KR20220017680A - Semiconductor test device - Google Patents

Abstract

According to the present invention, a semiconductor element can be easily attached to and detached from a test socket without mechanical coupling by using a clamping module using air pressure. In addition, the present invention can stably connect terminals and connection terminals as deformation by physical force on the semiconductor element is small and prevent poor engagement of connection terminals.

Description

Semiconductor device test device {SEMICONDUCTOR TEST DEVICE}

The present invention relates to a semiconductor device testing apparatus.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices thus formed may be manufactured into finished products through a dicing process, a bonding process, and a packaging process. .

These semiconductor devices may be determined to be good or defective through electrical characteristic inspection. A semiconductor device testing apparatus including a test handler for handling semiconductor devices and a tester for testing semiconductor devices may be used for electrical characteristic testing.

The test handler may include a test tray having a plurality of inserts, an interface module electrically connecting the semiconductor devices and the tester, and a match plate connecting the semiconductor devices and the interface module to each other.

The insert may include a pocket in which the semiconductor device is accommodated, and latches for preventing the semiconductor device from being separated. For example, there is disclosed an insert assembly including an insert body having an opening into which a semiconductor device is inserted, and a film-type support member attached to a lower portion of the insert body and supporting the semiconductor device. In particular, the support member may have a plurality of guide holes into which connection terminals of the semiconductor device are inserted.

The interface module may include a plurality of test sockets electrically connected to the semiconductor devices. The test socket includes terminals for external connection of the semiconductor device, for example, connection terminals such as a pogo pin or a probe pin for contacting solder balls.

Looking at the process of electrical property inspection, first, a semiconductor element is accommodated in an insert, and then a test socket is connected to the semiconductor element accommodated in the insert to electrically connect the semiconductor element and the tester. Then, a test signal is applied to the semiconductor device from the tester, and the semiconductor device outputs a signal in response to the test signal. The tester determines whether the output signal of the semiconductor device is a normal signal or an error signal to determine the semiconductor device as good or defective.

In particular, in the electrical characteristic test of semiconductor devices, when the solder balls of the semiconductor device and the connection terminals of the test socket are not normally aligned, the electrical connection between the semiconductor device and the tester is not stably made. Characteristic check is not done properly.

In order to prevent such defects, the semiconductor device testing apparatus includes a support film for aligning solder balls and connection terminals. The support film has a plurality of guide holes into which the solder balls are inserted, and is disposed between the insert and the test socket.

On the other hand, as the size of the solder balls of the semiconductor device is gradually reduced and the spacing between the solder balls is gradually decreased, it is very difficult to align the solder balls of the semiconductor device and the connection terminals of the test socket. Due to this, a defect in which the solder balls of the semiconductor device are caught in the guide holes of the support film may occur, it may be difficult to correct an alignment error over a certain range, and the support film may be deformed by a physical force.

In addition, in the test device, since the coupling between the semiconductor element and the insert and the socket guide is made at several points, cumulative tolerances occur. Such a cumulative tolerance causes misalignment between the fine pitched solder balls and contact terminals, and thus there is a problem in that the electrical inspection of the semiconductor device cannot be accurately performed.

In addition, as a strong bonding force is provided between the semiconductor device and the test socket as precise alignment is required, and a strong physical force is required to separate the semiconductor device, there is a problem in that the semiconductor device may be deformed.

Korean Patent Publication No. 10-1535245

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device testing apparatus capable of facilitating attachment and detachment between a semiconductor device and a test socket as well as an alignment accuracy therebetween.

A semiconductor device testing apparatus according to an aspect of the present invention includes: a loading unit for loading at least one test tray into a test tray for testing a semiconductor device; a test chamber including a semiconductor device pressing device for pressing the semiconductor device loaded onto the test tray transferred from the loading unit toward the test device; and an unloading unit for unloading the semiconductor device from the tray transferred from the test chamber, wherein the test chamber includes: a test head having a plurality of test sockets disposed at regular intervals; a test tray accommodating the semiconductor device SD; a carrier module installed movably with respect to the test socket; a match plate for pressing the semiconductor device SD; and a fluid supply unit that pressurizes the match plate with a fluid, wherein the test head and the test tray are brought into contact with each other by a clamping module.

In addition, the fluid supply unit is characterized in that it supplies compressed air of a predetermined pressure.

In addition, the clamping module is characterized in that the contact through the suction hole, the suction hole is characterized in that the suction by vacuum.

In addition, the test socket is characterized in that it has a plurality of connection terminals for connection with the semiconductor package.

According to the present invention, by using the pneumatic clamping module, attachment and detachment of the semiconductor device and the test socket can be facilitated without mechanical coupling.

In addition, since deformation due to physical force on the semiconductor device is small, it is possible to stably connect the connection terminals to the connection terminals, and it is possible to prevent pinching of the connection terminals.

Effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 shows an example of a schematic structure of a semiconductor device testing apparatus according to an embodiment of the present invention.
2 shows an example of a schematic structure of a test chamber according to an embodiment of the present specification.
3 shows another example of a schematic structure of a test chamber according to another embodiment of the present specification.
4 shows an example of a schematic structure for inspection of a semiconductor device according to an embodiment of the present specification.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in several different forms and is not limited to the embodiments described herein.

In order to clearly explain the present invention, parts irrelevant to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

In addition, in various embodiments, components having the same configuration will be described using the same reference numerals only in the representative embodiment, and only configurations different from the representative embodiment will be described in other embodiments.

Throughout the specification, when a part is said to be “connected” to another part, it includes not only a case in which it is “directly connected” but also a case in which it is “indirectly connected” with another member interposed therebetween. In addition, when a part "includes" a certain component, this means that other components may be further included rather than excluding other components unless otherwise stated.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

1 shows an example of a schematic structure of a test handler 100 according to an embodiment of the present specification. 1 is a schematic structural diagram of a test handler 100 viewed from the ceiling side. In this specification, the test handler 100 refers to a device that electrically connects a semiconductor device to a test interface in order to test a function and/or performance of a semiconductor device on which semiconductor processing and packaging have been performed. In addition, for the inspection of the semiconductor device, the test handler 100 transfers the delivered semiconductor device to a tray, creates an environment (eg, temperature) for the test, classifies the semiconductor device on which the test is completed according to a grade, A semiconductor element can be carried out. In this specification, a case in which the test handler 100 is connected to the test device through the test interface is described, but the embodiment of the present specification is not limited thereto, and the test handler 100 and the test device may be integrally configured. have. That is, the test handler 100 may also be referred to as a test device.

Referring to FIG. 1 , the test handler 100 may include a loading unit 110 , a first chamber 120 , a test chamber 130 , a second chamber 140 , and an unloading unit 150 . . First, a customer tray (or C-Tray) 30 accommodating a semiconductor device SD to be inspected is input to the test handler 100 . The loading unit 110 loads the semiconductor device SD stored in the customer tray 30 into the test tray (or T-Tray) 20 . Here, the test tray 20 and the customer tray 30 may have different sizes, the number of slots capable of accommodating the semiconductor device SD, or a distance between the slots. Although not shown, the loading unit 110 may include a pickup device for adsorbing the semiconductor device SD, a driving unit for moving the pickup device, and a moving rail. The test tray 20 on which the semiconductor device SD is mounted may be transferred to the first chamber 120 by a transfer device (not shown).

The first chamber 120 is a space for storing the test tray 20 and may be maintained as a temperature environment (first temperature) for testing. That is, the first chamber 120 may store the test tray 20 transferred from the loading unit 110 at the first temperature. The first temperature is a temperature for presetting the semiconductor device SD as a test temperature for testing in the test chamber 130 . That is, the first temperature may be the same as the test temperature or a temperature similar to the test temperature. The first chamber 120 may be referred to as a soak chamber. The test tray 20 stored in the first chamber 120 may be transferred to the test chamber 130 by a transfer device (not shown).

The test chamber 130 is coupled to the test interface 170 to perform a test on the semiconductor device SD, and provides an environment for testing the semiconductor device SD. The test interface 170 may be in contact with the semiconductor device SD to apply an electrical signal, and may transmit a signal output by the semiconductor device SD to a test device (not shown). In the test chamber 130 , a semiconductor device pressurizing device 220 for pressing the semiconductor device SD to bring the semiconductor device SD into contact with the test interface 170 may be provided. Configurations for testing the semiconductor device SD in the test chamber 130 will be described in more detail with reference to FIGS. 2 to 4 below. The semiconductor device SD that has been tested in the test chamber 130 may be transferred to the second chamber 140 .

The second chamber 140 is a space for storing the test tray 20 in which the semiconductor device SD, which has been tested, is accommodated, and may be maintained at room temperature (second temperature). That is, the second chamber 140 may store the test tray 20 transferred from the test chamber 130 at the second temperature. The test tray 20 stored in the second chamber 140 may be transferred to the unloading unit 150 by a transfer device (not shown). The unloading unit 150 may unload the semiconductor devices SD of the test tray 20 transferred from the second chamber 140 by classifying them according to grades.

2 shows an example of a schematic structure of a test chamber 130 according to an embodiment of the present specification. FIG. 2 shows an example of the test chamber 130 of FIG. 1 . Referring to FIG. 2 , the semiconductor device pressurizing device 200 may be positioned in the test chamber 130 , and a test tray 20 accommodating the semiconductor device SD pressed by the semiconductor device pressurizing device 200 is provided. can be located Here, the fluid supply unit 210 may be included in the semiconductor element pressurizing apparatus 200 or may be configured separately from the semiconductor element pressurizing apparatus 200 . In addition, an upper FFU 240 and a lower FFU 250 are installed in the upper and lower portions of the test chamber 130 , respectively. A test interface 170 connecting the semiconductor device SD and the test device may be docked with respect to one sidewall of the test chamber 130 . A method in which the test tray 20 is docked in a vertically erected state as shown in FIG. 2 may be referred to as a vertical docking system.

3 shows another example of a schematic structure of a test chamber according to an embodiment of the present specification. 3 shows an example of the test chamber 130 of FIG. 1 . Referring to FIG. 3 , the semiconductor device pressurizing device 200 may be positioned in the test chamber 130 , and a test tray 20 accommodating the semiconductor device SD pressed by the semiconductor device pressurizing device 200 is provided. can be located Here, the fluid supply unit 210 may be included in the semiconductor element pressurizing apparatus 200 or may be configured separately from the semiconductor element pressurizing apparatus 200 . A test interface 170 connecting the semiconductor device SD and the test device may be docked with respect to the lower region of the test chamber 130 . A method of docking the test tray 20 in a state in which it is laid in a horizontal direction as shown in FIG. 3 may be referred to as a horizontal docking system.

4 shows an example of a schematic structure for inspection of a semiconductor device according to an embodiment of the present specification. In FIG. 4 , the test interface 170 includes a test head 10 in which a plurality of test sockets 12 are arranged at regular intervals. In addition, in the test chamber 130 , a test tray 20 accommodating the semiconductor device SD, the carrier module 21 movably installed with respect to the test socket 12 , and a match for pressing the semiconductor device SD are provided. The plate 230, the semiconductor element pressurizing device 220 that presses the pusher 234 of the match plate 230 with the fluid supplied from the fluid supply unit 210, and a predetermined pressure applied to the semiconductor element pressurizing apparatus 220 The fluid supply unit 210 for supplying compressed air of the is located.

The test head 10 is provided with a protruding clamping module 14 supported by both ends of the test tray 20 in contact with each other.

Tray stoppers 11 supported by both ends of the test tray 20 in contact with both sides of the test head 10 protrude by a predetermined distance are provided. In addition, each test socket 12 is provided with a plurality of connection pins 13 electrically connected to a terminal such as a ball of the semiconductor element SD in the central portion, and the carrier module 21 is in contact with both sides. The supported carrier stopper 14 is formed to protrude to a predetermined thickness. The connection pin 13 may be configured as, for example, a pogo pin.

In the related art, a pair of guide pins inserted into the guide grooves of the carrier module 21 protrude from both sides of the test socket 12 . In the case of using the guide pins as described above, there is a possibility that the coupling of the plurality of guide pins is not normally mounted, or physical damage may occur when trying to separate the guide pins by the strong coupling force of the guide pins.

Accordingly, in the present invention, as shown in FIG. 4 , the test head 10 and the test tray 20 are connected by using the clamping module 14 .

The clamping module 14 suffices as long as it can stably hold and separate the test head 10 and the test tray 20 . As an example, as shown in FIG. 4 , it may be an adsorption hole. A guide groove 26 may be formed in the test tray as a portion corresponding to the suction hole. The guide groove 26 helps to more easily adsorb the suction hole. Since the test tray 20 is vacuum-adsorbed by the suction hole, the guide pin is not properly coupled in the process of testing the semiconductor device SD of the test tray 20, so the test head 10 and the test tray 20 Interference of the insert does not cause damage to the insert. In addition, when the test tray 20 is separated, it can be separated without applying excessive physical force.

The test tray 20 is for transporting the semiconductor device SD in a fixed state in the test handler, and a plurality of carrier modules 21 for fixing and releasing the semiconductor device SD to the metal frame in the shape of a square frame are provided at regular intervals. do.

The carrier module 21 includes a body 22 , a seating portion 24 , and a protrusion 25 . The body 22 is provided in the test tray 20 to be able to flow to a certain extent and has a cavity 23 in the center. The body 22 has a substantially rectangular frame shape, and accommodates the semiconductor device SD in the cavity 23 .

The seating part 24 is provided on the lower surface of the body 22 and the semiconductor device SD is mounted thereon. The seating part 24 has openings exposing terminals of the semiconductor device SD. The connection pin 13 may be connected to terminals of the semiconductor device SD through the openings. The protrusions 25 protrude from the inner surface of the body 22 having the cavity 23 to support the side surface of the semiconductor device SD seated on the seating portion 24 .

The match plate 230 presses the semiconductor element SD and the connection pin 13 to contact each other by using the force applied by the semiconductor element pressing device 220 . The match plate 230 includes a movable plate 231 , a pneumatic cylinder 233 that moves the movable plate 231 , and is arranged at regular intervals on the movable plate 231 , and according to the movement of the movable plate 231 , the carrier A carrier pressing block 232 for pressing the module 21, and a plurality of pushers 234 movably installed in the central portion of each carrier pressing block 232 to press the semiconductor element SD with a predetermined pressure. includes

Here, each of the pushers 234 includes a movable shaft 235 moving by the piston 222 and a contact portion movably installed at the front end of the movable shaft 235 to elastically contact the semiconductor device SD. 237) and a compression spring 236 installed between the movable shaft 235 and the contact portion 237.

The semiconductor element pressurizing device 220 includes a through-hole through which a fluid flows and a cylinder body forming a cylindrical space having an opening on the opposite side of the through-hole, and a cylinder liner coupled to be fixed to a side area of the cylindrical space of the cylinder body; It may include a piston inserted into the cylindrical space formed in the cylinder body, and inserted into the cylindrical space to be movable by the pressure of the fluid. The cylinder body and the cylinder liner may be integrally configured or may be configured as separate modules.

Although various embodiments of the present invention have been described above, the drawings and the detailed description of the described invention referenced so far are merely exemplary of the present invention, which are only used for the purpose of explaining the present invention and are not intended to limit meaning or claim claims. It is not intended to limit the scope of the invention described in the scope. Therefore, it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the true technical protection scope of the present invention should be defined by the technical spirit of the appended claims.

10: test head
11: stopper
12: test socket
13: connection pin
14: clamping module
15: Euro
20: test tray
21: carrier module
22: body
23: cavity
24: seating part
25: protrusion
26: guide groove
30: customer tray
100: test handler
110: loading unit
120: first chamber
130: test chamber
140: second chamber
150: unloading unit
170: test interface
200: semiconductor element pressurizing device
210: fluid supply unit
230: match plate
231: movable plate
232: pressure block
234: pusher
235: movable shaft
236: compression spring
237: contact

Claims (5)

a loading unit for loading the at least one semiconductor device into a test tray for testing;
a test chamber including a semiconductor device pressing device for pressing the semiconductor device loaded onto the test tray transferred from the loading unit toward the test device; and
An unloading unit for unloading the semiconductor device of the tray transferred from the test chamber;
a test head having a plurality of test sockets disposed at regular intervals in the test chamber;
a test tray accommodating the semiconductor device SD;
a carrier module installed movably with respect to the test socket;
a match plate for pressing the semiconductor device SD; and
a fluid supply unit that pressurizes the match plate with a fluid;
including,
The test head and the test tray are in contact with each other by a clamping module.
The semiconductor device testing apparatus according to claim 1, wherein the fluid supply unit supplies compressed air of a predetermined pressure.
According to claim 1,
The clamping module is a semiconductor device testing apparatus, characterized in that the contact through the suction hole.
4. The method of claim 3,
The device for testing a semiconductor device, characterized in that the suction hole is sucked by vacuum.
According to claim 1,
The test socket is a semiconductor package test apparatus, characterized in that it has a plurality of connection terminals for connection with the semiconductor package.

Images