JP2020084215A - Substrate holder and plating apparatus - Google Patents

Abstract

To solve at least one of the following problems: a lot of trouble is caused when a substrate is mounted on a conventional substrate holder; and a conventional substrate holder can have a different axial force of each of a plurality of bolts.SOLUTION: A substrate holder comprises a base plate and a cover plate. The cover plate comprises a pin, an inner seal, and an outer seal. The base plate includes a through hole. The substrate holder also has a lever. The lever, which includes a shaft and a mountain-shaped portion, is tiltable between a holding position and a release position.SELECTED DRAWING: Figure 2B

Description

The present invention relates to a substrate holder and a plating device.

Plating is known as one of semiconductor processing processes. Generally, the substrate to be plated is held by the substrate holder. Patent Document 1 discloses a substrate holder (in the terminology of the document, “plating jig”) including a base member and a cover member. In Patent Document 1, a substrate (in the terminology of the document, a “body to be plated”) is sandwiched between a base member and a cover member via a seal. The cover member is fixed to the base member by a plurality of bolts.

JP 2006-16649 A

It is an object of the present application to provide at least one of a substrate holder and a plating device.

The present application is, as one embodiment, a substrate holder comprising a base plate and a cover plate for supporting a substrate between the base plate, the cover plate comprising pins extending toward the base plate and a substrate to be held. An inner seal that contacts with an outer seal that contacts the base plate, the base plate has a through hole for the pin, the substrate holder further has a lever, and the lever maintains the sealing pressure of the inner seal and the outer seal. The lever is tiltable between a holding position where the lever pulls the pin and a release position where the seal pressure is released, and the lever is a shaft around which the lever is tilted and protrudes from the through hole. A lever that is configured to contact the base plate by being located between the shaft and the base plate when the lever is in the holding position. Disclosed is a substrate holder that includes a ridge for holding the in a holding position.

It is a top view of a plating apparatus. It is a front view of a plating apparatus. It is a top view of a substrate holder. It is an exploded sectional view of a substrate holder. It is an exploded perspective view showing a substrate holder in detail. FIG. 4 is an exploded cross-sectional view around a pin of the substrate holder. It is a figure showing a plurality of levers connected by one lever connection plate. FIG. 5B is a cross-sectional view of FIG. 5A at the position of the mountain portion. FIG. 5B is a cross-sectional view of FIG. 5A at the position of the mountain portion. FIG. 5C is the same as FIG. 5B except for some symbols. FIG. 9 is a cross-sectional view of the substrate holder when the lever is in the release position. FIG. 9 is a cross-sectional view of the substrate holder when the lever is at the holding position. It is a perspective view of a holder rotating part. It is sectional drawing of a holder box. It is a front view of the holder rotation part periphery of a plating device.

FIG. 1 is a schematic diagram of a plating apparatus 100 according to an embodiment. FIG. 1A is a top view of the plating apparatus 100. FIG. 1B is a front view of the plating apparatus 100. The plating apparatus 100 is an apparatus for plating the substrate W. The substrate W is held by the substrate holder 110. Details of the substrate holder 110 will be described later. Also, for convenience of illustration, the load port 151 and door 152 are not shown in FIG. 1A. Similarly, for convenience of illustration, window 153 is not shown in FIG. 1B.

The plating apparatus 100 includes a plating unit 120 for plating the substrate W held by the substrate holder 110. The plating unit 120 includes one or more processing baths. At least one of the one or more processing baths is a plating bath. The plating unit 120 of FIG. 1 includes six treatment tanks, that is, a pre-water washing layer 121, a pre-treatment layer 122, a first rinse tank 123, a plating tank 124, a second rinse tank 125 and a blow tank 126. The plating tank 124 may include a paddle (not shown) for stirring the plating solution and a mechanism (not shown) for driving the paddle. The plating apparatus 100 pre-washes the substrate W with the pre-washing layer 121, pre-treats the substrate W with the pre-treatment layer 122, rinses the substrate W with the first rinse bath 123, and plating the substrate W with the plating bath 124. The plating process of the substrate W is executed by the procedure of rinsing the substrate W by the rinsing bath 125 and blowing (drying) the substrate W by the blowing bath 126. However, the number of processing tanks is not limited to six. A person skilled in the art may appropriately determine the number, type and arrangement of treatment tanks, the order of treatments and the like.

The plating apparatus 100 further includes a transporter 130. The transporter 130 conveys the upright substrate holder 110. The transporter 130 includes a transporter arm 131 for suspending the substrate holder 110, a vertical movement mechanism 132 for vertically moving the transporter arm 131, and a transporter arm 131 and a vertical movement mechanism 132 arranged along the processing tank. And a horizontal moving mechanism 133 for moving horizontally. However, the configuration of the transporter 130 is not limited to the illustrated configuration. The specific configuration of the transporter 130 may be appropriately determined by those skilled in the art. The transporter 130 is configured to be accessible to each processing tank. The transporter 130 is configured so that it can also access a holder rotating unit 140 described later.

As will be described later, the substrate holder 110 is placed horizontally (sideways) on the table 160. On the other hand, each processing tank such as the pre-water washing layer 121 and the transporter 130 are configured to receive the upright (vertical) substrate holder 110. Therefore, when the substrate holder 110 is transferred from the table 160 to the transporter 130, the substrate holder 110 needs to be upright. Conversely, when the substrate holder 110 is transferred from the transporter 130 to the table 160, the substrate holder 110 must be horizontal. To meet this demand, the plating apparatus 100 includes a holder rotating unit 140. The holder rotating unit 140 can receive the substrate holder 110 placed on the table 160 and can erect the substrate holder 110. The holder rotating unit 140 can also make the upright substrate holder 110 horizontal. Details of the holder rotating unit 140 will be described later.

The plating apparatus 100 may include a housing 150. The housing 150 covers the plating part 120, the transporter 130, and the holder rotating part 140. However, the plating part 120, the transporter 130 and/or the holder rotating part 140 may be partially positioned outside the housing 150. The housing 150 protects each component of the plating apparatus 100. In addition, the housing 150 can prevent the liquid used by the plating apparatus 100 and the gas vaporized by the liquid from going out of the housing 150. The housing 150 may include an intake/exhaust mechanism, for example. The housing 150 may include a load port 151 for loading the substrate holder 110 into the housing 150. The load port 151 may include a door 152. The “door” mentioned here refers to a “member capable of opening and closing the load port 151”. Therefore, the "door" includes, for example, a shutter. The housing 150 may further include a window 153 that allows an operator to access the holder rotator 140. The window 153 may include a door (not shown). The specific shape and the like of the housing 150 may be appropriately determined by those skilled in the art. For example, the door 152 may be arranged between the holder rotating unit 140 and the plating unit 120.

The plating apparatus 100 further includes a table 160. The table 160 is arranged adjacent to the holder rotating unit 140. The load port 151 is located between the holder rotating unit 140 and the table 160. The table 160 is provided for attaching the substrate W to the substrate holder 110 and removing the substrate W from the substrate holder 110. The substrate holder 110 is placed horizontally on the table 160. The substrate holder 110 is placed on the table 160 with the base plate 200 (described below) facing downwards to allow attachment and detachment of the substrate W. Specifically, the table 160 includes a protrusion 161. The substrate holder 110 is placed on the protrusion 161. The protrusion 161 is configured so as not to interfere with the pin 214 of the substrate holder 110, the lever 220, and the lever connecting plate 310 (if any) which will be described later. The protrusion 161 may be integrally formed with the table 160, or may be a component separate from the table 160. Details of the protrusion 161 will be described later.

The possibility that liquid has adhered to the substrate W and the substrate holder 110 after plating is not zero. There is also a demand for cleaning the substrate W and/or the substrate holder 110 immediately before or after the plating process. To meet the above requirements, the table 160 preferably includes a rim 162 (also referred to as a lip). Due to the rim 162, the upper surface of the table 160 has a tray shape. Thus, in the preferred form, the table 160 is capable of receiving a quantity of liquid. The table 160 may further include a drain line (not shown) for discharging the received liquid. The rim 162 may be integrally formed with the table 160, or may be a separate component from the table 160. In addition or as an alternative to rim 162, table 160 may include a cover (not shown). The table 160 may further include a cleaning liquid supply mechanism for cleaning the substrate W and/or the substrate holder 110, for example, a shower head (not shown).

FIG. 2 is a schematic diagram of the substrate holder 110 according to the embodiment. FIG. 2A is a top view of the substrate holder 110. FIG. 2B is an exploded sectional view of the substrate holder 110. FIG. 3 is an exploded perspective view showing the substrate holder 110 according to one embodiment in detail. The substrate holder 110 includes a base plate 200 and a cover plate 210. The base plate 200 is a member for placing the substrate. The cover plate 210 is a member for supporting the substrate W with the base plate 200. In other words, the substrate W is sandwiched between the base plate 200 and the cover plate 210. There may be some member between the base plate 200 and the substrate W and/or between the cover plate 210 and the substrate W.

The base plate 200 includes a holder arm 201. The holder arm 201 suspends the substrate holder 110 from the transporter arm 131. Further, the holder arm 201 allows the substrate holder 110 to be received by a holder receiver (not shown) of each processing tank of the plating unit 120. An electrode 202 is provided on the holder arm 201. The electrode 202 is electrically connected to the bus bar 300 (see FIG. 3). The end of the bus bar 300 may be the electrode 202. When the substrate W is held by the substrate holder 110, the bus bar 300 is electrically connected to the substrate W via contact elements 403 (described later). Therefore, the electrode 202 is electrically connected to the substrate W. The electrode 202, bus bar 300 and contact element 403 are collectively referred to as the "conductive path for supplying current to the surface of the substrate". However, the current may be supplied by a conductive path having another configuration. In FIGS. 2 and 3, the electrode 202 is provided on one shoulder of the holder arm 201. However, the electrodes 202 may be provided on each of the two shoulders of the holder arm 201. The base plate 200 further has a through hole 203 for a pin 214 described below.

An opening 211 is formed in the center of the cover plate 210. One surface of the substrate W is exposed to the outside through the opening 211. The specific shape and arrangement of the openings 211 are determined by the shape of the substrate W and the specific specifications of the plating process. In the illustrated example, the substrate W has a rectangular shape. Therefore, the opening 211 is also rectangular. An inner seal 212 and an outer seal 213 are provided between the base plate 200 and the cover plate 210. Specifically, the inner seal 212 and the outer seal 213 are attached to the cover plate 210. The outer seal 213 may be attached to the base plate 200. The inner seal 212 is arranged in the vicinity of the opening 211 and is configured to come into contact with the substrate W. The outer seal 213 is arranged outside the inner seal 212 and is configured to come into contact with the base plate 200.

The inner seal 212 and the outer seal 213 seal the area between the seals. Therefore, the bus bar 300 and the like can be arranged between the inner seal 212 and the outer seal 213. Further, the substrate W is held by the sealing pressure of the inner seal 212.

In order to keep the sealing pressure of the inner seal 212 and the outer seal 213 appropriate, it is necessary to apply a force to the cover plate 210 in the direction toward the base plate 200. In order to meet this requirement, the substrate holder 110 according to the embodiment includes a pin 214 and a lever 220. Specifically, the pin 214 is attached to the cover plate 210. The pin 214 extends toward the base plate 200. The pin 214 passes through the through hole 203 and projects from the through hole 203. The pin 214 is engageable with the lever 220. Specifically, the pin 214 can be engaged with the shaft 500 described below. For example, the pin 214 has a cutout 215 for hooking the shaft 500. “Cutout” is a term for explaining the shape. Therefore, the means for forming the cutout 215 is not limited to cutting. Further, the cutout 215 is merely an example, and the pin 214 and the shaft 500 may be engageable by other methods.

The lever 220 is configured to be tiltable between a holding position and a release position. The holding position is a position where the lever 220 pulls the pin 214 so that the sealing pressure of the inner seal 212 and the outer seal 213 is maintained. The release position is a position where the seal pressure of the inner seal 212 and the outer seal 213 is released. The lever 220 is configured to be engageable with the pin 214. When the pin 214 is pulled by the lever 220, the cover plate 210 receives a force in the direction toward the base plate 200. Ignoring bending, wear, thermal expansion, etc. of the parts, the length that the pin 214 is pulled depends largely on the shape of the pin 214 and the lever 220. Therefore, by adopting the pin 214 and the lever 220, it becomes possible to uniformly compress the inner seal 212 and the outer seal 213. Further, tilting the lever 220 is easier than fastening a plurality of bolts. Hereinafter, the lever 220 will be described as being configured such that the position of the lever 220 when the lever 220 is tilted is the holding position. Further, in the following description, the lever 220 is configured so that the position of the lever 220 when the lever 220 is upright is the release position. However, the holding position and the releasing position may be other positions. For example, the lever 220 may be configured such that the position when the lever 220 is upright is the release position and the position when the lever 220 is tilted is the holding position.

The shapes and the numbers of the through holes 203 and the levers 220 correspond to the shapes and the numbers of the pins 214. The substrate holder 110 typically includes a plurality of pins 214, a plurality of through holes 203, and a plurality of levers 220. One lever 220 and another lever 220 may be connected by a lever connecting plate 310 so that the plurality of levers 220 can be tilted at once.

Details of the pin 214 will be described with reference to FIG. FIG. 4 is an exploded sectional view around the pin 214 of the substrate holder 110. The pin base 400 is attached to the back surface of the cover plate 210 by a fixture (not shown). However, the surface of the cover plate 210 exposed to the outside is the front surface of the cover plate 210, and the surface facing the base plate 200 is the back surface of the cover plate 210. A thread is provided at one end of the pin 214. The pin 214 is fixed to the pin base 400 with a bolt 401. By using the pin base 400, the bolt 401 and the like are not exposed to the outside. The pin base 400 further has a function of holding the inner seal 212 and the outer seal 213 in cooperation with the cover plate 210. However, the pin 214 may be fixed by another method. For example, the pin 214 may be directly attached to the cover plate 210. The pin 214 may be integrally formed with the cover plate 210.

A gap may occur between the pin 214 and the through hole 203. The gap may be sealed by a seal. In this specification, a seal provided to seal the gap between the pin 214 and the through hole 203 is referred to as a “pin seal 402”. In the preferred embodiment, the inner seal 212, the outer seal 213, and the pin seal 402 protect the bus bar 300 and the like.

The cover plate 210 further comprises contact elements 403. The contact element 403 is located in the area sealed by each seal. The contact element 403 is configured to electrically connect the bus bar 300 and the substrate W. The contact element 403 may be leaf spring-shaped, for example.

The cutout 215 is provided near the tip of the pin 214. For example, the cutout 215 is formed such that the tip of the pin 214 has a hook shape. A shaft 500 (described later) of the lever 220 is hooked on the cutout 215. Since the tip of the pin 214 has a hook shape, the shaft 500 can be prevented from falling off the cutout 215.

Next, details of the lever 220 will be described with reference to FIG. FIG. 5A is a diagram showing a plurality of (four in the figure) levers 220 connected by one lever connecting plate 310. 5B is a cross-sectional view of FIG. 5A at the position of the ridges 510. FIG. 5C is the same as FIG. 5B except for some symbols.

The lever 220 includes a shaft 500. The shaft 500 is provided near the end of the lever 220. The shaft 500 becomes the center of tilting of the lever 220. The shaft 500 can be engaged with a pin 214 protruding from the through hole 203. For example, as described above, the shaft 500 is hooked on the cutout 215. The lever connection plate 310 further extends from the tip of the lever 220. Lever 220 pulls pin 214, thereby compressing inner seal 212, outer seal 213 and pin seal 402 (if any). Therefore, the lever 220 or the lever connecting plate 310 has a sufficient length to compress each seal. The sufficiently long lever 220 or lever connecting plate 310 acts as a lever, allowing the operator to easily compress each seal. The specific length of the lever 220 or the lever connecting plate 310 may be determined by the weight of each component, the required compression length of each seal, the reaction force generated by each seal, and the like.

When the protrusion 161 does not exist or the protrusion length of the protrusion 161 is insufficient, the lever 220 and the lever connection plate 310 may interfere with the table 160. The protrusion 161 is configured so that the lever 220 and the lever connection plate 310 (if any) and the table 160 do not interfere (see also FIGS. 1 and 9). By preventing the interference between the components, the lever 220 of the substrate holder 110 mounted on the protrusion 161 can be tilted and made to stand upright.

Of the lever 220, a chamfered protrusion is provided on the surface facing the base plate 200 when the lever 220 is in the holding position (when it is tilted in this example). Hereinafter, the chamfered protrusion is referred to as "mountain-shaped portion 510". The crests 510 are located between the shaft 500 and the base plate 200 and contact the base plate 200 when the lever 220 is in the holding position. The tip of the mountain portion 510 is formed on a plane. In one embodiment, the plane is orthogonal to the extension direction of the pin 214 engaging the lever 220 when the lever 220 is in the holding position. The edges of the plane prevent the lever 220 from unintentionally moving to the release position. In other words, the chevron 510 keeps the position of the lever 220 in the holding position. Reference numeral “S1” in FIG. 5C is a surface facing the base plate 200 when the lever 220 is at the release position. Reference numeral “S3” is a flat surface formed at the tip of the mountain portion 510. Reference numeral "S2" is a surface generated by chamfering the mountain-shaped portion 510, and is a surface between S1 and S3. The symbol "C1" is the corner between S1 and S2. The symbol "C2" is the corner between S2 and S3. Reference symbol L1 in FIG. 5B is the distance between the shaft 500 (more precisely, the central axis of the shaft 500) and S2. Reference symbol L2 is the distance between the shaft 500 and C2. Reference symbol L3 is the distance between the shaft 500 and S3.

S1 is away from the base plate 200 when the lever 220 is in the released position. S2 faces the base plate 200 while the lever 220 is moving to the holding position (while the lever 220 is being tilted in this example). Preferably, S2 contacts base plate 200. In one embodiment, lever 220 is configured such that when S2 is in contact with base plate 200, the inner seal 212 and outer seal 213 seal pressures are substantially zero. Then, when the lever 220 moves to the holding position (in this example, the lever 220 is completely tilted), S3 comes into contact with the base plate 200. In the holding position, the lever 220 needs to pull the pin 214 so that the sealing pressure of the inner seal 212 and the outer seal 213 is maintained. Therefore, the lever 220 is designed so that L3 is larger than L1. The specific difference between L1 and L3 may be, for example, 0.1 mm or more and 2 mm or less. The above numerical values are merely examples, and the difference between the distance L1 and the distance L3 may be determined based on the compression length required for the inner seal 212 and the outer seal 213. The compression length required for the pin seal 402 may be further considered in determining the difference between the distance L1 and the distance L3. Further, since the mountain-shaped portion 510 is chamfered, L2 naturally becomes longer than L3. Therefore, the lever 220 in the holding position is prevented from unintentionally moving to the release position.

The operation of the lever 220 will be described with reference to FIG. FIG. 6A is a cross-sectional view of the substrate holder 110 when the lever 220 is in the release position (the lever 220 is upright in this example). FIG. 6B is a cross-sectional view of the substrate holder 110 when the lever 220 is in the holding position (the lever 220 is tilted in this example). See FIG. 4 for parts not labeled in FIG. For convenience of illustration, the opening 211 and the inner seal 212 are not shown in FIG.

When the lever 220 is in the release position as in FIG. 6A, the inner seal 212 and the outer seal 213 are not compressed (however, the inner seal 212 and the outer seal 213 may be compressed by the weight of the members or the like). When the lever 220 is in the holding position as in FIG. 6B, the lever 220 pulls the pin 214. When the pin 214 is pulled, the entire cover plate 210 is also pulled. As a result, the seal pressure of the inner seal 212 and the outer seal 213 is generated, and the seal pressure is maintained.

Next, details of the holder rotating portion 140 will be described with reference to FIGS. 7, 8 and 9. FIG. 7 is a perspective view of the holder rotating unit 140. FIG. 8 is a sectional view of the holder box 700. FIG. 9 is a front view of the periphery of the holder rotating unit 140 of the plating apparatus 100. The holder rotating unit 140 includes a holder box 700 and a pillar 710. The holder rotating unit 140 may further include a linear guide 720. The holder box 700 is a box-shaped member for housing the substrate holder 110. The holder box 700 and the pillar 710 are connected by a rotary shaft 711. The holder box 700 is rotatably supported by the pillar 710 and the rotating shaft 711. The direction of the rotation axis of the holder box 700 is the longitudinal direction of the holder arm 201. Preferably, the rotary shaft 711 is positioned so as to coincide with the center of gravity of the holder box 700 when the substrate holder 110 is housed.

The linear guide 720 guides the horizontal movement of the pillar 710. The pillar 710 has a first position where it can receive the substrate holder 110 from the transporter 130 and can transfer the substrate holder 110 to the transporter 130, and receives the substrate holder from the table 160 and the substrate holder 110 to the table 160. It is moveable between and to a second position where it can be handed over (see also Figure 1). The holder box 700 can be erected in the first position. Further, the holder box 700 can be made horizontal in the second position. The linear guide 720 allows the substrate holder 110 to be delivered even if the table 160 and the transporter 130 are separated. Holder box 700 and pillar 710 may be moved and rotated by an operator. The operator can access the holder box 700 and the pillar 710 through the window 153. The holder box 700 and the pillar 710 may be moved and rotated by a motor or the like. If the first position and the second position are the same position, the linear guide 720 is unnecessary.

A holder receiver 800 is provided inside the holder box 700 (FIG. 8). The holder receiver 800 guides insertion and removal of the substrate holder 110. The holder receiver 800 further receives the substrate holder 110 within the holder box 700.

The holder rotating unit 140 and the table 160 are configured such that the height of the holder box 700 when the holder box 700 is horizontally oriented is substantially the same as the height of the substrate holder 110 placed on the protrusion 161. (See FIG. 9). More specifically, the holder rotating unit 140 and the table 160 are configured such that the height of the holder receiver 800 is substantially the same as the height of the substrate holder 110 placed on the protrusion 161. According to the above configuration, it is easy to insert the substrate holder 110 into the holder box 700 and take out the substrate holder 100 from the holder box 700. In the illustrated example, the substrate holder 110 is placed on the table 160 (to be precise, on the protrusion 161 of the table 160) with the opening 211 facing upward (see FIGS. 1 and 2). However, the substrate holder 110 may be placed on the table 160 or the protrusion 161 so that the opening 211 faces downward.

In this embodiment, the pin 214 is provided on the back surface of the cover plate 210 having the opening 211. The pins 214 extend toward the back side of the substrate holder 110, that is, toward the base plate 200. Further, in the present embodiment, the lever 220 for pulling the pin 214 is arranged on the back side of the base plate 200. Therefore, the surface of the cover plate 210 of this embodiment has a flat surface. The flat surface of the cover plate 210 can improve the performance of plating, especially the uniformity of plating. However, the lever 220 may be arranged on the front side of the cover plate 210 having the opening 211. Further, the opening 211 may be provided in both the cover plate 210 and the base plate 200.

Although some embodiments of the present invention have been described above, the embodiments of the present invention described above are intended to facilitate understanding of the present invention, and do not limit the present invention. The present invention can be modified and improved without departing from the spirit of the invention, and it goes without saying that the present invention includes equivalents thereof. Further, in a range in which at least a part of the problems described above can be solved, or in a range in which at least a part of the effect is achieved, any combination of the constituent elements described in the claims and the specification, or omission is possible. Is.

For example, the specific configuration of the plating apparatus 100 may be appropriately determined. The plating apparatus 100 may include two holder rotating parts 140 and two transporters 130 corresponding to the two holder rotating parts 140, respectively. The plating apparatus 100 may include one transporter 130 that can access two or more holder rotating units 140. The plating apparatus 100 may include two or more tables 160. One table 160 may have two or more protrusions 161.

The present application is, as one embodiment, a substrate holder comprising a base plate and a cover plate for supporting a substrate between the base plate, the cover plate comprising pins extending toward the base plate and a substrate to be held. An inner seal that contacts with an outer seal that contacts the base plate, the base plate has a through hole for the pin, the substrate holder further has a lever, and the lever maintains the sealing pressure of the inner seal and the outer seal. The lever is tiltable between a holding position where the lever pulls the pin and a release position where the seal pressure is released, and the lever is a shaft around which the lever is tilted and protrudes from the through hole. A lever that is configured to contact the base plate by being located between the shaft and the base plate when the lever is in the holding position. Disclosed is a substrate holder that includes a ridge for holding the in a holding position.

This substrate holder has the effect of enabling uniform compression of the seal as an example. Moreover, the lever allows the operator to easily attach the substrate to the substrate holder.

Further, the present application discloses, as an embodiment, a substrate holder in which the tip of the mountain portion is a plane, and the plane is orthogonal to the extending direction of the pin engaging with the lever when the lever is in the holding position. To do. As an example, the substrate holder has an effect of preventing the lever from being abruptly raised.

Further, the present application discloses, as an embodiment, a substrate holder including a pin seal for sealing a gap between a pin and a through hole. The disclosure reveals details of the substrate holder.

Further, the present application discloses, as an embodiment, a substrate holder including a plurality of pins, through holes, and levers, and the substrate holder further includes a lever connecting plate for connecting at least two levers. As an example, this substrate holder has an effect that a plurality of levers can be tilted at once.

Further, the present application discloses, as an embodiment, a substrate holder in which the cover plate includes an opening for exposing the substrate. Further, the present application discloses, as an embodiment, a substrate holder in which the substrate holder includes a conductive path for supplying an electric current to a surface of the substrate.

These disclosures reveal additional details of the substrate holder.

Further, the present application, as an embodiment, conveys a substrate holder according to any one of the embodiments, a holder rotating unit for receiving the substrate holder placed on a table and erecting the substrate holder, and an upright substrate holder. Disclosed is a plating apparatus including a transporter for performing plating, and a plating unit for plating the substrate held by the substrate holder.

This plating apparatus has an effect that an operator can attach a substrate to a substrate holder on a table and erect a horizontally placed substrate holder as an example.

Further, the present application discloses, as an embodiment, a plating apparatus in which a holder rotating unit includes a holder box for housing a substrate holder, and a pillar and a rotating unit shaft that rotatably support the holder box.

This disclosure will reveal further details of the plating apparatus.

Further, in the present application, as one embodiment, the holder rotating unit includes a linear guide that guides the horizontal movement of the pillar, and the pillar can receive the substrate holder from the transporter and can transfer the substrate holder to the transporter. Moveable between a first position and a second position capable of receiving the substrate holder from the table and delivering the substrate holder to the table, the holder box standing upright in the first position. Disclosed is a plating apparatus that can be stamped and leveled in a second position.

As an example, this plating apparatus has an effect that the substrate holder can be delivered even if the transporter and the table are separated.

Further, in the present application, as one embodiment, the table includes a protrusion for placing the substrate holder, and the height of the holder box when the holder box is oriented horizontally is equal to the height of the substrate holder placed on the protrusion. Disclosed is a plating apparatus in which a holder rotating unit and a table are configured to be the same.

As an example, this plating apparatus has an effect of facilitating the transfer of the substrate holder between the table and the holder rotating portion.

100... Plating device 110... Substrate holder 120... Plating part 121... Pre-wash layer 122... Pre-treatment layer 123... First rinse tank 124... Plating tank 125... Second rinse tank 126... Blow tank 130... Transporter 131... Transporter arm 132... Vertical movement mechanism 133... Horizontal movement mechanism 140... Holder rotating part 150... Housing 151... Load port 152... Door 153... Window 160... Table 161... Projection 162... Rim 200... Base plate 201... Holder arm 202... Electrode 203... Through hole 210... Cover plate 211... Opening 212... Inner seal 213... Outer seal 214... Pin 215... Cutout 220... Lever 300... Busbar 310... Lever connecting plate 400... Pin base 401... Bolt 402... Pin seal 403... Contact Element 500... Shaft 510... Mountain part 700... Holder box 710... Pillar 711... Rotating part shaft 720... Linear guide 800... Holder receiver W... Substrate

Claims (10)

Base plate,
A cover plate for supporting the substrate between the base plate,
A substrate holder comprising:
The cover plate is
A pin extending toward the base plate,
An inner seal in contact with the substrate to be held,
An outer seal in contact with the base plate,
Equipped with
The base plate includes a through hole for the pin,
The substrate holder further includes a lever, and the lever has a holding position where the lever pulls the pin so that the seal pressure of the inner seal and the outer seal is maintained, and a release position where the seal pressure is released. Is tiltable between
The lever is a shaft that is a center of tilting of the lever, and includes a shaft that is engageable with the pin protruding from the through hole,
The lever is a mountain-shaped portion configured to come into contact with the base plate between the shaft and the base plate when the lever is in the holding position. The lever holds the position of the lever. Equipped with ridges to keep it in position,
Substrate holder. The tip of the mountain portion is a flat surface,
The substrate holder according to claim 1, wherein the plane is orthogonal to a direction in which the pin engaged with the lever extends when the lever is in a holding position. The substrate holder according to claim 1, wherein the substrate holder includes a pin seal for sealing a gap between the pin and the through hole. The substrate holder includes a plurality of the pins, the through holes, and the lever,
The substrate holder further comprises a lever connection plate for connecting at least two levers.
The substrate holder according to any one of claims 1 to 3. The substrate holder according to claim 1, wherein the cover plate has an opening for exposing the substrate. The substrate holder according to claim 5, wherein the substrate holder includes a conductive path for supplying an electric current to a surface of the substrate. A substrate holder according to any one of claims 1 to 6,
A table for placing the substrate holder horizontally,
A holder rotating unit for receiving the substrate holder placed on the table and erecting the substrate holder;
A transporter for carrying the upright substrate holder,
A plating unit for plating the substrate held by the substrate holder,
A plating apparatus comprising: The holder rotating part is
A holder box for accommodating the substrate holder,
A pillar and a rotating shaft that rotatably support the holder box;
The plating apparatus according to claim 7, further comprising: The holder rotating unit includes a linear guide for guiding the horizontal movement of the pillar,
The pillar is
A first position capable of receiving the substrate holder from the transporter and delivering the substrate holder to the transporter;
A second position capable of receiving the substrate holder from the table and delivering the substrate holder to the table;
Is movable between
The holder box can be upright in the first position and horizontal in the second position,
The plating apparatus according to claim 8. The table includes a protrusion for placing the substrate holder,
The holder rotating unit and the table are configured such that the height of the holder box when the holder box is oriented horizontally is the same as the height of the substrate holder placed on the protrusion. Item 8. The plating apparatus according to Item 8 or 9.