CN102851725A - Insulation plate of electroplating machine - Google Patents
Insulation plate of electroplating machine Download PDFInfo
- Publication number
- CN102851725A CN102851725A CN2011101819454A CN201110181945A CN102851725A CN 102851725 A CN102851725 A CN 102851725A CN 2011101819454 A CN2011101819454 A CN 2011101819454A CN 201110181945 A CN201110181945 A CN 201110181945A CN 102851725 A CN102851725 A CN 102851725A
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- CN
- China
- Prior art keywords
- electroplating
- liquid medicine
- processing vessel
- insulation plate
- insulcrete
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to an insulation plate of an electroplating machine, being of a convex structure sloping down gently from the center to two sides. The invention provides an insulation plate of an electroplating machine for small parts, which is easy to discharge an electroplating solution, and as a result, improves the electroplating quality of the small parts and prolongs the service life of a processing vessel.
Description
Technical field
The present invention relates to a kind of electroplanting device insulcrete, mainly be applicable to 0.1 ~ 5000 micron body of powder, the plating work of the findings such as superminiature capacitor, resistor, diode, junctor, spring switch, nail, screw, nut, packing ring.
Background technology
Fig. 1 is that the master of a kind of electrolytic plating apparatus in the existing finding surface processing device of conduct of expression shown in patent documentation 1 looks schematic cross-section.This electrolytic plating apparatus utilizes vertical rotating shaft to make to contain the processing vessel rotation of finding and makes finding contact electricity polar ring, and while make electroplating liquid medicine from the inside of processing vessel to the outside electroplating liquid medicine of circulation in from electrode to processing vessel switch on, thereby finding is electroplated.Processing vessel has the outflow mechanism that electroplating liquid medicine is circulated to the outside from the inside of processing vessel.In electrolytic plating apparatus, electroplating liquid medicine is exported in from nozzle to processing vessel, flows out, disperses to the outside of processing vessel by flowing out mechanism, and reclaim after being accepted by housing, utilizes pump to export from nozzle.That is, the Reusability while electroplating liquid medicine circulates.In addition, in electrolytic plating apparatus, be to be evenly distributed on thickness on the insulating base less than the pad of finding as what flow out that mechanism utilizes.The pad pad between insulcrete and electrode ring, the generation slit that electrode ring and insulating base are separated, as do not allow finding by and the strainer that only allows electroplating liquid medicine pass through work.After electroplating end-of-job, improve the rotating speed of vertical rotating shaft, the plating medicine liquid medicine in the processing vessel is all discharged.
Patent documentation 1:CN 101139732A applicant C. Uyemura ﹠ Co Ltd
In the outflow mechanism that is made of pad 15, following problem becomes outstanding.
⑴ the breakage of finding
After one electroplating work procedure finished, for the electroplating liquid medicine in the processing vessel is all discharged, the rotating speed that need to increase vertical rotation axis improved the centrifugal force of the electroplating liquid medicine in the processing vessel, and the linear velocity between finding and the electrode ring increases.In electroplating liquid medicine soon drains, lacked the lubricated of electroplating liquid medicine between finding and the electrode ring, form metal to-metal contact between finding and the electrode ring, add the increase of linear velocity, be easy to cause the breakage of finding.
⑵ electroplate the decline of yield
Pad also has electrode ring to link to each other by screw and insulating base, the difference of screw-driving torsion, gap between electrode ring and the insulating base is just different, in the process of rotation, causes easily the unbalance stress of processing vessel, cause the distortion of insulating base, gap size between insulating base and the electrode ring is difficult to control like this, and some findings are stuck between insulating base and the electrode ring, can't electroplate fully, the uneven coating of perhaps electroplating is even, and the yield of electroplating so just descends.
⑶ diseconomy
1. after one electroplating work procedure finished, the rotating speed that needs to improve processing vessel drained electroplating liquid medicine from processing vessel, and rotating speed is higher, and is just higher to the balance requirement of whole electroplanting device, also increased the accuracy requirement of component simultaneously.The production cost of whole like this equipment will increase, and use cost also can increase simultaneously.
2. pad also has electrode ring to link to each other by contact screw and insulating base, the difference of screw-driving torsion, gap between electrode ring and the insulating base is just different, in the process of rotation, cause easily the unbalance stress of processing vessel, cause the distortion of insulating base, arrive to a certain degree when distortion is large, whole processing vessel is just scrapped, and the cycle of changing accessory is just more frequent, has increased use cost.
Summary of the invention
The present invention is directed to defects, thereby purpose is to provide a kind of small part electroplating device insulcrete that improves the finding electroplating quality, improves the processing vessel life-span of easily electroplating liquid medicine being discharged.
The technical solution used in the present invention is for this reason: the present invention its by the mild convex configuration in middle mind-set both sides.
Pitch angle between its highs and lows of convex surface of the present invention is less than 5
o
The present invention is arranged to convex configuration high in the middle and low on both ends with insulcrete, and during row's electroplating liquid medicine, more traditional insulcrete structure formation electroplating liquid medicine flows out from the gap between pad and the insulcrete under action of gravitation easily.So the present invention is when row's electroplating liquid medicine, its rotating speed to processing vessel requires to reduce, and has reduced the damage to electroplated component and electroplanting device.
Description of drawings
Fig. 1 is structural representation of the present invention
1 is that processing vessel, 2 is that electric-conductor, 3 is that loam cake, 4 is that electrode ring, 5 is that pad, 6 is that insulcrete, 7 is that conducting plates, 8 is that retrieving arrangement, 9 is that vacuum extractor, 10 is that pump, 11 is that nozzle, 12 is that electroplating liquid medicine, 13 is finding among the figure.
Embodiment
Insulcrete 6 of the present invention is convex configuration, and the pitch angle between its convex surface highs and lows is less than 5
o
The present invention will be further described below in conjunction with its Working environment:
Processing vessel 1 of the present invention begins from below to stack up by conducting plates 7, insulcrete 6, pad 5, electrode ring 4, loam cake 3 in order, and utilizes electric-conductor 2 to be formed by connecting.When needs row electroplating liquid medicine 12, electroplating liquid medicine 12 in the processing vessel 1 enters in the retrieving arrangement 8 by the gap that forms between insulcrete 6 and the pad 5, between pad 5 and the electrode ring 4, starts to be connected the vacuum extractor 9 that connects with retrieving arrangement and to make the certain vacuum tightness of retrieving arrangement 8 interior formation with the smooth discharge of realization liquid medicine 12.
The recycle that liquid medicine of the present invention can be realized by pump 10, circulating line, the nozzle 11 that is connected to retrieving arrangement 8 bottoms liquid medicine 12 realizes little 0. 13 circulation is electroplated.
Claims (2)
1. the electroplanting device insulcrete is characterized in that, it is by the mild convex configuration in middle mind-set both sides.
2. electroplanting device insulcrete according to claim 1 is characterized in that, the pitch angle between its highs and lows of convex surface is less than 5
o
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101819454A CN102851725A (en) | 2011-06-30 | 2011-06-30 | Insulation plate of electroplating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101819454A CN102851725A (en) | 2011-06-30 | 2011-06-30 | Insulation plate of electroplating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102851725A true CN102851725A (en) | 2013-01-02 |
Family
ID=47398684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101819454A Pending CN102851725A (en) | 2011-06-30 | 2011-06-30 | Insulation plate of electroplating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102851725A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106884198A (en) * | 2017-04-18 | 2017-06-23 | 林春芳 | A kind of electroplanting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000309895A (en) * | 1999-04-22 | 2000-11-07 | Sekisui Chem Co Ltd | Device for producing electrically conductive fine particle |
| CN1576400A (en) * | 2003-07-18 | 2005-02-09 | 釜屋电机株式会社 | Electroplating apparatus and method for electronic parts,and the same electronic parts |
| CN202284231U (en) * | 2011-06-30 | 2012-06-27 | 扬州市金杨电镀设备有限公司 | Insulating plate of novel electroplating device |
-
2011
- 2011-06-30 CN CN2011101819454A patent/CN102851725A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000309895A (en) * | 1999-04-22 | 2000-11-07 | Sekisui Chem Co Ltd | Device for producing electrically conductive fine particle |
| CN1576400A (en) * | 2003-07-18 | 2005-02-09 | 釜屋电机株式会社 | Electroplating apparatus and method for electronic parts,and the same electronic parts |
| CN202284231U (en) * | 2011-06-30 | 2012-06-27 | 扬州市金杨电镀设备有限公司 | Insulating plate of novel electroplating device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106884198A (en) * | 2017-04-18 | 2017-06-23 | 林春芳 | A kind of electroplanting device |
| CN106884198B (en) * | 2017-04-18 | 2019-02-05 | 湖南省鎏源新能源有限责任公司 | A kind of electroplanting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130102 |