JP2011106019A - Tool for electroplating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating tool having a structure capable of carrying out a uniform electrolytic surface treatment without causing a tool contact mark such as chipping, flaw, undeposition, capable of reducing manufacture cost of energization pole member, remarkably reducing the surface area of an energization member and preventing the deposition of excessive plating film and to provide a plating method. <P>SOLUTION: The tool for plating includes the energization member constituting the electric contact to an article to be plated and a holding member for holding the article to be plated to be slightly movable. The energization member comprises a plate like conductive material having an opening part formed so that the article to be plated is inserted, almost of all surface except the cross section of the opening part and the vicinity is covered with an insulating body, at least surface of the holding member is the insulating body and the article to be plated is attached to the energization member so as to be held by the opening part of the energization member to be acted. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a plating jig and a plating method used for performing surface treatment such as electrodeposition coating or metal plating on the surface of a machine part or an electronic part.

Surfaces such as metal plating and electrodeposition coating may be applied to the surfaces of mechanical parts and electronic parts for the purpose of improving electrical characteristics and durability. Especially for equipment that requires high reliability, such as semiconductor parts and high-precision motors, along with the improvement in performance, the quality requirements of the components mounted inside are also increasing, and among these, surface treatment that greatly affects electrical characteristics and weather resistance. For high quality is required.

Conventionally, for small parts such as electronic parts, a so-called barrel plating method is widely used in which a product is put into a dedicated container for plating treatment and electrolytic plating is performed while rotating in a plating solution. In this case, there is an advantage that a large amount of products can be plated at a time, but on the other hand, the products interfere with each other due to rotational movement, causing defects such as scratches and deformation in the products, and worsening the yield in the manufacturing process. Has a chronic challenge. Also, in the barrel plating method, energization of the product is performed by energizing all the products through the products from the negative electrode provided inside the barrel, so the energization efficiency depends on the shape of the product, and while repeating contact and separation Since energization is performed, there is a problem that the plating efficiency is low and it takes time to secure a desired plating thickness.

On the other hand, the so-called rack plating method, in which the product is hooked on a current-carrying hook provided on the plating processing jig and electrolytic plating is performed in the plating solution, does not interfere with each other. While the product is always energized, it has the advantage of good plating deposition efficiency, while it takes time to install the product and lacks productivity, and is provided in a dedicated jig The flow of the plating solution is not perfect at the contact portion (energization portion) between the energization hook and the product, which may cause unplating or uneven plating. When such products are mounted on semiconductor parts or high-precision motors, depending on the environment in which they are used, corrosion of the material may occur from scratches or unplated parts, which may cause rust and electrical characteristics to deteriorate. there is a possibility. Therefore, various efforts have been made in the surface treatment industry to solve these problems, and the following literature proposes a rotating jig for electrolysis and an electrolytic surface treatment method.

JP 2006-291274 A

According to the literature, a drop-preventing member comprising a current-carrying frame made of a conductive material provided with a plurality of housing parts that accommodates two-dimensionally partitioned products, and a flat surface that covers both sides of the current-carrying frame. And a rotating shaft made of a conductive material provided so as to be orthogonal to the plane of the fall prevention member, wherein the rotating shaft and the energizing frame are electrically connected, and the jig Has been proposed which is provided so as to be rotatable around the rotation axis.

Further, in the rotating jig for electrolysis, the energizing frame is arranged in one of a lattice shape, a circumscribed circle or a polygonal shape, and a concentric circular shape divided in the circumferential direction. It is said that this is a rotating jig for electrolysis. Further, in any one of the electrolysis rotary jigs, the fall prevention member has a circular, rectangular, or polygonal plate shape having a rotation center, and is made of a porous or mesh-shaped lid member. The holes and mesh-shaped intervals provided in the lid member have a smaller dimension than the product accommodated in the accommodating portion. The lid member may be made of synthetic resin or metal mesh. The fall prevention member includes a group of wire rods arranged apart from each other or a projection group protruding toward the inside of the housing portion, and the interval between the wire rod groups is smaller than that of the product housed in the housing portion. The projection group extends inward from the outer shape of the product to be accommodated, and the wire and projection group may be a conductor or an insulating material.

Further, in the electrolytic surface treatment method using any one of the electrolysis rotary jigs, the product is stored in the storage portion, the electrolytic solution is placed in the electrolytic solution, the rotating shaft is horizontal, The jig is rotated around the rotating shaft, and the energizing frame is energized through the rotating shaft to move the contact point between the object to be processed and the frame to the object to be processed. An electrolytic surface treatment method is characterized in that an electrolytic surface treatment is performed. When the fall prevention member is made of a conductor, the drop prevention member is energized to perform electrolytic surface treatment on the article to be treated. There has been proposed an electrolytic surface treatment method characterized by being applied. Furthermore, according to the present invention, the counter electrode disposed at a distance from at least one of the container for storing the electrolytic solution, the electrolysis rotary jig, and the fall prevention member on both sides of the electrolysis rotary jig. The electrolysis rotating jig is provided so as to be rotatable around the rotation axis and to be able to energize the energization frame via the rotation axis, and the rotation axis is perpendicular to the counter electrode, and There has been proposed an electrolytic surface treatment apparatus in which the energization frame surface is disposed so as to be substantially parallel to the counter electrode.

FIG. 3 is a front view showing a conventional technique, and a detailed configuration will be described below with reference to the drawings.
The plating jig 101 includes a current-carrying frame 102 made of a strip-shaped metal plate material arranged in a lattice shape, and a lid member 103 made of a porous insulating material as a fall-preventing member that covers the front and back surfaces of the current-carrying frame 102. A rotating shaft 104 is provided to allow the plating jig 101 to rotate around the plane formed by the 103 and the energizing frame 102. In the energizing frame 102, the space defined by the lattice is a housing compartment for the square-shaped workpiece 2. The dimensions of this square section are slightly larger than the item, and the item can move a little around an axis parallel to the axis of rotation. In the example shown in the drawing, only several tens of sections are shown, but several hundred sections are actually formed depending on the size of the article and the jig. In this example, the current-carrying frame 102 is formed from a strip-shaped metal plate, but a metal wire or a thin metal rod may be used as a matter of course. Further, the distance between the inner walls of the lid member 103 is designed to be smaller than twice the thickness of the product, although it is larger than the thickness of the product 2 to be plated. The plurality of holes provided in the lid member 103 may have any size as long as the product does not protrude beyond the lid member 103, and does not reduce the strength. If there are, many may be formed. The lid member 103 is fixed by inserting a bolt so as to penetrate both sides in a direction perpendicular to the lid member 103 even if the lid members 103 themselves are fitted to each other, and a spacer between the lid members 103. It may be fixed via a clip, or may be fixed with clips or the like from both sides, and is not limited to the fixing means.

With these configurations, it is possible to provide a rotating jig for electrolysis capable of continuously and efficiently performing uniform electrolytic surface treatment on the article to be plated 2. In addition, it is possible to provide a rotating jig for electrolysis that does not cause plating or scratches on the product to be plated. In addition, if these electrolysis rotary jigs are used, it is possible to provide an electrolysis rotary jig that can continuously move the contact and does not leave a jig mark on the workpiece. . Furthermore, it is said that an electrolytic surface treatment method and an electrolytic surface treatment apparatus can be provided by using the electrolysis rotating jig described above.

As described above, the feature of the prior art is that the article to be plated 2 is inserted into the accommodating portion of the energized frame 102 made of a conductive material and arranged, and the article to be plated 2 is removed by the lid member 103 for the purpose of preventing falling. The rotating shaft 104 made of a conductive material provided at the center of the energizing frame 102 is driven in a state where it is regulated so that it does not fall off from the energizing frame 102, and the energizing frame 102 is electrically connected via the rotating shaft 104. In this state, electrolytic plating is performed in a plating solution. The article to be plated 2 inserted in the housing portion of the energizing frame 102 is freely moved in the area formed by the energizing frame 102 and the lid member 103 by the rotational movement, and the contact position between the energizing frame 102 and the article to be plated 2 is moved. It is possible to carry out the plating without changing the trace of the jig and leaving the jig trace.

However, the conventional techniques have the following problems.
The energizing frame 102 has a structure composed of strip-shaped metal plates arranged in a grid. To form the grid, the strip-shaped metal plate is formed by performing sheet metal processing, welding processing, brazing processing, or the like. It must be bent and joined. Even when materials such as metal wires and metal rods are used, it is necessary to perform sheet metal processing or welding processing with a high degree of difficulty in order to form a lattice shape. This is because the lattice shape becomes polygonal or As the number of lattice shapes increases, the degree of difficulty of processing increases and the manufacturing cost of the energizing frame 102 increases.

The energizing frame 102 has a structure made of strip-shaped metal plates arranged in a lattice shape, and it is assumed that a material having a certain degree of strength must be used in order to maintain the lattice shape. If the mechanical strength of the energizing frame 102 is weak and the lattice shape is deformed or distorted, the gap to be maintained between the energizing frame 102 and the product to be plated 2 changes, and the electrolysis of the product 2 to be plated is performed. Not only does the energization state necessary for the process change, but there is also a concern that a problem may occur in the insertion of the article to be plated 2 depending on the degree of deformation. In addition, when a large number of products to be plated 2 are mounted, it is clear that the weight of the products to be plated 2 and the dynamic load during rotation are also added. It is presumed that the faster the rotation of 101, the greater the stress applied to the energizing frame 102, which not only causes distortion or deformation in the energizing frame 102, but also in the worst case may lead to damage to the energizing frame 102. . Therefore, it is necessary for the energizing frame 102 to have an appropriate mechanical strength for holding and restricting the article 2 to be plated. This is because a metal rod is used even if the material constituting the energizing frame 102 is a metal wire. Even if there is, it is the same.

In order to ensure the mechanical strength of the current-carrying frame 102, for example, if it is a belt-like metal plate as in the prior art, it is necessary to increase the plate width and thickness, but this simultaneously increases the surface area of the current-carrying frame 102. It leads to letting. In addition, when using a metal wire or a metal bar, the mechanical strength can be secured by increasing the diameter, side dimensions, etc., but it is unavoidable to increase the surface area of the energizing frame 102 as well. it is conceivable that. It can be said that a strip-shaped metal plate, metal wire, or metal bar having a large surface area is necessary in order for the current-carrying frame 102 to hold a large number of articles 2 to be plated accurately and withstand rotational movement in the plating solution. .

The increase in the surface area of the current-carrying frame 102 in this way, particularly in the case of electroplating, leads to the deposition of a plating film on the current-carrying frame 102 in addition to the plating film deposited on the product 2 to be plated. There is a problem that the coating cost is generated. This is a more serious problem as the type of plating is more expensive, such as gold plating, and there is a concern that the manufacturing cost may be reduced due to excessive plating film costs. Therefore, it is considered that it is desirable to reduce the surface area of the current-carrying member that supplies power to the object to be plated 2 like the current-carrying frame 102 in order to reduce the plating film cost.

That is, an object of the present invention is a structure capable of performing a uniform electrolytic surface treatment on a product to be plated without generating jig contact traces such as chipping, scratches, and unplated plating, and a through electrode member. An object of the present invention is to provide a plating jig capable of reducing the manufacturing cost and further preventing the deposition of an excessive plating film by making the surface area of the energizing member extremely small.

In order to solve the above problems, a plating jig according to the present invention includes an energizing member that constitutes an electrical contact with a product to be plated, and a holding member that is held in a state in which the product to be plated is slightly movable. A plating jig provided, wherein the current-carrying member is made of a plate-like conductive material having an opening into which the product to be plated is inserted, and most of the plane excluding the cross-section of the opening and the vicinity thereof. The holding member is covered with an insulator, and at least a surface of the holding member is an insulator, and is attached to the energizing member so that the article to be plated is operatively held in the opening of the energizing member. It is what.

As described above, according to the plating jig of the present invention, the energizing member only forms an opening in a plate-like conductive material, and can be easily increased by a laser drilling process or a metal etching process, which are conventional processing methods. An accurate opening shape can be formed, and like a current-carrying frame described in the prior art, a metal plate for forming a lattice shape is subjected to sheet metal processing, welding processing, brazing processing, etc. There is no need to bend or join metal plates. Moreover, the highly difficult sheet metal processing and welding processing for forming a grid | lattice shape using materials, such as a metal wire and a metal bar, are unnecessary. In addition, as the lattice shape becomes polygonal or the number of lattice shapes increases, the difficulty of processing increases and the manufacturing cost of the energizing frame increases. This can be solved by forming a polygonal hole. Therefore, the cost of the current-carrying member can be greatly reduced, and as a result, the manufacturing cost of the product to be plated can be reduced.

Further, according to the plating jig of the present invention, even if the outer contour of the product to be plated is not a simple shape such as a quadrangle but a complicated shape including a curved line, an appropriate opening of the current-carrying member matching the contour is provided. The part can be easily formed into any shape by laser processing or etching processing. As a result, it is possible to efficiently perform the plating process even on a complicated shape to be plated which cannot be handled by the conventional energizing frame.

The plating jig of the present invention is configured to maintain the mechanical strength of the plating jig and hold the product to be plated by the holding member attached to the current-carrying member made of a plate-like conductive material. There is no need to obtain mechanical strength. This is due to a lack of mechanical strength of the energizing frame 102, a change in energized state, or a change in the state of the article 2 to be plated, which is a concern when the size of the metal material used is reduced in order to reduce the surface area of the energizing frame 102. All problems such as insertion defects can be solved. As a result, the opening cross section formed in the thin plate-shaped conductive material and the vicinity thereof are not exposed, and only the minimum surface necessary for configuring electrical contact with the product to be plated is in the plating solution. In addition to the plating film deposited on the product to be plated 2, the plating film also deposited on the current-carrying frame 102, which caused the extra plating film cost. can do.

That is, with the plating jig of the present invention, it is a structure that can perform uniform electrolytic surface treatment on a product to be plated without generating jig contact traces such as chipping, scratches, and unplated plating, and through electrodes It is possible to provide a plating jig that exhibits an excellent effect that the manufacturing cost of the member can be reduced, and the deposition of an excessive plating film can be prevented by extremely reducing the surface area of the energizing member.

It is a perspective view which shows embodiment of this invention. It is aa 'sectional drawing of FIG. It is a typical figure which shows the prior art.

Embodiments of the present invention will be described below with reference to the drawings.
1 and 2, the energizing member 1 is formed of a conductive metal material such as stainless steel, copper alloy, nickel alloy. The current-carrying member 1 is made of a thin plate-like metal material having a thickness of about 0.5 mm to 5 mm, and is appropriately changed depending on the size and specifications of the article 2 to be plated. The current-carrying member 1 is formed with an opening 3 for inserting the product to be plated 2 so as to be slightly operable. The size of the opening 3 is about 5 to 20 than the outer dimension of the product to be plated 2. It is formed in a dimension that is about% larger. Similar to the thickness of the current-carrying member 1, this is appropriately changed depending on the size and specification of the product 2 to be plated.

The cross section of the opening 3 formed in the current-carrying member 1 and most of the flat surface except the vicinity thereof are covered with an insulator 4 such as vinyl chloride or polycarbonate. The current-carrying member 1 and the insulator 4 are fixed with an adhesive having chemical resistance or heat resistance. This time, the current-fixing member 1 and the insulator 4 are bonded and fixed using a one-component room temperature drying type silicone sealant. Thus, by coat | covering with the insulator 4, the site | part which comprises the electrical contact to the to-be-plated goods 2 exposed in the plating solution 5 can be made very small.

In the present embodiment, the adhesive fixing structure is used to almost completely block the plating solution from entering the gap between the current-carrying member 1 and the insulator 4, but the current-carrying member 1 depends on the plating solution used and the conditions. Further, a method such as sandwiching rubber packing or the like so that the insulator 4 can be detached can be used.

Next, the holding member 6 is fixed to both sides of the energizing member 1, and at least one side is detachably attached. In this way, the workpiece 2 can be inserted and removed. The holding member 6 is formed with a holding member opening 7 that is substantially the same as the opening 3 formed in the energizing member 1, so that the plating solution 5 can flow well with respect to the article 2 to be inserted. ing. In addition, a protrusion 8 is provided in a part of the holding member opening 7, and the protrusion of the holding member 6 provided on both sides of the energizing member 1 so that the article 2 to be inserted does not fall off during the plating process. 8 serves as a stopper that regulates dropping of the article 2 to be plated with a gap.

In the present embodiment, the product to be plated is regulated to be dropped by the protrusion 8 provided in a part of the holding member opening 7, but the product to be plated 2 is not dropped from the opening 3 of the current-carrying member 1. Any shape can be used as long as the shape is not limited to the protrusion 8. Since the plating jig 10 of the present invention has the above-described structure, the current-carrying member 1 that constitutes the electrical contact and the article to be plated 2 are held in a slightly movable state by the holding member 6. It has become.

Next, a plating method using the plating jig 10 of the present invention will be described. Originally, it is common to perform pretreatment such as cleaning, polishing and activating the surface of the material before the step of depositing a plating film in the plating treatment. Although a washing step for washing away and a step for drying the article to be plated are provided, only the plating film deposition step will be described for the purpose of the present invention, and the pre-treatment and post-treatment will be omitted.

A product to be plated 2 is inserted into the opening 3 of the energization member 1 constituting the plating jig 10. In the drawing, in order to explain the structure of the opening 3 and the like, the article to be plated 2 is shown only in one of the four openings, but in reality, the article to be plated 2 is placed in all the openings 3. It is desirable to insert. The plating jig 10 is placed on two holding rolls 11 provided below, and the movement of the holding roll 11 in the axial direction is restricted by a guide portion provided at the end of the two holding rolls 11. Has been. The holding roll 11 is desirably rotated smoothly by using a bearing or a bush inside, so that the plating jig 10 can be smoothly rotated.

Next, a driving roll 12 that is rotated by a motor 18, pulleys 20 a and 20 b, a belt 21, and the like is provided above the plating jig 10, and the plating jig 10 is caused by the frictional force between the plating jig 10 and the driving roll 12. It is the structure to which rotational drive force is given to. Each component is attached to the housing 19 and constitutes a rotating device 13.

The drive roll 12 is desirably made of a material having as large a frictional force as possible. For example, urethane rubber or silicon rubber is suitable. The drive roll 12 may be configured to press the drive roll 12 against the plating jig 10 in order to more stably transmit the rotational driving force to the plating jig 10. Further, the same operation can be obtained by a structure in which the two holding rolls 11 are lifted upward and the plating jig 10 is pressed against the drive roll 12 relatively. Moreover, since there is no restriction | limiting in particular that the upper side is a drive roll and the downward | lower direction is a holding roll with respect to the plating jig | tool 10, it is not restricted to description in drawing.

Further, in order to make the plating jig 10 detachable from the range surrounded by the two holding rolls 11 and the driving rolls 12, either the driving roll 12 or the two holding rolls 11 are provided so as to be movable or removable. It is desirable that As a result, the plating jig 10 in which the article to be plated 2 is stored can be easily attached to and detached from the rotating device 13.

The rotating device 13 is provided with a power transmission plate 14, one end of which is connected to a DC power source such as a plating power source (not shown) via a wiring 15, and the other end is exposed to the outer periphery of the plating jig 10. It is comprised so that it may be in an electrical contact state with the outer peripheral part of the electricity supply member 1 currently performed. The power transmission plate 14 is made of a conductive material such as stainless steel, a copper alloy, or an iron-nickel alloy, and even when the plating jig 10 is rotated by the rotating device 13, the plating treatment is performed using its spring property. The outer peripheral part of the current-carrying member 1 exposed on the outer periphery of the tool 10 is always in close contact with the current-carrying member 1, and a current necessary for electrolytic plating can be stably supplied to the current-carrying member 1.

In the embodiment of the present invention, the power transmission plate 14 is a metal plate. However, for example, a metal wire, a braided wire, a metal rod, or the like may be used. In addition to the method of closely contacting the portion, there is also a method of forcibly pressing against the outer peripheral portion of the energizing member 1 using a spring or the like, and the present invention is not limited to the configuration of the embodiment. In addition to the method in which the power transmission plate 14 is brought into contact with the outer peripheral portion of the energization member 1, direct wiring connection may be made to a part of the energization member 1 using a bolt or the like. There is a concern that the wiring 15 may be twisted and troubles such as wiring cutting may occur, but this can be solved by alternately rotating the plating jig 10 clockwise and counterclockwise. Furthermore, a rotary connector or the like can be used in the middle of wiring.

The plating jig 10 of the present invention as described above is put into the plating tank 16 while being mounted on the rotating device 13, and electrolytic plating is performed. The plating solution 5 necessary for the treatment is stored inside the plating treatment tank 16, and the treatment solution is stirred by a stirrer (not shown) as necessary. The processing tank is provided with an anode 17 and is connected to a direct current power source such as a plating power source (not shown) by wiring so that a current necessary for electrolytic plating can be applied.

The plating jig 10 attached to the rotating device 13 is immersed in the plating tank 16. Further, the driving roll 12 of the rotating device 13 is rotated while applying a current to rotate the plating jig 10. The size of the opening 3 formed in the energizing member 1 constituting the plating jig 10 is slightly smaller than the size of the holding member opening 7 formed in the holding member 6. Since the opening 3 protrudes slightly inward from the holding member opening 7, when the article to be plated 2 is operably accommodated in the opening 3 of the energizing member 1, the article to be plated 2 is held by the holding member. The opening 3 can be preferentially brought into contact with the cross section of the opening 3 of the energizing member 1 over the opening 7.

Further, the plating jig 10 is further rotated, and the accommodated article 2 is subjected to electrolytic plating while changing the contact position with the cross section of the opening 3 of the current-carrying member 1 one after another by the rotational motion and the gravity acting on the article 2 to be plated. To go. As a result, it is possible to efficiently energize and perform plating without generating a plating non-deposited portion on the surface of the product to be plated 2, and at the same time, the product to be plated is in a state of being accommodated in the plating jig 10 with a gap. Since it only works, problems such as scratches and crack deformation can be solved.

Further, in the plating jig of the present invention, the energizing member 1 only forms the opening 3 in the plate-like conductive material, and can be easily and highly accurately achieved by laser drilling or metal etching which is a conventional processing method. A strip-shaped metal plate that can be formed in the shape of an opening and is subjected to sheet metal processing, welding processing, brazing processing, or the like of a metal plate for forming a grid shape like the energization frame 102 described in the prior art There is no need to bend or join.

Moreover, the highly difficult sheet metal processing and welding processing for forming a grid | lattice shape using materials, such as a metal wire and a metal bar, are unnecessary. In addition, as the lattice shape becomes polygonal or the number of lattice shapes increases, the difficulty of processing increases and the manufacturing cost of the energizing frame increases. This can be solved by forming a polygonal hole.

Note that the shape of the opening 3 is either linear or non-linear, and the shape can be freely selected. For example, the opening 3 having a jagged shape such as a saw blade is used to form the article to be plated 2 and the current-carrying member. The contact area with 1 can be made as small as possible. According to this, an energized state which is more advantageous with respect to energized traces and unplated plating is obtained.

Further, according to the plating jig of the present invention, even if the outer contour of the product to be plated is not a simple shape such as a quadrangle but a complicated shape including a curved line, an appropriate opening of the current-carrying member matching the contour is provided. The part can be easily formed into any shape by laser processing or etching processing. As a result, it is possible to efficiently perform the plating process even on a complicated shape to be plated which cannot be handled by the conventional energizing frame.

As described above, according to the configuration of the plating jig of the present invention, it is possible to easily manufacture the energizing member 1, greatly reduce the cost, and thus reduce the manufacturing cost of the article to be plated 2.

Furthermore, in the plating jig 10 of the present invention, the plating solution is obtained by covering the cross section of the opening 3 formed in the current-carrying member 1 and most of the flat surface except for the vicinity thereof with an insulator 4 such as vinyl chloride or polycarbonate. The part which comprises the electrical contact to the to-be-plated goods 2 exposed inside can be made very small.

In addition, since the current-carrying member 1 is configured to maintain mechanical strength and hold the article 2 to be plated by the holding member 6 to which the current-carrying member 1 is attached, there is no need to obtain mechanical strength for the current-carrying member 1 itself, and a material with a thickness as thin as possible is used. Can be used. According to this, as in the prior art, in order to reduce the surface area of the energization frame, there is a concern about the insufficient mechanical strength of the energization frame 102 or the state of energization, which is a concern when the size of the metal material used is reduced. All the problems such as change or defective insertion of the article to be plated 2 can be solved. As a result, the cross section of the opening 3 formed in the energizing member 1 and the insulating portion 4 are covered so as not to be exposed, and the minimum necessary for configuring electrical contact with the article 2 to be plated. Since only the surface is exposed in the plating solution, in addition to the plating film deposited on the product to be plated 2, which has been in the prior art, extra plating film cost due to the deposition of the plating film on the current-carrying frame 102 It is possible to solve a serious problem that occurs.

That is, according to the present invention, it is possible to perform uniform electrolytic surface treatment on a product without generating jig contact traces such as chipping, scratches, and unplated plating, and reduce the manufacturing cost of a through electrode member. In addition, it is possible to provide a plating jig that exhibits an excellent effect that the deposition of an excessive plating film can be prevented by reducing the surface area of the current-carrying member extremely.

In the present embodiment, the product to be plated 2 has a quadrangular shape and the plating jig 10 has a circular shape, but can be changed depending on the shape of the product to be plated 2 and the plating specifications.

Further, the present invention is not limited to the plating process, and can be applied to a process of performing an electrolytic process in a plating solution such as electrodeposition coating or electrolytic cleaning.

Further, not only one plating jig 10 but also a plurality of plating jigs 10 can be attached to the rotating jig to improve the manufacturing capability. In addition, the rotation device 13 can be appropriately changed without departing from the concept of the present invention, such as reducing the burden on the operator by installing the rotation device 13 permanently in the plating tank 16 and detaching only the plating jig 10. is there.

The plating jig of the present invention has a structure for uniform electrolytic surface treatment on a product to be plated without generating jig contact traces such as cracks, scratches and unplated plating, and manufacture of a through electrode member Cost can be reduced, and furthermore, it can be used as a plating jig when it is necessary to prevent deposition of an excessive plating film by making the surface area of the energizing member extremely small.

DESCRIPTION OF SYMBOLS 1 Current supply member 2 Product to be plated 3 Opening 4 Insulator 5 Plating solution 6 Holding member 7 Holding member opening 8 Protrusion 10 Plating jig 11 Holding roll 12 Driving roll 13 Rotating device 14 Power transmission plate 15 Wiring 16 Plating tank 17 Anode 18 Motor 19 Housings 20a, 20b Pulley 21 Belt 101 Conventional plating jig 102 Energizing frame 103 Lid member 104 Rotating shaft

Claims (1)

A plating jig comprising a current-carrying member that constitutes an electrical contact with a product to be plated and a holding member that is held in a state in which the product to be plated is slightly movable. It consists of a plate-like conductive material with an opening for inserting a plated product, and most of the flat surface except for the cross section of the opening and its vicinity is covered with an insulator, and at least the surface of the holding member is insulated. An electroplating jig, wherein the jig is attached to the energizing member so that the article to be plated is operatively held in the opening of the energizing member.

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