CN204385310U - A kind of array Herba Damnacanthi electroplanting device - Google Patents
A kind of array Herba Damnacanthi electroplanting device Download PDFInfo
- Publication number
- CN204385310U CN204385310U CN201520018442.9U CN201520018442U CN204385310U CN 204385310 U CN204385310 U CN 204385310U CN 201520018442 U CN201520018442 U CN 201520018442U CN 204385310 U CN204385310 U CN 204385310U
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- beryllium copper
- array
- circle
- plating tank
- hole
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- Expired - Fee Related
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Abstract
The utility model discloses a kind of array Herba Damnacanthi electroplanting device, primarily of upper cover, anode bar, plating tank, beryllium copper circle cover and beryllium copper seat composition, plating tank is provided with top stage hole, electric bath groove, array circle trepanning and bottom stage hole, described beryllium copper circle is arranged with hole and lower opening, described beryllium copper seat is provided with negative contact, electroplate liquid is injected in described electric bath groove and array circle trepanning inside, Herba Damnacanthi inserts array beryllium copper circle and puts hole and lower opening, anode bar passes into positive source, power cathode is passed in negative contact, electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.The beneficial effects of the utility model are as follows: the electroplating activity that disposablely can realize many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, have higher promotional value.
Description
Technical field
The utility model relates to a kind of electroplanting device, particularly a kind of array Herba Damnacanthi electroplanting device.
Background technology
In textile industry, due to mechanical wear and corrosion, a large amount of Herba Damnacanthi of annual consumption.Change Herba Damnacanthi impact weaving operation process, expend man-hour.Therefore, electroplating processes is carried out to Herba Damnacanthi, increase its wear resistance and solidity to corrosion is extremely necessary.The utility model provides a kind of array Herba Damnacanthi electroplanting device, disposablely can realize the electroplating activity of many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, have higher promotional value.
Summary of the invention
The purpose of this utility model is exactly the deficiency existed for prior art, provide a kind of array Herba Damnacanthi electroplanting device, disposablely can realize the electroplating activity of many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, there is higher promotional value.
Its technical scheme is: a kind of array Herba Damnacanthi electroplanting device, primarily of upper cover, anode bar, plating tank, beryllium copper circle cover and beryllium copper seat composition, described upper cover is polypropylene material, described anode bar is arranged on upper cover center, described plating tank is polypropylene material, plating tank is provided with top stage hole, electric bath groove, array circle trepanning and bottom stage hole, described upper cover is arranged on plating tank top stage hole, described anode bar lower end is inserted in electric bath groove space, described beryllium copper circle is arranged with hole and lower opening, beryllium copper circle cover is arranged on plating tank array circle trepanning, described beryllium copper seat is provided with array connector and negative contact, beryllium copper seat is arranged on the bottom stage hole of plating tank, the lower opening of described beryllium copper circle cover is arranged on the array connector of beryllium copper seat.
Electroplate liquid is injected in described electric bath groove and array circle trepanning inside, Herba Damnacanthi inserts array beryllium copper circle and puts hole and lower opening, anode bar passes into positive source, passes into power cathode in negative contact, and electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.
Accompanying drawing explanation
Accompanying drawing 1 is one-piece construction schematic diagram of the present utility model.
Accompanying drawing 2 is internal structure schematic diagram of the present utility model.
Accompanying drawing 3 is the utility model beryllium copper circle cover and beryllium copper holder structure schematic diagram.
Accompanying drawing 4 is beryllium copper holder structure schematic diagram of the present utility model.
Accompanying drawing 5 is beryllium copper of the present utility model circle cover schematic diagram.
In upper figure: upper cover 1, anode bar 2, plating tank 3, top stage hole 3.1, electric bath groove 3.2, array circle trepanning 3.3, bottom stage hole 3.4, beryllium copper circle cover 4, upper hole 4.1, lower opening 4.2, beryllium copper seat 5, array connector 5.1, negative contact 5.2.
Embodiment
1-5 by reference to the accompanying drawings, the utility model will be further described:
The utility model is primarily of upper cover 1, anode bar 2, plating tank 3, beryllium copper circle cover 4 and beryllium copper seat 5 form, described upper cover 1 is polypropylene material, described anode bar 2 is arranged on upper cover 1 center, described plating tank 3 is polypropylene material, plating tank 3 is provided with top stage hole 3.1, electric bath groove 3.2, array circle trepanning 3.3 and bottom stage hole 3.4, described upper cover 1 is arranged on plating tank 3 top stage hole 3.1, described anode bar 2 lower end is inserted in electric bath groove 3.2 space, described beryllium copper circle cover 4 is provided with hole 4.1 and lower opening 4.2, beryllium copper circle cover 4 is arranged on plating tank 3 array circle trepanning 3.3, described beryllium copper seat 5 is provided with array connector 5.1 and negative contact 5.2, beryllium copper seat 5 is arranged on the bottom stage hole 3.4 of plating tank 3, the lower opening 4.2 of described beryllium copper circle cover 4 is arranged on the array connector 5.1 of beryllium copper seat 5.
Electroplate liquid is injected in described electric bath groove 3.2 and array circle trepanning 3.3 inside, Herba Damnacanthi inserts hole 4.1 and lower opening 4.2 on array beryllium copper circle cover 4, anode bar 2 passes into positive source, pass into power cathode in negative contact 5.2, electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.
The beneficial effects of the utility model are: the electroplating activity that disposablely can realize many Herba Damnacanthis, greatly improve electroplating efficiency, meet industrialized mass production needs, have higher promotional value.
Claims (2)
1. an array Herba Damnacanthi electroplanting device, it is characterized in that: primarily of upper cover, anode bar, plating tank, beryllium copper circle cover and beryllium copper seat composition, described upper cover is polypropylene material, described anode bar is arranged on upper cover center, described plating tank is polypropylene material, plating tank is provided with top stage hole, electric bath groove, array circle trepanning and bottom stage hole, described upper cover is arranged on plating tank top stage hole, described anode bar lower end is inserted in electric bath groove space, described beryllium copper circle is arranged with hole and lower opening, beryllium copper circle cover is arranged on plating tank array circle trepanning, described beryllium copper seat is provided with array connector and negative contact, beryllium copper seat is arranged on the bottom stage hole of plating tank, the lower opening of described beryllium copper circle cover is arranged on the array connector of beryllium copper seat.
2. a kind of array Herba Damnacanthi electroplanting device according to claim 1, its technical scheme is: electroplate liquid is injected in described electric bath groove and array circle trepanning inside, Herba Damnacanthi inserts array beryllium copper circle and puts hole and lower opening, anode bar passes into positive source, pass into power cathode in negative contact, electroplate liquid can form the hard alloy layer of one deck on Herba Damnacanthi surface under galvanic action.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520018442.9U CN204385310U (en) | 2015-01-12 | 2015-01-12 | A kind of array Herba Damnacanthi electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520018442.9U CN204385310U (en) | 2015-01-12 | 2015-01-12 | A kind of array Herba Damnacanthi electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204385310U true CN204385310U (en) | 2015-06-10 |
Family
ID=53358043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520018442.9U Expired - Fee Related CN204385310U (en) | 2015-01-12 | 2015-01-12 | A kind of array Herba Damnacanthi electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204385310U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684578A (en) * | 2018-05-24 | 2018-10-23 | 佛山科学技术学院 | A kind of removable honey collection device |
| CN113109606A (en) * | 2021-03-30 | 2021-07-13 | 渭南高新区木王科技有限公司 | Repairing machine for test probe |
-
2015
- 2015-01-12 CN CN201520018442.9U patent/CN204385310U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684578A (en) * | 2018-05-24 | 2018-10-23 | 佛山科学技术学院 | A kind of removable honey collection device |
| CN113109606A (en) * | 2021-03-30 | 2021-07-13 | 渭南高新区木王科技有限公司 | Repairing machine for test probe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150610 Termination date: 20160112 |