JP2007291463A - Method and system for plating electronic circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the manufacture of plated defective products by almost uniformizing the plating thickness of an electronic circuit board in a plating fixture used in a plating line. <P>SOLUTION: An method for plating an electronic circuit board is characterized in that an electronic circuit board to be plated is attached to and held by the plating fixture 23 and after the plating fixture 23 is attached to a plating fixture conveying apparatus 21 in the plating line, the resistance value of the electronic circuit board in the plating fixture 23 is measured in the plating line, and that when the resultant measured value is equal to or below a preset resistance value, the plating is carried out and when the measured value is larger than the preset resistance value, the plating fixture 23 is removed from the plating line. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a plating method and a plating system for an electronic circuit board, and in particular, in a plating line for plating the electronic circuit board using a plating jig for holding the electronic circuit board. The present invention relates to a plating method and a plating system for an electronic circuit board in which functions of manufacturing equipment used in a plating line are improved in order to make the plating thickness substantially uniform.

Conventionally, in a manufacturing process for forming a wiring pattern on the surface of an electronic circuit board such as a semiconductor wafer or a printed wiring board, for example, as shown in Patent Document 1, when a wafer is subjected to a predetermined process in a reaction vessel, In order to perform optimum and highly accurate temperature control of the wafer temperature, a method of measuring the wafer resistivity and calculating the wafer temperature based on the measured value of the wafer resistivity is performed. The so-called wafer resistance measurement at this time is performed in order to calculate, manage and control the wafer temperature. When measuring the resistance value of the wafer, the wafer resistivity is measured by applying a pair of probes to the lower surface of the wafer. Alternatively, it is described that two pairs of probes are applied, spread resistance in two circuits → wafer resistivity → wafer temperature, and an average value thereof, a four-probe method, or another measurement method is used. Has been.
Japanese Patent Laid-Open No. 5-67662

  By the way, the purpose of the conventional wafer resistance measurement is to calculate, manage, and control the temperature of the wafer when receiving a predetermined process in a reaction vessel in a so-called semiconductor wafer manufacturing process. Therefore, it is not intended to reduce the plating thickness variation in the plating process, which is one of the manufacturing processes of the semiconductor wafer, and eliminate defective products in the plating process.

  In the conventional wafer plating process, the wafer is housed in a plating jig, the plating jig is transported by a plating line, and the plating process is performed by a plating apparatus. Therefore, there is a problem in that the thickness of the plating becomes large and defective products are generated.

  In order to achieve the problem to be solved by the above invention, an electronic circuit board plating method according to the present invention comprises attaching an electronic circuit board to be plated to a plating jig and holding the plating jig on a plating line. After attaching to the jig conveying device, the resistance value of the electronic circuit board in the plating jig is measured at this plating line, and when this measured value is less than the preset resistance setting value, the plating process is performed. On the other hand, when the measured value is larger than the resistance set value, the plating jig is excluded from the plating line.

  Further, the electronic circuit board plating method of the present invention includes mounting and holding an electronic circuit board to be plated on a plating jig, measuring a resistance value of the electronic circuit board in the plating jig, and measuring the measured value. When the measured value is equal to or lower than the resistance set value, the plating jig is attached to a plating jig conveying device of a plating line, and the plating process is performed. When the measured value is larger than the resistance set value, the electronic circuit board is set again on the plating jig and then the resistance value of the electronic circuit board is measured again and compared with the resistance set value. To do.

  Further, the electronic circuit board plating method of the present invention includes attaching and holding an electronic circuit board to be plated on a plating jig, measuring a resistance value of the electronic circuit board in the plating jig, 1 measured value is compared with a preset resistance setting value. When the first measured value is equal to or less than the resistance setting value, the plating jig is attached to the plating jig conveying device of the plating line, The resistance value of the electronic circuit board in the plating jig is measured again at the plating line, and when the measured second measured value is less than or equal to the resistance set value, the plating process is performed, while the second measured value is measured. Is larger than the resistance set value, the plating jig is excluded from the plating line.

  In the electronic circuit board plating method of the present invention, in the electronic circuit board plating method, the resistance measurement points of the electronic circuit board in the plating jig are preferably at least three points.

  In addition, the plating system of the present invention holds an electronic circuit board to be plated and includes a plating jig having a power supply terminal portion for supplying power to the electronic circuit board when plating, and the plating jig on the plating line. A plating apparatus having a plating jig conveying apparatus for conveying to a plating tank, a measuring part having a resistance measuring terminal part for measuring a resistance value of the electronic circuit board before plating, and measurement measured by this measuring part And a comparison / determination unit that determines whether or not the value is equal to or less than a preset resistance setting value.

  In the plating system of the present invention, in the plating system, the resistance measurement terminal portion of the measurement unit is provided in the plating jig transport device in the plating apparatus and is mounted on the plating jig transport device. It is preferable that the power supply terminal portion is provided so as to be freely contacted / separated.

  In the plating system of the present invention, in the plating system, the resistance measurement terminal portion of the measurement unit is provided in a plating jig holder for holding a plating jig on which an electronic circuit board is mounted, and the plating jig holder It is preferable that the holding plating jig is provided on the power supply terminal portion so as to be able to contact and separate.

  As will be understood from the means for solving the problems as described above, according to the method for plating an electronic circuit board of the present invention, the resistance value of the electronic circuit board in the plating jig is not more than the resistance set value in the plating line. Since the plating process is performed only in the case of the above, the electronic circuit board is not properly set to the plating jig, the mounting of the plating jig to the plating line is poor, and the electronic circuit board is disturbed by disturbance during the transportation of the plating line. Since set defects can be excluded, it is possible to prevent the production of defective plating products.

  In addition, the resistance of the electronic circuit board can be automatically measured on the plating line, and the data collection is also automated, so that the data transfer mistake of the measurer can be prevented.

  Moreover, according to the plating method of the electronic circuit board of the present invention, only when the resistance value of the electronic circuit board in the plating jig is equal to or less than the resistance set value, the plating circuit can be attached to the plating jig conveying device. Since the defective setting of the electronic circuit board to the plating jig can be excluded, the manufacture of defective plating products can be prevented.

  According to the method for plating an electronic circuit board of the present invention, the plating jig conveying device for the plating line only when the first measured value of the resistance value of the electronic circuit board in the plating jig is equal to or less than the resistance set value. Therefore, it is possible to eliminate defective setting of the electronic circuit board to the plating jig. Further, the resistance value of the electronic circuit board in the plating jig is measured again at the plating line, and the plating process is performed only when the second measured value is equal to or less than the resistance setting value. Since it is possible to exclude defective circuit board setting, poor mounting of a plating jig on a plating line, and poor setting of an electronic circuit board due to disturbance during transportation of the plating jig on the plating line, manufacturing of defective plating products can be prevented. .

  In addition, the resistance of the electronic circuit board can be automatically measured on the plating line, and the data collection is also automated, so that the data transfer mistake of the measurer can be prevented.

  Further, according to the plating system of the present invention, the resistance value of the electronic circuit board can be measured by bringing the resistance measurement terminal part provided in the measurement part into contact with the power supply terminal part of the plating jig before the plating process. Whether or not the value is equal to or less than the resistance set value can be determined by the comparison / determination unit.

  As a result, poor setting of the electronic circuit board on the plating jig, poor mounting of the plating jig on the plating line, and poor setting of the electronic circuit board due to disturbance during the transportation of the plating jig on the plating line can be excluded. Production of non-defective products can be prevented.

  In addition, from the above, it is possible to automatically measure the resistance of the electronic circuit board on the plating line and to automate the data collection, so that it is possible to prevent the data transfer error of the measurer.

  Embodiments of the present invention will be described below with reference to the drawings.

  Referring to FIGS. 9A and 9B, the plating apparatus 1 according to this embodiment uses an electronic circuit such as a semiconductor wafer (hereinafter simply referred to as “wafer”) or a printed wiring board by a semi-additive method, for example. It is used when forming a wiring pattern on the surface of a substrate.

  Generally, in the semi-additive method, for example, a seed layer made of a conductive material such as copper is formed on the surface of a base substrate such as Si, and after the resist layer is applied to the seed layer, the resist layer is exposed. Then, development is performed to form a resist groove of the wiring pattern. Next, a conductive material such as copper is deposited in the resist groove by a plating apparatus such as electroplating. Thereafter, the resist layer is removed, and the portion of the seed layer unrelated to the wiring pattern is etched to manufacture a printed wiring board having a fine wiring pattern.

  The plating apparatus 1 according to this embodiment is an apparatus for copper plating, for example, a wafer as an electronic circuit board to be plated. In FIGS. 9A and 9B, the first shower rinsing tank 3 is sequentially arranged from the right end to the left side. , Pickling tank 5, two first water washing tanks 7, five copper plating tanks 9, three second water washing tanks 11, second shower water washing tank 13, unloader area 15, and loader area 17. Is arranged. Further, the plating apparatus 1 includes a plating jig transport device 21 for traveling and moving on the LM guide rail 19 disposed substantially parallel to the line of each processing tank and transporting the wafer to the processing tank. Is provided. Further, a partition wall P having a height approximately equal to the height of each processing tank is provided between the line of each processing tank and the plating jig transport device 21.

  Although the detailed description of the plating jig transport device 21 will be described later, the plating jig transport device 21 includes a clamping device for clamping and unclamping a plating jig for holding a wafer to be plated with copper, and the clamp. A jig lifting / lowering device is provided for lowering the plating jig clamped by the apparatus so as to be put into each of the processing tanks and for lifting the plating jig after the processing from the processing tanks.

  The outline of the operation of the plating apparatus 1 shown in FIGS. 9A and 9B will be described. The loader area 17 accommodates a number of plating jigs that hold a wafer in advance. A desired plating jig is clamped by the clamping device of the plating jig conveying device 21 and then pulled up by the jig vertical movement device, and then the first shower at the right end as shown by the arrow in FIG. 9B. It is conveyed to the washing tank 3.

  The plating jig is put into the first shower rinsing tank 3, and the wafer in the plating jig is washed with shower water. Then, it is conveyed to the pickling tank 5, and the surface of the wafer is pickled in the pickling tank 5 as a pretreatment step for copper plating. Subsequently, it is conveyed to the 1st washing tank 7, and the acid adhering to the surface of the said wafer is removed by washing with this 1st washing tank 7.

  The two first water rinsing tanks 7 are provided in order to use another first water rinsing tank 7 when the plating jig holding the wafer to be processed next is washed with water. That is, clean water always flows into each first washing tank 7 for purification, and when the wafer after pickling is washed with water as described above, the water in the first washing tank 7 is acidified. It will take a little time to be cleaned. Accordingly, the wafers to be subsequently processed are washed with water using the two first washing tanks 7 alternately, so that a time difference is provided so that the water in each first washing tank 7 is cleaned.

  The plating jig washed with water as described above is transported to the first copper plating tank 9 out of the five copper plating tanks 9 and is plated with copper in the first copper plating tank 9. This copper plating process takes about 5 minutes, for example. Accordingly, the plating jig transporting device 21 moves to the loader area 17 after unclamping the plating jig that has been put into the copper plating tank 9 and immersed in the plating solution.

  Then, the plating jig transporting device 21 clamps the plating jig holding the second wafer to be processed next in the loader area 17 with a clamp device, and the second plating jig is washed with the first shower water. Transport to tank 3. As with the first plating jig described above, shower water is washed in the first shower water rinsing tank 3, then pickled in the pickling water tank 5, then washed in another first water rinsing tank 7, and then It is conveyed to the second copper plating tank 9 and plated with copper.

  The plating jig conveying device 21 moves to the loader area 17 after unclamping the plating jig put into the second copper plating tank 9 as in the case of the first copper plating tank 9. After the second plating jig is clamped, it is processed in each processing tank in the same manner as the first and second plating jigs, and then transferred to the third copper plating tank 9 to be copper plated. The fourth and fifth plating jigs are similarly performed.

  In this embodiment, since one plating jig takes about 1 minute 30 seconds to process from the first shower rinsing tank 3 to the first rinsing tank 7, the fourth plating jig is used. Is transferred to the copper plating tank 9 and the copper plating is started, the wafer in the first plating jig has passed about 5 minutes.

  Therefore, in this embodiment, before the wafer in the fifth plating jig is subjected to the copper plating process, the plating jig in the first copper plating tank 9 is again used by the clamping device of the plating jig conveying device 21. After being clamped and then pulled up by the jig vertical movement device, it is conveyed to the second water rinsing tank 11 as indicated by the arrow in FIG.

  The first plating jig is put into the second washing tank 11 and the wafer in the plating jig is washed with water, whereby the plating solution adhering to the surface of the wafer is removed.

  The first plating jig washed with water as described above is transported to the second shower rinsing tank 13, and the wafer in the plating jig is washed with shower water in the second shower rinsing tank 13, so that it is surely cleaned. The Thereafter, the first plating jig is put into the water tank in the unloader area 15 and is unclamped from the clamping device of the plating jig conveying device 21. The reason why the plating jig holding the copper-plated wafer is put into the water tank in the unloader area 15 is to prevent the copper plating on the surface of the wafer from being oxidized.

  As described above, the second, third, and subsequent plating jigs are processed in the same manner as the first plating jig.

  Next, the plating jig 23 will be described in detail.

  Referring to FIG. 3, as the plating jig 23, the jig body 25 is a rectangular flat plate for holding the wafer 27 inside and is made of vinyl chloride, and has a clamping hole 29 on the upper part. A plating hole 31 for copper plating is provided on the surface of the wafer 27 at the lower portion. Further, contacts for energizing the wafer 27 at at least three locations in a substantially uniform arrangement around the plating hole 31, and in this embodiment, three contacts 33 A, 33 B, and 33 C protrude. Further, for example, electrode pins 35 serving as at least three power supply terminal portions for supplying power to the internal wafer 27 are exposed below the clamping hole 29, and each electrode pin 35 and the contact 33A are exposed. , 33B, and 33C are provided with conductive wires 37 for electrical connection.

  When the wafer 27 placed on the contacts 33A, 33B, and 33C is sandwiched between the pressing plate 39 and the jig body 25, the wafer 27 is pressed to the contacts 33A, 33B, and 33C to be conductive. It is the structure to do. The pressing plate 39 is made of vinyl chloride and has a substantially elliptical flat plate shape. A plurality of tightening bolts 41 project outside the three contact points 33A, 33B, and 33C on the jig body 25, and an elongated hole portion 43 through which each of the tightening bolts 41 is inserted into the pressing plate 39. Is provided.

  With the above configuration, after the wafer 27 is placed on the three contact points 33A, 33B, and 33C, the wafer 27 is sandwiched between the pressing plate 39 and the jig body 25 so that the jig body 25 is sandwiched. The fastening bolts 41 are inserted into the elongated hole portions 43 of the pressing plate 39 and fastened by the fastening bolts 41, whereby the wafer 27 is pressed to the contacts 33A, 33B, and 33C to be conducted. Therefore, the wafer 27 is not simply connected to one straight line, but is energized to at least three positions widely separated from each other. The plating process can be performed with a substantially uniform plating thickness.

  In order to make the wafer 27 substantially evenly energized, it is a necessary condition that the contact resistance between the wafer 27 and the three contacts 33A, 33B, and 33C is small, and the above three contacts 33A, 33B, and 33C are necessary. Factors such as the arrangement state and contact state of the wafer 27 with respect to and the tightening state of each tightening bolt 41 affect the contact resistance. Therefore, in this embodiment, if the preset resistance setting value is 2Ω, for example, and the resistance values of the three contacts 33A, 33B, and 33C are equal to or less than the resistance setting value 2Ω, the entire wafer 27 is almost the same. It can be plated with a uniform plating thickness.

  Therefore, as a plating method and plating system constituting the main part of this embodiment, before the plating jig 23 is placed on the plating line, the wafer 27 is set on the plating jig 23, that is, the three contacts 33A, After confirming that the resistance values of 33B and 33C were not more than the above resistance setting value of 2Ω, the plating jig 23 was placed on the plating line.

Referring to FIG. 4, the wafer resistance measuring device 45 before the plating line (off-line) will be described. The wafer resistance measuring device 45 includes a plating jig holder portion 47 for holding the plating jig 23 in a predetermined position. For example, a resistance measurement pin 49 is provided as a resistance measurement terminal portion that contacts and separates from the electrode pin 35 of the plating jig 23 set on the plating jig holder portion 47, and the plating jig holder portion 47 has a hinge portion 51. And a resistance for measuring the resistance value of each of the contacts 33A, 33B, and 33C by being connected to the resistance measurement pin 49 via the transfer cable 55. The measurement data of the resistance value measured by the measurement unit 57 and the resistance measurement unit 57 is transferred via the transfer cable 55 and the measurement data is set to a preset resistance. For example, the data management unit 59 as a comparison determination unit for managing by determining whether value follows (PLC), and a.

  The resistance measurement pin 49, the transfer cable 55, and the resistance measurement unit 57 are the basic configuration of the measurement unit for measuring the resistance value of the wafer 27 of the plating jig 23 in the offline state.

  The resistance measuring pins 49 correspond to the three electrode pins 35 in this embodiment, and each resistance measuring pin 49 is always urged forward by a spring or the like (not shown). Further, magnets 61 that attract the left and right sides of the measurement pin pressing portion 53 in FIG. 4A are provided on the left and right sides of the plating jig holder portion 47 in FIG. 4A. By the magnet 61, each of the three resistance measurement pins 49 of the measurement pin pressing portion 53 is pressed against the three electrode pins 35 against the biasing force of the spring and is surely conducted.

  The resistance measuring unit 57 is provided with various switches and indicator lamps such as a measurement start button 65, a resistance measuring device 67, a measurement / adjustment changeover switch 69, and an OK / NG determination lamp 71 in the operation box 63. Yes. The measurement / adjustment changeover switch 69 is a switch for switching which resistance is measured between, for example, the contacts 33A-33B, between the contacts 33B-33C, and between the contacts 33C-33A. The OK / NG determination lamp 71 is When the measured values between the contacts 33A-33B, between the contacts 33B-33C, and between the contacts 33C-33A are less than the resistance set value, the OK lamp 71A on the left side in FIG. When it is large, the right NG lamp 71B is turned on in FIG.

  With the above configuration, after the plating jig 23 on which the wafer 27 is set is set at a predetermined position of the plating jig holder 47 with the measurement pin pressing portion 53 opened, the measurement pin pressing portion 53 is rotated. When the resistance measurement pin 49 is brought into contact with the electrode pin 35 of the plating jig 23, the measurement pin pressing portion 53 is attracted to the plating jig holder portion 47 by the magnet 61, so that each resistance measurement of the measurement pin pressing portion 53 is performed. Since the pin 49 is always urged forward by a spring (not shown), the three electrode pins 35 are reliably pressed with a constant pressing force and are conducted.

  Next, the measurement / adjustment changeover switch 69 of the resistance measurement unit 57 is switched to the resistance adjustment side. Each time the measurement start button 65 is pressed, the resistance measurement point is switched by the relay, and the respective resistance setting values between the contacts 33A-33B, between the contacts 33B-33C, and between the contacts 33C-33A are adjusted to 2Ω.

  Next, the measurement / adjustment changeover switch 69 of the resistance measurement unit 57 is switched to the resistance measurement side. When the measurement start button 65 is pressed, the resistance measurement location is automatically switched by a relay, and each measured value between the contacts 33A-33B, between the contacts 33B-33C, and between the contacts 33C-33A is measured by the resistance meter 67. Each measurement data is transferred to the measurement data transfer mode, transferred by the transfer cable 55, and taken into the PLC 59. At this time, it is monitored by the PLC 59 whether or not each measured value is equal to or less than the resistance set value 2Ω, and the determination result is lit on either the OK lamp 71A or the NG lamp 71B of the OK / NG determination lamp 71. .

  If an operator manually measures resistance using a tester, variations in measurement values due to individual differences and measurement data input errors occur. However, measurement work should be performed using the resistance measuring device 45 as described above. As a result, there is no measurement due to individual differences among workers, and there is no mistake in inputting measurement data. Therefore, accurate data management can be performed, and it can be accurately determined whether or not the measured value is 2Ω or less of the resistance set value. .

  If the measured values between the contacts 33A-33B, the contacts 33B-33C, and the contacts 33C-33A are all OK, the wafer 27 can be plated with a substantially uniform plating thickness.

  Here, the point that the variation in the resistance value affects the uniformity of the plating thickness will be described.

  First, in a state where one of the three contacts 33A, 33B, and 33C is detached from the wafer 27, the plating thickness when the wafer 27 is plated with copper is uniformly distributed over the entire wafer 27 at 17 locations. As a result of measurement at a point, the average value of the measured value was 9.3 to 9.8 μm with respect to the target value of the plating thickness of 9 μm, for example, but the variation of the plating thickness was 48.4 to 52.3%. The standard deviation was 1.06 to 1.13. Cpk was 0.80 to 0.91.

  On the other hand, when the measured values between the contacts 33A-33B, between the contacts 33B-33C, and between the contacts 33C-33A are all OK, the plating thickness when the wafer 27 is plated with copper is set to the entire thickness of the wafer 27. Was measured uniformly at 17 points. As a result, the average value of the measured values was 9.2 to 9.4 μm while the target value of the plating thickness was 9 μm. Moreover, the plating thickness variation was 21.6 to 25.9%, and the standard deviation was 0.52 to 0.71. Cpk was 1.37 to 1.76.

  Comparing both of the above, Cpk is statistically determined to be good at 1.33 or more, and in the former case, the variation in plating thickness was large, while Cpk was 1.33 or less. In the latter case, the variation in plating thickness was small, and Cpk was 1.33 or more. Therefore, it can be seen that the variation in resistance value greatly affects the uniformity of the plating thickness.

  Next, the plating jig conveying apparatus 21 constituting the main part of the plating method and plating system according to the embodiment of the present invention will be described in detail.

  Referring to FIGS. 1 and 2, the plating jig conveying device 21 includes a base portion 73 that travels on the LM guide rail 19, a column portion 75 that is erected on the base portion 73, For example, an LM guide actuator 77 as a jig vertical movement device arranged so as to extend in the vertical direction along the support column 75, and is driven in the vertical direction by the LM guide actuator 77, and to the line side of each processing tank. A carrier part 79 arranged to extend, and a clamp device 81 provided on the carrier part 79 for clamping and unclamping a plating jig 23 for holding, for example, a wafer 27 as an electronic circuit board to be copper-plated, It is composed of

  The LM guide actuator 77 lowers the plating jig 23 clamped by the clamp device 81 in order to put it into each of the processing tanks, and pulls up the plated jig 23 after the processing from each processing tank. This is a jig vertical movement device.

  In addition, a cable bearer 83 of an electric wire for supplying a current for operating the plating jig transporting device 21 is provided between the lower portion of the support column 75 and the carrier unit 79.

  Note that FIG. 2 is a view of the inside of the plating jig 23, and the wafer 27 inside the plating jig 23 is opened to the outside by a plating hole 31 so that it can be uniformly processed in each processing tank. It is held in the state.

  Referring to FIGS. 5A and 5B together, the clamp device 81 includes two clamp shafts 85 arranged on the left and right of the carrier part 79 in FIG. The both ends of each clamp shaft 85 are supported by the left and right bearings 87 in FIG. A clamp arm 89 having an L-shaped cross section is fixed to the two clamp shafts 85 with, for example, a bolt BT. When the two clamp shafts 85 are rotated, the two clamp arms 89 are moved to a plating jig. It is comprised so that it may insert | pinch from the both sides of 23, and the operation | movement which open | releases. Further, at the lower part of one clamp arm 89, two hooking parts 91 to be inserted and hooked into the clamping hole 29 of the plating jig 23 protrude, and the lower part of the other clamp arm 89 is projected. Is provided with a hooking hole 93 into which the hooking portion 91 is inserted.

  Further, a gear 95 is fixed to the left end of the two clamp shafts 85 in FIG. 2, and a rack 97 that meshes with the gear 95 is provided on a clamp cylinder 99 provided on the top of the carrier part 79. It is provided on the cylinder shaft 101. The stroke ST1 of the clamping cylinder 99 is as shown in FIG.

  With the above configuration, when the cylinder shaft 101 of the clamping cylinder 99 is lowered by the stroke ST1, the rack 97 is lowered as shown in FIG. 5A, and the left gear 95 in FIG. Since the gear 95 on the right side in FIG. 5A rotates in the counterclockwise direction while rotating in the clockwise direction, the two clamp arms 89 rotate in the direction for unclamping the plating jig 23.

  On the other hand, when the cylinder shaft 101 of the clamping cylinder 99 is raised by the stroke ST1, the rack 97 is raised as shown in FIG. 5B, and the left gear 95 in FIG. 5B is counterclockwise. 5B, the right gear 95 in FIG. 5B rotates in the clockwise direction, so that the two clamp arms 89 rotate in the direction in which the plating jig 23 is clamped. The two latching portions 91 of the arm 89 are inserted into the two clamping hole portions 93 of the other clamping arm 89 after being inserted into the clamping hole portion 29 of the plating jig 23.

  In addition, as shown in FIG. 2, the low-power supply pin 103 is supported on the upper portion of the carrier portion 79 so as to be movable in the vertical direction at a position where the tip of the pin butts against the upper end of the plating jig 23. And it is urged | biased by the direction which always protrudes downward via the spring 105. FIG. Therefore, in order to clamp the plating jig 23 with the clamping device 81, the tip of the weak electricity supply pin 103 is abutted against the upper end of the plating jig 23 when the carrier portion 79 is lowered, and further resists the biasing force of the spring 105. Then, the carrier part 79 descends. Next, the plating jig 23 is clamped by the two clamp arms 89.

  In addition, the plating jig conveying device 21 is provided with a wafer resistance measuring device 107 in a plating line that constitutes a main part of the plating method and plating system of this embodiment.

  The reason for this is that when the plating jig 23 is set on the plating jig conveying device 21, if the plating jig 23 is hit, the wafer 27 in the plating jig 23 is separated from the contacts 33A, 33B, 33C by the impact. Therefore, there is a possibility that a defective plating product may be produced due to the problem of uniformity of plating thickness. Further, even when the plating jig 23 is transported by the plating jig transport device 21, the wafer 27 may be detached from the contacts 33A, 33B, 33C due to some disturbance such as an impact.

  Therefore, before the wafer 27 is plated, the resistance value of each contact 33A, 33B, 33C of the wafer 27 in the plating jig 23 is measured again by the wafer resistance measuring device 107 on the plating line, and each measured value is measured. Plating is performed after confirming that the resistance value is 2Ω or less of the resistance setting value. On the other hand, when each of the measured values is larger than 2Ω of the resistance setting value, the plating jig 23 is excluded from the plating line, and again. The way to adjust is taken.

  6A and 6B together, as the wafer resistance measuring device 107, one measuring pin shaft portion 109 is on the left side of the carrier portion 79 in FIG. It is arranged in the same direction as the longitudinal direction of the carrier portion 79, and both end portions of the measuring pin shaft portion 109 are supported by the left and right bearing portions 111 in FIG. A measuring pin arm 113 having an L-shaped cross section is fixed to the measuring pin shaft portion 109 with, for example, a bolt BT. When the measuring pin shaft portion 109 is rotated, For example, the resistance measurement pin 115 as the provided resistance measurement terminal portion is configured to be in contact with and separated from the left electrode pin 35 in FIG. 6A of the plating jig 23.

  Further, a gear 117 is fixed to the left end of the measurement pin shaft 109 in FIG. 2, and a measurement pin rotating cylinder 121 provided on the upper portion of the carrier portion 79 is a rack 119 that meshes with the gear 117. The cylinder shaft 123 is provided. Note that the stroke ST2 of the measuring pin rotating cylinder 121 is as shown in FIG. 6B.

  In addition to the above configuration, the wafer resistance measuring device 107 in the plating line is electrically connected to the resistance measuring pin 115 via the transfer cable 125 as shown in FIG. The resistance measurement unit 127 for measuring the resistance values of 33A, 33B, and 33C, and the measurement data of the resistance value measured by the resistance measurement unit 127 are transferred via the transfer cable 125, and the measurement data is set in advance. For example, a data management unit 59 (PLC) is provided as a comparison / determination unit for determining and managing whether or not the resistance is less than the set resistance value. The resistance measurement unit 127 is the same as the resistance measurement unit 57 used in the above-described (off-line) wafer resistance measurement device 45 before the plating line, and thus detailed description thereof is omitted.

  The resistance measurement pin 115, the transfer cable 125, and the resistance measurement unit 127 described above are the basic configuration of the measurement unit for measuring the resistance value of the wafer 27 of the plating jig 23 on the plating line.

  With the above configuration, when the cylinder shaft 123 of the measuring pin rotating cylinder 121 is lowered by the stroke ST2, the rack 119 is lowered as shown in FIG. 6A, and the gear 117 shown in FIG. Since the measurement pin arm 113 rotates in the clockwise direction as indicated by the arrow in FIG. 6A, the resistance measurement pin 115 provided at the tip of the measurement pin arm 113 is rotated in the clockwise direction. It is separated from the left electrode pin 35.

  On the other hand, when the cylinder shaft 123 of the measuring pin rotating cylinder 121 is raised by the stroke ST2, the rack 119 is raised as shown in FIG. 6B, and the gear 117 in FIG. Since it rotates counterclockwise, the measurement pin arm 113 also rotates counterclockwise, and the resistance measurement pin 115 provided at the tip of the measurement pin arm 113 is shown in FIG. 6B of the plating jig 23. It contacts the left electrode pin 35.

  Therefore, in the plating line, the carrier part 79 of the plating jig conveying device 21 is lowered, the plating jig 23 is clamped by the two clamp arms 89 of the clamping device 81, and is raised to the measurement height. Next, as described above, the measurement pin arm 113 automatically rotates and the resistance measurement pin 115 contacts the electrode pin 35 of the plating jig 23.

  Then, each measured value between the contacts 33A-33B, between the contacts 33B-33C, and between the contacts 33C-33A of the plating jig 23 is measured by the resistance measuring unit 127, and each measurement data is switched to the measurement data transfer mode and transferred to the transfer cable. 125 and transferred to the PLC 59. At this time, it is monitored by the PLC 59 whether or not each measured value is 2Ω or less of the resistance set value. If it is not less than the resistance set value, an alarm alarm is issued to notify the operator. Alternatively, similar to the resistance measurement unit 57 used in the wafer resistance measurement device 45 before the plating line (off-line) described above, the above-described monitored determination results are the OK lamps 71A and NG of the OK / NG determination lamp 71. Any one of the lamps 71B may be lit.

  If the measured values between the contacts 33A-33B, between the contacts 33B-33C, and between the contacts 33C-33A are all OK, an alarm alarm does not sound and the wafer 27 has a substantially uniform plating thickness. It can be plated.

  As described above, since the wafer resistance measuring device 107 is installed in the plating jig transport device 21, the resistance value of the wafer 27 of the plating jig 23 can be measured at an arbitrary position in the plating process. Further, it is possible to prevent the production of defective plating due to the separation of the wafer 27 and the contacts 33A, 33B, and 33C.

  Next, the copper plating tank 9 will be described in detail with reference to the drawings.

  Referring to FIG. 7, there is a plating jig insertion portion 129 for inserting a plating jig 23 inside the copper plating tank 9, and guides both sides of the plating jig 23 in the width direction. A jig insertion guide part 131 for insertion into the insertion part 129 is provided in a rail shape. Further, in FIG. 7 and FIG. 8A of the copper plating tank 9, five power supply shafts 135 arranged at the same interval as the five electrode pins 35 of the plating jig 23 are arranged on the left side wall 133. The five feeding shafts 135 are inserted into the copper plating tank 9 and protruded into the copper plating tank 9, and five electrodes of the plating jig 23 inserted into the plating jig insertion portion 129. It is provided so as to be able to move forward and backward in a direction to abut against the pin 35.

  7 and 8A of the copper plating tank 9, an air cylinder 139 is mounted on the mounting table 141 as a power feeding shaft driving unit for moving the five power feeding shafts 135 forward and backward. A support bracket 145 for holding five power supply shafts 135 is fixed to the tip of the cylinder shaft 143 of the air cylinder 139. The support bracket 145 has a y-shaped cross section with front and rear support pieces 147A and 147B in FIG. 8A, and the five power supply shafts 135 are spaced at the same intervals as the five electrode pins 35 of the plating jig 23. The support brackets 145 are supported by front and rear support pieces 147A and 147B so as to be movable in the front-rear direction.

  Each of the power supply shafts 135 is provided with a flange portion 149 protruding in the outer peripheral direction at an intermediate position in the longitudinal direction, and a spring provided between the flange portion 149 and the support piece 147B behind the support bracket 145. The flange portion 149 is in contact with the support piece 147 </ b> A in front of the support bracket 145. Each of the five power supply shafts 135 is configured to be supplied with power by a conductive wire 153. The air cylinder 139 and the five power supply shafts 135 are entirely covered with a power supply shaft cover 155.

  With the above configuration, when the plating jig 23 is inserted into the plating jig insertion portion 129 inside the copper plating tank 9, the cylinder shaft 143 of the air cylinder 139 moves to the right arrow in FIG. As a result, the support bracket 145 moves rightward, so that the five power supply shafts 135 simultaneously pass through the power supply shaft hole portions 137 provided in the side wall 133 as shown in FIG. 8B. The tip of each power supply shaft 135 is abutted against the corresponding electrode pin 35. Even if the cylinder shaft 143 of the air cylinder 139 further advances further, it can advance against the urging force of the spring 151, and the tip of each power supply shaft 135 can be reliably associated with each electrode pin by the urging force of the spring 151. It is in a state of being abutted against 35. In this way, the wafer 27 in the plating jig 23 is plated with copper in the copper plating tank 9.

  After the copper plating is completed, the cylinder shaft 143 of the air cylinder 139 moves leftward in FIG. 8B, so that the support bracket 145 moves leftward. The front ends of the power supply shafts 135 are separated from the corresponding electrode pins 35 and retract to the original position shown in FIG.

  From the above, since the wafer 27 in the plating jig 23 is attached to the plating jig transporting device 21 only when the resistance value of the wafer 27 is equal to or less than the resistance set value, the wafer 27 to the plating jig 23 is attached. Set defects can be excluded.

  Further, since the plating process is performed only when the resistance value of the wafer 27 in the plating jig 23 is equal to or less than the resistance set value in the plating line, the wafer 27 is not properly set on the plating jig 23, Since the mounting failure of the plating jig 23 and the setting failure of the wafer 27 due to disturbance during the transportation of the plating jig 23 on the plating line can be excluded, it is possible to prevent the production of defective plating products.

  In addition, the resistance measurement of the wafer 27 can be automatically performed on the plating line, and the data acquisition is also automated, so that the data transfer mistake of the measurer can be prevented.

It is a schematic perspective view which shows the plating jig conveying apparatus which comprises the principal part of the plating apparatus of embodiment of this invention. It is the side view seen from the left side of FIG. It is a disassembled perspective view of a plating jig. (A) is a plan view of an off-line wafer resistance measuring apparatus, and (B) is a side view of the plating jig holder of (A) as viewed from the right side. (A), (B) is schematic sectional drawing of the clamp apparatus in the arrow VV line | wire of FIG. (A), (B) is schematic sectional drawing of the resistance measurement apparatus of the wafer in the arrow VV line | wire of FIG. It is a front view of the plating tank containing the principal part cross section in embodiment of this invention. (A), (B) is an enlarged view which shows the operation state of the VIII part of FIG. BRIEF DESCRIPTION OF THE DRAWINGS The whole layout of the plating apparatus of embodiment of this invention is shown, (A) is a top view, (B) is a front view.

Explanation of symbols

1 Plating equipment 9 Copper plating tank (plating tank)
15 Unloader area 17 Loader area 19 LM guide rail 21 Plating jig transport device 23 Plating jig 25 Jig body 27 Wafer (semiconductor wafer; electronic circuit board)
29 Clamping hole 31 Plating hole 33A, 33B, 33C Contact 35 Electrode pin (power supply terminal)
37 Conductive wire 39 Pressing plate 41 Clamping bolt 43 Elongated hole portion 45 Resistance measuring device 47 Plating jig holder portion 49 Resistance measuring pin 51 Hinge portion 53 Measuring pin pressing portion 55 Transfer cable 57 Resistance measuring portion 59 Data management unit (PLC, Comparison judgment part)
61 Magnet 63 Operation box 65 Measurement start button 67 Resistance measuring instrument 69 Measurement / adjustment changeover switch 71 OK / NG determination lamp 77 LM guide actuator (Jig vertical movement device)
79 Carrier portion 81 Clamp device 83 Cable bear 89 Clamp arm 91 Latch portion 93 Latch hole portion 107 Wafer resistance measurement device 109 Measurement pin shaft portion 111 Bearing portion 113 Measurement pin arm 115 Resistance measurement pin (resistance measurement terminal) Part)
121 Measuring Pin Rotating Cylinder 123 Cylinder Shaft 125 Transfer Cable 127 Resistance Measuring Unit 135 Feeding Shaft

Claims (7)

  An electronic circuit board to be plated is attached to and held on a plating jig, and the plating jig is attached to a plating jig conveying device of a plating line, and then the resistance of the electronic circuit board in the plating jig is installed on the plating line. When the measured value is less than or equal to a preset resistance setting value, plating is performed. On the other hand, when the measured value is greater than the resistance setting value, the plating jig is removed from the plating line. A method for plating an electronic circuit board, characterized in that it is excluded.   The electronic circuit board to be plated is attached to and held on a plating jig, the resistance value of the electronic circuit board in the plating jig is measured, and the measured value is compared with a preset resistance setting value. When the measured value is equal to or less than the resistance set value, the plating jig is attached to a plating jig conveying device of a plating line to perform the plating process. On the other hand, when the measured value is greater than the resistance set value, the electronic A method of plating an electronic circuit board, wherein the circuit board is set again on the plating jig and the resistance value of the electronic circuit board is measured again and compared with the resistance set value.   The electronic circuit board to be plated is attached to and held on a plating jig, the resistance value of the electronic circuit board in the plating jig is measured, and the measured first measurement value and a preset resistance setting value are obtained. In comparison, when the first measured value is equal to or less than the resistance set value, the plating jig is attached to the plating jig conveying device of the plating line, and then the electronic circuit board in the plating jig is used in the plating line. When the measured second measured value is equal to or less than the resistance set value, plating is performed. On the other hand, when the second measured value is greater than the set resistance value, the plating jig is used. Is excluded from the plating line. A method for plating an electronic circuit board.   4. The method of plating an electronic circuit board according to claim 1, wherein the resistance measurement points of the electronic circuit board in the plating jig are at least three points. A plating jig provided with a power supply terminal for holding the electronic circuit board to be plated and supplying power to the electronic circuit board when plating;
A plating apparatus having a plating jig conveying device for conveying the plating jig to a plating tank of a plating line;
A measuring part having a resistance measuring terminal part for measuring a resistance value of the electronic circuit board in advance before the plating process;
A comparison / determination unit that determines whether the measurement value measured by the measurement unit is equal to or less than a preset resistance setting value;
A plating system characterized by comprising:   A resistance measurement terminal portion of the measurement unit is provided in the plating jig conveying device in the plating apparatus, and is provided in contact with and separated from the power supply terminal portion of the plating jig attached to the plating jig conveying device. The plating system according to claim 5. The resistance measuring terminal portion of the measuring portion is provided on a plating jig holder for holding a plating jig on which an electronic circuit board is mounted, and contacts and separates from the power supply terminal portion of the plating jig held on the plating jig holder. 6. The plating system according to claim 5, wherein the plating system is provided freely.

Images