CN204174295U - Be configured with bianode Acidic zinc-nickel alloy electroplanting device - Google Patents
Be configured with bianode Acidic zinc-nickel alloy electroplanting device Download PDFInfo
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- CN204174295U CN204174295U CN201420421914.0U CN201420421914U CN204174295U CN 204174295 U CN204174295 U CN 204174295U CN 201420421914 U CN201420421914 U CN 201420421914U CN 204174295 U CN204174295 U CN 204174295U
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- nickel
- anode
- zinc
- conducting rod
- rectifier
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Abstract
The utility model is configured with bianode Acidic zinc-nickel alloy electroplanting device, by power rectifier 6. this device is, 7. with plating tank 1., 5. 1. described plating tank be vertically arranged with the workpiece that will electroplate and negative electrode, two conducting rods in left and right are vertically arranged with 2. relative to negative electrode, 3. zinc anode directly hangs on conducting rod, connects conducting rod on 6. rectifier A with wire; 4. nickel anode is also suspended on conducting rod, but and to do insulation between conducting rod non-conductive, then nickel anode wire is connected to 7. on rectifier B.8. plating tank is 1. interior injects acidic zinc nickel plating solution.The beneficial effects of the utility model are: the problem solving the configuration of acid zinc-nickel double anode comparatively economically, can supplement for acidic zinc nickel plating solution provides required with stable zinc and nickel metal ion.
Description
Technical field
The present invention relates to plating and apparatus field thereof, is specifically be configured with bianode acid alloy plating device.
Background technology
Technologically speaking, Zinc-nickel alloy electroplating is divided into two types: alkaline zinc-nickel alloy and Acidic zinc-nickel alloy.For alkaline zinc-nickel alloy, the pH of Acidic zinc-nickel alloy electroplate liquid is less than 7.0, and the fast efficiency of its electroplating velocity is high, can plating on Cast Iron Surface is direct.
The component that patent CN1291068C gives Acidic zinc-nickel alloy electroplate liquid is as follows:
| Project | Concentration |
| Zinc chloride | 115g/L |
| Nickelous chloride (six water) | 143g/L |
| Repone K | 245g/L |
| Boric acid | 20g/L |
| pH | 5.3-5.7 |
| Organic additive | Several |
Electroplating process must use anode, and in general, is the anode using single material.The anode of Electrodeposition of Zn-ni Alloy In Alkaline Bath generally adopts nickel plate as insoluble anode, and in plating tank, zine ion supplements with the molten zinc of alkali or interpolation zinc oxide, and nickel ion is that the single nickel salt by adding complexing supplements.Existing a large amount of report, is not repeated here.
But the acid zinc-nickel plating under sour environment, the supplementary needs of the zine ion in coating bath and nickel ion directly obtain from anode, this just needs zinc anode and nickel anode as soluble anode simultaneously, Here it is said double anode, but about the double anode device of Acidic zinc-nickel alloy plating, there is no a lot of report.
Patent CN2175238Y reports in acid zinc-nickel plating, uses single power supply and shunt resistance to control zinc anode and nickel anode, and this is the blank of Acidic zinc-nickel alloy plating double anode configuration.But problem is to use single power supply and shunt resistance, does not have actual operation, single power supply just cannot realize independent control zinc anode and nickel anode on the one hand, and shunt resistance is the loss to electric energy in addition.And the emphasis of this patent is report microporous membrane anode jacket is isolating nickel ion in the impact of zinc anode, but not bianode configuration.
Patent CN203639589U reports the electroplanting device of the two rectifier systems of a kind of Double-positive-pole structure for Acidic zinc-nickel alloy.This device has 4 copper anode bars, and corresponding outermost two anode rod bronze medals are connected as zinc anode, then are connected on zinc reorganizer; Two anode rods of inner side are connected as nickel anode with bronze medal, then are connected on nickel rectifier by bronze medal.
But the device of patent CN203639589U report needs 4 copper anode bars, and also needs between zinc anode and nickel anode to pull open certain distance, and this just needs wider electroplating cell body and more copper anode bar, not ideal in economic benefit.And for the plating line that some original electroplating cell body width are just narrow, this device cannot be installed.
Summary of the invention
Technical problem to be solved in the utility model is the defect overcoming prior art, proposes and is configured with bianode Acidic zinc-nickel alloy electroplanting device.
The utility model solves the technical scheme that its technical problem adopts: be configured with bianode Acidic zinc-nickel alloy electroplanting device, comprise power rectifier and plating tank, the workpiece that will electroplate and negative electrode is vertically arranged with in described plating tank, two conducting rods in left and right are horizontally arranged with relative to negative electrode, zinc anode directly hangs on conducting rod, connects conducting rod on rectifier with wire; Nickel anode is also suspended on conducting rod, but and do between conducting rod insulation non-conductive, then nickel anode wire is directly connected on another rectifier.Acidic zinc nickel plating solution is injected in plating tank.
Illustrate further, the electric current of a rectifier is communicated on zinc anode by conducting rod, the electric current of a rectifier is then directly communicated on nickel anode, the electric current of two rectifiers is separate control, so just can realize the independent control of zinc anode and nickel anode, thus provide required zine ion and nickel ion to supplement for acidic zinc nickel plating solution.
The invention has the beneficial effects as follows: the problem solving the configuration of acid zinc-nickel double anode very economically, can supplement with stable zinc and nickel metal ion for electroplate liquid provides required.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model electroplanting device.
Shown in Fig. 1:
plating tank,
conducting rod,
zinc anode,
nickel anode,
negative electrode,
rectifier A,
rectifier B,
electroplate liquid.Wherein
nickel anode and
that mutually insulated is nonconducting between conducting rod, for making figure clear, not shown on the FIG..
Fig. 2 is the another kind of structural representation of the utility model electroplanting device.
Shown in Fig. 2: the plating tank of I assembling zinc anode, the plating tank of II assembling nickel anode,
conducting rod,
zinc anode,
nickel anode,
negative electrode,
rectifier A,
rectifier B.Electroplate liquid in I plating tank and II plating tank is mutual conduction, for making figure clear, does not show here.
Embodiment
Below in conjunction with accompanying drawing and two embodiments, the present invention is described in further detail; but be not limited to two following embodiments; the technician of same area can propose other embodiment in framework of the present invention, but these embodiments are all in protection domain of the present utility model.
Device shown in Fig. 1 is a kind of embodiment of the present utility model, plating tank
inside be vertically arranged with the workpiece and negative electrode that will electroplate
, be vertically arranged with two conducting rods in left and right relative to negative electrode
, zinc anode
directly hang on conducting rod, with wire connect conducting rod in
on rectifier A; Nickel anode
also conducting rod is suspended on
on, but and do between conducting rod insulate namely mutually non-conductive, then nickel anode
direct wire is connected to
on rectifier B.Plating tank
interior injection acidic zinc nickel plating solution
.
Shown in Fig. 1, nickel anode
and conducting rod
be insulate mutually nonconducting, the electric current so just achieving zinc anode and nickel anode independently controls, and does not also just need many conducting rods to hang nickel anode.Also can adjust according to actual needs, conversely, nickel anode is directly suspended on conducting rod, and zinc anode insulation hangs on conducting rod, is then connected on reorganizer B and zinc rectifier A.
Shown in Fig. 1, conducting rod
on hang with 5 zinc anodes
with 1 nickel anode
, can adjust the number and their ratio that hang zinc anode and nickel anode according to actual needs.
Fig. 2 is another embodiment of the invention, and this device comprises the plating tank I of assembling zinc anode and the plating tank II of assembling nickel anode, is all vertically arranged with the workpiece that will electroplate and negative electrode in each plating tank
, be vertically arranged with two conducting rods in left and right relative to negative electrode
.Zinc anode in plating tank I
directly hang on conducting rod, do not do and insulate, with wire connect conducting rod in
on rectifier A; Nickel anode in plating tank II
also be suspended on conducting rod, also do not do and insulate, with wire connect conducting rod in
on rectifier B.Plating tank
interior injection acidic zinc nickel plating solution
.
Shown in Fig. 2, the electroplate liquid in I plating tank and II plating tank is mutual conduction, and namely their solution mixes uniformly, for making figure clear, does not show here.Like this anode of electrolytic cell only provides zinc, and an anode of electrolytic cell only provides nickel, and electroplate liquid is each other again conducting and mixed uniformly, also just achieves double anode, and supplements zine ion in whole electroplate liquid and the synchronous of nickel ion.
Shown in Fig. 2, a plating tank I assembling zinc anode is only had to be connected with the plating tank II of an assembling nickel anode, also can install multiple I and multiple II according to actual needs and be interconnected, and adjusting the number ratio of plating tank I and plating tank II as required.
Claims (1)
1. be configured with bianode Acidic zinc-nickel alloy electroplanting device, it is characterized in that: this device comprises power rectifier A, power rectifier B (7) and plating tank (1), described plating tank (1) is vertically arranged with the workpiece and negative electrode (5) that will electroplate, two conducting rods (2) in left and right are vertically arranged with relative to negative electrode, zinc anode (3) directly hangs on conducting rod, connects conducting rod on rectifier A (6) with wire; Nickel anode (4) is also suspended on conducting rod, but with it is non-conductive to do insulation between conducting rod, then nickel anode wire is directly connected on rectifier B (7), injects acidic zinc nickel plating solution (8) in plating tank (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420421914.0U CN204174295U (en) | 2014-07-29 | 2014-07-29 | Be configured with bianode Acidic zinc-nickel alloy electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420421914.0U CN204174295U (en) | 2014-07-29 | 2014-07-29 | Be configured with bianode Acidic zinc-nickel alloy electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204174295U true CN204174295U (en) | 2015-02-25 |
Family
ID=52563119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420421914.0U Expired - Fee Related CN204174295U (en) | 2014-07-29 | 2014-07-29 | Be configured with bianode Acidic zinc-nickel alloy electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204174295U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104975332A (en) * | 2015-07-30 | 2015-10-14 | 江苏金曼科技有限责任公司 | Method for adjusting ion concentration of plating solution |
| CN105018971A (en) * | 2015-07-20 | 2015-11-04 | 哈尔滨工业大学 | Method for preparing functional micro-nano structure dendritic alpha-Fe-based material through iron |
| CN106119938A (en) * | 2016-08-31 | 2016-11-16 | 厦门同恒金属有限公司 | A kind of barrel plating tank red brass electroplanting device and technique |
| CN111094632A (en) * | 2017-09-28 | 2020-05-01 | 德国艾托特克公司 | Method for electrolytically depositing a zinc-nickel alloy layer on at least one substrate to be treated |
-
2014
- 2014-07-29 CN CN201420421914.0U patent/CN204174295U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105018971A (en) * | 2015-07-20 | 2015-11-04 | 哈尔滨工业大学 | Method for preparing functional micro-nano structure dendritic alpha-Fe-based material through iron |
| CN105018971B (en) * | 2015-07-20 | 2017-09-12 | 哈尔滨工业大学 | A kind of method by the dendritic α Fe sills of iron standby functional micro-nano structure |
| CN104975332A (en) * | 2015-07-30 | 2015-10-14 | 江苏金曼科技有限责任公司 | Method for adjusting ion concentration of plating solution |
| CN106119938A (en) * | 2016-08-31 | 2016-11-16 | 厦门同恒金属有限公司 | A kind of barrel plating tank red brass electroplanting device and technique |
| CN111094632A (en) * | 2017-09-28 | 2020-05-01 | 德国艾托特克公司 | Method for electrolytically depositing a zinc-nickel alloy layer on at least one substrate to be treated |
| CN111094632B (en) * | 2017-09-28 | 2021-02-09 | 德国艾托特克公司 | Method for electrolytically depositing a zinc-nickel alloy layer on at least one substrate to be treated |
| US10961637B2 (en) | 2017-09-28 | 2021-03-30 | Atotech Deutschland Gmbh | Method for electrolytically depositing a zinc nickel alloy layer on at least a substrate to be treated |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150225 Termination date: 20200729 |