TW580745B - Electroplating jig for semiconductor wafers and apparatus for electroplating wafers - Google Patents

Abstract

The purpose of the present invention is to provide a plating jig of a semiconductor wafer, which sandwiches and holds the semiconductor wafer between the first holding member and the sealing gasket of the second holding member. The second holding member is provided with the second energizing member, which comes into contact with both of the first energizing member of the first holding member and the semiconductor, so as to use tight ring to press the second holding member on the first holding member for holding the semiconductor wafer.

Description

580745 V. Description of the invention (l) [Technical field to which the invention belongs] The present invention relates to a plating fixture for a semiconductor wafer and a key device for the semiconductor wafer. The plating fixture for a semiconductor wafer is used to hold the semiconductor wafer when electroplating the semiconductor wafer. [Related technology] When electroplating a semiconductor wafer, the conductive plug is brought into contact with the conductive film of the semiconductor wafer in a state where the semiconductor wafer is held by an electric jig. Then, the electroplating jig is immersed in the electroplating bath's electroplating bath to maintain the state of the semiconductor wafer, and electric current is passed through the electroplating bath and the current-supply plug to the semiconductor wafer to perform electroplating. When performing plating on a semiconductor wafer as described above, the semiconductor wafer is held by a plating jig, and a current-carrying pin is brought into contact with the semiconductor wafer, and a current flows through the current-carrying pin. However, it is not easy to mount the semiconductor wafer with a conventional plating jig. In addition, the first aspect of the present invention in which a conductive pin cannot be brought into contact with a semiconductor wafer to provide a semiconductive wafer with a conductive film is that in view of the problems described above, the mounting of the bulk wafer is easy, and the semiconductor can be reliably energized. The semiconductor wafer plating jig has a first purpose.

π by using forging cooler < sealing pin sealing method On the semiconductor wafer and holding the semiconductor wafer holding member 1 塾, the gasket is screwed with a plurality of bolts to apply 2 = to seal. Seeking the surface pressure j However, the method of applying a uniform surface pressure pin by using a plurality of bolts to screw the screws has poor workability. Because it is not easy to

580745 Description of the invention (2) Five: When the applied force is uneven, the plating solution penetrates. The second aspect of the invention of the sealing heat is to solve the above-mentioned problems in order to provide the counter-screwing force :: The industry is easy to apply the plating fixture of the wafer to the outer periphery of the gasket [summary of the invention]. 2 goals. The second form of the hibiscus of the mat is provided. The first holding member and a sealing member are provided. # A semiconductor wafer is held and held on the semi-conductive circle of the first holding member. At the same time, a round surface is exposed to expose the inner peripheral portion of the gasket, and the first holding member is provided with a first current-carrying structure that is electrically connected to an external electrode. The second holding member is provided in contact with the foregoing. No. 1 ## hibi 祙 > " ^^^, ίΛΛ ^ Wafer plating jigs Semiconductors featuring current-carrying components First pass power generation: Second formation-annular, near the outer periphery of the front wafer In order to distinguish the semiconductor cross section of the first holding member, the cross section of the seal is a reverse U-shape, and it is connected to the surface of a semiconductor wafer at the front end of the first holding member in the reverse shape. "/ The front end of the square is in contact with the aforementioned second current-carrying member, and the current-carrying member accommodating hole is preferably provided between the two ends. The file is captured and installed in the receiving hole of the current-carrying member, and then the second current-carrying member is formed in a reverse shape on the side, which is reversed. $ 5 pages C: \ Program Files \ Patent \ 31062l.ptd 580745

580745

The first current-carrying member is provided at the portion where the first holding member is held, and the outer periphery of the abundant conductor wafer is located near the second holding member to seal the enemy. The first current-carrying member of the holding member and the exposed contact are provided at the first. 1 The second conductive member of the semiconductor wafer electroplating clip with a characteristic is a second aspect of the present invention. To form a raised portion, and the predetermined retaining claw interval of the i-th retaining structure is rotated by a predetermined size so that the raised portion slides into the first retaining member and the second retaining structure = the inside of the preformed claw. It is advisable to have Yu β 筮 1 only branch H to stop it. It is also stated that the first holding member is connected to the second holding device, and the hinge mechanism is centered on the energy: the chain mechanism is connected to-the energy can be tightened by the ring holding member through the ring holding member. The second opening of the present invention is rotated on the second holding member with a predetermined size. The second opening is provided with: the first piece; and the semiconductor wafer which can be moved to a fixed position and an open position, and the piece = the electroplating loss of the semiconductor wafer holding the structural ring. It can be fixed between the first holding member and the former second holding member with eight buckles, and the Fengdao wafer can be detachably held.] The semiconductor can be held in the first holding member and the second The fastening part of the aforementioned fixing ring is self-releasing ", and either one of the components is provided. If the aforementioned fixing ring is in the fixed position, j Tian said the fastening part of the fixing ring

580745

The buckle is fastened to the buckled part, and the holding member and the second holding member are fixed. Σ will be described as the first guarantee. When the fixing ring is in the open position, the " The component and the second holding device are described below. The first holding component and the second holding device a. The semiconductor wafer plating jig is another example. The third aspect of the present invention is an application of any one of the above items. The semiconductor gate is in the third aspect of the present invention, and is provided with a guide that can be implemented: The semiconductor wafer is housed in a power ore jig and is contained by: 容 ίίί: The electric power ore fixture holds the semiconductor wafer in a wafer card. The aforementioned electroplating jig containing the semiconductor wafer is immersed in a plating bath and electroplated. As another embodiment, a semiconductor wafer electroplating apparatus for a plating bath portion that performs plating on a semiconductor wafer is used. [Preferred Embodiment of the Invention] Embodiments of the present invention will be described below with reference to the drawings. FIG. 丨, FIG. 2, FIG. 3A and FIG. 3B show one embodiment of the j-shaped semiconductor wafer electroplating jig of the present invention. Figs. 7A, 7β, 8, 9, and 10 show an embodiment of the semiconductor wafer plating jig of the second aspect of the present invention. Fig. 1 is a perspective view showing the appearance of a semiconductor wafer plating fixture according to an embodiment of the present invention. As shown, the electroplating jig 10 includes:

C: \ ProgramFiles \ Patent \ 310621.ptd Page 8 580745 V. Description of the invention (6) Synthetic resin) 1st holding member 11 and 1 holding hibiscus strain η * 2nd holding member 12 is hinged The mechanism 14 and the first end portion are provided with a ^ ί5 and ^ 1 holding member 11 of the inverse hinge mechanism 14. The side holding member 11 is formed with a wafer accommodating recess on the semiconductor wafer 16 which is approximately the same shape as the semiconductor wafer 16; The crystal will be placed on the upper surface ^ week 0 卩, and a plurality of (4 in the figure) are provided at equal intervals, and the upper surface and the first holding member qΗ are provided. In the second current-carrying member that keeps the hibiscus strains consistent, the center of iU 9, f in f is slightly smaller than that of semiconductor wafer 16

The above-mentioned ring-shaped gasket 13 is provided on the periphery of Jl iil ^ QW.

The cross section of the gasket 13 is formed into an inverse U-shape A and an inverse U-shape. The front end portion 13a of the square is in contact with the second structure, and the front end portion 13b of the square is in contact with the semiconductor crystal member 11, and the other ends are held by the second The member 12 is projected to be j = the pad 13 has a front-end portion 13a and a front-end portion m in which the electro-mechanical component receiving hole 13c receives the German receiving hole 13c. The wafer accommodating recess is accommodating half; at the end of the first holding member! 3b :: = Member: upper surface, and the other side of the leading edge is held between the first holding member 11 and held. = Semiconductor 2.

580745

The surface of the wafer 16 is exposed in the hole 12 a of the second holding member 12. Fig. 2 is a diagram showing a positional relationship between the first current-carrying member 17 and the gasket 13 when the second holding member 12 is superposed on the first holding member. If not, one of the front end portions 13a of the gasket 13 is in contact with the upper surface of the first holding member, and the other front end portion 13b is in contact with the semiconductor wafer 16. : The second current-carrying member 18 is cylindrical, and a concave structure is formed on the front end surface thereof, and the cross-section is reverse U-shaped, and one front end portion 18b is connected to the exposed conductive film on the bulk wafer 16 '. Yet another front end portion 18. The state in contact with the upper surface of the first electric member 17 is attached to the second holder 12 via the spring member 19. The i-th current-carrying member 17 is connected to the external electrode terminal through the i-th holding member 丨, and the electric member 20 is connected to the external electrode terminal (not shown in FIG. 3A and FIG. 3B). State diagram on member 11. Figure 3A is a front view, Figure 36 is a plan view; as shown, the second holding member 12 is superimposed on the first holding member 丨 '", and on the hinge mechanism The side on the opposite side of 14 is held by the clamp 21. As a result, the semiconductor wafer 16 is held by the first holding member 丨 and the seal 1 as described above, and may be interposed between the first current-carrying member 17 and the first 2 The current-carrying member 18 ', piece 20 is indeed in conduction with the conductive film on the semiconductor wafer 16. The conductive film on the body wafer 16 is connected to the external electrode terminal. Figure 4 shows the plating fixture 1 using the above structure 〇A schematic configuration diagram of an electrolytic device. In the figure, 30 is a plating solution tank, and the anode electrode 31 is placed in the 30 and the semiconductor wafer 16 ′ 22 is held. The electrolytic plating solution is passed through a pump 35 and a filter. The electroplating solution is sent into the plating device 32 so that the electrolytic power mineral liquid overflows in the electroplating solution tank 30 Circulation. ^

580745 V. Description of the invention (8) The conductive structure of the anode electrode 31 and the above-mentioned electric mining fixture} 〇: The sub-33 is connected to the + terminal and the one end of the direct-current power supply 34, respectively, so that a current of 2 = k on the surface of the semiconductor wafer 16 An electrolytic plating film is formed. ,,. The straight and first plating jig divides the current-carrying members into the first holding member U and the second holding member 12 (installed as the first current-carrying member 17 and the second current-carrying structure, and the recesses accommodated in the semiconductor wafer 16 and the wiring The guide 20 is mounted on the first holding member, and on the second holding member, only the second current-carrying member 18 is connected to the plug. Therefore, the mounting and operation of the semiconductor wafer 16 is easy. It will also be used as a current-carrying device. The second energized member 18 of the plug is inversely U-shaped, and is mounted on the second holding member via a spring member 19. The inverse u-shaped tip is in contact with the conductive film 17 and the conductive film of the semiconductor wafer η. Both parties therefore "for example," as shown in FIG. 5, even when there is a step between the upper surface of the semiconductor wafer M and the first conductive member 17, the conductive film of the semiconductor wafer can be energized. FIG. 6 shows the hinge mechanism 14 The example diagram is that the hinge head Ha is mounted on the first holding member 11, and the hinge pin Hb that is engaged with the hinge head 14a is mounted on the second holding member 12. In the electroplating jig 10 having the above structure, the second The current-carrying member 18 is attached to the second housing via a spring member 19 The member 12 is not limited to the use of a spring member 19 'As long as it is an elastic member.' FIG. 7A, FIG. 7B, and FIG. 8 are perspective views showing the external configuration of a semiconductor wafer plating jig of the present invention. As shown, the plating jig 110 includes a plate-shaped first holding member 11 1, a second holding member 11 2 with an annular gasket 丨 3, and a tightening ring 11 4. C: \ ProgramFiles \ Patent \ 310621.ptd Page 11 580745 V. Description of the Invention (9) The first retaining member ill is made of an electrically insulating material (eg, synthetic resin) as a rectangular plate-like body as shown in the figure. A wafer accommodating recess for accommodating semiconductors aa circle 1 1 6 is formed at a central portion thereof, and a plurality of (8 in the figure) first energizing members are arranged at equal intervals near the outer periphery of the wafer accommodating recess, and the top and The upper surface of the first holding member 111 is slightly consistent. A plurality of (eight in the figure) inverse L-shaped claws 12 are arranged at regular intervals on the outside of the first conducting member 117. The second holding member 112 is made of electrical It is threatened by an insulating material (eg, synthetic resin), as shown in the figure, with a ring portion 112 & and A linear support portion is formed. The gasket 113 is formed of an elastic electrical insulating material such as an inverted 11-shaped rubber in cross section, and is attached to the ring portion of the second holding member 112 as shown in the figure. A plurality of (8 in the figure) conductive member receiving holes are provided between the two front ends of the section 113 in the shape of an inverse 11 at an equal interval. The second conductive member 118 (see later) is received in the receiving hole 1133 (see二 二 = Circle Π4 The outer periphery forms a plurality of (eight in the figure) ^ bells at a predetermined interval, and a plurality of them are formed on it (3 预定 32143 in the figure) at a predetermined interval. Inside the rotating guide groove U4a, a ring holding member ^ provided on the ring of the retaining member 112 and the equally spaced ring above 2a are penetrated. = This enables the tightening ring m to rotate (slide) on the second holding member 112: that is, the tightening ring 11 4 is a ring holding member that passes through the rotating guide groove i] 4 a of a plurality of boxes-Λ 3) The guidance of 119 makes a large amount of movement on the ring portion 112a. The supporting portion of the second holding member 112 is rotatably connected by the hinge mechanism 115 to the end of the second holding member iu. In the key clamp 11G having the above configuration, the second holding member ιι2 is introduced.

580745 V. Description of the invention (10) · " ----- The first holding member 丨 i which is rotated by the hinge mechanism 115 and overlaps with the above-mentioned wafer accommodating recess 116 for accommodating the semiconductor wafer 116, and The tightening ring 丨〗 4 is pushed in the direction shown by the arrow A, and the tightening ring 114 is moved by a predetermined amount, so that the convex portion u4b slides into the inside of the inverse L-shaped claw 1 2 0, thereby making the first holding member 2i and The second holding members 1 1 2 are tightened to each other. η When the second holding member 112 is rotated through the hinge mechanism 115 to overlap with the first holding member 111 and tightened by the tightening ring 114, the cross section of the gasket 113 is reversed as shown in FIG. 9 One of the front end portions 13b is blocked on the edge of the semiconductor wafer f received in the recessed portion of the first holding member 1 丨, and the other end portion 113c is blocked on the first holding member 丨 1 outside. / The second current-carrying member Π8 is a cylinder made of a conductive material. The front end is formed with a groove portion 11 8 a and the cross-sectional shape is inverse. The rear end is mounted on the gasket 13 through a spring member 121. When the second holding member 112 overlaps the second holding member 112 as described above, as shown in FIG. IM0, the second holding member 112 is in contact with the front end portion ii8b of the second current-carrying member 118 and the conductor. The conductive film on the wafer 116, and the other front end portion 118o: the first conductive member 117 is blocked. The first current-carrying member 117 is connected to a conductor 122 penetrating inside the first holding member 111, and the conductor 122 is connected to an external electrode (not shown). As described above, the plating fixture of this embodiment is formed on the outer periphery of the tightening ring 114 at a predetermined interval to form the convex portions 11 4b, and the rotating tightening ring 1 1 4 slides the convex portions 11 4b into the first holding portion.丨 丨 1 Inverse [character claws 丨 2 〇 The inner side is configured to tighten the first holding member 111 and the second holding member 112, so that an even surface pressure can be applied to the gasket 113 and good sealing performance can be obtained. also

580745

Π 二 = ☆ Conductor 122 penetrating inside the first holding member 111 'The conductive boat 122 is connected to an external electrode guide yio diagram (not shown). In the second embodiment, when the second holding = member m, the second current-carrying member One of the front end portions U8b of the 118 is a conductive film on the + conductor wafer 116, and the other front end 8c is the first current-carrying member 117. It is known that the current-carrying member 117 provided in the first holding member lu may be removed. As shown in FIG. 11, the current-carrying member 123 contacts only the conductive film on the semiconductor wafer 116, and the second holding member 112 may be provided with a conductive body 122 connected to an external electrode, and the conductive body 122 is connected to the current through a spring 21 Component 123. 7A, 7B, 8 and g, the plating jig 110 can also be used in the plating apparatus shown in FIG. 4. The semiconductor wafer key holder of the present invention can be applied to a plating device for a semiconductor wafer. The immersion type semiconductor electroplating device has to mount a semiconductor wafer in a jig. This operation is conventionally performed manually. However, as wafers become larger, the difficulty of manual operations increases significantly. Therefore, automatic plating equipment corresponding to more than 8 pairs of plating equipment is required. Therefore, semiconductor plating equipment The wafer cassette is placed at a predetermined position, and the wafer can be automatically plated by simply pressing the start button, and then the wafers are returned to the original cassette. Figs. 12 and 13 show an embodiment of a semiconductor electroplating apparatus using a plating jig of a semiconductor wafer according to the present invention. The semiconductor plating apparatus 200 in FIG. 12 is provided with a wafer for carrying in a semiconductor wafer.

C: \ Program Files \ Patent \ 310621.ptd Page 14 580745

The round cassette is moved into 201; plate 202; signal tower 203; box 2 04. It is used to control the loading and unloading table, the plating tank part, etc., and the electrical equipment electrically connected to the control panel 202. The semiconductor power mining device shown in FIG. The ground is fixed to the plating clip The wafers can be loaded and unloaded, and the semiconductors can be removed from the fixed electroplating jig. By using the plating fixture of the present invention, the table SB can be unloaded. On the one hand, the electroplating bath 240 can also be immersed in the electroplating bath in the electroplating bath, and the semiconductor wafer can be electroplated. That is, in the third aspect of the present invention, it is possible to provide a semiconductor wafer that can be taken out from a wafer cassette containing semiconductors and wafers and stored in a plating jig. A semiconductor wafer electroplating device for taking out a loading and unloading stage accommodated in a wafer cassette; and a semiconductor wafer plating device capable of dipping the aforementioned plating jig containing semiconductor wafers into a plating bath in a plating bath to plate the semiconductor wafer. The unloading station 210 may be provided with a wafer cassette receiving unit 212, a wafer transfer robot 216, a wafer centering device 218, and a transfer drying device 219 placed on the table portion 212. A sensing device 214 is provided to detect whether the wafer has a wafer core. The sensing device includes a sensor for detecting whether a wafer is present at a predetermined position inside the wafer card E, and a driving device for moving the sensor. Typical sensors can be moved up and down. The wafer transfer robot 216 can remove the wafer from the wafer cassette and transfer it to the jig mounting table. also

580745 V. Description of the invention (13) The wafer can be transported and stored in the wafer cassette by the jig loading table. The wafer transfer robot 216 is preferably capable of operating in a rotation direction. The spin-drying device 219 is used to dry plated semiconductor wafers. The loading and unloading stage 210 may be provided with a stage portion 220 on which one or a plurality of wafer loading and unloading stages 222a and 22 2b are arranged. The wafer loading and unloading tables 222a and 22 2b can be moved to positions of the wafer loading and unloading tables 222b and 222a, respectively. A jig mounting device for mounting a wafer in a jig is arranged on the wafer loading and unloading table 222b. An embodiment of the fixture mounting device is shown in Figs. 14A and 14B. It is preferable to arrange a power-on confirmation device (not shown) for confirming whether the wafer and the jig are electrically connected to the loading / unloading station 210. The semiconductor plating apparatus 200 may be provided with a jig storage rack 230 for storing the jig 232. In the embodiment shown in FIG. 13, two rows in the longitudinal direction are stored in the clamp storage rack 230, and each row includes 13 clamps 232. The central gear storage rack 230 should be provided with a sensor for judging the presence or absence of a fixture. A plating tank 250, a water washing tank 260, and a drying tank 270 may be disposed in the plating tank section 240. The plating tank 250 is preferably provided with a plurality of compartments 252. In each of the compartments, a jig containing one wafer can be immersed in a plating solution and electroplated. That is, it is suitable to have a clamp inserting part, a current supply device for the clamp and an anode in each compartment. The anode exposed surface facing the wafer should be concentric with the wafer. The stirring device 258 may use one stirring device in a plurality of compartments. For example, the stirring rod can be driven parallel to the wafer surface, or the stirring rod can be driven between two compartments. It is also possible to change the moving speed of the stirring rod. Pure water is flowed from bottom to top in the water washing tank 2 60 to clean the jigs and clamps.

C: \ ProgramFiles \ Patent \ 310621.ptd Page 16 580745 V. Description of the Invention (14) ~ It is better to have a wafer plating surface inside. It is advisable to have a quick dumper to improve the cleaning effect. ° Drying tank 270 is used to dry the wafers taken out of the jig and clamp ears taken out from the water washing tank 260. The drying tank 270 may be designed to blow gas into the jig to blow off water droplets. Next, the jig is transferred to the jig loading and unloading tables 222a and 222b, the wafer is taken out by the jig, and the wafer is stored in the wafer cassette. The robot can be transported by a jig to the transport path 280, and the inflammation tool can be moved between the loading station 210 and the plating tank 240. A not-shown HEPA filter is installed on the ceiling portion of the loading and unloading base 210 to blow clean air downward. As a result, the vapor evaporated from the plating tank 250 can leave the loading and unloading station 210. ^ μ When an abnormality occurs, it is advisable for the semiconductor plating device to automatically stop after outputting an alarm signal and displaying an abnormality. Only in the case of minor abnormalities, it is better to apply electricity to the end of the plating operation. ^ The operation method of the semiconductor wafer plating device is as follows: First, the wafer is taken out from the wafer cassette in which the wafer is stored, and assembled in a plating jig. The above process includes a process of taking out a wafer from a wafer cassette, and a process of moving the jig 23 2 from the clamp and storage rack 230 to the wafer loading and unloading station 222 b. In more detail, the wafer cassette is set at a predetermined position on the loading table. After the start button is pressed, a jig transfer robot (not shown) removes the jig 2 32 from the lost tool storage 230 and places it on the wafer loading and unloading table 22 2b. On the one hand, the wafer is transported by the robot 21, and the wafer is taken out by the wafer cassette, and placed on the 9 wafer 222b jigs. i

580745 V. Description of the invention (15) First, the wafer is placed in the jig on the wafer loading and unloading table 222b by a jig loading device. Then, the wafer loading and unloading stage 222b on which the wafer is loaded is moved to the wafer loading and unloading stage 222a. The jig transfer robot (not shown) transfers the wafer-equipped jig on the wafer loading and unloading station 222a to the compartment 2 5 2 in the plating tank 25 again, and conducts electricity for a predetermined time to perform power mining. After the electric transfer is completed, the jig transfer robot transfers the jig to the water washing tank 260, and blows gas in the drying tank 270 after water washing to remove water droplets. The gripper transfer robot transfers the gripper to the gripper mounting table. Remove the jig from the jig with a / say '. The wafer is then transferred to a rotary drying tank in a rotary dryer 219. The jig is transferred to the storage section 230 and stored. The wafer is spin-washed in a spin-drying tank and finally dried at high speed. The dried wafer system is stored in the original wafer cassette, and when all wafer processing is completed, the buzzer is released and the device is in a standby state. FIG. 14A shows an embodiment of the fixture mounting device. The fixture mounting device 300 includes: a driving device (not shown); a shaft portion 302 that can reciprocate in the axial direction and can be rotated; and is fixed to the shaft portion 30. 2 of the disk 3 04; and the disk 3 06 fixed to the disk 3 04. A fastening device capable of attaching and detaching the electric money clips freely is provided on the disc 306. The fastening device in this aspect is a plurality of bolts 3 10a, 316b. ~ As shown in FIG. 14B, when the shaft portion 30 is moved downward by the driving device, the bolts 310a and 310b are inserted into the recesses 322a and 322b of the plating jig 320, respectively. Then, when the driving device rotates the shaft 302 in a clockwise or counterclockwise direction by a certain angle, the bolts 310a, 310b rotate the plating fixture μ 〇 and rotate the fixture 3 20 at a certain angle to tightly fix the internal semiconductor wafer.

580745 V. Description of the invention (16) After the bolt 310 is moved, the shaft portion 302 is moved upward by the driving device 310b and taken out by the plating fixture. When the acoustic key / Λ320 is implemented as shown in FIG. 8, when the fixture is moved, the bolt 3i ° a, 3m is inserted into the groove where the holding member 119 is arranged. Then when the plugs 31a, 31b rotate a certain j x. The ring holding members 119 and 114 are pressed by the pins 31a and 310b to tighten the semiconductor wafer. Tightening the frame for electricity: In the opposite operation, the fixture 300 can be used to mount the device with a 32G clamping ring 114 rotating in the opposite direction to open and close. As mentioned above, according to the present invention, the following excellent effects can be obtained. As easy as the first aspect of the present invention, the mounting industry of semiconductor wafers M can form a reversed "Yinyi®" holding surface of the inverse u-shaped front end, and the other front end is connected to the semiconductor crystal. The through-member is installed in the first electrochemical morning via an elastomer material, and the energized contact portion is completely sealed with a gasket. ▶ The side of the second current-carrying member forms a conductive layer on the side of the first Λ f U sub-type conductor wafer provided on the first holding member, and a half of the conductive film is exposed through the elastic element ^. Semiconductor = the second holding structure of the second holding structure that is pressed against the hairline Λ. It uses a tightening ring to place the second holding member ^ centimeters and the first holding member. Therefore, an equal pressure can be applied to the seal, so that m page 19 C: \ Program Files \ Patent \ 31〇621.ptd 580745 V. Description of the invention (17) The seal is good and the convex part uses an L-shaped claw, so the operation during sealing is extremely easy. Furthermore, since the opening and closing structure centered on the hinge mechanism is used, positioning of the first holding member and the second holding member is facilitated. Since the tightening ring can be rotated on the second holding member by a predetermined size, the tightening ring and the claw can be easily positioned and the workability is good. Brief description of the L plane] An external Γ oblique view is a diagram illustrating a semiconductor wafer power ore clip according to an embodiment of the present invention. The diagram is not a semiconductor wafer electroplating clip according to an embodiment of the present invention. = 2 Explanatory diagram of the positional relationship between the i-th pass and the branch seal when the holding member is superposed on the i-th holding member. The representation of the semi-conductor wafer wafer mining fixture according to one embodiment of the present invention is shown in the table below. The outline of the present invention-the embodiment of the semiconductor wafer electroplating clamp device is shown in the table. Figure 5 of the power plant shows the second holding member of the semi-clamp in another embodiment of the present invention. The second holding member overlaps the position of the first captured copy of the Japan-Japan power plant and the seal. The section J = the first when the member is on the member. Fig. 6 shows a sectional view of an embodiment of the hinge mechanism. FIG. 7A shows another embodiment of the semiconductor wafer key of the present invention. 580745 V. Description of the invention (18) An external oblique view of the jig, and is a table view. /, 笫 1 when the holding member is opened The 7β diagram shows an enlarged view of part B in FIG. 7A. Fig. 8 is a perspective view showing the external appearance of the jig according to another embodiment of the present invention, and is a perspective view showing the closed state of the first round plating. The holding member is closed. Fig. 9 is a cross-sectional view showing the " section in Fig. 8. The first (), expressed in pressing down! Sectional view of one aspect of the current-carrying member and the second relationship. Position of the weighing member Fig. 11 is a sectional view showing another aspect of the energized structure when pressed. Positional diagram of Moribo Yen position Figure 12 shows the side view of the implementation of the semiconductor wafer plating device Figure 13 shows the implementation of the semiconductor wafer money device-flat surface of implementation Sectional view. FIG. 14B shows a cross section of an embodiment of a semiconductor wafer plating jig [simple description of symbols] 10 jig 12 second holding member 13 seal 13c receiving hole 14a hinge joint 11 first holding member 12a hole 1 3 a, 1 3 b front end 14 hinge mechanism 14b hinge bolt C: \ ProgramFiles \ Patent \ 310621.ptd page 21 580745

18a concave structure 19 spring member 21 clamp 31 anode electrode 33 external electrode terminal + 35 pump 111 first holding member 112a ring portion 113 gasket 113b '11 3c front end portion 114a rotary guide groove 115 drum key mechanism 117 first power-on member 118a groove part 119 ring holding member 121 spring member 123 energizing member 201 cassette loading port 203 signal tower 210 loading and unloading table 214 sensing device 218 centering device 16 semiconductor wafer 18 second energizing member 18b, 1 8 c front end portion 20 conductive member 30 Plated roll groove 32 Filter 34 DC power supply 110 Plated jig 112 Second holding member 112b Support 113a Current-carrying mechanism housing 114 Tightening ring 114b Bump 116 Semiconductor wafer 118 Second current-carrying member 118b '118c Front end 120 L Zigzag claw 122 Conductor 200 Plating device 202 Control panel 204 Electrical box 212 Cassette table 216 Wafer handling, machinery 219 Rotary drying device

580745 V. Description of the invention (20) 220 units 222a Wafer loading and unloading station 222b Wafer loading and unloading station 230 Jig storage rack 232 Jig 240 Plating tank part 250 Plating structure 252 Compartment 253 Stirring device 260 Water vapor machine 270 Dryer 280 Transport path 300 Fixture mounting device 302 Shaft 304 Disc 306 Disc 310a Plunger 310b Plunger 320 Plating fixture 322a Recess 322b Recess

C: \ ProgramFiles \ Patent \ 310621.ptd page 23

Claims (1)

0M—MIMO29 —-> Patent application scope A second retaining member provided with a ring-shaped fork seal for electroplating of a semiconductor wafer :, a: a first retaining structure ^ retained at a 2 speed first retaining member and The aforementioned 2 + conductor wafer is held in parallel, so that the inner peripheral portion of the sealing gasket of the Π member is held so that the outer surface of the semiconductor wafer on which the first conductive member is disposed is exposed on the surface ^. The first holding structure is described as an external electrode; nearby. The second holding member is placed in a position, and is connected to the side. The second holding member is provided in respect of the first holding member & 2 conducting member. The holding member 1 holding the semiconductor wafer surface is exposed and the front and f contact seals are The characteristics of the conductive film are as follows: the two parts are as follows: two; guarantee 2. If you apply for a special brake ^ 丁, where the aforementioned ":: 1" of the semiconductor wafer, the cross section of the two gaskets at the front end is Reverse Zhuang Zhuang & electroplating jig, " Ministry touch :; Angle: i the first 1 4 pieces: ΓΓυ between the current on the semiconductor wafer surface, 1 on the other side and the second pass + The component receiving hole is in the energized μ # the two front ends 3. Rushen? Direct electrical components. The rabbit component receiving hole is provided with the main component, which is described in item 1 or 2. The inverse shape of the aforementioned second current-carrying member side Φ is a conductor / circle electric scale loss member and ^ and The first energization across the semiconductor wafer V:;: that is located in the aforementioned ^ th zizi shape and holds the semiconductor body Page 1 llff __ 2003.] 〇〇2 580745 _ Case No. 88108029 Month and Day __ Sixth, the scope of the patent application has a first holding member having a first current-carrying member in communication with an external electrode; and a first holding member having a second current-carrying member and A second holding member provided with a ring-shaped gasket; wherein the semiconductor wafer is detachably held between the first holding member and the second holding member, and the first holding member and the second holding When the semiconductor wafer is held between the sealing members, the surface of the semiconductor wafer held on the inner peripheral surface of the sealing member is exposed, and the contact between the first current-carrying member and the second current-carrying member and the plating solution can be prevented. The second holding member is characterized in that the second conductive member contacts both the first conductive member of the first holding member and the semiconductor wafer. 5. A plating fixture for a semiconductor wafer, which includes a plate-shaped first holding member, a ring-shaped second holding member to which a gasket is mounted, and a tightening ring for interposing the semiconductor wafer in the first holding member. And the gasket of the second holding member, the tightening ring presses the second holding member against the first holding member to hold the semiconductor wafer, and the seal of the second holding member contacts the exposed semiconductor crystal A conductive film having a round surface and a current-carrying member sealed by the gasket is a feature of the conductive film. 6. A plating fixture for a semiconductor wafer, comprising: a plate-shaped first holding member; a ring-shaped second holding member to which a gasket is mounted; and a tightening ring for interposing the semiconductor wafer between the first holding Between the component and the second holding member, the second holding structure is held by the tightening ring. 310621.pic 2003. 1 0. 02. 026 Page 2 580745 PM 88108029 ^ Sixth, the scope of the patent application-rush the piece to the aforementioned first holding member so that the aforementioned first holding member does not merge with the temple + v limb The wafer is provided with a first current-carrying member at a position near the outer periphery of the semiconductor wafer near the aforementioned second holding member so that it is in contact with the second current-carrying member provided at the above-mentioned second carrier. The first conductive member and the exposed sealing member of the second holding member are sealed as the conductive film on both sides, and the two are: if the scope of the patent application is 5 or 6, among them, 'in the aforementioned tightening ring; Bu: ：：： Plating loss of the body wafer =, and the first holding member is provided with a reverse L ::, forming a raised tight ring and rotating to a predetermined size, then the ~ + L sub-shaped claw can be used to shape the aforementioned character The inner side of the claw slides the raised part at the other place into the tightening. The holding member and the second holding member mutually = 1 As described in item 7 of the scope of patent application, the first holding structure 2 = Japanese yen plating It is connected with the mechanism, and can hold the second holding member 弁 v " Shen Jing patent r = ί is described as the key mechanism. It is opened and closed as compared to the item s of the key range of the key Jiaming patent. In the above, the second holding structure guides the Japanese yen and the electroplating clip and can be connected by Λ The Lisher tightening ring is sized by its dimensions. ^ I-ring is in the second holding structure described above], the component]. The semiconductor wafer is known as the m-th holding component and / or the plating loss tool. ·· 第 有 入 月 月 刀 以 于 ## 1 holding member · Fixed ring with fastening portion, 疋 position and open enemy position, and: Among them, it can be in the aforementioned m-th holding member ^ and other 2nd holding member ^ i 062] .pic 2003 ·] 〇. 〇2 · 〇27 580745 _ Case No. 88108029_Yi Nianyue month ___ Six, semiconductor wafers can be freely held between the scope of the patent application, as described above Either the first holding member or the second holding member is provided with a buckled portion that can be loosened from the fixed ring engaging portion, and when the fixed ring is in a fixed position, the fixed ring is fastened by the fixed ring. And the buckled portion are fastened in a detachable manner, so that the first holding member and the front The second holding member is fixed. When the fixing ring is in the open position, the semiconductor wafer can be placed between the first holding member and the second holding member, or the semiconductor wafer can be placed from the first holding member. 1 The method of taking out between the holding member and the second holding member, so as to release the fixing function of the first holding member and the second holding member as its characteristics. 1 1. A plating device for a semiconductor wafer to which the above is applied The semiconductor wafer electroplating jig described in any one of the scope of the patent application is a feature thereof. 1 2. A plating device for a semiconductor wafer, comprising: a wafer cassette capable of accommodating a semiconductor wafer; the semiconductor wafer can be accommodated in a plating jig; and the semiconductor wafer can be accommodated by a plating jig that accommodates the semiconductor wafer. A loading / unloading station accommodated in a wafer cassette; and a plating bath portion in which the aforementioned plating jig for accommodating a semiconductor wafer is immersed in a plating bath, and a plating bath portion for performing a plating operation on the semiconductor wafer is a feature thereof. 1 3. —A plating device for semiconductor wafers, including: loading and unloading station, including: a wafer cassette containing semiconductor wafers, and a wafer handling robot capable of taking wafers out of or containing the wafer cassettes And a fixture mounting device for loading and unloading wafers into the fixture; 310621.pic Page 4 2003. 10.02.028 580745 _ Case No. 88108029_ Dead 4th of February ___ Sixth, the scope of the patent application plating tank section, with plating tank for the above-mentioned inflammation immersion of the wafer In the electric clock liquid, a crystal electric clock is executed, and a jig transfer robot is used to transport the jig containing the wafer between the loading and unloading table and the plating tank portion. 14. The electroplating device according to item 13 of the scope of application for a patent, wherein the loading and unloading table further comprises: a jig mounting table (wafer loading and unloading table) for loading and unloading wafers to and from the jig by the jig mounting device; and A transport robot that is transported to the jig mounting table. 15. The electroplating device according to item 13 or 14 of the scope of patent application, wherein the electroplating tank part further includes a water washing tank and a drying tank. 16. The electroplating device according to item 13 or 14 of the scope of the patent application, wherein the clamp includes: a first holding member, a second holding member provided with a gasket, a current-carrying member, and a tightening ring. A semiconductor wafer is interposed between the first holding member and the second holding member seal, and the second holding member is pressed against the first holding member by the tightening ring, and the semiconductor wafer is fixed and energized. 1 7. A method for electroplating a semiconductor wafer, including the steps of: taking out a wafer from a wafer card containing the wafer, and transferring the wafer to a wafer unloading station by a wafer handling robot; On the round loading and unloading table, the process of mounting wafers in the jig by the jig loading and unloading device; the jig transfer robot transfers the jig containing the wafer to the plating tank, and immerses it in the plating solution to perform the plating process; Transfer robot transfers jigs to wafer loading and unloading 3] 062] .pic Page 5 2003.] 0.02. 029 580745 Amendment No. 88108029 6. Apply for a patent scope, use the above sequence; and make a statement 18: If you apply for a patent plating process and place the above wafer in The process. 19. If the patent application circular loading and unloading table is filled with crystal 0 cards, dry 20 is used. — A semiconductor loading and unloading platform for conductor wafer receiving and plating jigs immersing a semi-plating bath in electroplating; A process in which the loading and unloading device stores the wafers removed from the jig in a wafer cassette. The electroplating method according to item 17 of the scope, wherein the electroplating method for cleaning the water tank and removing the water droplets in the drying tank is provided between the process of transferring the electric jig to the wafer loading and unloading station, and the method of electroplating in the range of 17 or 18 is provided. Among them, between the step of removing the wafer from the jig and the step of storing the wafer, a step of placing the wafer in a rotary drying tank is provided. The wafer electroplating device includes: a semi-capacitor can be contained in a plating jig from a wafer cassette containing a semiconductor wafer, and a wafer cassette can be contained in an electric conductor wafer containing a semiconductor wafer; The semiconductor wafer is electro-delivered to the electroplating solution in the electroplating jig tank containing the semiconductor wafer, and the robot can be placed between the mounting table and the electroplating tank. 1. A plating fixture for a semiconductor wafer, comprising: a first holding member having a semiconductor wafer supporting surface; a ring-shaped second holding member; and a tightening ring which is rotatable relative to the second holding member and 310621.pic — ^ 1 ϋ ^ 'is— 1 Page 6 2003. 10. 02. 030 580745 _ Case No. 88108029 Rev. b / Year_6. Patent application scope The second holding member is pushed toward the first holding member in order to make the semiconductor crystal A circle is held therein; a pad is provided on the second holding member, and when the first holding member and the second holding member hold the semiconductor wafer therein, the pad has a contact surface and can be sealed with the first holding member; A holding member is in contact; and a current-carrying member is provided in the recess of the pad, and is configured to be in contact with the semiconductor wafer when the first holding member and the second holding member hold the semiconductor wafer therein. The conductive film is in contact. 2 2. The electroplating jig for a semiconductor wafer as described in item 21 of the patent application scope, further comprising an elastic member to elastically press the conductive member against the conductive film of the semiconductor wafer. 2 3. The plating holder for a semiconductor wafer according to item 21 of the scope of patent application, wherein the first holding member is plate-shaped. 24. The plating fixture for a semiconductor wafer as described in item 21 of the scope of patent application, wherein the tightening ring has a plurality of raised portions formed therein, and the raised portions are arranged at specific intervals. And the first holding member includes a plurality of inverse L-shaped claws, the plurality of protrusions slide into the plurality of inverse L-shaped claws so that the first holding member is rotated when the tightening ring rotates a specific angle It is tightened together with the second holding member. 2 5. The electroplating jig for a semiconductor wafer according to item 21 of the scope of patent application, further comprising a hinge mechanism to connect the first holding member and the second holding member, the first holding member and the second holding member. Component can 310621.pic Page 7 2003.10.02. 031 580745 _ Case No. 88108029_ ^ year / 〇 On the date of the month __ VI. Scope of patent application Pivot around the chain mechanism. 2 6. The electroplating jig for a semiconductor wafer as described in item 21 of the scope of patent application, further comprising a fixing ring, the second holding member and the tightening ring are connected by the fixing ring, and the fixing ring can pass through A specific angle is rotated on the second holding member. 2 7. A plating fixture for a semiconductor wafer, comprising: a first holding member, which is plate-shaped; a ring-shaped second holding member, including a pad mounted thereon; and a tightening ring, which can A second holding member is pressed against the first holding member to hold the semiconductor wafer therein, the semiconductor wafer having an outer periphery; the first holding member includes a first current-carrying member, and the first current-carrying member is held adjacently to The semiconductor wafer between the first holding member and the second holding member is arranged on the outer periphery; the pad of the second holding member includes a second current-carrying member, and when the semiconductor wafer is held on the first holding member and the second holding member When the holding members are sealed by the gasket, the second current-carrying member is disposed in contact with the first current-carrying member and the conductive film of the semiconductor wafer. 2 8. The plating fixture for a semiconductor wafer as described in item 27 of the scope of patent application, wherein the tightening ring has a plurality of raised portions formed therein, and the raised portions are arranged at specific intervals. And the first holding member includes a plurality of inverse L-shaped claws, and the plurality of protrusions slide into the plurality of inverse L-shaped claws so that when the tightening ring rotates a specific angle, 310621.pic Page 8 2003. 1 0.02.032 ^^ 18108029 6. The scope of the patent application The first holding member and 29. If the scope of the patent application, the two holding members are connected, around the hinge mechanism pivot 30. If the scope of the patent application * 'wherein, the complex includes two retaining members connected around the hinge mechanism pivot 3 1 · as claimed in the scope of the patent ^ where the complex includes the members and the tightening ring connected to the second retaining member on the 32. The scope of the patent application includes 'compounding including tight ring connection' for rotation on the fixing member. 33. A type used for electroplating system. Preparation: T-shaped insulating member, a ring-shaped pad, a contact surface of which is at least a part of a conductive contact surface of the semiconductor; Said member_half is to hold the holding member to half to hold the holding member to half by the fixing ring, and to hold the first specified angle second to the hinge mechanism described in item 28, the first rotation. 2 The 7th hinge mechanism The first guarantee. 30 Fixing ring as described in Item 0, then, this fixed rotation. The fixation ring described in item 7 is a ring that can pass through the semiconductor wafer. It defines a centrally placed contact with the ring-shaped semiconductor wafer; the component is tightened as a correction. The first holding member and the second and second holding members of the electroplating clip of the conductive wafer can be the first holding member and the second and second holding members of the electroplating clip of the conductive wafer. Hold the electric iron clip on the Yanhai conductor wafer through a specific angle ^ The second holding member and the plating fixture of the second holding structure on the second holding structure are attached to the edge member, and define the cathode, and define the word police __ Gas 310621.pic «9 pages 2003.10.02 580745 case number 88108029 p year ~ month previous date amendment 3] 0621.pic Page 10 2003. 10. 02. 034 580745 _ Case No. 88108029 Λ year ~ month of work day _ ^ VI. Application for a patent, wherein the sheet-shaped holding member includes an insulating material. 4 3. A plating fixture for a semiconductor wafer in a plating system, comprising: a ring-shaped insulating member defining a central opening; a ring-shaped gasket provided on the ring-shaped insulating member and defining a A contact surface to be in contact with the semiconductor wafer; and at least one current-carrying member serving as a cathode and defining a portion of the contact surface; wherein the at least one current-carrying member is connected to a connection member provided through the annular insulating member , And this connector can be connected to an external electrode. 4 4. The electroplating clamp for a semiconductor wafer as described in item 43 of the patent application scope, wherein the ring-shaped insulating member includes an insulating material. 45. The semiconductor wafer electroplating clamp according to item 44 of the patent application scope, wherein the insulating material includes a synthetic resin. 46. The semiconductor wafer electroplating clamp as described in item 43 of the patent application scope, wherein the ring-shaped gasket is removable. 47. The plating fixture for a semiconductor wafer as described in item 43 of the patent application scope, wherein the ring-shaped gasket includes an elastic material. 48. The plating fixture for a semiconductor wafer as described in item 43 of the scope of patent application, wherein the at least one current-carrying member is connected to an external electrode. 49. The plating fixture for a semiconductor wafer as described in item 43 of the patent application scope, wherein the ring-shaped gasket and the at least one current-carrying member include an integral part. 310621.pic page] 1 page 2003. 10. 02. 035 580745 _ case number 88108029 _ production "year / 〇 月 ι _ charm_ VI. Application scope of patent 50. As described in item 43 of the scope of patent application A plating fixture for a semiconductor wafer, further comprising a sheet-like holding member to hold the semiconductor wafer together with the ring-shaped insulating member. 51. The plating fixture for a semiconductor wafer as described in claim 50 of the scope of patent application, wherein the sheet-shaped holding member includes an insulating material. 5 2. —A plating fixture for a semiconductor wafer in an electroplating system, comprising: a ring-shaped insulating member defining a central opening; a ring-shaped gasket provided on the ring-shaped insulating member and defining a A contact surface to be in contact with the semiconductor wafer; and a plurality of current-carrying members provided in the ring-shaped insulating member, each of the current-carrying members having an interior that is in contact with the semiconductor wafer and serves as a cathode, and can be electrically connected to the outside by contact The electrodes are external to the current-carrying member. 53. The electroplating clamp for a semiconductor wafer according to item 52 of the scope of the patent application, wherein the current-carrying member includes one or more connectors having a plurality of holes. 54. The electroplating clamp for a semiconductor wafer according to item 52 of the scope of patent application, wherein the ring-shaped insulating member includes an insulating material. 5 5. The semiconductor wafer electroplating clamp as described in item 54 of the scope of patent application, wherein the insulating material includes a synthetic resin. 56. The semiconductor wafer plating fixture as described in item 52 of the scope of patent application, wherein the ring-shaped gasket is removable. 57. Electroplating clips for semiconductor wafers as described in item 52 of the scope of patent application 31062] .pic Page 12 2003. 10.02.036 580745 Case No. 88108029 / October 2 Amendment 6. Scope of patent application, wherein the ring-shaped gasket includes an elastic material. 58. The plating fixture for a semiconductor wafer as described in item 52 of the scope of the patent application, wherein the ring-shaped gasket and the current-carrying member include an integral part. 59. The plating fixture for a semiconductor wafer according to item 52 of the scope of patent application, further comprising a sheet-shaped holding member for holding the semiconductor wafer together with the ring-shaped insulating member. 60. The plating fixture for a semiconductor wafer according to item 59 of the patent application scope, wherein the sheet-shaped holding member includes an insulating material. 6 1. The electroplating clamp for a semiconductor wafer according to item 52 of the scope of the patent application, wherein the current-carrying member is provided on the sheet-shaped holding member. 6 2. An electroplating system for electroplating a semiconductor wafer, comprising: an electroplating tank containing a plating solution; an anode disposed in the electroplating tank; and a plating fixture for a semiconductor wafer for holding a semiconductor A wafer so that the semiconductor wafer faces the anode, the plating fixture of the semiconductor wafer includes: a ring-shaped insulating member defining a central opening; a ring-shaped gasket provided on the ring-shaped insulating member, and A contact surface is defined to be in contact with the semiconductor wafer; and at least one current-carrying member is used as a cathode and defines a portion of the contact surface; wherein the ring-shaped gasket has an inner portion and an outer portion, and the inner portion A component is compatible with the at least one energized member. 31062] .pic Page 13 2003. 10.02.037 580745 _ Case No. 88108029_ Household "Month Office & Month> Day _ ^ _ VI. Within the scope of patent application, the outer part is compatible with the at least one power-on Beyond components. 63. The electroplating system for a semiconductor wafer according to item 62 of the scope of the patent application, wherein the at least one current-carrying member includes one or more connectors having a plurality of holes. 64. The electroplating system for a semiconductor wafer according to item 62 of the scope of patent application, wherein the ring-shaped insulating member includes an insulating material. 65. The electroplating system for a semiconductor wafer as described in item 64 of the patent application scope, wherein the insulating material includes a synthetic resin. 6 6. The plating system for a semiconductor wafer as described in item 62 of the scope of patent application, wherein the ring-shaped gasket is removable. 67. The plating system for a semiconductor wafer as described in item 62 of the patent application scope, wherein the ring-shaped gasket includes an elastic material. 68. The electroplating system for a semiconductor wafer according to item 62 of the scope of patent application, wherein the at least one current-carrying member is connected to an external electrode. 69. The electroplating system for a semiconductor wafer according to item 62 of the scope of the patent application, wherein the ring-shaped gasket and the at least one current-carrying member include an integral part. 70. The plating system for a semiconductor wafer as described in item 62 of the patent application scope, further comprising a sheet-shaped holding member for holding the semiconductor wafer together with the ring-shaped insulating member. 7 1. The plating system for a semiconductor wafer as described in item 70 of the scope of patent application, wherein the sheet-shaped holding member includes an insulating material. 7 2. —A plating system for plating semiconductor wafers, which has: 3] 0621.pic Page M 2003.10.02. 038 580745 _ Case No. 88108029 L Year / October > Day Amendment_ VI. Patent application scope Electroplating bath, which contains electroplating solution; anode, which is set in the electroplating bath And a plating fixture for a semiconductor wafer for holding the semiconductor wafer so that the semiconductor wafer faces the anode, the plating fixture for the semiconductor wafer includes: a ring-shaped insulating member defining a central opening; a ring A gasket, which is disposed on the ring-shaped insulating member and defines a contact surface to be in contact with the semiconductor wafer; and a plurality of current-carrying members, which are provided in the ring-shaped insulating member, each of which has a connection with the The semiconductor wafer is in contact with and serves as the inside of the cathode and the outside of a current-carrying member that can be electrically connected to an external electrode ^ 7 3. The plating system for a semiconductor wafer as described in item 72 of the patent application scope, wherein the current-carrying member Includes one or more connectors with a plurality of holes. 74. The electroplating system for a semiconductor wafer according to item 72 of the scope of patent application, wherein the ring-shaped insulating member includes an insulating material. 75. The plating system for a semiconductor wafer as described in item 74 of the scope of patent application, wherein the insulating material includes a synthetic resin. 76. The plating system for a semiconductor wafer ′ according to item 72 of the scope of the patent application, wherein the ring-shaped gasket is removable. 77. The electroplating system for a semiconductor wafer according to item 72 of the scope of patent application, wherein the ring-shaped gasket includes an elastic material. 7 8. The key system of the semiconductor wafer as described in item 72 of the scope of patent application 31062] .pic Page 15 2003.] 0.02. 039 580745 _ Case No. 88108029 ^ 1st of the year amended _ Sixth, the scope of patent application, wherein the ring gasket and the current-carrying member include an integral part. 79. The plating system for a semiconductor wafer as described in item 72 of the patent application scope, further comprising a sheet-shaped holding member for holding the semiconductor wafer together with the ring-shaped insulating member. 80. The plating system for a semiconductor wafer according to item 79 of the scope of the patent application, wherein the sheet-shaped holding member includes an insulating material. 8 1. The electroplating system for a semiconductor wafer as described in item 72 of the scope of patent application, wherein the current-carrying member is provided on the sheet-shaped holding member. 1¾ 3] 〇621.ptc Page 16 2003. 10.02. 040