CN113238106A - Method for rapidly checking electrical conductivity of electroplating clamp - Google Patents
Method for rapidly checking electrical conductivity of electroplating clamp Download PDFInfo
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- CN113238106A CN113238106A CN202110445374.4A CN202110445374A CN113238106A CN 113238106 A CN113238106 A CN 113238106A CN 202110445374 A CN202110445374 A CN 202110445374A CN 113238106 A CN113238106 A CN 113238106A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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Abstract
The invention provides a method for rapidly checking the conductivity of an electroplating clamp. The method comprises the following steps: processing the PCB into an inspection board through film pasting, exposure, development, etching and film stripping, wherein the inspection board comprises an insulating base material and M pairs of metal strips which are positioned on the insulating base material and are isolated from each other, each pair of metal strips comprises two metal strips which are symmetrically distributed on two surfaces of the base material, and M is more than or equal to 1; cleaning and microetching the metal strip on the inspection plate; enabling N electroplating fixtures to clamp N pairs of metal strips on the inspection plate, wherein two clamping points of the electroplating fixtures are respectively clamped on two different metal strips in the same pair, and N is more than or equal to 1 and less than or equal to M; the inspection plate enters an electroplating bath, current electroplating is started, and the inspection plate is taken out; and judging the conduction condition of the electroplating clamp by checking the condition of the metal plated on the plate metal strip. The inspection board used by the invention is excess rim charge cut by cutting materials during PCB production, belongs to waste utilization, and has extremely low cost; the workload is small, the operation is convenient, the inspection result is quick, and the identifiability is high.
Description
Technical Field
The invention relates to the field of printed circuit board processing, in particular to a method for rapidly checking the conductivity of an electroplating clamp used for electroplating a printed circuit board.
Background
In order to adapt to the diversified development trend in the application field of electronic products, the Printed Circuit Board (PCB) used as a component carrier has higher and higher requirements on reliability and external dimensional tolerance. The existing PCB electroplating processing process mainly adopts the clamp clamping plate edge to conduct electricity, and whether the conducting performance of the clamp is good or not has great influence on the uniformity of an electroplating metal layer. The electroplating clamp is a multi-screw connection locking fixing device, and is connected to the flying target through screws, so that poor conduction is easily caused due to the fact that the contact surface is dirty, impurities or the screws are loosened, and quality abnormity is caused due to overlarge or undersize local current of the PCB.
The number of clamps on one electroplating line is large, and how to quickly check whether all the clamps are conductive and identify abnormal clamps is a great problem in the electroplating process of a PCB factory. In the existing method, clamps passing through the current are measured one by one on an electroplating line by using a pincer-shaped ammeter, so that the workload is very large and the operation is very inconvenient.
Disclosure of Invention
In view of the deficiencies in the prior art, it is an object of the present invention to address one or more of the problems in the prior art as set forth above. For example, one of the purposes of the invention is to solve the problem of large workload of the existing electroplating clamp for detecting the processing of the printed circuit board.
In order to achieve the above object, the present invention provides a method for rapidly checking the conductive performance of a plating jig. The method may comprise the steps of: processing the PCB into an inspection board through film pasting, exposure, development, etching and film stripping, wherein the processed inspection board comprises an insulating base material and M pairs of metal strips which are positioned on the insulating base material and are isolated from each other, each pair of metal strips comprises two metal strips which are symmetrically distributed on two sides of the insulating base material, M is an integer and is more than or equal to 1; cleaning the M pair of metal strips on the inspection plate by using an acid cleaning solution; carrying out micro-etching treatment on the M pairs of metal strips on the inspection plate; clamping N electroplating clamps to be detected on N pairs of metal strips on the inspection plate, wherein two clamping points of each electroplating clamp are respectively clamped on two different metal strips in the same pair, N is an integer and is more than or equal to 1 and less than or equal to M; the inspection plate enters an electroplating bath, the current is started for electroplating, and then the inspection plate is taken out; and judging the conduction condition of the electroplating clamp by checking the condition of the metal plated on the plate metal strip.
Further, the PCB may include an excess rim material cut off from the cut-out during the production of the PCB.
Further, the inspection board may have a long bar shape.
Further, the strip-shaped PCB board can comprise redundant rim charge cut off during PCB production.
Further, the metal strip is made of copper, and when the electroplated metal is non-copper and the color of the metal is greatly different from that of the copper, the current density during electroplating is 12-20 ASF, and the time is 15-20 seconds.
Further, the material of the metal strip is copper, and in a case that the plated metal is non-copper and the color of the metal is different from the color of the copper greatly, the step of determining the conduction condition of the plating jig may include: under the condition that non-copper metal is deposited on the two metal strips of the same pair and the color of the metal deposited on the two metal strips is consistent, the electroplating clamp is judged to have good conductivity, otherwise, the electroplating clamp is judged to have poor conductivity.
Further, the metal strip is made of copper, and under the condition that the electroplated metal is copper, the current density during electroplating is 12-20 ASF, and the time is 5-10 minutes.
Further, the material of the metal strip is copper, and in the case that the plated metal is copper, the step of determining the conduction condition of the plating jig may include: under the condition that the two metal strips in the same pair are in a bright state and the two metal strips are in a consistent bright state, the electroplating clamp is judged to have good conductivity, otherwise, the electroplating clamp is judged to have poor conductivity.
Further, the acid cleaning solution can comprise 0.8-1.2% of surfactant and 1-1.5% of citric acid.
Further, the solutions used in the cleaning step and the microetching treatment step may be stored in a chemical tank provided in the electrolytic bath.
Further, in the exposure, the films at the positions corresponding to the metal strips on the PCB are colorless, and the films at other positions are black.
Further, after the conduction condition is judged, the method further comprises the following steps: and removing the electroplated metal on the inspection plate by using the metal removing liquid medicine so as to realize the reutilization of the inspection plate. The metal removing solution may include an intrinsic metal removing solution of a PCB processing plant.
Compared with the prior art, the beneficial effects of the invention can comprise at least one of the following:
(1) the inspection board used by the invention is excess rim charge cut by cutting materials during PCB production, belongs to waste utilization, and has extremely low cost; meanwhile, the invention can adopt the inherent metal removing liquid medicine of the PCB processing factory to remove the electroplated metal on the inspection board for reuse;
(2) the detection of the invention can be flexibly arranged when the production equipment is shut down, the clearance is maintained and the normal production is carried out;
(3) the invention does not need the on-line inspection of inspectors, and has high safety factor;
(4) the invention has the advantages of small workload, convenient operation, quick inspection result and high identifiability;
(5) the inspection board can be used for rapidly judging the conductivity of the electroplating clamp, can be used for timely replacing an abnormal clamp, and can ensure the uniformity of copper plating and the thickness of a copper layer during normal production of a printed circuit board;
(6) the invention can guarantee the stability and consistency of the quality of the PCB.
Drawings
The above and other objects and features of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic view showing a film attachment in an inspection board manufacturing flow in exemplary embodiment 3;
FIG. 2 is a schematic view showing a developed inspection board in the flow of manufacturing the inspection board in exemplary embodiment 3;
FIG. 3 shows a schematic view of an inspection plate fabricated in exemplary embodiment 3;
fig. 4 is a schematic diagram showing the detection of conductivity in exemplary embodiment 3.
Description of the main reference numerals:
1-insulating base material, 2-conductive metal, 3-corrosion-resistant dry film, 4-metal strip, 5-flying target, 6-electroplating fixture, 7-clamping point and 8-inspection plate.
Detailed Description
Hereinafter, a method of rapidly inspecting a conductive property of a plating jig according to the present invention will be described in detail with reference to the accompanying drawings and exemplary embodiments.
Exemplary embodiment 1
The method for rapidly checking the conductive performance of the electroplating clamp can comprise the following steps:
s11: the PCB is processed into a long strip-shaped inspection board through film pasting, exposure, development, etching and film removal, and the processed inspection board comprises an insulating base material and two metal strips which are symmetrically distributed on two sides of the insulating base material.
S12: and cleaning the two metal strips on the inspection plate by using an acidic cleaning solution to remove oil stains, sweat stains and other dirt on the surfaces of the metal strips. Wherein, the metal strip is a copper strip.
S13: the two metal strips on the inspection plate are subjected to microetching treatment, so that the copper strips on the inspection plate are in the color of uniform matt pink copper, and comparison and observation after electroplating are facilitated.
S14: so that the two clamping points of the electroplating clamp to be detected are respectively clamped on different metal strips.
S15: and (4) enabling the inspection plate to enter an electroplating bath, starting current to carry out electroplating, and then taking out.
S16: and judging the conduction condition of the electroplating clamp by checking the condition of the metal plated on the plate metal strip.
In this embodiment, the PCB may be an excess rim material cut by cutting when the PCB is produced.
In this embodiment, in the case that the plated metal is non-copper and the color of the metal is different from the color of copper greatly, the step of determining the conductive condition of the plating jig may include: under the condition that non-copper metal is deposited on the two metal strips of the same pair and the color of the metal deposited on the two metal strips is consistent, the electroplating clamp is judged to have good conductivity, otherwise, the electroplating clamp is judged to have poor conductivity. The current density during electroplating can be 12-20 ASF, such as 13, 15, 18, 19 ASF; the plating time may be 15 to 20 seconds, for example, 16, 18, 19 seconds.
In this embodiment, in the case that the plated metal is copper, the step of determining the conductivity of the plating jig may include: under the condition that the two metal strips in the same pair are in a bright state and the two metal strips are in a consistent bright state, the electroplating clamp is judged to have good conductivity, otherwise, the electroplating clamp is judged to have poor conductivity. The current density during electroplating can be 12-20 ASF, such as 13, 15, 18, 19 ASF; the plating time may be 5 to 10 minutes, for example, 6, 8, 9 minutes.
In this embodiment, the acidic cleaning solution may include 0.8% to 1.2% of a surfactant and 1% to 1.5% of citric acid.
The method for rapidly checking the conductive performance of the electroplating clamp can comprise the following steps:
s21: the PCB is processed into an inspection board through film pasting, exposure, development, etching and film removal, the processed inspection board comprises an insulating base material and X pairs of metal strips which are positioned on the insulating base material and are isolated from each other, each pair of metal strips comprises two metal strips which are symmetrically distributed on two sides of the insulating base material, and X is an integer and is more than or equal to 2.
S22: and cleaning the X pair metal strips on the inspection plate by using an acid cleaning solution.
S23: and carrying out microetching treatment on the X pair of metal strips on the inspection plate.
S24: and clamping Y electroplating clamp clamps to be detected on Y pairs of metal strips on the inspection plate respectively, wherein two clamping points of each electroplating clamp are clamped on two different metal strips in the same pair respectively, N is an integer, and Y is more than or equal to 1 and less than or equal to X. For example, a plating jig may be applied to a pair of metal strips.
S25: and (4) enabling the inspection plate to enter an electroplating bath, starting current to carry out electroplating, and then taking out.
S26: and judging the conduction condition of the electroplating clamp by checking the condition of the metal plated on the plate metal strip.
The process steps and related parameter control in this exemplary embodiment are generally the same as in the previous exemplary embodiment, except that the number of pairs of metal strips on the inspection plate, and the number of plating fixtures that can be inspected simultaneously, are followed.
FIG. 1 shows a schematic view of a film in an inspection board manufacturing flow. FIG. 2 shows a schematic representation of the inspection board fabrication flow after development. Fig. 3 shows a schematic view of the manufactured inspection plate. FIG. 4 is a schematic diagram showing the conductivity measurement performed by the present invention.
The invention utilizes the characteristic that metal can be plated after the clamping points of the electroplating clamp are contacted with the metal strips on the inspection plate for conduction, and a metal layer which can be identified by naked eyes is electroplated on the surface of the metal strips so as to judge the conductivity of the electroplating clamp. Specifically, the method for rapidly checking the electrical conductivity of the electroplating clamp can comprise a link A and a link B.
Wherein, link A is inspection board preparation flow, includes: margin → pasting film → exposing → developing → etching → removing film. As shown in fig. 1, the laminated board includes a corrosion-resistant dry film 3, a conductive metal 2 and an insulating substrate 1 from outside to inside. After development, the corrosion-resistant dry film 3 is removed in areas not corresponding to the metal strips, as shown in fig. 2. Fig. 3 shows a schematic view of the inspection board prepared in the step a, which includes the insulating substrate 1 and a plurality of pairs of metal strips 4 isolated from each other on the insulating substrate 1.
Link B is anchor clamps conductivity inspection flow, includes: clamping plate → degreasing → micro-etching → electroplating → inspection.
In this embodiment, the rim charge in the link a is an excess rim charge cut off by cutting during PCB production.
In this embodiment, the invention can make the rim charge into a strip-shaped PCB board with copper on both sides and insulation between them according to the distance (fixed) between the plating jigs, and the copper on each side is a plurality of pairs of copper bars isolated from each other, the copper bars corresponding to the clamping points of different plating jigs on the same side of the inspection board are not intercommunicated, and the copper bars corresponding to both sides of the same plating jig are not intercommunicated.
In this embodiment, the plating jig may be located on a plating line target.
In this embodiment, in the process of manufacturing the inspection board, the film is colorless and has a width of 10-15 mm corresponding to the position of the electroplating jig, and after exposure, the dry film of the inspection board is photo-cured on the inspection board corresponding to the position of the clamping point of the electroplating flying target.
The position of the gap between two adjacent electroplating fixtures is corresponded, the film is black, the dry film is not subjected to photocuring during exposure, the copper layer is exposed after being developed by alkalescent liquid medicine, the copper at the position is etched and then the insulating base material is exposed, and the copper strips reserved at the positions of the clamping points are isolated from each other.
In this embodiment, the dry film, the exposure machine, the developing device and the liquid medicine, the etching liquid medicine and the etching device used in the manufacturing process are all inherent in the PCB production factory, and no additional increase is needed.
In this embodiment, as shown in fig. 4, when conducting the electrical conductivity test, the test plate 8 is sequentially clamped to the plurality of plating jigs 6 on the flying target 5, and the metal strip 4 on the plate surface of the test plate 8 is brought into contact with the clamping points 7 of the plating jigs 6. After normal surface treatment, the mixture enters an electroplating bath, and current electroplating is started.
In this embodiment, under the condition that the color of the electroplated metal is different from the color of the copper, for example, the electroplating bath is a tin electroplating bath, a nickel electroplating bath, etc., the electroplating bath is taken out after being electroplated for 15 to 20 seconds by using a current with a current density of 12 to 20ASF, and then whether the non-copper metal is deposited on the copper bars of the plate and the color of the metal is uniform is checked according to the alignment of different clamping points, so as to quickly determine whether the conductive performance of the clamp is good.
When the conductivity of the copper plating tank clamp is checked, the copper plating tank clamp can be taken out after being electroplated for 5-10 min by adopting current with the current density of 12-20 ASF, and the conductivity of each electroplating clamp can be quickly judged according to whether the copper strip on the check plate is bright or not.
In this embodiment, the electroplating time can be set as the shortest time that the electroplated metal is deposited and can be better identified during the inspection, so as to reduce the material consumption caused by the inspection.
In this embodiment, when the conductivity of the clamp is checked, it is necessary to ensure that the closing point of the clamp on the flying target is accurately clamped on the copper strip of the check plate.
In this embodiment, the solution used for degreasing is an acidic cleaning solution containing about 0.8% to 1.2% by mass of a surfactant and 1% to 1.5% by mass of citric acid, for example, the surfactant may be present in the solution used for degreasing at 0.9%, 1%, 1.1% by mass, or the like, and the citric acid may be present at 1.1%, 1.3%, 1.4% by mass, or the like. The solution used for degreasing is used for removing greasy dirt, sweat stains and other smudges existing on the copper surface of the inspection board.
In the embodiment, the microetching solution is prepared by using 3-5% by mass of sulfuric acid and 60-80 g/L of sodium persulfate.
The micro-etching is to ensure that the copper strips on the conductive performance inspection plate are in the color of uniform matt pink copper, and is convenient for comparison and observation after electroplating. In addition, the degreasing and micro-etching liquid medicines are the liquid medicine tanks which are inherent on the electroplating line, and no additional liquid medicine tank is needed.
Although the present invention has been described above in connection with exemplary embodiments, it will be apparent to those skilled in the art that various modifications and changes may be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A method for rapidly inspecting the conductive properties of a plating jig, the method comprising the steps of:
processing the PCB into an inspection board through film pasting, exposure, development, etching and film stripping, wherein the processed inspection board comprises an insulating base material and M pairs of metal strips which are positioned on the insulating base material and are isolated from each other, each pair of metal strips comprises two metal strips which are symmetrically distributed on two sides of the insulating base material, M is an integer and is more than or equal to 1;
cleaning the M pair of metal strips on the inspection plate by using an acid cleaning solution;
carrying out micro-etching treatment on the M pairs of metal strips on the inspection plate;
clamping N electroplating clamps to be detected on N pairs of metal strips on the inspection plate, wherein two clamping points of each electroplating clamp are respectively clamped on two different metal strips in the same pair, N is an integer and is more than or equal to 1 and less than or equal to M;
the inspection plate enters an electroplating bath, the current is started for electroplating, and then the inspection plate is taken out;
and judging the conduction condition of the electroplating clamp by checking the condition of the metal plated on the plate metal strip.
2. The method for rapidly inspecting the conductive performance of a plating jig according to claim 1, wherein the PCB comprises excess rim charge cut off from the cut-off material during the production of the PCB.
3. The method for rapidly inspecting the conductive performance of a plating jig according to claim 1, wherein the inspection plate is elongated.
4. The method for rapidly inspecting the conductive performance of a plating jig as claimed in claim 1, wherein the material of the metal strip is copper, and when the plated metal is non-copper and the color of the metal is different from the color of copper, the current density during plating is 12 to 20ASF for 15 to 20 seconds.
5. The method for rapidly inspecting the conductive performance of a plating jig as claimed in claim 1, wherein the material of the metal strip is copper, and the step of determining the conductive condition of the plating jig comprises the following steps when the plated metal is non-copper and the color of the metal is different from the color of the copper:
under the condition that non-copper metal is deposited on the two metal strips of the same pair and the color of the metal deposited on the two metal strips is consistent, the electroplating clamp is judged to have good conductivity, otherwise, the electroplating clamp is judged to have poor conductivity.
6. The method for rapidly inspecting the conductive performance of an electroplating fixture as claimed in claim 1, wherein the material of the metal strip is copper, and when the electroplated metal is copper, the current density during electroplating is 12-20 ASF, and the time is 5-10 minutes.
7. The method for rapidly inspecting the conductive performance of a plating jig as claimed in claim 1, wherein the material of the metal strip is copper, and in the case that the plated metal is copper, the step of determining the conductive condition of the plating jig comprises:
under the condition that the two metal strips in the same pair are in a bright state and the two metal strips are in a consistent bright state, the electroplating clamp is judged to have good conductivity, otherwise, the electroplating clamp is judged to have poor conductivity.
8. The method for rapidly inspecting the conductive performance of the electroplating clamp according to claim 1, wherein the acid cleaning solution comprises 0.8-1.2% of surfactant and 1-1.5% of citric acid.
9. The method for rapidly inspecting the conductive property of a plating jig according to claim 1, wherein the solution used in the cleaning step and the microetching treatment step is stored in a chemical tank provided in the electrolytic bath.
10. The method for rapidly inspecting the electrical conductivity of the electroplating fixture as claimed in claim 1, wherein during the exposure, the films on the PCB corresponding to the metal strips are colorless, and the films on other positions are black.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114295966A (en) * | 2022-03-10 | 2022-04-08 | 四川英创力电子科技股份有限公司 | System and method for fully automatically testing retraction of printed circuit board |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10121296A (en) * | 1996-10-16 | 1998-05-12 | Nippon Light Metal Co Ltd | Electric conductivity testing method for suspender |
| JP2005002407A (en) * | 2003-06-11 | 2005-01-06 | Shinko Electric Ind Co Ltd | Plating fixture conducting inspection device and plating fixture conducting inspection method |
| JP2007291463A (en) * | 2006-04-26 | 2007-11-08 | Fujikura Ltd | Method and system for plating electronic circuit board |
| JP2011106019A (en) * | 2009-11-19 | 2011-06-02 | Yamaguchi Seisakusho:Kk | Tool for electroplating |
| CN202786480U (en) * | 2012-08-31 | 2013-03-13 | 广州中国科学院先进技术研究所 | Clamp for electrochemical treatment of metal surface |
| CN103132127A (en) * | 2011-12-05 | 2013-06-05 | 华通电脑股份有限公司 | Electroplating rack pinch current monitoring device and method thereof |
| JP2016121397A (en) * | 2014-12-24 | 2016-07-07 | 株式会社デンソー | Plating device and production method of plating product |
| JP2018053316A (en) * | 2016-09-29 | 2018-04-05 | 株式会社荏原製作所 | Substrate holder, plating device, and method for manufacturing substrate holder |
| CN207649677U (en) * | 2017-12-29 | 2018-07-24 | 广东科翔电子科技有限公司 | A kind of VCP flies bar electric conductivity and levelness tests system |
| CN109152240A (en) * | 2018-08-27 | 2019-01-04 | 电子科技大学 | A kind of printed circuit board and its hole metallization technique with metallization engagement mechanism |
| CN109338441A (en) * | 2018-10-18 | 2019-02-15 | 东莞宇宙电路板设备有限公司 | The detection device and electroplating device for takeofing abnormal for hanger |
| CN109778289A (en) * | 2019-02-27 | 2019-05-21 | 中国电子科技集团公司第二十九研究所 | A kind of electroplating clamp and the circuit board electroplating method using electroplating clamp |
| CN110029382A (en) * | 2019-05-22 | 2019-07-19 | 电子科技大学 | A kind of process of surface treatment and its related directly electroplating technology for being directly electroplated |
| CN209307504U (en) * | 2019-01-11 | 2019-08-27 | 联策科技股份有限公司 | The residual copper vision detection system of clamping jaw is electroplated |
| CN110940885A (en) * | 2019-12-17 | 2020-03-31 | 东莞市五株电子科技有限公司 | PCB electroplating production device, and performance detection device and method of electroplating clamp |
| CN211505299U (en) * | 2019-11-08 | 2020-09-15 | 东莞市泰利锐航机械科技有限公司 | Detection equipment for electroplating clamp |
| CN112230096A (en) * | 2020-09-16 | 2021-01-15 | 昆山沪利微电有限公司 | VCP electroplating line chuck on-line continuous detection equipment |
-
2021
- 2021-04-25 CN CN202110445374.4A patent/CN113238106B/en active Active
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10121296A (en) * | 1996-10-16 | 1998-05-12 | Nippon Light Metal Co Ltd | Electric conductivity testing method for suspender |
| JP2005002407A (en) * | 2003-06-11 | 2005-01-06 | Shinko Electric Ind Co Ltd | Plating fixture conducting inspection device and plating fixture conducting inspection method |
| JP2007291463A (en) * | 2006-04-26 | 2007-11-08 | Fujikura Ltd | Method and system for plating electronic circuit board |
| JP2011106019A (en) * | 2009-11-19 | 2011-06-02 | Yamaguchi Seisakusho:Kk | Tool for electroplating |
| CN103132127A (en) * | 2011-12-05 | 2013-06-05 | 华通电脑股份有限公司 | Electroplating rack pinch current monitoring device and method thereof |
| CN202786480U (en) * | 2012-08-31 | 2013-03-13 | 广州中国科学院先进技术研究所 | Clamp for electrochemical treatment of metal surface |
| JP2016121397A (en) * | 2014-12-24 | 2016-07-07 | 株式会社デンソー | Plating device and production method of plating product |
| JP2018053316A (en) * | 2016-09-29 | 2018-04-05 | 株式会社荏原製作所 | Substrate holder, plating device, and method for manufacturing substrate holder |
| CN207649677U (en) * | 2017-12-29 | 2018-07-24 | 广东科翔电子科技有限公司 | A kind of VCP flies bar electric conductivity and levelness tests system |
| CN109152240A (en) * | 2018-08-27 | 2019-01-04 | 电子科技大学 | A kind of printed circuit board and its hole metallization technique with metallization engagement mechanism |
| CN109338441A (en) * | 2018-10-18 | 2019-02-15 | 东莞宇宙电路板设备有限公司 | The detection device and electroplating device for takeofing abnormal for hanger |
| CN209307504U (en) * | 2019-01-11 | 2019-08-27 | 联策科技股份有限公司 | The residual copper vision detection system of clamping jaw is electroplated |
| CN109778289A (en) * | 2019-02-27 | 2019-05-21 | 中国电子科技集团公司第二十九研究所 | A kind of electroplating clamp and the circuit board electroplating method using electroplating clamp |
| CN110029382A (en) * | 2019-05-22 | 2019-07-19 | 电子科技大学 | A kind of process of surface treatment and its related directly electroplating technology for being directly electroplated |
| CN211505299U (en) * | 2019-11-08 | 2020-09-15 | 东莞市泰利锐航机械科技有限公司 | Detection equipment for electroplating clamp |
| CN110940885A (en) * | 2019-12-17 | 2020-03-31 | 东莞市五株电子科技有限公司 | PCB electroplating production device, and performance detection device and method of electroplating clamp |
| CN112230096A (en) * | 2020-09-16 | 2021-01-15 | 昆山沪利微电有限公司 | VCP electroplating line chuck on-line continuous detection equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114295966A (en) * | 2022-03-10 | 2022-04-08 | 四川英创力电子科技股份有限公司 | System and method for fully automatically testing retraction of printed circuit board |
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| CN113238106B (en) | 2023-04-07 |
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