KR101381632B1 - Apparatus to plate substrate - Google Patents

Abstract

In accordance with another aspect of the present invention, there is provided a substrate plating apparatus, including: a process chamber in which an electrolyte is accommodated and a target part is installed at an inner lower part to generate positive metal ions when an anode voltage is applied; And a loading chuck disposed on an upper portion of the process chamber and having a lift portion rotatably provided relative to the process chamber, and a rotatable portion rotatably coupled to the lift portion and holding a substrate plated by plus metal ions. The rotating part includes: a loading body including a loading part in which an edge part of the substrate is loaded in contact with the loading part; A pressing member which is provided to be movable in the vertical direction in the loading body and presses the substrate against the loading portion; And an elastic member interposed between the inner upper surface of the loading body and the upper surface of the pressing member and having an elastic force to push the pressing member downward. According to the embodiment of the present invention, the loading chuck can smoothly perform loading and unloading of the substrate by a simple driving principle, so that the plated substrate can be easily unloaded after the substrate plating process is completed reliably.

Description

Apparatus to plate substrate

A substrate plating apparatus is disclosed. More specifically, a substrate plating apparatus is disclosed in which a loading chuck can smoothly load and unload a substrate by a simple driving principle.

In general, a metal film is patterned on the entire surface of a substrate in order to form a metal wiring on a silicon wafer constituting a semiconductor device. At this time, the metal film formed on the entire surface of the substrate is formed of aluminum, copper, or the like.

Among them, the metal film formed of copper has a high melting point compared to the metal film formed of aluminum, and thus may have a large resistance to electrical mobility. As a result, the reliability of the semiconductor device may be improved and the signal resistance is low. There is an advantage to increase the delivery speed. Therefore, a metal film formed of copper is mainly used.

The thin film deposition method is largely classified into physical vapor deposition (PVD) using physical collisions and chemical vapor deposition (CVD) using chemical reactions. Physical vapor deposition methods include sputtering methods, and chemical vapor deposition methods include thermal CVD using heat and plasma enhanced CVD using plasma. .

However, in order to pattern a metal film on a substrate, an electroplating method, which is more resistant to electric mobility and relatively low in manufacturing cost, is preferred to the deposition method.

The structure of the conventional substrate plating apparatus to which the electroplating method is applied is Korean Patent Application No. 2009-0123980 (Name of Invention: Substrate Plating Device) and Korean Patent Application No. 2007-0127891 (Invention: Copper Electroplating Apparatus) And copper plating method).
Such a substrate plating apparatus has a target portion for discharging positive metal ions, for example, copper ions (Cu ²⁺ ) when an electrolyte is received and an anode voltage is applied to an inner lower portion thereof, and a lowering and rotatable upper portion of a process chamber. And a loading chuck capable of gripping the substrate.

The loading chuck may include a supporting portion on which the substrate is supported and a pressing portion for pressing the substrate to the supporting portion to secure the loading state of the substrate for loading and unloading the substrate.

In detail, plating of the substrate may be performed while the pressing portion presses the substrate to the supporting portion, and after the plating process is completed, the pressing portion may be spaced apart from the supporting portion to unload the substrate. .

Therefore, there is a need for development of a structure of a loading chuck to reliably perform loading and unloading of a substrate.

An object according to an embodiment of the present invention is that the loading chuck can smoothly perform the loading and unloading of the substrate by a simple driving principle, so that the plated substrate can be easily unloaded after the substrate plating process is completed reliably. It is to provide a substrate plating apparatus.

In accordance with another aspect of the present invention, there is provided a substrate plating apparatus, including: a process chamber in which an electrolyte is accommodated and a target part is installed at an inner lower part to generate positive metal ions when an anode voltage is applied; And a lifting part disposed above the process chamber, the lifting part being provided to be liftable with respect to the process chamber, and a rotation part rotatably coupled to the lifting part and holding the substrate plated by the plus metal ion. A loading body including a loading part to be loaded in contact with an edge portion of the substrate; A pressing member which is provided to be movable in an up and down direction from the inside of the loading body to press the substrate against the loading portion; And an elastic member interposed between the inner upper surface of the loading body and the upper surface of the pressing member and having an elastic force to push the pressing member downward, thereby allowing the loading chuck to have a simple driving principle. As a result, the loading and unloading of the substrate can be performed smoothly, and thus the plating finished substrate can be easily unloaded after the substrate plating process is completed reliably.

The loading chuck may further include a locking part for locking the position of the pressing member after moving the pressing member in a direction away from the substrate for unloading of the substrate.

The locking unit may include a connecting member having one end connected to the pressing member and the other end exposed to the outside of the loading body; And a pressure release member coupled to the lifting unit to release the pressing force of the pressure member against the substrate by grasping the connection member.

The other end of the connection member may be provided with a latching portion and may be latched when the pressure release member rises.

The pressure member may move in a direction in which an elastic force of the elastic member acts upon unlatching of the connection member by the pressure release member.

The elastic member may be regularly arranged in a circumferential direction between the inner upper surface of the loading body and the pressing member.

According to the embodiment of the present invention, the loading chuck can smoothly perform loading and unloading of the substrate by a simple driving principle, so that the plated substrate can be easily unloaded after the substrate plating process is completed reliably.

1 is a view showing the configuration of a substrate plating apparatus according to an embodiment of the present invention.
2 is a view showing a loading state of the substrate by the loading chuck shown in FIG.
3 is a diagram illustrating an unloading state of a substrate by the loading chuck illustrated in FIG. 2.
4 is an enlarged view of a portion of FIG. 3.

Hereinafter, configurations and applications according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE INVENTION The following description is one of many aspects of the claimed invention and the following description forms part of a detailed description of the present invention.

In the following description, well-known functions or constructions are not described in detail for the sake of clarity and conciseness.

Hereinafter, would be a metal ion which is generated from the target portion, described as a copper ion (Cu ^{2 +)} is not limited to this, it is no wonder is that to proceed the plating process on the substrate by the different kinds of metal ions.

1 is a view showing the configuration of a substrate plating apparatus according to an embodiment of the present invention, Figure 2 is a view showing a loading state of the substrate by the loading chuck shown in Figure 1, Figure 3 is FIG. 4 is a view illustrating an unloading state of a substrate by the loading chuck shown in FIG. 4, and FIG. 4 is an enlarged view of a portion of FIG. 3.

1, the substrate plating apparatus 100 in accordance with one embodiment of the present invention, the electrolytic solution 103 is accommodated, and an inner lower portion of positive metal ions, upon application of a positive voltage, that is, examples of copper ion of this embodiment (Cu ^{2 +} ) of the substrate (W) to be plated by the features enabling the lifting and rotating the inner upper copper ion (Cu ^{2 +)} of the target portion (the process chamber 110, process chamber 110, which is 120) is arranged to generate a A gripping loading chuck 150 may be included. Here, the loading chuck 150 of the present embodiment can firmly support the substrate W during loading of the substrate W so that the substrate plating process can proceed reliably, and at the same time after the completion of the plating process, Unloading of the substrate W may also be performed.

Moreover, copper ion (Cu ^{2 +)} on the electrolyte 103 is provided in the substrate plating apparatus 100, the process chamber 110 so as to surround a target part 120 as shown in Figure 1 according to this embodiment It may further include a filtration unit 130 for filtering.

Referring to each configuration, first, the process chamber 110 of the present embodiment, as shown in Figure 1, the inner chamber 111 and the outer chamber 115, which can be detachably assembled together, the outer chamber 115, outer chamber). In the inner chamber 111 of the present embodiment, the electrolyte 103 is filled up to the upper end, and the lower end is equipped with the target unit 120 and the filtration unit 130 surrounding the target unit 120.

The inner chamber 111 is detachably coupled to the inner side of the outer chamber 115 and can be more reliably protected from the external environment by this coupling structure.

As such, the process chamber 110 of the present embodiment includes an inner chamber 111 and an outer chamber 115 that are easily assembled and separated from each other. However, the structure of the process chamber 110 is not limited to this, and it is natural that the inner chamber 111 and the outer chamber 115 can be integrally formed.

On the other hand, inside the inner chamber 111, as shown in Figure 1, the target portion 120 for forming an anode (anode) is provided. Target portion 120 is a portion is completely immersed in the electrolyte (103) for generating a positive metal ions, i.e. in this embodiment a copper ion (Cu ^{+ 2)} by an oxidation reaction when applied to the positive voltage by the power supply.

In this embodiment, the upper surface of the target portion 120 may be provided irregularly. This, is to enlarge the substantial surface area of the upper surface of the target portion 120 to be a large amount of copper ion (Cu ^{+ 2)} occurs when a positive voltage is applied to the target portion 120.

Thus, when copper ions (Cu ^{2 +} ) are generated from the target portion 120, the generated copper ions (Cu ^{2 +} ) must be transferred to the substrate W to be plated. This is accomplished by the electrolyte 103 which is accommodated in the inner chamber 111 up to a line. Therefore, the electrolytic solution 103 is applied as a copper sulfate solution suitable for conducting copper ions (Cu ^{2 +} ). However, the present invention is not limited thereto, and it is needless to say that other kinds of electrolytic solution 103 can be applied.

On the other hand, filtering unit 130, a, provided on the inside of the inner chamber 111 to surround the target portion 120 of the copper ion (Cu ^{2 +)} moving through the electrolyte solution 103, as shown in Figure 1 Filtered. The filtration unit 130 may include a filtration hole (not shown) that is provided substantially parallel to the target portion 120 at an upper portion of the target portion 120 and has a diameter of 1 to 10 micrometers (μm) And may be provided with a membrane filter.

Therefore, it is possible to prevent such a matter, for example, except for copper ion (Cu ^{+ 2)} on the electrolyte 103, such as air bubbles to reach the substrate (W).

On the other hand, the substrate plating apparatus 100 of the present embodiment is connected to the electrolyte supply unit (not shown) to supply the electrolyte solution 103 into the inner chamber 111 as well as to form a flow of the electrolyte solution 103 140 may further include.

Not only the electrolyte 103 may be supplied to the inner chamber 111 through the electrolyte supply line 140, but also the flow of the electrolyte 103 may be formed to be transferred from the target part 120 to the substrate W. It can activate the movement of copper ions (Cu ^{2 +} ).

On the other hand, as described above, the substrate plating apparatus 100 of the present embodiment includes a loading chuck 150 that can hold the substrate (W), according to the lifting and rotating operation of the loading chuck 150 The plating process and the loading / unloading process for W) can be performed.

As shown in FIG. 1, the loading chuck 150 of the present embodiment includes a lifting unit 160 coupled to an external lifting device so as to be able to lift in a height direction with respect to the process chamber 110. It may include a rotating unit 151 rotatably coupled to the unit 160 and directly holding the substrate (W).

With this configuration, the substrate W held by the rotating unit 151 can be lowered so as to be immersed in the electrolyte solution 103 of the process chamber 110 in accordance with the lifting operation of the lifting unit 160 by the lifting device. In the plating process for the substrate W, the plating process of the substrate W may be performed by relatively rotating the rotating unit 151 with respect to the lifting unit 160.

In addition, although not shown, the lifting unit 160 and the rotating unit 151 are provided with a negative power supply unit (not shown) connected to each other. A portion of the cathode voltage applying unit is formed along the axis of the elevating unit 160, and another portion of the cathode voltage applying unit is formed in a shape that is split from both sides of the rotating unit 151 to apply a uniform cathode voltage to the substrate W. Can be.

Here, a portion of the negative voltage applying unit disposed in the lifting unit 160 and another portion of the negative voltage applying unit disposed in the rotating unit 151 may be connected by a slip ring (not shown), and thus, the rotating unit with respect to the lifting unit 160. Relative rotation of 151 is possible.

On the other hand, the loading chuck 150 of the present embodiment has a structure of a rotating part 151 that can facilitate loading and unloading of the substrate (W). As shown in FIGS. 2 and 3, the rotating part 151 includes a loading body 152 having a loading part 153 in which the edge portion of the substrate W is loaded in contact with the loading body 152. A pressing member 155 disposed to be movable in the vertical direction from the inner side to press the substrate W against the loading portion 153, and disposed inside the loading body 152 and having an elastic force to press the pressing member ( It may include an elastic member 157 to push the 155 downward.

With this configuration, the pressing member 155 can press the substrate W by the elastic force of the elastic member 157 while the edge portion of the substrate W is loaded on the loading portion 153, so that the substrate W The loading state of the can be kept firm.

However, in order to unload the substrate W after the plating process of the substrate W is completed, the pressing member 155 must be moved upward and then the position of the pressing member 155 must be fixed. The chuck 150 may further include a locking unit 170 for adjusting the position of the pressing member 155. This will be described later.

Referring to each configuration, first, the loading body 152 of the present embodiment, as shown in Figures 2 and 3, to form a basic frame of the rotating part 151, it may have a cylindrical shape which is open downward. . The lower end portion of the loading body 152 is provided with a loading portion 153 in which the edge portion of the substrate W is partially loaded, thereby loading the substrate W onto the loading body 152.

On the other hand, the pressing member 155 is disposed so as to be movable in the vertical direction from the inside of the loading body 152 and has a roughly disk shape to press the substrate (W). The pressing member pressurizes the substrate W so that the substrate W and the loading part 153 may be in close contact with each other, and thus the plating process of the substrate W may be smoothly performed. In addition, due to the adhesion between the substrate W and the loading portion 153, the electrolyte 103 may be prevented from entering the inside thereof.

Here, a plurality of elastic members 157 are provided between the upper surface of the pressing member 155 and the inner upper surface of the loading body 152 so that the pressing member 155 may press the substrate W with a predetermined force. That is, a plurality of elastic members 157 having a spring shape are disposed in the loading body 152 along the circumferential direction to press the pressing member 155 downward, and thus the edge portion of the substrate W. To be in close contact with the loading portion 153 of the loading body 152.

Meanwhile, after the plating process of the substrate W is completed, the substrate W should be unloaded from the loading portion 153 of the loading body 152. For this purpose, the pressing of the pressing member 155 should be released.

Thus, as described above, the loading chuck 150 of the present embodiment is provided with a locking unit 170 for adjusting the position of the pressing member 155, which will be described below.

2 to 4, the locking unit 170 of the present embodiment is provided in a bar shape having a longitudinal direction and is disposed to penetrate the top wall of the loading body 152, and one end of the pressing member 155 is provided. Coupled to the other end and exposed to the upper side of the loading body 152, the plurality of connecting members 171 and the lifting member 160 is coupled to the pressing member 160 by holding the connecting member 171 and the pressing member against the substrate (W) It may include a pressure release member 175 for releasing the pressing force of the (155).

Here, the other end of the connecting member 171 is provided with a locking portion 172 having a longitudinal direction and a horizontal direction of the connecting member 171, so that the locking portion 172 of the connecting member 171 is a pressure release member ( According to the lifting operation of the 175 may be selectively latched (latching) or unlatching (unlatching).

2 is the latching state of the pressure release member 175 with respect to the engaging portion 172 of the connecting member 171 is released, in this case the pressing member 155 is moved downward by the elastic force of the elastic member 157 It is possible to maintain a state in which the state is maintained, and thus, by pressing the substrate W downward, the adhesion state between the substrate W and the loading part 153 can be maintained firmly.

On the other hand, Figures 3 and 4 is a view showing a state in which the engaging portion 172 of the connecting member 171 latched by the pressure release member 175, when the pressure release member 175 raises the connection member The engaging portions 172 of the 171 may be caught by the pressure release member 175, and as the connection member 171 is raised by the continuous rise of the pressure release member 175, the pressure member 155 may also rise. have.

Accordingly, the pressing force of the pressing member 155 against the substrate W may be released, and thus the unloading process of the substrate W may be performed after the plating process of the substrate W is completed.

As such, the position of the pressing member 155 that presses the substrate W by the locking unit 170 may be adjusted. For example, when the substrate W is unloaded, the pressing member 155 may be raised to free the substrate W. Not only can the loading be performed smoothly, but also the substrate W can be uniformly pressed by releasing the locking of the pressing member 155 when the substrate W is loaded, so that the plating process of the substrate W can be performed reliably. .

As such, according to an embodiment of the present invention, the loading chuck 150 can smoothly perform the loading and unloading of the substrate W by a simple driving principle, thereby completing the plating process after the substrate plating process is reliably completed. There is an advantage in that the substrate W can be easily unloaded.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: substrate plating apparatus 103: electrolyte solution
110: process chamber 120: target portion
130: filtration unit 140: electrolyte solution supply line
150: loading chuck 151: rotating part
152: loading body 155: pressure member
157: elastic member 160: lifting portion
170: locking part

Claims (6)

A process chamber in which an electrolyte is accommodated and a target part is installed at an inner lower part to generate positive metal ions when an anode voltage is applied; And
A loading chuck disposed on an upper portion of the process chamber, the lifting part being provided to be liftable with respect to the process chamber, and a rotating part rotatably coupled to the lifting part and holding a substrate plated by the plus metal ion; ;
/ RTI >
The rotation unit includes:
A loading body including a loading portion in which an edge portion of the substrate is loaded in contact with the loading portion;
A pressing member which is provided to be movable in an up and down direction from the inside of the loading body to press the substrate against the loading portion; And
An elastic member interposed between the inner upper surface of the loading body and the upper surface of the pressing member and having an elastic force to push the pressing member downward;
Substrate plating apparatus comprising a.
The method of claim 1,
The loading chuck is
And a locking part for locking the position of the pressing member after moving the pressing member in a direction away from the substrate for unloading the substrate.
3. The method of claim 2,
The locking portion
A connecting member having one end connected to the pressing member and the other end exposed to the outside of the loading body; And
And a pressing release member coupled to the lifting unit to release the pressing force of the pressing member against the substrate by grasping and connecting the connecting member.
The method of claim 3,
The other end of the connecting member is provided with a latching portion is plated apparatus for latching (latching) on the pressure release portion when the pressure release member is raised.
5. The method of claim 4,
And the pressing member moves in a direction in which an elastic force of the elastic member acts upon unlatching of the connection member by the pressing release member.
The method of claim 1,
The elastic member is a substrate plating apparatus which is regularly arranged in the circumferential direction between the inner upper surface of the loading body and the pressing member.

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