JP2020105576A - Substrate holder and plating apparatus - Google Patents

Abstract

To provide a substrate holder having a centering member.SOLUTION: The present invention discloses, as one embodiment, a substrate holder comprising a first holding member, a second holding member, and a centering member, in which the centering member comprises an inner plate spring and an outer plate spring, and the substrate holder is configured to center the substrate by the outer plate spring pressing the substrate through the inner plate spring when the substrate is sandwiched between the first holding member and the second holding member.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate holder and a plating device.

Conventionally, a plating apparatus for plating a substrate is known. Generally, the substrate is held by the substrate holder. Japanese Patent Application Laid-Open No. 2004-52059 discloses a substrate holder including a substrate holder and a centering mechanism for aligning (centering) the substrate.

JP, 2004-52059, A JP, 2004-76022, A

One object of the present application is to provide a substrate holder having a centering mechanism.

The present application is, as one embodiment, a substrate holder including a first holding member, a second holding member, and a centering member, the centering member having an inner leaf spring and an outer leaf spring. The substrate holder is configured to center the substrate by pushing the substrate through the inner leaf spring when the substrate is sandwiched between the first holding member and the second holding member. Disclose.

It is a top view of a plating apparatus. It is a side view of a plating apparatus. It is a perspective view of a substrate holder. It is sectional drawing in the position of the board|substrate mounting part of a board|substrate holder. It is a perspective view of the outer base to which the outer leaf spring is not attached. It is a perspective view of an outer leaf spring. It is a perspective view of the outer side base to which the outer side leaf spring was attached. It is a perspective view of the inside base with which the inside leaf spring was attached. It is a perspective view of an inside base to which an inside leaf spring is not attached. It is a perspective view of an inner leaf spring. It is sectional drawing of a board|substrate holder when a 2nd holding member is closed. FIG. 9 is a perspective view of another example of an inner base to which an inner leaf spring is attached. It is a front view of a double-sided holder. It is sectional drawing of the double-sided holder of FIG. FIG. 13 is a cross-sectional view of the holder of FIG. 12 around the centering member. It is a figure when the hook main body of FIG. 14 is hooked on the claw. It is sectional drawing of a double-sided holder for demonstrating a board|substrate base.

<About plating equipment>
FIG. 1 is a schematic diagram of a plating apparatus 100 according to one embodiment. FIG. 1A shows a plating apparatus 10.
It is a top view of 0. FIG. 1B is a side view of the plating apparatus 100. The plating apparatus 100 according to the embodiment includes a load port 110, a substrate transfer robot 120, a dryer 130, a substrate attaching/detaching device 140, a plating processing unit 150, a transporter 160, and a stocker 170. The plating apparatus 100 may further include a control unit 180 for controlling each unit of the plating apparatus 100.

The load port 110 is provided for loading the substrate on the plating apparatus 100 and for unloading the substrate from the plating apparatus 100. The load port 110 may be configured so that a mechanism such as a FOUP can be placed on the load port 110 or a substrate can be transferred to and from the mechanism such as a FOUP.

The substrate loaded by the load port 110 is transported by the substrate transport robot 120. The substrate transfer robot 120 is configured to transfer a substrate between the load port 110, the dryer 130, and the substrate attaching/detaching device 140. However, a transfer mechanism other than the substrate transfer robot 120 may be used. In this specification, "transporting a substrate to the load port 110" includes "transporting a substrate to a mechanism such as a FOUP placed in the load port 110". The dryer 130 is a member for drying the substrate.

The substrate attaching/detaching device 140 is a device for attaching the substrate to the substrate holder and/or removing the substrate from the substrate holder. Both the substrate and the substrate holder need to be carried into the substrate attaching/detaching device 140. Therefore, the substrate attaching/detaching device 140 is positioned so that both the substrate transfer robot 120 and the transporter 160 can access it.

The plating processing unit 150 is provided to perform plating processing (plating processing) on the substrate. The plating processing unit 150 includes one or more processing baths. At least one of the one or more processing baths is a plating bath. As an example, the plating treatment unit 150 of FIG. 1 has eight treatment tanks, namely a pre-water washing tank 151, a pre-treatment tank 152, a first rinse tank 153, a first plating tank 154, a second rinse tank 155, and a second rinse tank 155. The plating tank 156, the third rinse tank 157, and the blow tank 158 are provided. The plating apparatus 100 can sequentially perform predetermined processing in each processing tank.

The transporter 160 is configured to convey the substrate holder between the substrate attaching/detaching device 140, the plating processing unit 150, and the stocker 170. Further, the transporter 160 is configured to convey the substrate holder among the processing tanks (pre-water washing tank 151 to blowing tank 158). The transporter 160 horizontally moves the transporter arm 161 for suspending the substrate holder, the arm up-and-down moving mechanism 162 for vertically moving the transporter arm 161, and the arm up-and-down moving mechanism 162 along the line of the processing tank. And a horizontal movement mechanism 163 for. The horizontal movement mechanism 163 may be expressed as a mechanism for horizontally moving the transporter arm 161. It should be noted that the configuration of transporter 160 is exemplary only.

The stocker 170 is configured to store at least one substrate holder, preferably a plurality of substrate holders. Preferably, the substrate holder that does not hold the substrate is stored in the stocker 170. On the other hand, the substrate holder holding the substrate may be stored in the stocker 170. The transporter 160 may carry the substrate holder in and out of the stocker 170.

<About the board holder>
FIG. 2 is a perspective view of the substrate holder 200 according to the embodiment. The substrate holder 200 has a substantially plate-shaped first holding member 210 and a second holding member 220. The substrate holder 200 shown in FIG. 2 is a holder for holding a circular substrate. However, the shape of the substrate is not limited to the circular shape, and may be, for example, a rectangular shape. If a substrate other than a circular substrate is used, the shape of the member of the substrate holder 200 may be changed as appropriate.

<About the first holding member>
A substrate mounting portion 212 for mounting a substrate is provided at a substantially central portion of the first holding member 210. The board mounting portion 212 is planar. The phrase “the substrate mounting portion 212 is planar” as used herein means that the flat substrate and the substrate mounting portion are in fact in contact with each other on the upper surface. Therefore, the substrate mounting portion 212 may be, for example, an annular shape or a square annular shape. As another example, a recess, such as a hole, may be present in the substrate mounting portion 212. A plurality of clampers 213 are provided on the outer periphery of the board mounting portion 212. The clampers 213 are arranged along the circumference of the board mounting portion 212 at approximately equal intervals. The clamper 213 has an inverted L shape protruding inward.

A pair of hands 214 is provided at the end of the first holding member 210. The hand 214 is hooked on the transporter arm 161, for example. The hand 214 may be hooked on, for example, each tank of the pre-water washing tank 151 to the blow tank 158 and a part of the stocker 170, a tank side wall in one example, a hand receiver (not shown) in another example, and the like.

The hand 214 may include electrodes (not shown). The electrode of the hand 214 is electrically connected to the substrate via a contact 310, a relay contact 311 and the like which will be described later. The current required for the plating process is supplied from the outside of the substrate holder 200 (for example, from the plating apparatus 100).

<About the second holding member>
The second holding member 220 is a member for sandwiching the substrate between the substrate mounting portion 212 and the second holding member 220. The second holding member 220 of FIG. 2 is attached to the first holding member 210 so as to be openable and closable. Specifically, the second holding member 220 of FIG. 2 is configured to pivot about the hinge 211. Alternatively, a second holding member 220 that can be simply attached to and removed from the first holding member 210 can be used. Regardless of the presence or absence of the hinge 211 or the like, “closing the second holding member 220 ”in the present specification means “moving the second holding member 220 toward the first holding member 210 to cause the second holding member 220 to move”. It should be understood that it is “sandwiching the substrate WF with the substrate rest part 212” or “an operation of sandwiching the substrate WF”. Similarly, "opening the second holding member 220" in the present specification means "moving the second holding member 220 away from the first holding member 210 to release the holding of the substrate WF" or ". The operation of trying to release the holding of the substrate WF”.

The second holding member 220 has an opening 220OP for exposing the plated surface of the substrate. The second holding member 220 shown in FIG. 2 is a generally annular member as a whole. The second holding member 220 includes a base 221 fixed to the hinge 211 and a ring-shaped seal holder 222 fixed to the base 221. The seal holder 222 includes a seal member (see FIG. 3) for sealing a power feeding path (contact 310, relay contact 311 described later, etc.). The seal holder 222 includes a pressing ring 223 for fixing the seal holder 222 to the first holding member 210. The pressing ring 223 has a plurality of ridges 223a protruding outward on its outer peripheral portion. The position and the number of the protrusions 223a may be determined according to the position and the number of the clampers 213. The protruding portion 223a is hooked on the clamper 213, so that the opening of the second holding member 220 is restricted.

<Installation and removal of the board>
When the substrate is attached to the substrate holder 200, first, the substrate is placed on the substrate placing portion 212 of the first holding member 210. Then, the second holding member 220 is closed. This allows
The substrate is sandwiched between the substrate mounting portion 212 and the second holding member 220. Closing the second holding member 220 may be performed by the substrate attaching/detaching device 140, and may be performed by another device or a user. When the second holding member 220 is closed, the ridge portion 223a is positioned so as not to collide with the clamper 213. The second holding member 220 is pressed toward the substrate mounting portion 212 with appropriate strength so that a sufficient sealing pressure is applied to the sealing member (see FIG. 3).

Subsequently, the pressing ring 223 is rotated so that the protruding portion 223a is hooked on the clamper 213. This limits the opening of the second holding member 220. One surface of the substrate held by the substrate holder 200 is exposed to the outside through the opening 220OP. The plating process by the plating apparatus 100 is performed on the surface exposed to the outside of the substrate.

When the substrate is removed from the substrate holder 200, the pressing ring 223 is rotated so that the protruding portion 223a comes off the clamper 213. Then, the second holding member 220 is opened.

<Cross section of substrate holder>
FIG. 3 is a sectional view of the substrate holder 200 at the position of the substrate mounting portion 212. The substrate WF is shown in phantom in FIG. In FIG. 3, the second holding member 220 is not completely closed. Although FIG. 3 is a cross-sectional view, hatching to each component is omitted.

As shown in FIG. 3, the first holding member 210 may have a movable base 330. When the movable base 330 is provided, the substrate mounting portion 212 is formed on the movable base 330. The movable base 330 is movable in a direction perpendicular to the plane on which the substrate mounting portion 212 is located, that is, in a direction perpendicular to the surface to be plated of the substrate WF. The movable base 330 is held by a spring or the like (not shown). The spring elastically holds the movable base 330. The elastic force of the spring facilitates application of sufficient sealing pressure to the substrate seal 300 and the holder seal 301 (each of which will be described later). Since the movable base 330 is elastically attached to the first holding member 210, sufficient sealing pressure can be applied to the substrates WF having various thicknesses.

<About the seal holder>
The seal holder 222 includes a substrate seal 300 and a holder seal 301. The substrate seal 300 contacts the substrate WF when the second holding member 220 is closed. More specifically, the substrate seal 300 makes contact with the edge of the plated surface of the substrate WF. The substrate seal 300 seals the gap between the substrate WF and the seal holder 222. The holder seal 301 contacts the first holding member 210 when the second holding member 220 is closed. The holder seal 301 seals the gap between the first holding member 210 and the seal holder 222. In the example of FIG. 3, the seal holder 222 has an inner ring 340 for fixing the substrate seal 300 and the holder seal 301. However, the substrate seal 300 and the holder seal 301 may be fixed by a member or method other than the inner ring 340.

The seal holder 222 further comprises contacts 310. The contacts 310 are located within the area to be sealed (the area to be sealed). One end of the contact 310 electrically contacts the plated surface of the substrate WF when the second holding member 220 is closed. The other end of the contact 310 comes into contact with the relay contact 311 when the second holding member 220 is closed. The relay contact 311 is a contact provided on the first holding member 210. The relay contact 311 is electrically connected to the electrode of the hand 214 described above. Therefore, the current is supplied to the substrate WF from the outside of the substrate holder 200 via the relay contact 311 and the contact 310. The contact point 310 is preferably a leaf spring made of stainless steel or the like. Elastic contacts 310 ensure electrical contact.
In addition, the elastic contacts 310 allow the substrates WF having various thicknesses to be received. In FIG. 3, the shape of the contact point 310 when the second holding member 220 is opened is shown by a solid line (reference numeral “310a”). The shape of the contact point 310 in the state where the second holding member 220 is closed is shown by an imaginary line (reference numeral “310”).

<About centering members>
If the positional relationship between the substrate WF and the substrate seal 300, the positional relationship between the substrate WF and the contact point 310, or the positional relationship between the substrate WF and the plating bath is misaligned, the performance of the plating apparatus 100 may be affected. Therefore, the substrate WF is preferably positioned (centered) with respect to the substrate holder 200. The substrate holder 200 according to the embodiment has a centering member 320 for centering the substrate WF. Although only one centering member 320 is shown in FIG. 3, at least two, preferably three or more, centering members 320 are provided along the outer periphery of the substrate WF. When the substrate holder 200 has a plurality of centering members 320, it is preferable that the centering members 320 are arranged at equal intervals (equal angles). However, arranging the centering members 320 at unequal intervals (unequal angles) is not excluded. At least a portion, and preferably all of the centering member 320 is located within the sealed area. The centering member 320 has an outer leaf spring 321 and an inner leaf spring 322. The outer leaf spring 321 and the inner leaf spring 322 are elastically deformable in a direction toward/away from the substrate mounting portion 212. In other words, the outer leaf spring 321 and the inner leaf spring 322 can be deformed in a direction toward/away from the edge portion of the substrate WF.

Since FIG. 3 and FIG. 10 (described later) are cross-sectional views, it may seem that the contact point 310 may come into contact with and interfere with the outer leaf spring 321 and the inner leaf spring 322 at first glance. However, in practice, it is desirable that the contact 310, the outer leaf spring 321, and the inner leaf spring 322 are installed at angular positions deviated on the circumference of the substrate.

<About outer leaf springs>
The outer leaf spring 321 is fixed to the second holding member 220 via the outer base 323. In the example of FIG. 3, the outer leaf spring 321 is attached to the outer base 323. The outer base 323 is attached to the inner ring 340. The inner ring 340 is attached to the seal holder 222 which is a part of the second holding member 220. However, the outer base 323 may be directly attached to the seal holder 222 or another component of the second holding member 220 instead of the inner ring 340. The outer base 323 may be a part of any one of the inner ring 340, the seal holder 222, and the second holding member 220. The outer leaf spring 321 may be attached to any one of the inner ring 340, the seal holder 222, and the second holding member 220.

FIG. 4 is a perspective view of the outer base 323 to which the outer leaf spring 321 is not attached. FIG. 5 is a perspective view of the outer leaf spring 321. FIG. 6 is a perspective view of the outer base 323 to which the outer leaf spring 321 is attached. The outer base 323 has a first surface 400 and a second surface 401. The first surface 400 is inclined so as to push the inner leaf spring 322 through the outer leaf spring 321 toward the substrate mounting portion 212 while the second holding member 220 is closed. In short, the first surface 400 is a surface that can face the edge portion of the substrate WF, and is inclined so as to approach the center of the substrate WF toward the upper portion of FIG. However, in the initial stage of the operation of closing the second holding member 220, the substrate holder 200 is configured such that the outer base 323, the inner ring 340, or a part of the second holding member 220 pushes the inner leaf spring 322 instead of the outer leaf spring 321. It may have been done. The outer base 323 is positioned to allow the first surface 400 to push the inner leaf spring 322. For example, in FIG. 3, the outer base 323 is attached to the inner ring 340 so that the tip of the inner leaf spring 322 is located below the first surface 400.

The second surface 401 is a surface continuous with the first surface 400, and is positioned farther from the first holding member 210 than the first surface 400. In short, the second surface 401 is the surface that is “above” the first surface 400. However, the "upper" referred to here is a direction based on FIG. 3, and does not always coincide with the vertically upward direction. The second surface 401 faces the edge portion of the substrate WF when the second holding member 220 is completely closed and when the substrate WF is placed on the substrate placing portion 212. However, when it is described in the present specification that “A faces B”, other parts or portions may exist between A and B. The second surface 401 extends perpendicularly to the plane on which the substrate mounting portion 212 is located. Alternatively, the second surface 401 may be inclined with respect to the plane where the substrate mounting portion 212 is located. The second surface 401 may be inclined so as to move away from the center of the substrate WF toward the upper portion of FIG. Preferably, like the first surface 400, the second surface 401 is also inclined so as to approach the center of the substrate WF toward the upper portion of FIG. Most preferably, the inclination angle of the second surface 401 is 0 degree or substantially 0 degrees (provided that the inclination angle when the second surface 401 extends perpendicularly to the plane on which the substrate mounting portion 212 is located is 0 degrees). Degree). The range of the inclination angle of the second surface 401 is determined so that the substrate holder 200 can hold the substrate WF when the second holding member 220 is closed (see FIG. 10 described later). Although it depends on various factors such as material, size, rigidity, friction coefficient, and positional relationship of various parts, in one example, the inclination angle of the second surface 401 is 0 degree or more, and the inclination of the first surface 400 is Smaller than a corner. In still another example, the inclination angle of the second surface 401 is in the range of 0 degree or more and 5 degrees or less.

The outer leaf spring 321 is attached to the outer base 323 along the first surface 400. One end of the outer leaf spring 321 extends beyond the first surface 400, and a gap is formed between the outer leaf spring 321 and the second surface 401. Therefore, a part of the outer leaf spring 321 can be elastically deformed between the end surface of the substrate WF and the second surface 401.

The tip of the outer leaf spring 321 has an angle inclined with respect to a plane perpendicular to the plane on which the substrate mounting portion 212 is located when the second holding member 220 is opened. Further, the tip of the outer leaf spring 321 projects toward the center side of the substrate from a position (assumed position) where the edge portion of the substrate placed on the substrate mounting portion 212 will be located.

For example, in FIG. 3, when the second holding member 220 is closed when the substrate WF having a predetermined diameter is on the right side of the predetermined position, the outer leaf spring 321 and the edge portion of the substrate WF come into contact with each other. The “contact between the outer leaf spring 321 and the substrate WF” mentioned here is an indirect contact through the inner leaf spring 322. Then, the first surface 400 pushes the substrate WF (to the left in this example) via the outer leaf spring 321 and the inner leaf spring 322. This may be expressed as “the outer leaf spring 321 pushes the substrate WF via the inner leaf spring 322”.

When the second holding member 220 is completely or almost completely closed, the second surface 401 pushes the substrate WF through the outer leaf spring 321 and the inner leaf spring 322. As a result, the gap between the four members (the substrate WF (the edge portion thereof), the inner leaf spring 322, the outer leaf spring 321 and the outer base 323 (the second surface 401 thereof)) is substantially eliminated or minimized. Is desirable. The vicinity of the end of the outer leaf spring 321 tends to elastically deform toward the second surface 401. On the other hand, the substrate WF receives a force from the outer leaf spring 321 toward the left side in FIG. By using the elastic member, it becomes easy to center the substrate WF even when there is an error in the diameter of the substrate WF or when the substrate WF is warped (the warpage of the substrate will be described later). Further, since the elastic body and the substrate WF are in soft contact, the damage that the centering member 320 can give to the substrate WF can be reduced.

When the substrate WF is on the left side of the predetermined position in FIG. 3, another centering member 320 (not shown) located on the opposite side of the centering member 320 of FIG. 3 pushes the substrate WF.

When an object is held elastically or when an object is pushed by an elastic body, the larger the amount of deformation of the elastic body, the larger the error in the position of holding the object or the amount of movement of the object. In the centering member 320 according to this embodiment, the outer leaf spring 321 is partially supported by the first surface 400. The maximum deformation amount of the outer leaf spring 321 is limited by the second surface 401. Therefore, the deformation amount of the outer leaf spring 321 in the present embodiment is limited to a certain range. Therefore, the centering member 320 according to the present embodiment can accurately center the substrate WF.

It is considered that the shorter the distance between the substrate WF and the second surface 401 is, the more the deformation amount of the outer leaf spring 321 is limited. For example, in the state where the second holding member 220 is completely or almost completely closed, the inner leaf spring 322 and the outer side are provided between the substrate WF (the edge portion thereof) and the outer base 323 (the second surface 401 thereof). The leaf spring 321 may be sandwiched. In this case, it is desirable that there is almost no gap between the four members (the substrate WF (the edge portion thereof), the inner leaf spring 322, the outer leaf spring 321 and the outer base 323 (the second surface 401 thereof)). In one embodiment, the distance between the substrate WF and the second surface 401 when the second holding member 220 is completely or almost completely closed may be 1 mm or less. However, the “distance” mentioned here means a distance when a substrate having a predetermined diameter is placed on the substrate holder 200 having no error, that is, a designed distance (estimated or designed length). The thickness of each of the outer leaf spring 321 and the inner leaf spring 322 is, for example, 0.05 mm or more and 0.5 mm or less.

On the other hand, when the diameter of the substrate WF is larger than the predetermined diameter, the edge portion of the substrate WF may interfere with the first surface 400 or the second surface 401. Therefore, in order to obtain further elasticity, the outer base 323 may have a slit 324 that allows the outer base 323 to elastically deform in a direction toward/away from the substrate mounting portion 212. The specific shape, position, etc. of the slit 324 may be appropriately determined. The deformation of the outer base 323 itself facilitates holding the large-diameter substrate WF.

<About inner leaf springs>
The inner leaf spring 322 is fixed to the movable base 330. Specifically, the inner leaf spring 322 is attached to the inner base 325. The inner base 325 is attached to the outer edge of the movable base 330. The inner leaf spring 322 extends upward from the lower portion of FIG. FIG. 7 is a perspective view of an example of the inner base 325 to which the inner leaf spring 322 is attached. FIG. 8 is a perspective view of the inner base 325 of FIG. 7 alone. FIG. 9 is a perspective view of the inner leaf spring 322 of FIG. 7 alone.

Inner base 325 may have sidewall 700. The sidewall 700 is configured to receive a portion of the outer base 323 and position the outer base 323 when the second holding member 220 is closed. The outer base 323 is a part of the seal holder 222. The seal holder 222 is a part of the second holding member 220. Therefore, it can be said that positioning the outer base 323 is positioning the seal holder 222 and the second holding member 220. The side wall 700 may be configured to directly receive the seal holder 222 or the second holding member 220 instead of the outer base 323. In FIGS. 7 and 8, the side wall 700 is provided near the inner leaf spring 322. However, the position of the side wall 700 is not limited as long as it contributes to the positioning of the outer base 323, the seal holder 222 and/or the second holding member 220. Similarly, the shape of the side wall 700 is not limited, and a member (portion) having a shape other than the wall shape may be used.

The inner leaf spring 322 protrudes beyond the plane where the substrate mounting portion 212 is located outside the position where the edge portion of the substrate WF having a predetermined diameter should be located. When the second holding member 220 is closed, the inner leaf spring 322 is pushed by the first surface 400 in the direction toward the board mounting portion 212. It may be expressed as “the inner leaf spring 322 is pushed by the outer leaf spring 321”. In the preferred embodiment, the vertical positional relationship between the inner leaf spring 322 and the substrate WF does not change even when the movable base 330 moves. Therefore, in the preferred embodiment, rubbing between the substrate WF and the centering member 320 when the second holding member 220 is opened and closed is prevented.

The position of the substrate WF is limited by the inner leaf spring 322 projecting beyond the plane where the substrate placing portion 212 is located. Therefore, the inner leaf spring 322 can also serve as a guide for placing the substrate WF on the substrate placing portion 212.

The substrate seal 300 is immersed in the plating solution while being pressed against the substrate WF. Therefore, the substrate seal 300 may stick (stick) to the substrate WF. When the inner leaf spring 322 does not exist, the outer leaf spring 321 can move up and down together with the second holding member 220 while elastically holding the end surface of the substrate WF. Therefore, if the inner leaf spring 322 does not exist, the substrate WF may be lifted together with the second holding member 220. However, the “up and down” mentioned here is a direction with reference to FIG. 3, and does not always coincide with the vertical up and down direction. In the centering member 320 according to the embodiment, the inner leaf spring 322 is fixed to the movable base 330, and the vertical positional relationship between the inner leaf spring 322 and the substrate WF does not change. When the second holding member 220 is opened and closed, the inner leaf spring 322 is pushed by the outer leaf spring 321 toward the board mounting portion 212. As a result, the top end of the inner leaf spring 322 is deformed toward the center of the substrate WF. As a result, the inner leaf spring 322 can temporarily hold the (edge portion of) the substrate WF. Therefore, the centering member 320 according to the embodiment can prevent the substrate WF from being lifted together with the second holding member 220. As a further embodiment, the tip of the inner leaf spring may be bent slightly inward to more positively press the substrate to be lifted downward.

<Specific operation of the centering member>
FIG. 10 shows a cross section of the substrate holder 200 when the second holding member 220 is closed. When the second holding member 220 is closed, the tip of the inner leaf spring 322 is pushed by the first surface 400 or the outer leaf spring 321, and is deformed toward the board mounting portion 212. As a result, the inner leaf spring 322 pushes the substrate WF.

The contact point 310 and the substrate seal 300 sequentially contact the substrate WF, and the holder seal 301 contacts the first holding member 210. As a result, the area where the contact 310 and the like are present is sealed. Since the contact 310 and the substrate seal 300 push the substrate WF, the movable base 330 also descends. Since a spring (not shown) or the like pushes the movable base 330 upward, the sealing pressure of the substrate seal 300 and the holder seal 301 is secured. However, the terms “upper” and “lower” as used herein are directions determined with reference to FIG. 10, and do not necessarily match the vertical up and down directions.

At first glance, it seems that the gap between the movable base 330 and the first holding member 210 (see the left end of FIG. 10: the gap between reference numerals “330” and “210”) is not sealed. However, since each of the substrate seal 300 and the holder seal 301 is arranged over the entire circumference of the substrate WF and the periphery of the portion where the movable base 330 of the first holding member 210 is installed, such a problem does not occur. ..

One end of the contact point 310 comes into contact with the substrate WF and elastically deforms (deforms from the portion indicated by reference numeral “310a” in FIG. 3). The other end of the contact 310 contacts the relay contact 311. As a result, a conductive path from the electrode of the hand 214 to the substrate WF is formed.

It is preferable that the contact between the outer leaf spring and the substrate (correction of warpage: warpage will be described later) or the contact between the inner leaf spring and the substrate (centering) be started before the contact between the substrate seal 300 and the contact point 310. .. When a strong pressing force is applied to the substrate from the substrate seal 300 or the contact 310, it may be difficult to center the substrate (move the substrate in the horizontal direction) due to friction. Therefore, it is desirable that the contact between the substrate seal 300 and the contact 310 is made after the substrate is centered.

In one embodiment, the contact 310 is located closer to the substrate rest 212 than the substrate seal 300 when the second holding member 220 is open (see reference numeral “310a” in FIG. 3). Therefore, when the substrate holder 200 is closed, the contacts 310 first contact the substrate WF and then the substrate seal 300 contacts the substrate WF. After that, the second holding member 220 is closed until a sufficient sealing pressure is obtained.

In the substrate holder 200 according to the embodiment, the outer leaf spring 321 and the inner leaf spring 322 form a guide surface for guiding the edge portion of the substrate WF. More specifically, the guide surface extends from the tip of the outer leaf spring 321 through the contact portion between the outer leaf spring 321 and the inner leaf spring 322 to the same height as the board rest portion 212 of the inner leaf spring. ing. The guide surface formed by the outer leaf spring 321 and the inner leaf spring 322 guides (the edge portion of) the substrate WF when centering the substrate WF and/or correcting the warp of the substrate WF described later.

<About warpage of substrate>
As described above, the inner leaf spring 322 projects beyond the substrate rest portion 212. However, if the protrusion amount of the inner leaf spring 322 is too large, the size of the seal holder 222 may become huge. Therefore, in practice, the maximum amount of protrusion of the inner leaf spring 322 from the plane on which the substrate mounting portion 212 is located is the same as or slightly longer than the expected thickness of the substrate WF. When a plurality of substrates WF are used, the thickest substrate WF may be used as a reference. For example, when the thickness of the substrate WF is 1 mm, the maximum protrusion amount of the inner leaf spring 322 may be 2 mm or less.

In one example, the substrate WF has a thickness of about 0.2 mm to about 2 mm, and the substrate WF has a diameter of about 200 mm to about 500 mm. Therefore, the substrate WF may have warp, flexure, twist (hereinafter collectively referred to as “warp”), and the like. When the substrate is warped in a concave shape (V-shape or U-shape) in FIG. 3, the edge portion of the substrate WF can be positioned higher than the substrate rest portion 212. On the other hand, as described above, the maximum amount of protrusion of the inner leaf spring 322 may be limited. As a result, the substrate WF and the inner leaf spring 322 may not come into contact with each other. Therefore, it is difficult to center the substrate WF having a large warp by using the centering mechanism that does not have the outer leaf spring 321. If the inner leaf spring 322 can be projected toward the center from the assumed position of the edge portion of the substrate WF (the inner leaf spring is inclined toward the inner side), the inner leaf spring 322 can correct the warp of the substrate WF. .. However, if the inner leaf spring 322 is configured in this way, it becomes impossible or difficult to place the substrate WF on the substrate placing portion 212. Therefore, in the substrate holder 200 according to the embodiment, the outer leaf spring 321 corrects the warp of the substrate WF.

As can be seen from FIG. 3, the outer leaf spring 321 projects toward the center from the assumed position of the edge portion of the substrate WF. Therefore, the outer leaf spring 321 can also contact the warped substrate WF. As the second holding member 220 is closed, the warp of the substrate WF is corrected by the second holding member 220. When the warp of the substrate WF is corrected, the substrate WF and the inner leaf spring 322 may come into contact with each other. Therefore, the substrate holder 200 according to the embodiment may enable centering of the substrate WF having a large warp. The outer leaf spring 321 and the inner leaf spring 322 are elastic bodies, and the outer leaf spring 321 and the inner leaf spring 322 are generally thin (for example, 0.05 mm or more and 0.5 mm or less). The step generated between the leaf spring 321 and the inner leaf spring 322 does not pose a problem.

The centering member 320 according to an exemplary embodiment centers the substrate WF with an elastic body. Therefore, the centering member 320 according to the embodiment softly contacts the substrate WF as compared with a member that centers the substrate WF only by the rigid body or a member that forces the warpage of the substrate WF by only the rigid body. Therefore, the centering member 320 according to the embodiment can reduce damage that can be applied to the substrate WF.

<Regarding the centering member according to another example>
The centering member 320 described above is merely an example. The shape and arrangement of each member of the centering member 320 may be appropriately determined. FIG. 11 is a perspective view showing an inner base 325 according to another example. The inner base 325 of FIGS. 7 and 8 has side walls 700, whereas the inner base 325 of FIG. 11 does not have side walls 700.

As a further modification, a centering member 320 having the function of the contact 310 may be used. Specifically, the centering member 320 may be configured so that the outer leaf spring 321 and/or the inner leaf spring 322 electrically connects the relay contact 311 and the substrate WF. The outer leaf spring 321 and/or the inner leaf spring 322 may be in contact with an edge portion of the substrate WF, a bevel portion, a portion of the surface to be plated, which is close to the edge, or the like. When the centering member 320 acts as the contact 310, the substrate holder 200 may or may not have another contact 310 independent of the centering member 320.

<About double-sided holder>
In the substrate holder 200 described above, only one surface of the substrate WF is exposed. The substrate holder 200 for exposing and holding both surfaces of the substrate WF will be described below. FIG. 12 is a front view of the substrate holder 200 according to the embodiment. FIG. 13 is a sectional view of the substrate holder 200 of FIG. The substrate holder 200 of FIG. 12 is a holder for a rectangular substrate WF. The substrate holder 200 may be configured to hold the circular substrate WF.

The substrate holder 200 of FIG. 12 includes a first holding member 210 and a second holding member 220. The first holding member 210 may be referred to as a “front frame”, and the second holding member 220 may be referred to as a “rear frame”. However, the names "front frame" and "rear frame" are merely used for distinction. That is, either the front frame or the rear frame may face the front. When describing the double-sided holder in this specification, the "holding member to which the inner leaf spring is attached" is referred to as the "first holding member" and the "holding member to which the outer leaf spring is attached" is referred to as the "second holding member". "Holding member". The substrate WF is sandwiched and held between the first holding member 210 and the second holding member 220 (see FIG. 13). Each of the first holding member 210 and the second holding member 220 has an opening 220OP. Each surface of the substrate WF is exposed through each of the openings 220OP. The first holding member 210 and/or the second holding member 220 may have an electrode 280. The electrode 280 may be electrically connected to a conductive path (not shown) inside the substrate holder 200.

The clamper 213 of FIGS. 12 and 13 includes a hook portion 250 and a plate 270 having a claw 271. Note that the number, arrangement, size, etc. of the clampers 213 are merely examples. The hook part 250 includes a hook base 251 and a hook body 252. The hook body 252 is pivotally attached to the hook base 251 via a shaft 253. The hook portion 250 may further include a lever 254 for pivoting the hook body 252. When the hook main body 252 is hooked on the claw 271, the positional relationship between the first holding member 210 and the second holding member 220 is fixed. In FIGS. 12 and 13, the first holding member 210 includes the hook portion 250, and the second holding member 220 includes the plate 270. However, the second holding member 220 may include the hook portion 250 and the first holding member 210 may include the plate 270. Both the hook portion 250 and the plate 270 may be attached to the first holding member 210 and the second holding member 220.

FIG. 14 is a cross-sectional view of the substrate holder 200 of FIG. 12 around the centering member 320. In FIG. 14, the clamper 213 is illustrated in a simplified manner. For example, shaft 253 is not shown in FIG.

The first holding member 210 includes a substrate seal 300, an inner leaf spring 322 and an inner base 325. The second holding member 220 includes a substrate seal 300, a holder seal 301, an outer base 323 and an outer leaf spring 321. Additionally or alternatively, the first retaining member 210 may include a holder seal 301. The substrate seal 300 may be called an “inner seal”, and the holder seal 301 may be called an “outer seal”. The substrate WF is placed on the substrate seal 300. Therefore, it may be described that “the substrate seal 300 of FIG. 14 can serve as the substrate mounting portion 212 ”.

As shown in FIG. 15, when the hook main body 252 is hooked on the claw 271, the substrate seal 300 and the holder seal 301 are compressed, and the space defined by the substrate seal 300 and the holder seal 301 is sealed. "The hook body 252 is hooked on the claw 271" means "the second holding member 220 is attached to the first holding member 210", "the first holding member 210 is attached to the second holding member 220", " 2 holding member 220/first holding member 210/substrate holder 200 is closed”, “second holding member 220/first holding member 210/substrate holder 200 is fixed (fixed)”, and the like. .. It should be noted that some symbols are omitted in FIG. 15 for convenience of illustration (see FIG. 14). As in the case of the single-sided holder, the inner leaf spring 322 contacts the outer leaf spring 321, and the inner leaf spring 322 is pushed by the outer leaf spring 321. As a result, centering of the substrate WF is realized.

As shown in FIG. 16, the first holding member 210 may have a substrate base 1600. The substrate base 1600 is arranged inside the region to be sealed by the substrate seal 300 and the holder seal 301, and at a position that can support the edge portion of the substrate WF or the vicinity of the edge portion. The substrate base 1600 may replace the substrate seal 300 or may function as the substrate mounting portion 212 together with the substrate seal 300. The substrate base 1600 can be locally located. For example, the substrate holder 200 may have one, four, six, eight, twelve, etc. substrate bases 1600. Additionally or alternatively, the second holding member 220 may have a substrate base 1600. In order to facilitate both the sealing by the substrate seal 300 and the support by the substrate base 1600, the substrate base 1600 is preferably configured to be movable up and down by a spring or the like (not shown).

The foregoing has described some embodiments of the present invention. However, the above embodiments are for the purpose of facilitating the understanding of the present invention, and do not limit the present invention. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes equivalents thereof. Further, a range in which at least a part of the above-mentioned problems can be solved,
Alternatively, any combination of the constituent elements described in the claims and the specification or omission is possible within a range in which at least a part of the effect is exhibited.

The present application is, as an embodiment, a substrate holder including a first holding member, a second holding member for sandwiching the substrate between the first holding member, and a centering member for positioning the substrate. The centering member is fixed to the first holding member, protrudes beyond the plane where the substrate will be located, and is elastically deformable toward the center of the substrate that will be held. A leaf spring and an outer leaf spring fixed to the second holding member, wherein the outer leaf spring has an inclined portion that is inclined with respect to a plane perpendicular to a plane on which the substrate is located. The tip of the spring has an outer leaf spring protruding inward from an assumed position of the edge portion of the substrate, and the outer leaf spring is provided when the substrate is sandwiched between the first holding member and the second holding member. Disclosed is a substrate holder configured to center the substrate by pushing it through an inner leaf spring.

As an example, this substrate holder has the effect of accurately centering the substrate. This substrate holder further exhibits the effect of preventing friction between the centering member and the end surface of the substrate as an example. The substrate holder further exhibits the effect of preventing sticking of the substrate as an example. This substrate holder further exhibits the effect of enabling centering of a substrate having a large warp as an example.

Further, in the present application, as one embodiment, the first holding member and/or the second holding member includes an opening for exposing at least one surface of the substrate, and the inner leaf spring is elastic toward the center of the opening. A deformable substrate holder is disclosed.

Further, in the present application, as one embodiment, the first holding member has a planar substrate mounting portion, the centering member includes an outer base for fixing the outer leaf spring to the second holding member, and the outer base is A first surface inclined so as to push the inner leaf spring through the outer leaf spring in a direction toward the substrate mounting portion, and a second surface continuous with the first surface, A second surface that is positioned away from the first holding member and that extends substantially perpendicularly to the plane in which the substrate mounting portion is located; and the outer leaf spring is along the first surface and the second surface. Disclosed is a substrate holder attached to an outer base such that a void is formed therebetween.

Further, in the present application, as one embodiment, the first holding member includes a movable base having a substrate mounting portion formed thereon, and the movable base is movable in a direction perpendicular to a plane on which the substrate mounting portion is located. A substrate holder is disclosed in which the spring is fixed to the movable base.

Further, the present application discloses, as an embodiment, a substrate holder in which the outer base has a slit that allows the outer base to be elastically deformed in a direction toward the substrate rest portion and in a direction away from the substrate rest portion.

Further, the present application discloses, as an embodiment, a substrate holder in which the outer base is a member independent of the second holding member.

Further, according to one embodiment of the present application, when the substrate is sandwiched between the first holding member and the second holding member, the inner leaf spring and/or the inner leaf spring is provided between the substrate and the second surface of the outer base. Alternatively, a substrate holder is disclosed in which an outer leaf spring is configured to be sandwiched with almost no space.

Further, according to the present application, as one embodiment, the second holding member is arranged in an opening for exposing one surface of the substrate, a substrate seal, a holder seal, and a region sealed by the substrate seal and the holder seal. A contact for supplying an electric current to the exposed surface of the substrate.

Further, the present application discloses, as an embodiment, a substrate holder in which the centering member is disposed within the area to be sealed.

Further, the present application discloses, as an embodiment, a substrate holder in which the contacts are members independent of the inner leaf spring and the outer leaf spring.

Further, the present application discloses, as an embodiment, a plating apparatus including a substrate holder according to any one of the embodiments and a plating processing unit having at least one plating tank.

100... Plating device 110... Load port 120... Substrate transfer robot 130... Dryer 140... Substrate attachment/detachment device 150... Plating treatment part 151... Pre-washing bath 152... Pre-treatment bath 153... First rinse bath 154... First plating bath 155... Second rinse tank 156... Second plating tank 157... Third rinse tank 158... Blow tank 160... Transporter 161... Transporter arm 162... Arm vertical movement mechanism 163... Horizontal movement mechanism 170... Stocker 180... Control unit 200... Substrate holder 210... First holding member 211... Hinge 212... Substrate placing part 213... Clamper 214... Hand 220... Second holding member 220OP... Opening part 221, Base part 222... Seal holder 223... Pressing ring 223a... Projection Strip portion 300... Board seal 301... Holder seal 310... Contact point 311... Relay contact point 320... Centering member 321... Outer leaf spring 322... Inner leaf spring 323... Outer base 324... Slit 325... Inner base 330... Movable base 340... Inner ring 400... 1st surface 401... 2nd surface 700... Side wall 1600... Substrate base WF... Substrate

Claims (11)

A first holding member,
A second holding member for sandwiching the substrate with the first holding member;
A centering member for positioning the substrate,
A substrate holder comprising:
The centering member is
An inner leaf spring that is fixed to the first holding member, protrudes beyond a plane where the substrate will be located, and is elastically deformable toward the center of the substrate that will be held;
An outer leaf spring fixed to the second holding member, wherein the outer leaf spring has an inclined portion that is inclined with respect to a plane perpendicular to a plane on which the substrate is located. The outer edge of the outer edge of the board extends beyond the assumed position of the edge of the board,
Have
A substrate holder configured to center the substrate by pushing the substrate through the inner leaf spring when the substrate is sandwiched between the first holding member and the second holding member. The first holding member and/or the second holding member has an opening for exposing at least one surface of the substrate,
The inner leaf spring is elastically deformable toward the center of the opening,
The substrate holder according to claim 1. The first holding member has a planar substrate mounting portion,
The centering member includes an outer base for fixing the outer leaf spring to the second holding member,
The outer base is
A first surface inclined so as to push the inner leaf spring through the outer leaf spring in a direction toward the substrate mounting portion;
A second surface continuous with the first surface, the second surface being positioned farther from the first holding member than the first surface, and extending substantially perpendicular to the plane in which the substrate mounting portion is located. Face of
Equipped with
The outer leaf spring is attached to the outer base such that a gap is formed along the first surface and between the outer surface and the second surface.
The substrate holder according to claim 1 or 2. The first holding member includes a movable base on which the substrate mounting portion is formed, and the movable base is movable in a direction perpendicular to a plane on which the substrate mounting portion is located,
The inner leaf spring is fixed to the movable base,
The substrate holder according to claim 3. The substrate holder according to claim 3, wherein the outer base has a slit that allows the outer base to be elastically deformed in a direction toward the substrate mounting portion and in a direction away from the substrate mounting portion. The substrate holder according to claim 3, wherein the outer base is a member independent of the second holding member. When the substrate is sandwiched between the first holding member and the second holding member, the inner leaf spring and/or the outer leaf plate is provided between the substrate and the second surface of the outer base. The substrate holder according to any one of claims 3 to 6, wherein the spring is configured to be sandwiched with substantially no space. The second holding member,
An opening for exposing one surface of the substrate,
Board seal,
Holder seal,
A contact arranged in a region sealed by the substrate seal and the holder seal, the contact for supplying an electric current to the exposed surface of the substrate;
The substrate holder according to any one of claims 1 to 7, further comprising: The substrate holder according to claim 8, wherein the centering member is arranged in the sealed region. 10. The substrate holder according to claim 8, wherein the contact point is a member independent of the inner leaf spring and the outer leaf spring. A substrate holder according to any one of claims 1 to 10,
A plating treatment section having at least one plating tank;
A plating apparatus comprising: