embodiment of a reference example. FIG. 4 is a schematic cross-sectional view of a semiconductor electrolytic plating apparatus according to another embodiment of the reference example. FIG. 5 is a cross-sectional explanatory view showing the positional relationship between the first energizing member and the seal packing when the second holding member of the semiconductor wafer plating jig of another embodiment of the reference example is overlaid on the first holding member. It is. FIG. 6 is a cross-sectional view showing an embodiment of the hinge mechanism. FIG. 7A is a perspective view showing an appearance of a semiconductor wafer plating jig according to another embodiment of the present invention, and is a perspective view showing a state in which a first holding member is opened. FIG. 7B is an enlarged view of a portion B in FIG. 7A. FIG. 8 is a perspective view showing an appearance of a semiconductor wafer plating jig according to another embodiment of the present invention, and is a perspective view showing a state where the first holding member of FIG. 7A is closed. FIG. 9 is a cross-sectional view showing a CC cross section of FIG. FIG. 10 is a cross-sectional view showing one aspect of the positional relationship between the first energization member and the second energization member during fastening and fixing. FIG. 11 is a cross-sectional view showing another aspect of the positional relationship between the energization member and the semiconductor wafer at the time of fastening and fixing. FIG. 12 is a side view showing an embodiment of the semiconductor wafer plating apparatus of the present invention. FIG. 13 is a plan view showing one embodiment of the semiconductor wafer plating apparatus of the present invention. FIG. 14A is a cross-sectional view of one embodiment of the jig mounting device of the present invention. FIG. 14B is a cross-sectional view of one embodiment of the semiconductor wafer plating jig of the present invention.

Claims (6)

A first holding member;
A second holding member;
A fixing ring movable to a fixing position and an open position and having a locking part;
A semiconductor wafer plating jig comprising:
A semiconductor wafer can be detachably held between the first holding member and the second holding member,
Either of the first holding member and the second holding member is provided with a locked portion that can be detachably locked to the locking portion of the fixing ring,
When the fixing ring is in the fixing position, the first holding member and the second holding member are fixed by the locking portion of the fixing ring and the locked portion being detachably locked. And
When the fixing ring is in the open position, the semiconductor wafer can be placed between the first holding member and the second holding member, or the semiconductor wafer can be placed between the first holding member and the first holding member. so that it can be removed from between the second holding member, the first holding member and the second holding plating jig for semiconductor wafer fixing is released members. A semiconductor wafer plating apparatus comprising: a semiconductor wafer plating jig; and a jig mounting device for mounting the semiconductor wafer on the plating jig,
The jig mounting device is
A locking device for detachably locking the semiconductor wafer in the plating jig,
Anda drive shaft vertically movably and rotatably supported to the locking device,
The plating jig is
A first holding member;
A second holding member;
A fixed ring that is movable to a fixed position and an open position, and has a locking portion;
A semiconductor wafer can be detachably held between the first holding member and the second holding member,
Either of the first holding member and the second holding member is provided with a locked portion that can be detachably locked to the locking portion of the fixing ring,
When the fixing ring is in the fixing position, the first holding member and the second holding member are fixed by the locking portion of the fixing ring and the locked portion being detachably locked. And
When the fixing ring is in the open position, the semiconductor wafer can be placed between the first holding member and the second holding member, or the semiconductor wafer can be placed between the first holding member and the first holding member. 2. A plating apparatus for a semiconductor wafer, wherein the first holding member and the second holding member are released so that they can be removed from between the two holding members . The semiconductor wafer from the storage to the wafer cassette is taken out the semiconductor wafer, can be detachably fixed to the plating jig, and takes out the semiconductor wafer from the plating jig detachably fixing the semiconductor wafer, wherein Wafer transfer, which is a load / unload station that can be stored in a wafer cassette, and transfers the semiconductor wafer between the plating jig and the wafer cassette on a jig mounting base in the load / unload station. A loading / unloading station equipped with a device;
Said semiconductor wafer is immersed detachably fixed the plating jig in a plating solution in the plating bath, the plating bath section capable of plating the semiconductor wafer,
A jig transport device for transporting the plating jig on which the semiconductor wafer is detachably fixed between the load / unload station and the plating tank section ;
The plating jig includes first and second holding members that sandwich and hold the semiconductor wafer, the second holding member includes a seal packing, and the first holding member is electrically connected to an external electrode. Members are provided,
The second holding member is provided with a second energizing member that conducts to the conductive film exposed on the surface of the semiconductor wafer to be held and also conducts to the first energizing member, and the seal packing seals the second energizing member from the plating solution. conducting member are sealed, the plating apparatus for a semiconductor wafer. Wherein the loading and unloading station is arranged jig mounting device for mounting the semiconductor wafer to the plating jig, the jig mounting device engaged for detachably engaging the semiconductor wafer in a plating jig The plating apparatus for a semiconductor wafer according to claim 3 , further comprising: a stopping device; and a drive shaft that pivotally supports the locking device so as to be movable up and down .   The plating apparatus for a semiconductor wafer according to claim 3, further comprising a jig stocker capable of accommodating the plating jig from which the plated semiconductor wafer is removed.   The semiconductor wafer plating apparatus according to claim 3, further comprising a cleaning unit that cleans the semiconductor wafer after being removed from the plating jig.

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