TWI648433B - Plating combined mechanism - Google Patents

Abstract

An electroplating assembly mechanism comprising a moving frame and a plating drum; the plating drum has an annular cylinder, a rotating shaft and a engaging portion, a first end of the rotating shaft is disposed on the annular cylinder, the engaging portion It is disposed at a bottom of the annular cylinder.

Description

Electroplating assembly mechanism

This invention relates to an electroplating assembly mechanism, and more particularly to an electroplating assembly mechanism for electroplating or electroless plating of a plurality of small parts.

Usually, there are two ways of plating, one is hanging plating and the other is barrel plating. Hanging plating is a plating method in which parts are mounted on a hanger for plating deposition, and is generally used for plating of large-sized parts. For small parts that cannot be or are not suitable for hanging due to factors such as shape and size, barrel plating is generally used. Barrel plating, also known as roller plating, is to deposit a certain number of small parts in a special roller and deposit various metal or alloy plating on the surface of the part in an indirect conductive manner to achieve surface protection, decoration or functionality. . Compared with the hanging plating, the plating method of the barrel plating parts has undergone a large change, in which the hanging plating is performed in a state in which the parts are separately packaged, and the barrel plating is performed in a state where the parts are concentrated and separated from each other, in this state. The mixing cycle of the parts is generated during the process; in addition, the plating is performed in a state where the parts are completely exposed, and the barrel plating is performed in a closed drum (having a hole in the wall plate) and a solution having a low concentration of the solution. The change in the way the part is plated brings two major defects to the barrel plating, namely the defects caused by the mixing cycle and the structural defects of the barrel plating. The above defects have a serious impact on the production efficiency of the barrel plating and the improvement of the product quality, so that the superiority of the barrel plating cannot be fully exerted.

Further, the current barrel plating technique is to connect the roller to a driving device, and after loading the workpiece to be plated in the roller, the driving device is then placed in the plating tank, so that The workpiece to be plated is turned over, causing it to fully contact with the electrolyte to produce an electrochemical effect. Since many surface of the needle-like or flaky microelectronic product parts are plated, usually in a plating cylinder, there are many kinds of plating cylinders in the prior art. Most of the plating cylinders are driven by horizontal driving devices. These plating cylinders generally have problems of complicated structure, difficult solution replacement, low plating efficiency, unevenness, and high maintenance cost.

In addition, a plating drum is disposed at a lower end of the drive shaft for enabling the electroplating tank provided with the anode to be rotationally driven, and is discharged from the inside of the plating drum to the outside by the centrifugal force acting when the electroplating drum is rotationally driven. It flows from the outside to the inside, but the plating drum is fixed to the lower end of the drive shaft and cannot be removed by transfer, so that the plating process of the automatic shift change can not be achieved.

Accordingly, it would be desirable to provide an improved electroplating assembly mechanism to address the problems of the prior art described above.

The main object of the present invention is to provide an electroplating assembly mechanism for forming a vortex into a plating solution in an annular cylinder by using a vortex blade, so that the plating solution is quickly exchanged, and the flow direction of the plating solution is stabilized by the power line guide ring, so that the plating solution can be evenly distributed. Soaking these small parts to achieve uniform plating of the surface of these small parts.

In order to achieve the above object, the present invention provides an electroplating assembly mechanism for electroplating a plurality of small parts, the electroplating assembly mechanism comprising a plating cylinder for supporting the small parts, wherein the electroplating cylinder has an annular cylinder, A rotating shaft, a engaging portion and a plurality of vortex blades. A first end of the rotating shaft is disposed on the annular cylinder, and the engaging portion is disposed at a bottom of the annular cylinder for being rotated by a driver, and the vortex blades are disposed at a bottom of the annular cylinder.

In an embodiment of the present invention, the electroplating assembly mechanism further includes a moving frame, the plating cylinder is combined on the moving frame, the moving frame has a fixing plate, two side plates, two auxiliary rods and a rotary joint, and the like The side plates are combined on two sides of the fixing plate, and the auxiliary rods are disposed between the side plates such that the annular cylinder is located above the auxiliary rod, and the rotary joint is pivotally connected to the fixing plate for A second end is combined.

In an embodiment of the invention, the moving frame further has two cathode seats disposed on two sides of a bottom of the fixing plate for electrically connecting with a cathode ring.

In an embodiment of the invention, the moving frame further has a cathode lead connected to the cathode block for electrically connecting to the cathode ring.

In an embodiment of the invention, the annular cylinder has a base, a surrounding wall, an upper cover and a cathode ring, the base is combined with the surrounding wall, and the upper cover covers the surrounding wall and forms an internal space. The rotating shaft is connected to the upper cover from the base and extends outward, and the cathode ring is disposed in the surrounding wall.

In an embodiment of the invention, the plating drum further has a power line guide ring disposed within the annular barrel and spaced from the surrounding wall.

In an embodiment of the invention, the plating drum further includes a current transport layer disposed on the base of the annular cylinder.

In an embodiment of the present invention, the annular cylinder further has a plurality of cathode discs and a plurality of sloping flow guiding slopes, and the cathode discs and the slanting flow guiding slopes are alternately arranged on the current transport layer. Moreover, the cathode disks are located between adjacent two deflection flow guides.

As described above, the cathode ring surrounding the wall of the annular cylinder can be electrically connected to the cathode blocks through the cathode wire through the rotating shaft, and the centrifugal roller starts to rotate to generate centrifugal force. At the same time, the small parts in the annular cylinder are driven to move toward the cathode ring, and at the same time, the vortex blades form a vortex flow to the plating solution in the annular cylinder, so that the plating solution is quickly exchanged and transmitted through the power line guide. The design of the ring can stabilize the flow direction of the plating solution, so that the plating solution can uniformly soak the small parts to achieve uniform plating effect on the surface of the small parts.

2‧‧‧Mobile rack

21‧‧‧ fixed board

22‧‧‧ side panels

24‧‧‧Auxiliary pole

26‧‧‧ Holding parts

27‧‧‧Rotary joint

28‧‧‧ cathode seat

29‧‧‧Cathode wire

3‧‧‧ plating cylinder

31‧‧‧Circular cylinder

311‧‧‧Base

312‧‧‧ Around the wall

313‧‧‧Upper cover

314‧‧‧Cathode ring

317‧‧‧Cathode wafer

318‧‧‧Scratch flow slope

32‧‧‧ shaft

321‧‧‧ first end

322‧‧‧ second end

33‧‧‧Care Department

34‧‧‧current transport layer

36‧‧‧Power line guide ring

37‧‧‧Vortex blades

38‧‧‧ dish

1 is a side elevational view of a preferred embodiment of an electroplating assembly in accordance with the present invention; FIG. 2 is an exploded view of a preferred embodiment of an electroplating assembly in accordance with the present invention; and FIG. 3 is in accordance with the present invention An exploded view of another preferred embodiment of the electroplating assembly mechanism.

The above and other objects, features and advantages of the present invention will become more <RTIgt; Furthermore, the directional terms mentioned in the present invention, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, central, horizontal, horizontal, vertical, longitudinal, axial, Radial, uppermost or lowermost, etc., only refer to the direction of the additional schema. Therefore, the directional terminology used is for the purpose of illustration and understanding of the invention.

Please refer to FIGS. 1 and 2, which illustrate a preferred embodiment of a plating assembly mechanism for mounting a plurality of small parts for electroplating or electroless plating, such as wafer type resistors, Inductors, capacitors, connectors, precision parts, etc. The electroplating assembly mechanism includes a moving frame 2 and a plating drum 3. The detailed construction, assembly relationship, and operation principle of each element will be described in detail below.

Referring to FIGS. 1 and 2, the moving frame 2 has a fixing plate 21, two side plates 22, two auxiliary levers 24, a plurality of gripping members 26, a rotary joint 27, two cathode seats 28 and a cathode lead 29. The side plates 22 are combined on the two sides of the fixing plate 21, and the auxiliary rods 24 are disposed between the side plates 22, and the holding members 26 are respectively spaced apart from the top surface of the fixing plate 21 The side is configured to be lifted and moved. The rotary joint 27 is pivotally connected to the fixing plate 21 for combining with a second end 322 of the rotating shaft 32. The cathode holder 28 is disposed on the fixing plate 21 The cathode wires 29 connect the two cathode blocks 28 on the two sides of a bottom portion.

Referring to FIGS. 1 and 2, the plating drum 3 is for supporting the small parts (not shown), and the plating drum 3 can be combined on the moving frame 2, wherein the plating drum 3 has a ring. a cylindrical body 31, a rotating shaft 32, an engaging portion 33, a current transmission layer 34, a power line guide ring 36 and a plurality of vortex blades 37. A first end 321 of the rotating shaft 32 is disposed on the annular cylinder 31. And the engaging portion 33 is located below the first end 321 , and the vortex blades 37 are disposed on the disk body 38 at intervals around the rotating shaft 32 . In addition, the engaging portion 33 is disposed at a bottom of the annular cylinder 31, wherein an end surface of the second end 322 is in the shape of a claw, and the auxiliary rods 24 are disposed between the side plates 22, so that The annular cylinder 31 is located above the auxiliary lever 24. It is to be noted that the engaging portion 33 is mounted on a driver (not shown) and is rotated by a driving wheel of the driver.

It should be noted that the current transmission layer 34 is made of titanium metal or titanium-plated, titanium-sprayed material, and the annular cylinder 21 is made of a plastic material, and the current transmission layer 34 and the annular cylinder 21 An intermediate layer (not shown) is disposed between the intermediate layers made of a plastic material.

Referring to FIGS. 1 and 2 , the annular cylinder 31 has a base 311 , a surrounding wall 312 , an upper cover 313 and a cathode ring 314 . The base 311 is combined with the surrounding wall 312 . The upper cover 313 covers the surrounding wall 312 and defines an internal space (not shown) for accommodating the small parts. The rotating shaft 32 is connected to the upper cover 313 from the base 311 and extends upward. The cathode ring 314 The cathode wire 29 is electrically connected to the cathode ring 314 via the rotating shaft 22, and the disk body 38 is combined on the base 311 such that the vortex blades 37 are located. Above the base 311.

According to the above structure, the rotary joint 27 can be loosened to separate the annular cylinder 31 from the rotating shaft 32, and the cathode holders 28 on the two sides of the bottom of the fixing plate 21 can be electrically contacted. The cathode ring 314 is electrically connected, and when the fixing plate 21 is removed, a power failure is formed. In addition, when the cathode ring 314 is rotationally accelerated to a specified rotational speed, the small parts (the object to be plated) in the annular cylinder 31 are pressed against the cathode ring 314 by centrifugal force, and the power is supplied for electroplating, after a period of time. The power is turned off and the cathode ring 314 is decelerated to a low rotational speed, and the small parts (objects to be plated) in the annular cylinder 31 are mixed by gravity on the bottom of the annular cylinder 31, and then the small parts are After the object to be plated, the cathode ring 314 is rotated and accelerated to a specified number of rotations, so that the small parts (the object to be plated) are intermittently mixed at a low speed and accelerated, and then mixed at a low speed and accelerated, thereby making the small parts ( The surface of the object to be plated can have a more uniform plating effect.

With the above design, the cathode ring 314 of the annular cylinder 31 surrounding the wall 312 can be electrically connected to the cathode blocks 28 through the cathode wire 29 via the rotating shaft 22, and when the plating drum 3 starts to rotate to generate centrifugal force. The small parts in the annular cylinder 21 are driven to move toward the cathode ring 314. At the same time, the vortex blades 37 form a vortex to the plating solution in the annular cylinder 21, so that the plating solution is quickly exchanged. Further, through the design of the power line guide ring 36, the flow direction of the plating solution can be stabilized, and the plating solution can uniformly soak the small parts to achieve uniform plating effect on the surface of the small parts.

Further, with the design of the engaging portion 33, the driver can be easily engaged and rotated by the driver, and the rotary joint 27 is designed such that the plating cylinder 3 can be easily mounted on the movement. The frame 2 is detached from the moving frame 2, and the speed of the plating drum 3 can be shortened, and the efficiency of the plating operation can be improved. Further, the ring portion 31 is rotated by the engaging portion 33, and the ring body 31 is rotated. The small parts in the annular cylinder 21 are moved toward the cathode ring 314 by the centrifugal force during rotation, so that the small parts can be efficiently tumbling in the plating solution.

Please refer to FIG. 3, which is another preferred embodiment of the electroplating assembly mechanism of the present invention, and generally uses the same component names and drawings as the above preferred embodiment, but the difference between the two is characterized by: the annular cylinder 31 has a plurality of cathode discs 317 and a plurality of sloping flow guides 318, and the cathode dies 317 and the sloping flow guides 318 are alternately spaced on the current transport layer 34, and the cathode discs 317 are located Adjacent to the two deflection flow guides 318. Therefore, the preferred embodiment can also make the plating drum 3 easy to move and replace, and can achieve the effect of uniformly plating the surfaces of the small parts according to the requirements of different types of small parts being plated.

As described above, the cathode ring 314 of the annular cylinder 31 surrounding the wall 312 can be electrically connected to the cathode blocks 28 through the cathode wire 29 via the rotating shaft 22, and when the plating drum 3 starts to rotate to generate centrifugal force, The small parts in the annular cylinder 21 are driven to move toward the cathode ring 314. At the same time, the vortex blades 37 form a vortex to the plating solution in the annular cylinder 21, so that the plating solution is quickly exchanged and transmitted. The power line guide ring 36 is designed to stabilize the flow direction of the plating solution, so that the plating solution can uniformly soak the small parts to achieve uniform plating effect on the surface of the small parts.

The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

Claims (7)

An electroplating assembly mechanism for electroplating a plurality of small parts, the electroplating assembly mechanism comprising: a plating drum for supporting the small parts, wherein the electroplating drum has: an annular cylinder; a rotating shaft, one of the rotating shafts a first end is disposed on the annular cylinder; a engaging portion is disposed at a bottom of the annular cylinder for being rotated by a driver; and a plurality of vortex blades are disposed at a bottom of the annular cylinder; wherein The annular cylinder has a base, a surrounding wall, an upper cover and a cathode ring. The base is combined with the surrounding wall. The upper cover covers the surrounding wall and forms an internal space. The rotating shaft connects the upper cover from the base. And extending outwardly, the cathode ring is disposed within the surrounding wall. The electroplating assembly mechanism of claim 1, further comprising a moving frame, the plating cylinder being combined on the moving frame, the moving frame having: a fixing plate; and two side plates combined on two sides of the fixing plate a second auxiliary rod disposed between the side plates such that the annular cylinder is located above the auxiliary rod; and a rotary joint pivotally connected to the fixed plate for combining with a second end of the rotating shaft . The electroplating assembly mechanism of claim 2, wherein the moving frame further has two cathode seats disposed on two sides of a bottom portion of the fixing plate for electrically connecting with a cathode ring. The electroplating assembly mechanism of claim 3, wherein the moving frame further has a cathode lead connected to the cathode holder for electrically connecting to the cathode ring. The electroplating assembly mechanism of claim 1, wherein the electroplating drum further has a power wire guide ring disposed in the annular cylinder and spaced apart from the surrounding wall. The electroplating assembly mechanism of claim 1, wherein the electroplating drum further comprises a current transport layer disposed on the base of the annular cylinder. The electroplating assembly mechanism of claim 6, wherein the annular cylinder further has a plurality of cathode discs and a plurality of sloping flow guiding slopes, wherein the cathode discs and the slanting flow guiding slopes are alternately arranged at intervals The current transport layer is disposed, and the cathode wafers are located between adjacent two deflection flow guides.