CN204385310U - A kind of array Herba Damnacanthi electroplanting device - Google Patents

A kind of array Herba Damnacanthi electroplanting device Download PDF

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Publication number
CN204385310U
CN204385310U CN201520018442.9U CN201520018442U CN204385310U CN 204385310 U CN204385310 U CN 204385310U CN 201520018442 U CN201520018442 U CN 201520018442U CN 204385310 U CN204385310 U CN 204385310U
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CN
China
Prior art keywords
beryllium copper
array
circle
plating tank
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520018442.9U
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Chinese (zh)
Inventor
李冰
姜可
蒋希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China University of Petroleum East China
Original Assignee
China University of Petroleum East China
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by China University of Petroleum East China filed Critical China University of Petroleum East China
Priority to CN201520018442.9U priority Critical patent/CN204385310U/en
Application granted granted Critical
Publication of CN204385310U publication Critical patent/CN204385310U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of array Herba Damnacanthi electroplanting device, primarily of upper cover, anode bar, plating tank, beryllium copper circle cover and beryllium copper seat composition, plating tank is provided with top stage hole, electric bath groove, array circle trepanning and bottom stage hole, described beryllium copper circle is arranged with hole and lower opening, described beryllium copper seat is provided with negative contact, electroplate liquid is injected in described electric bath groove and array circle trepanning inside, Herba Damnacanthi inserts array beryllium copper circle and puts hole and lower opening, anode bar passes into positive source, power cathode is passed in negative contact, electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.The beneficial effects of the utility model are as follows: the electroplating activity that disposablely can realize many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, have higher promotional value.

Description

A kind of array Herba Damnacanthi electroplanting device
Technical field
The utility model relates to a kind of electroplanting device, particularly a kind of array Herba Damnacanthi electroplanting device.
Background technology
In textile industry, due to mechanical wear and corrosion, a large amount of Herba Damnacanthi of annual consumption.Change Herba Damnacanthi impact weaving operation process, expend man-hour.Therefore, electroplating processes is carried out to Herba Damnacanthi, increase its wear resistance and solidity to corrosion is extremely necessary.The utility model provides a kind of array Herba Damnacanthi electroplanting device, disposablely can realize the electroplating activity of many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, have higher promotional value.
Summary of the invention
The purpose of this utility model is exactly the deficiency existed for prior art, provide a kind of array Herba Damnacanthi electroplanting device, disposablely can realize the electroplating activity of many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, there is higher promotional value.
Its technical scheme is: a kind of array Herba Damnacanthi electroplanting device, primarily of upper cover, anode bar, plating tank, beryllium copper circle cover and beryllium copper seat composition, described upper cover is polypropylene material, described anode bar is arranged on upper cover center, described plating tank is polypropylene material, plating tank is provided with top stage hole, electric bath groove, array circle trepanning and bottom stage hole, described upper cover is arranged on plating tank top stage hole, described anode bar lower end is inserted in electric bath groove space, described beryllium copper circle is arranged with hole and lower opening, beryllium copper circle cover is arranged on plating tank array circle trepanning, described beryllium copper seat is provided with array connector and negative contact, beryllium copper seat is arranged on the bottom stage hole of plating tank, the lower opening of described beryllium copper circle cover is arranged on the array connector of beryllium copper seat.
Electroplate liquid is injected in described electric bath groove and array circle trepanning inside, Herba Damnacanthi inserts array beryllium copper circle and puts hole and lower opening, anode bar passes into positive source, passes into power cathode in negative contact, and electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.
Accompanying drawing explanation
Accompanying drawing 1 is one-piece construction schematic diagram of the present utility model.
Accompanying drawing 2 is internal structure schematic diagram of the present utility model.
Accompanying drawing 3 is the utility model beryllium copper circle cover and beryllium copper holder structure schematic diagram.
Accompanying drawing 4 is beryllium copper holder structure schematic diagram of the present utility model.
Accompanying drawing 5 is beryllium copper of the present utility model circle cover schematic diagram.
In upper figure: upper cover 1, anode bar 2, plating tank 3, top stage hole 3.1, electric bath groove 3.2, array circle trepanning 3.3, bottom stage hole 3.4, beryllium copper circle cover 4, upper hole 4.1, lower opening 4.2, beryllium copper seat 5, array connector 5.1, negative contact 5.2.
Embodiment
1-5 by reference to the accompanying drawings, the utility model will be further described:
The utility model is primarily of upper cover 1, anode bar 2, plating tank 3, beryllium copper circle cover 4 and beryllium copper seat 5 form, described upper cover 1 is polypropylene material, described anode bar 2 is arranged on upper cover 1 center, described plating tank 3 is polypropylene material, plating tank 3 is provided with top stage hole 3.1, electric bath groove 3.2, array circle trepanning 3.3 and bottom stage hole 3.4, described upper cover 1 is arranged on plating tank 3 top stage hole 3.1, described anode bar 2 lower end is inserted in electric bath groove 3.2 space, described beryllium copper circle cover 4 is provided with hole 4.1 and lower opening 4.2, beryllium copper circle cover 4 is arranged on plating tank 3 array circle trepanning 3.3, described beryllium copper seat 5 is provided with array connector 5.1 and negative contact 5.2, beryllium copper seat 5 is arranged on the bottom stage hole 3.4 of plating tank 3, the lower opening 4.2 of described beryllium copper circle cover 4 is arranged on the array connector 5.1 of beryllium copper seat 5.
Electroplate liquid is injected in described electric bath groove 3.2 and array circle trepanning 3.3 inside, Herba Damnacanthi inserts hole 4.1 and lower opening 4.2 on array beryllium copper circle cover 4, anode bar 2 passes into positive source, pass into power cathode in negative contact 5.2, electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.
The beneficial effects of the utility model are: the electroplating activity that disposablely can realize many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, have higher promotional value.

Claims (2)

1. an array Herba Damnacanthi electroplanting device, it is characterized in that: primarily of upper cover, anode bar, plating tank, beryllium copper circle cover and beryllium copper seat composition, described upper cover is polypropylene material, described anode bar is arranged on upper cover center, described plating tank is polypropylene material, plating tank is provided with top stage hole, electric bath groove, array circle trepanning and bottom stage hole, described upper cover is arranged on plating tank top stage hole, described anode bar lower end is inserted in electric bath groove space, described beryllium copper circle is arranged with hole and lower opening, beryllium copper circle cover is arranged on plating tank array circle trepanning, described beryllium copper seat is provided with array connector and negative contact, beryllium copper seat is arranged on the bottom stage hole of plating tank, the lower opening of described beryllium copper circle cover is arranged on the array connector of beryllium copper seat.
2. a kind of array Herba Damnacanthi electroplanting device according to claim 1, its technical scheme is: electroplate liquid is injected in described electric bath groove and array circle trepanning inside, Herba Damnacanthi inserts array beryllium copper circle and puts hole and lower opening, anode bar passes into positive source, pass into power cathode in negative contact, electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.
CN201520018442.9U 2015-01-12 2015-01-12 A kind of array Herba Damnacanthi electroplanting device Expired - Fee Related CN204385310U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520018442.9U CN204385310U (en) 2015-01-12 2015-01-12 A kind of array Herba Damnacanthi electroplanting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520018442.9U CN204385310U (en) 2015-01-12 2015-01-12 A kind of array Herba Damnacanthi electroplanting device

Publications (1)

Publication Number Publication Date
CN204385310U true CN204385310U (en) 2015-06-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520018442.9U Expired - Fee Related CN204385310U (en) 2015-01-12 2015-01-12 A kind of array Herba Damnacanthi electroplanting device

Country Status (1)

Country Link
CN (1) CN204385310U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108684578A (en) * 2018-05-24 2018-10-23 佛山科学技术学院 A kind of removable honey collection device
CN113109606A (en) * 2021-03-30 2021-07-13 渭南高新区木王科技有限公司 Repairing machine for test probe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108684578A (en) * 2018-05-24 2018-10-23 佛山科学技术学院 A kind of removable honey collection device
CN113109606A (en) * 2021-03-30 2021-07-13 渭南高新区木王科技有限公司 Repairing machine for test probe

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150610

Termination date: 20160112