JPH04326542A - Burn-in equipment of integrated circuit - Google Patents

Abstract

PURPOSE:To omit a transferring work wherein an IC is taken out from an accommodation tool and mounted on a substrate for exclusive use, and enable the test in the state that the IC is contained in a pallet as the accommodation tool as it is, in the burn-in process of ICs. CONSTITUTION:An IC is accommodated in a pallet 2 and sandwiched by substrates 3 from above and below. Leads 1a of the IC 1 are pressed against contactors 3a of the lower substrate by a pressing members 3b of the upper substrate 3. The above state is realized in a high temperature vessel by using a pressing means or the like, and the burn-in test is enabled in the state that the IC is contained in the pellet as it is. The above purpose is attained and, at the same time, also the number of pallets accommodated in the high temperature vessel can be increased.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] This invention relates to integrated circuits (hereinafter referred to as IC).
This relates to a burn-in device used in a burn-in test (a test in which ICs are energized and screened in a high-temperature chamber).

0002

2. Description of the Related Art FIG. 8 shows a conventional burn-in device. In the figure, 11 is a burn-in furnace that heats, energizes, and tests the IC, 11a is a board socket provided in the furnace, and 1
2 is a burn-in board on which a plurality of ICs are mounted, 13 is a plurality of burn-in boards 12 with a predetermined gap,
It is a carrier to hold. FIG. 9 shows the burn-in board 1
2, 12a is an IC socket provided on the board 12, and 12b is each pin of the socket 12a and the printed circuit 12.
The board connector part connected by c, 1 is the IC,
14 is a tube that stores the IC1, and 2 is a pallet that stores the IC1.

Next, a procedure for performing a burn-in test using this device will be explained. As shown in FIG. 9, IC1
is taken out from the tube 14 and attached to the IC socket 12a on the board 12. Board 12 with all ICs installed
is stored in the carrier 13 shown in FIG. The carrier 13 containing all the substrates is pushed into the burn-in furnace 11 and stored. At this time, the connector portion 12b on the board 12 is inserted into the board socket 11a in the furnace and electrically conductive. Thereafter, the temperature is raised, electricity is applied, and a test is performed. After the test is completed, the carrier 13 is taken out from the furnace, and the IC 1 on the substrate 12 is taken out and returned to the tube 14 or the pallet 2.

0004

Since the conventional burn-in apparatus is constructed as described above, it is necessary to insert the IC into the burn-in board and remove it from the board just for this process. Furthermore, since it is necessary to provide a gap between the substrates, there is a problem in that the number of burn-in substrates that can be stored in the furnace is also limited.

[0005] This invention was made to solve the above-mentioned problems, and aims to eliminate the need for attaching and detaching ICs to IC sockets after the burn-in process, and to increase the number of ICs stored in the burn-in furnace. shall be.

[0006]

[Means for Solving the Problems] A burn-in device according to the present invention comprises a substrate layer on which a plurality of ICs are mounted and housed, and a high-temperature bath where the substrate layer is housed and internally tested.

The substrate layer consists of a pallet on which a plurality of ICs are positioned and mounted, and a substrate having a contactor at a position corresponding to the lead position of the IC and a presser for pressing the lead against the contactor. and boards are stacked alternately.

[0008]

[Operation] In the present invention, a substrate layer made of pallet substrates is stored in a high temperature bath, and a press provided in the bath pressurizes the substrate layer. At this time, the IC on the pallet is pressed against the contactor provided on the board one board below, and makes electrical contact. In this way, a burn-in test can be performed without removing the IC from the pallet that is the storage means.

[0009]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is an IC, 2 is a pallet that stores the IC, 3 is a board that sandwiches the pallet 2 from above and below, 3a is a contactor that contacts the IC lead 1a, and 3b is a contactor for pressing the IC lead 1a from above onto the contactor 3a. This is a lead presser (hereinafter referred to as a presser). FIG. 2 shows an overall view of the board layer 4 in which multiple sets of the pallet 2 and the board 3 are stacked in a sandwich-like manner, and FIG. 3 is a detailed view of the pallet 2, in which 2a is a pocket for storing and positioning an IC, and 2b is a pocket for storing and positioning an IC. A hole drilled at the bottom along the side wall of pocket 2a,
This is for bringing the IC lead 1a into contact with the lower contactor 3a. FIG. 4 is a detailed view of the board 3, in which 3a is a contactor for contacting the IC lead;
3d is a printed circuit that electrically connects the contactor 3a and the electrode 3c; 3b is a lead holder shown in FIG. 1; The presser 3b is provided on the upper surface of the substrate 3, and the presser 3b is provided on the lower surface of the substrate 3. In Figure 5,
Reference numeral 5 denotes a high-temperature bath that houses the substrate layer 4, and in addition to heating and temperature raising means not particularly shown in the figure, a press 5a that presses the substrate layer 4, and a socket 5 that contacts the electrode 3c in the substrate 3.
It has b.

Next, the operation will be explained. As shown in FIG. 1, when the pallet 2 containing the IC1 is sandwiched between the boards 3 from above and below, the contactor 3a on the board 3 connects to the lead 1a of the IC1 in the pallet 2 above, and the pallet 2 shown in FIG. Contact is made through hole 2b on the bottom. When the whole is pressurized from above, the lead 1a is pushed downward by the presser 3b provided on the lower surface of the upper substrate 3, and is pressed against the contactor 3a shown in FIG. 4. All the ICs 1 in each pallet 2 of the board layer 4 shown in FIG.
electrically conductive with.

Next, the substrate layer 4 is placed in a high-temperature bath 5 shown in FIG. 5, and pressurized from above with a press 5a, thereby ensuring the contact between the IC leads and the contactors as described above. After pressing is completed, the electrode 3c of each substrate is connected to the socket 5b in the tank, and a burn-in test is performed. After the test, disconnect the electrode 3c from the socket 5b, release the press,
The substrate layer 4 is taken out from the high temperature bath 5. Even if the substrate layer 4 is disassembled, the IC 1 remains stored on the pallet 2, so it can be transported and put into the next process as it is.

Example 2. In the above embodiment, a pressurizing mechanism is provided in the high temperature bath, but as shown in FIG. 6, the substrate layer may be compressed and fixed with screws or the like before being put into the high temperature bath.

Example 3. In the above embodiment, an example was shown in which the IC was housed in a pallet, but similar means can be applied as long as the IC is positioned and the lead portion can be contacted from above and below. An IC frame shown in FIG. 7 may be used.

Example 4. Furthermore, it is also possible to reduce damage to the IC leads by using an elastic body as a presser provided on the bottom surface of the substrate. Furthermore, it is also possible to obtain better electrical continuity by using the presser itself as an electrode and contacting the IC lead from both the upper and lower sides.

[0015]

[Effects of the Invention] As described above, according to the present invention, when performing burn-in, the enormous work of transferring ICs from a jig such as a pallet to a burn-in board can be omitted, and the number of ICs that can be stored in a high-temperature bath can be reduced. Since the spacing between pallets can be compressed to the same level as the board thickness, it is possible to significantly increase the number of pallets compared to conventional methods.
Work efficiency can be improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing essential parts of a first embodiment of the invention.

FIG. 2 is an external perspective view of FIG. 1.

FIG. 3 is a perspective view of a pallet.

FIG. 4 is a perspective view of the substrate.

FIG. 5 is a sectional view of a high temperature bath showing Example 1 of the present invention.

FIG. 6 is a perspective view of a substrate layer showing Example 2 of the present invention.

FIG. 7 is a plan view of an IC frame showing a third embodiment of the invention.

FIG. 8 is a perspective view showing a conventional burn-in device.

FIG. 9 is a perspective view showing a conventional burn-in board.

[Explanation of symbols]

1 IC 1a IC lead 2 Palette 2a Pocket 2b hole 3　　　　　Substrate 3a Contactor 3b Presser 3c Electrode 3d printed circuit 4 Substrate layer 5 High temperature bath 5a Press 5b socket

Claims (2)

[Claims] [Claim 1] In an IC burn-in device consisting of a board layer on which a plurality of ICs are mounted and housed, and a high-temperature tank that houses the board layer and performs internal testing, it corresponds to the IC leads of the pocket that houses the ICs. A pallet with a hole in the bottom, a contactor corresponding to the above IC lead on the top surface, a lead holder corresponding to the above IC lead on the bottom surface, and an electrode connected to the above contactor by a printed circuit on the end surface. 1. A burn-in device for an integrated circuit, characterized in that the pallet is sandwiched between the substrates from above and below to form a substrate layer. [Claim 2] An IC burn-in device comprising a substrate layer on which a plurality of ICs are mounted and housed, and a high-temperature chamber that houses the substrate layer and performs internal tests, in which a plurality of ICs are connected together. It is equipped with a frame, a substrate having a contactor corresponding to the IC lead on the upper surface, a lead holding device corresponding to the IC lead on the lower surface, and an electrode connected to the contactor by a printed circuit on the end surface. . A burn-in device for an integrated circuit, characterized in that a substrate layer is formed by sandwiching the IC frame between the substrates from above and below.