JPS6035278A - Inspecting device - Google Patents

Abstract

PURPOSE:To shorten the distance between a terminal and the terminal of a tester by providing a heating means on a pressurizing piece adapted to be pressed in contact with the terminal pushing a lead to eliminate the arrangement a heating means on the terminal side. CONSTITUTION:A handler is equipped with a socket 4 horizontally installed and a void 5 is formed enough to house an IC1 at the center of the socket 4. On a substrate 6 arranged on the bottom of the void 5, a plurality of terminals 7 are arranged on four arms corresponding to a lead 3 of the IC1 and errected and then, connected electrically to each terminal of a tester for implementing a selective inspection. Above the socket 4, a cylinder device 9 is provided on the center line of the void 5 and a pressurizing piece 10 is fastened at the lower end of a piston rod 9a thereof. A lead holder 11 is projected about the under- surface of the pressurizing piece 10 and a heater 12 is provided at the center thereof as heating means so as to ensure that a flat pack package 2 of the IC1 can be heated up to a specified temperature.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to inspection technology, particularly to electronic components such as semiconductor devices (
Hereinafter referred to as IC. ) is referred to as a flat back pan cage (hereinafter referred to as Fl) P, for example. ) type IC
Concerning effective techniques for use in autohandlers.

[Background Art] There is a demand for the development of an autohandler that can automatically perform screening inspections on FPP type ICs.

In FPP type ICs, the external leads protrude axially in all directions from the PPP, so it is necessary to apply the terminals to the external leads at right angles and press the external leads from the opposite side with a pressure piece to bring them into pressure contact with the terminals. It is believed that there is.

In the selection and inspection of ICs, it may be necessary to test the ICs at high temperatures, and in such cases, it is usually considered to provide means for heating the ICs on the terminal side.

However, if the IC pressurizing means is placed on the terminal side, the distance between the tester terminal and the terminal becomes longer, which increases the line capacitance between the terminals, making it impossible to perform tests using high frequencies. The present inventor has revealed that there is a problem.

[Object of the Invention] An object of the present invention is to provide an inspection technique that can shorten the distance between terminals of a tester.

Another object of the present invention is to provide an inspection technique that allows testing to be performed using signals in a higher frequency band.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

In other words, by providing a heating means in the pressure piece that presses the lead into pressure contact with the terminal, it is possible to omit the provision of a heating means on the terminal side and shorten the distance between the branch wire and the terminal of the tester. This is what I did.

[Example] Fig. 1 is a longitudinal sectional view showing an FPP type IC autohandler which is an embodiment of the present invention, and Figs. 2, 3, 4 and F5 are longitudinal sectional views showing each operating state thereof. 6 is a plan view taken along the line Vl-VI in FIG. 2. In this embodiment, the ICI as an electronic component to be subjected to screening inspection is equipped with an FPP 2 formed in a square flat plate. , this FPP
A plurality of leads 3 are provided axially protruding from each of the four sides of 2. The lead 3 is bent in a zig-zig shape at the middle part, and the direction of the bend is usually on the lower side.

This handler is equipped with a socket 4 installed horizontally, and a cavity 5 is formed in the center of the socket 4 in which an ICI can be accommodated. A substrate 6 placed at the bottom of the empty space 5
A plurality of terminals 7 are arranged upright on four sides so as to correspond to the ICI board 3, and the terminals 7 are connected to each terminal (not shown) of the tester that performs the screening test.
electrically connected directly to or through a short wire.

Although the top of the terminal 7 slightly protrudes from the upper surface of the socket 4, the terminal 7 is fitted into a guide groove (not shown) in the socket 4 to prevent it from falling sideways.

A plurality of holes 8 as positioning recesses are formed in the socket 4 so as to open at the upper surface.

A cylinder device 9 is installed above the socket 4 on the center line of the cavity 5, and a pressure piece 10 is fixed to the lower end of the piston rod 9a. A lead presser 11 is provided protruding from the lower surface of the pressure piece 10 at its periphery, and a heater 12 serving as pressurizing means is provided at the center thereof so as to heat the ICI FPP 2 to a predetermined temperature.

This handler is equipped with a positioning device 13, which includes a jig 14, a jig support stand 15, and a transfer device 16.
It is equipped with The receiver stand 15 is placed horizontally at a location different from the socket 4, and is formed in substantially the same shape as the socket 4. A hollow space 17 capable of accommodating an ICI is formed in the center of the support base 15, and a plurality of holes 18 as positioning recesses are bored outside the hollow space 17 so as to open at the top surface. Below the platform 15, an elevator 19 consisting of a jack or the like is installed on the center line of the space 17, and at the upper end of the ram 19a there is an ICI
A receiving member 20 for receiving is fixed horizontally.

The jig 14 is formed into a square flat plate, and in the center thereof,
An alignment hole 21 having a diameter equal to the outer diameter of the ICI glue 3 is concentrically drilled. A guide slope 22 is formed at the upper part of the alignment hole 21 so as to extend upwardly. On the lower surface of the jig 14, a plurality of pins 23 as a positioning convex portion are arranged outside the positioning hole 21 and protrude.
5, 68 and 1B.

The transfer device 16 includes a holder 24, which
4 is an ICI storage station (not shown) by a combination of appropriate moving means and elevating means (not shown).
, the receiver is configured to be able to reciprocate and move up and down in the space between the stand 15 and the socket 4. The holder 24 has a first suction port 25 as a means for holding the ICI at the center of its lower surface, and a plurality of second suction ports 26 as means for holding the jig 14 around the lower surface thereof. The first
The second suction port 25.26 is connected to a first and second negative pressure supply path 27.26 connected to a negative pressure pump or the like (not shown).
28 are connected to each other.

Next, the action will be explained.

The holder 24 holds an IC stored in a tray (not shown) or the like.
I is sucked and held by the suction port 25, and the receiver is placed on the stand 15.
Carry it in until it is directly above it. At this time, as shown in FIG. 1, the jig 14 is positioned and centered on the stand 15 by fitting its pin 23 into the hole 18. When the IC 1 is carried in, the receiving member 2o is raised by the elevator 19, as shown by the imaginary line in FIG.
The receiver allows the rci to be transferred silently from the holder 24.

Subsequently, as shown in FIG. 2, the receiving member 2o that has received the Icl is lowered by the elevator 19, and the
I is fitted into the alignment hole 21 of the jig 14. At this time, since the guide slope 22 is formed above the alignment hole 21, even if there is an error in alignment between the ICI on the member 20 and the alignment hole 21, the guide slope 22
The ICI is automatically aligned by being guided by the lead 3 of the IC, and the ICI is appropriately introduced into the alignment hole 21. Since the inner diameter of the alignment hole 21 and the outer diameter of the lead 3 are set equal, as shown in FIG. are set in the jig 1 in a predetermined alignment state.

In this cent state, the holder 24 is lowered, and the holder 24 suction-holds the ICI FPP 2 with its first suction port 25 and the jig 14 with its second suction port 26, as shown in FIG. With the ICI centered, the jig 14 is lifted from the cradle 15 and removed.

The holder 24 holding the ICI and the jig 14 is moved directly above the socket 4 and then lowered.

Thereby, as shown in FIG. 4, the jig 14 is set on the socket 4 in an accurately positioned state by fitting its pin 23 into the 68. In this positioning state, the jig 1 is placed so that the ICI lead 3 set in the jig 14 and the terminal 7 of the socket 4 face
4 alignment hole 21, IC lead 3, pin 23, hole 8
Since the correlation between the terminals 7 and 7 is set in advance, the leads 3 of the IC 1 and the terminals 7 are accurately aligned and come into contact with each other.

Next, the holding tool 24 is released from holding, and the jig 14 and JC
Leave the holder 1 set in the socket 4 and remove it from the socket 4.

Subsequently, as shown in FIG.
The lead 3 is pressed into contact with the terminal 7 with a predetermined pressing force, and the heater 12 is brought into light contact with the ICI(7) FPP 2. The heater 12 heats the IC 1 to a predetermined temperature. To ensure that this heating is carried out effectively, the ICI is reversed (
It is preferable to cent it with the bottom facing upwards. Incidentally, if the ICI is inserted into the jig 14 in the opposite direction, the center of gravity will be lowered, so that the above-described positioning of the IC will be effectively executed.

In this way, when the lead 3 is properly pressed into contact with the terminal 7 and the PPP 2 is heated to a predetermined temperature, a test signal is input from the tester to the terminal 7, and a predetermined test is executed as appropriate. At this time, the terminal 7 is configured so that the point of contact with the lead 3 is close to the terminal of the tester,
Since the line capacitance is kept small, it is also possible to apply a test signal in a high frequency band to the ICI. Therefore, inspection under desired conditions becomes possible and highly reliable screening inspection is ensured. The reason why the distance between the terminals 7 and the terminals can be shortened is that there is no need to provide a space occupied by the heater on the socket side.

After the inspection is completed, the pressure piece 10 is raised by the cylinder device 9, the ICI is transferred to a predetermined location by the transfer device 16 depending on whether it is a good product or a defective product, and the jig 14 is moved to a cradle 15.
returned to the top.

Thereafter, the above-mentioned operations are repeated to automatically and individually perform a selection test for FPP type ICs.

[Effect (1): By providing the heating means in the pressurizing piece, it becomes possible to conduct tests under high temperature conditions in the selection and inspection of electronic components.

(2) By providing the heating means on the pressure piece, there is no need to provide the heating means on the terminal side, so the distance between the test terminals can be shortened, and the line capacitance between the terminals can be kept small. This makes it possible to carry out inspections using high frequencies.

(3) By making the pressure piece movable, the terminal side can be made into a fixed structure, which simplifies the electrical wiring structure and provides enough space to attach electronic components to the terminals. can be secured.

(4) By inserting the electronic component into the jig and positioning the jig with respect to the terminal to ensure alignment between the lead and the terminal, it is possible to make accurate contact between the lead and the terminal. .

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, in addition to making the pressure piece movable, the terminal side can also be made movable.

The alignment of the leads and terminals of electronic components is not limited to the method of fitting the electronic components into a jig.

The positioning unevenness can be replaced between the jig, the socket, and the pedestal.

An electromagnetic device or the like may be used as a means for holding the jig and electronic components for transfer.

[Field of Application] In the above description, the invention made by the present inventor was mainly applied to an autohandler of an FPP type IC, which is the field of application that formed the background of the invention, but the present invention is not limited to this. For example, it can be applied to the case where the leads of axial lead type resistors, capacitors, single in-line packaged ICs, dual in-line packaged ICs, etc. are brought into pressure contact with measurement terminals.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention, FIGS. 2, 3, 4 and 5 are longitudinal sectional views showing each operating state thereof, and FIG. 6 is the 2nd embodiment of the present invention. It is a top view along the VI-Vl line. ■...IC (electronic component), 3...Lead, 4...
Socket, 5... Blank space, 6... Board, 7... Terminal, 8.18... Hole (positioning recess), 9... Cylinder device, 10... Pressure piece, 11...・Lead holding,
12... Heater, 13... Positioning device, 14.
...Jig, 15...Jig holder is stand, 16...Transfer device, 17...Empty space, 19...Elevator, 20...
The receiver is a member, 21... Positioning hole, 22... Guide slope, 23... Pin (positioning recess), 24... Holder, 25.26... Suction port, 27° 28...・Negative pressure supply path.

Claims (1)

[Scope of Claims] 1. An inspection device characterized in that a heating means is provided on a pressure piece that presses a lead of an electronic component and brings it into contact with a terminal. 2. The inspection device according to claim 1, wherein the pressurizing piece is movable. 3. The inspection device according to claim 1, wherein the electronic component is fitted into a jig and the leads are aligned with the terminals.