CN102851724A - Electroplating solution recovery device - Google Patents
Electroplating solution recovery device Download PDFInfo
- Publication number
- CN102851724A CN102851724A CN2011101819420A CN201110181942A CN102851724A CN 102851724 A CN102851724 A CN 102851724A CN 2011101819420 A CN2011101819420 A CN 2011101819420A CN 201110181942 A CN201110181942 A CN 201110181942A CN 102851724 A CN102851724 A CN 102851724A
- Authority
- CN
- China
- Prior art keywords
- processing vessel
- retrieving arrangement
- liquid medicine
- electrode ring
- recovery device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to an electroplating solution recovery device arranged below a treatment container of an electroplating apparatus. The treatment container comprises an upper cover, an electrode ring, a gasket, an insulating plate and a conductive plate, which are sequentially connected from the top down via conductive pieces. The recovery device communicates with a gap formed among the electrode ring, the gasket and the insulating plate, and is provided thereon with an evacuation unit for forming vacuum in the recovery device. The recovery device can easily discharge electroplating solution, to improve electroplating quality of small parts, and prolong service life of the treatment container.
Description
Technical field
The present invention relates to a kind of electroplating liquid medicine retrieving arrangement, mainly be applicable to 0.1 ~ 5000 micron body of powder, the plating work of the findings such as superminiature capacitor, resistor, diode, junctor, spring switch, nail, screw, nut, packing ring.
Background technology
Fig. 1 is that the master of a kind of electrolytic plating apparatus in the existing finding surface processing device of conduct of expression shown in patent documentation 1 looks schematic cross-section.This electrolytic plating apparatus utilizes vertical rotating shaft to make to contain the processing vessel rotation of finding and makes finding contact electricity polar ring, and while make electroplating liquid medicine from the inside of processing vessel to the outside electroplating liquid medicine of circulation in from electrode to processing vessel switch on, thereby finding is electroplated.Processing vessel has the outflow mechanism that electroplating liquid medicine is circulated to the outside from the inside of processing vessel.In electrolytic plating apparatus, electroplating liquid medicine is exported in from nozzle to processing vessel, flows out, disperses to the outside of processing vessel by flowing out mechanism, and reclaim after being accepted by housing, utilizes pump to export from nozzle.That is, the Reusability while electroplating liquid medicine circulates.In addition, in electrolytic plating apparatus, be to be evenly distributed on thickness on the insulating base less than the pad of finding as what flow out that mechanism utilizes.The pad pad between insulcrete and electrode ring, the generation slit that electrode ring and insulating base are separated, as do not allow finding by and the strainer that only allows electroplating liquid medicine pass through work.After electroplating end-of-job, improve the rotating speed of vertical rotating shaft, the plating medicine liquid medicine in the processing vessel is all discharged.
Patent documentation 1:CN 101139732A applicant C. Uyemura ﹠ Co Ltd
In the outflow mechanism that is made of pad 15, following problem becomes outstanding.
⑴ the breakage of finding
After one electroplating work procedure finished, for the electroplating liquid medicine in the processing vessel is all discharged, the rotating speed that need to increase vertical rotation axis improved the centrifugal force of the electroplating liquid medicine in the processing vessel, and the linear velocity between finding and the electrode ring increases.In electroplating liquid medicine soon drains, lacked the lubricated of electroplating liquid medicine between finding and the electrode ring, form metal to-metal contact between finding and the electrode ring, add the increase of linear velocity, be easy to cause the breakage of finding.
⑵ electroplate the decline of yield
Pad also has electrode ring to link to each other by screw and insulating base, the difference of screw-driving torsion, gap between electrode ring and the insulating base is just different, in the process of rotation, causes easily the unbalance stress of processing vessel, cause the distortion of insulating base, gap size between insulating base and the electrode ring is difficult to control like this, and some findings are stuck between insulating base and the electrode ring, can't electroplate fully, the uneven coating of perhaps electroplating is even, and the yield of electroplating so just descends.
⑶ diseconomy
1. after one electroplating work procedure finished, the rotating speed that needs to improve processing vessel drained electroplating liquid medicine from processing vessel, and rotating speed is higher, and is just higher to the balance requirement of whole electroplanting device, also increased the accuracy requirement of component simultaneously.The production cost of whole like this equipment will increase, and use cost also can increase simultaneously.
2. pad also has electrode ring to link to each other by contact screw and insulating base, the difference of screw-driving torsion, gap between electrode ring and the insulating base is just different, in the process of rotation, cause easily the unbalance stress of processing vessel, cause the distortion of insulating base, arrive to a certain degree when distortion is large, whole processing vessel is just scrapped, and the cycle of changing accessory is just more frequent, has increased use cost.
Summary of the invention
The present invention is directed to defects, thereby purpose is to provide a kind of finding electroplating liquid medicine retrieving arrangement that improves the finding electroplating quality, improves the processing vessel life-span of easily electroplating liquid medicine being discharged.
The technical solution used in the present invention is for this reason: the present invention is arranged on the lower end of electroplanting device processing vessel, described processing vessel comprises loam cake, electrode ring, pad, insulcrete and the conducting plates that connects successively from top to down, each parts connects by electric-conductor, on the described retrieving arrangement and the gap that forms between the described electrode ring, pad, insulcrete is communicated with, and retrieving arrangement is provided with the vacuum extractor that makes retrieving arrangement form vacuum.
Described retrieving arrangement lower end comprises a pump and circulating line, and the end of circulating line connects processing vessel by nozzle.
The present invention establishes vacuum extractor, make retrieving arrangement have certain vacuum tightness by vacuum extractor, effect by barometric point easily forms electroplating liquid medicine between electrode ring, pad and insulcrete gap flows into the retrieving arrangement, and does not need traditional retrieving arrangement to realize the discharge of liquid medicine by the mode that improves rotary shaft rotating speed.
Thigh advantage of the present invention is:
⑴ compare with patent documentation 1, after a procedure finishes, owing to when liquid medicine drains in the processing vessel, do not need to improve the rotating speed of processing vessel, can suppress the finding breakage;
⑵ compare with patent documentation 1, stressed comparatively balance between each parts of processing vessel, and be adjacent to fully, the phenomenon that can not get stuck, the quality of product is guaranteed;
⑶ compare with patent documentation 1, adopts this structure, and in steps in the operational process, required maximum speed of revolution reduces equipment greatly in institute, and the balance of equipment is wanted at the bottom of the changes persuing, while parts machining accuracy requirement is also with regard to step-down, and the manufacturing cost of whole equipment is also with regard to step-down.
Description of drawings
Fig. 1 is structural representation of the present invention
1 is that processing vessel, 2 is that electric-conductor, 3 is that loam cake, 4 is that electrode ring, 5 is that pad, 6 is that insulcrete, 7 is that conducting plates, 8 is that retrieving arrangement, 9 is that vacuum extractor, 10 is that pump, 11 is that nozzle, 12 is that electroplating liquid medicine, 13 is finding among the figure.
Embodiment
Processing vessel 1 of the present invention begins from below to stack up by conducting plates 7, insulcrete 6, pad 5, electrode ring 4, loam cake 3 in order, and utilizes electric-conductor 2 to be formed by connecting.When needs row electroplating liquid medicine 12, electroplating liquid medicine 12 in the processing vessel 1 enters in the retrieving arrangement 8 by the gap that forms between insulcrete 6 and the pad 5, between pad 5 and the electrode ring 4, starts to be connected the vacuum extractor 9 that connects with retrieving arrangement and to make the certain vacuum tightness of retrieving arrangement 8 interior formation with the smooth discharge of realization liquid medicine 12.
The recycle that liquid medicine of the present invention can be realized by pump 10, circulating line, the nozzle 11 that is connected to retrieving arrangement 8 bottoms liquid medicine 12 realizes little 0. 13 circulation is electroplated.
Claims (2)
1. electroplating liquid medicine retrieving arrangement, be arranged on the lower end of electroplanting device processing vessel, described processing vessel comprises loam cake, electrode ring, pad, insulcrete and the conducting plates that connects successively from top to down, each parts connects by electric-conductor, on the described retrieving arrangement and the gap that forms between the described electrode ring, pad, insulcrete is communicated with, it is characterized in that retrieving arrangement is provided with the vacuum extractor that makes retrieving arrangement form vacuum.
2. electroplating liquid medicine retrieving arrangement according to claim 1 is characterized in that, described retrieving arrangement lower end comprises a pump and circulating line, and the end of circulating line connects processing vessel by nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101819420A CN102851724A (en) | 2011-06-30 | 2011-06-30 | Electroplating solution recovery device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101819420A CN102851724A (en) | 2011-06-30 | 2011-06-30 | Electroplating solution recovery device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102851724A true CN102851724A (en) | 2013-01-02 |
Family
ID=47398683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101819420A Pending CN102851724A (en) | 2011-06-30 | 2011-06-30 | Electroplating solution recovery device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102851724A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1556254A (en) * | 2004-01-05 | 2004-12-22 | 番禺得意精密电子工业有限公司 | Electroplating method and special electroplating device using said electroplating method |
| CN101139732A (en) * | 2006-07-06 | 2008-03-12 | 上村工业株式会社 | Surface treatment apparatus for small object |
| KR20100119731A (en) * | 2010-06-24 | 2010-11-10 | 전맹실 | Plating apparatus |
| CN202347121U (en) * | 2011-06-30 | 2012-07-25 | 扬州市金杨电镀设备有限公司 | Novel electroplating medicinal liquid recovery device |
-
2011
- 2011-06-30 CN CN2011101819420A patent/CN102851724A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1556254A (en) * | 2004-01-05 | 2004-12-22 | 番禺得意精密电子工业有限公司 | Electroplating method and special electroplating device using said electroplating method |
| CN101139732A (en) * | 2006-07-06 | 2008-03-12 | 上村工业株式会社 | Surface treatment apparatus for small object |
| KR20100119731A (en) * | 2010-06-24 | 2010-11-10 | 전맹실 | Plating apparatus |
| CN202347121U (en) * | 2011-06-30 | 2012-07-25 | 扬州市金杨电镀设备有限公司 | Novel electroplating medicinal liquid recovery device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102225598B (en) | Solar silicon wafer wire cutting guide roller and manufacturing method and special film coating machine and electroplating machine | |
| CN110139949B (en) | Electroplating device for small parts | |
| CN205171009U (en) | Medicine water circle device and have device's heavy copper system, electroplating system | |
| CN202297829U (en) | Novel electroplating device | |
| CN102943295A (en) | Aluminium alloy piston top and ring groove anodization method | |
| CN202347121U (en) | Novel electroplating medicinal liquid recovery device | |
| CN109097815B (en) | A kind of autocontrol method of circuit board electroplating | |
| CN102851724A (en) | Electroplating solution recovery device | |
| CN109943867A (en) | A kind of device for electro-deposition thin-wall seamless round tube | |
| CN202284231U (en) | Insulating plate of novel electroplating device | |
| CN202297830U (en) | Novel small part electroplating device | |
| CN102851725A (en) | Insulation plate of electroplating machine | |
| CN103084677B (en) | Device used for electrolyzing and processing double-faced trumped-shaped hole array in a thin walled cylinder | |
| CN203307458U (en) | Copper foil electroplating testing device | |
| CN204434756U (en) | A kind of plating bath arrangement | |
| CN111630210B (en) | Electroplating combined mechanism | |
| CN102851726A (en) | Electroplating machine for small parts | |
| CN102851723A (en) | Electroplating machine | |
| CN207537587U (en) | Electroplating flower basket | |
| CN109023458A (en) | A kind of electroplanting device and method of PCB circuit board | |
| CN204138800U (en) | A kind of integral type point plating appts | |
| CN102061496B (en) | Electro-deposition metallic bellows forming device | |
| CN203065625U (en) | Novel swing type vapor plating device for chip-type gadget | |
| CN207787889U (en) | A kind of high speed fliud flushing micro electrode arrays preparation facilities | |
| CN205062209U (en) | Circulating filter apparatus of electroforming lathe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130102 |
|
| RJ01 | Rejection of invention patent application after publication |