TWI648434B - Electroplating device for small parts - Google Patents

Electroplating device for small parts Download PDF

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Publication number
TWI648434B
TWI648434B TW106139399A TW106139399A TWI648434B TW I648434 B TWI648434 B TW I648434B TW 106139399 A TW106139399 A TW 106139399A TW 106139399 A TW106139399 A TW 106139399A TW I648434 B TWI648434 B TW I648434B
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Taiwan
Prior art keywords
electroplating
plating
drum
cylinder
small parts
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TW106139399A
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Chinese (zh)
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TW201825720A (en
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黃愽道
劉耀崇
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黃愽道
劉耀崇
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Publication of TW201825720A publication Critical patent/TW201825720A/en
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Publication of TWI648434B publication Critical patent/TWI648434B/en

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18Apparatus for electrolytic coating of small objects in bulk having closed containers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22Apparatus for electrolytic coating of small objects in bulk having open containers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks

Abstract

一種小型零件的電鍍裝置,包含一個或以上的電鍍單元,每一個電鍍單元具有一電鍍滾筒、一電鍍槽、一驅動器及一移動架;該驅動器是設置在該電鍍槽內,用以帶動該電鍍滾筒作間歇性旋轉。該移動架組合在該電鍍槽的一頂部,透過搬移該移動架可將該電鍍滾筒自該電鍍槽抽離,並放置於另一電鍍槽中,其中可擴充多個電鍍槽,達成自動連續生產的目的。 A small part electroplating device includes one or more electroplating units. Each electroplating unit has an electroplating drum, an electroplating tank, a driver, and a moving frame. The driver is arranged in the electroplating tank to drive the electroplating. The drum rotates intermittently. The moving rack is combined on the top of the plating tank. By moving the moving rack, the plating drum can be detached from the plating tank and placed in another plating tank. Multiple plating tanks can be expanded to achieve automatic continuous production. the goal of.

Description

小型零件的電鍍裝置    Plating device for small parts   

本發明係關於一種電鍍裝置,特別是關於一種小型零件的電鍍裝置。 The present invention relates to a plating device, and more particularly to a plating device for small parts.

通常情況下電鍍有兩種方式,一種是掛鍍,另一種是滾鍍。掛鍍是將零件裝在掛具上進行鍍層沈積處理的一種電鍍方式,一般用於大尺寸零件的電鍍。而對於因形狀、大小等因素影響無法或不宜裝掛的小零件,則一般採用滾鍍。滾鍍亦稱滾筒電鍍,它是將一定數量的小零件置於專用滾筒內、在滾動狀態下以間接導電方式在零件表面沈積各種金屬或合金鍍層,以達到表面防護、裝飾或功能性的目的。與掛鍍相比,滾鍍零件的受鍍方式發生了較大改變,其中掛鍍在零件單獨分裝的狀態下進行,而滾鍍在零件集中且時合時離的狀態下進行,在這個過程中產生了零件的混合週期;另外,掛鍍在零件完全暴露的狀態下進行,而滾鍍在封閉的(雖然壁板上有孔)、溶液濃度較低的滾筒內進行。零件受鍍方式的改變給滾鍍帶來兩個最主要缺陷,即混和週期帶來的缺陷和滾鍍的結構缺陷。上述的缺陷對滾鍍生產效率和產品質量的提高造成嚴重影響,使滾鍍的優越性不能得以充分發揮。 There are usually two methods of electroplating, one is rack plating and the other is barrel plating. Hang plating is a plating method in which parts are mounted on a hanger for plating deposition, and is generally used for electroplating of large-sized parts. For small parts that cannot or cannot be hung due to factors such as shape and size, barrel plating is generally used. Barrel plating, also known as drum plating, is to place a certain number of small parts in a dedicated drum and deposit various metal or alloy coatings on the surface of the parts in an indirect conductive manner under rolling conditions to achieve the purpose of surface protection, decoration or functionality . Compared with rack plating, the plating method of barrel-plated parts has changed greatly. Rack plating is performed in the state of separate packaging of parts, and barrel plating is performed in a state where parts are concentrated and separated at times. In the process, the mixing cycle of the parts is generated; in addition, the rack plating is performed in a state where the parts are completely exposed, and the barrel plating is performed in a closed (though there are holes in the wall plate) and the solution concentration is low. The change of the plating method of the parts brings two major defects to barrel plating, namely the defects caused by the mixing cycle and the structural defects of barrel plating. The above defects have a serious impact on the improvement of barrel plating production efficiency and product quality, so that the advantages of barrel plating cannot be brought into full play.

進一步來說,目前的滾鍍技術是將滾筒連接於一驅動裝置,當滾筒內載入待鍍工件後,接著置於電鍍槽內運轉該驅動裝置,而使待鍍工件翻轉,促使其與電解液充分接觸而產生電化學作用,由於許多針狀或薄片狀的微小電子產品零件的表面電鍍,通常在電鍍滾筒中進行,現有技術中有很多種電鍍滾筒,大部分的電鍍滾筒都是由水平的驅動裝置進行驅動,這些電鍍滾筒普遍存在結構複雜、溶液置換不易、電鍍效率低及維護成本較高的問題。 Further, the current barrel plating technology is to connect the drum to a driving device. After loading the workpiece to be plated in the drum, the driving device is then placed in the electroplating tank to turn the workpiece to be plated, which promotes its electrolysis. Electrolyzation occurs when the liquid is fully contacted. Due to the surface plating of many needle-like or sheet-like tiny electronic product parts, it is usually carried out in a plating drum. There are many types of plating drums in the prior art. These electroplating rollers generally have the problems of complicated structure, difficult solution replacement, low electroplating efficiency and high maintenance cost.

另外,還一種電鍍滾筒是設置在驅動軸的下端,用以使裝設有陽極的電鍍槽能夠被旋轉驅動,並且利用電鍍滾筒旋轉驅動時所作用的離心力,從電鍍滾筒的內部流出到外部並且從外部流入到內部,但是該電鍍滾筒是固定在驅動軸的下端,無法被搬移抽換,因而無法達成自動搬移換槽的電鍍流程。 In addition, another type of electroplating drum is provided at the lower end of the driving shaft, so that the electroplating tank equipped with the anode can be rotationally driven, and the centrifugal force acting when the electroplating drum is rotationally driven is discharged from the inside of the electroplating drum to the outside and It flows into the interior from the outside, but the plating drum is fixed at the lower end of the drive shaft, and cannot be transferred and exchanged, so the plating process of the automatic transfer and replacement tank cannot be achieved.

因此,有必要提供改良的一種小型零件的電鍍裝置,以解決上述習知技術所存在的問題。 Therefore, it is necessary to provide an improved electroplating device for small parts to solve the problems existing in the conventional techniques.

本發明之主要目的在於提供一種小型零件的電鍍裝置,利用將該驅動器設置在該電鍍槽下,並且透過該卡合部及該驅動馬達相卡合的方式帶動該電鍍滾筒旋轉,使該電鍍滾筒容易自一電鍍槽移動至另一電鍍槽來進行搬移抽換的換槽作業。 The main object of the present invention is to provide a plating device for small parts, which uses the driver to be set under the plating tank, and drives the plating drum to rotate through the engagement part and the driving motor to make the plating drum rotate. It is easy to move from one electroplating tank to another electroplating tank to carry out the changing and replacing operation.

為達上述之目的,本發明提供一種小型零件的電鍍裝置,包含至少一個電鍍單元;每一個電鍍單元包含一移動架、一電鍍滾筒、一電鍍槽及一驅動器;該電鍍滾筒具有一筒體、一轉軸及一卡合部,其中該轉軸的 一第一端設置在該筒體上,該卡合部設置在該筒體的一底部;該電鍍槽容置一電鍍液以浸泡該電鍍滾筒;該驅動器設置在該電鍍槽內,用以驅動該卡合部轉動而帶動該電鍍滾筒旋轉而產生離心力。 To achieve the above object, the present invention provides a plating device for small parts, including at least one plating unit; each plating unit includes a moving frame, a plating drum, a plating tank, and a driver; the plating drum has a cylinder, A rotating shaft and an engaging portion, wherein A first end is disposed on the cylinder, the engaging portion is disposed on a bottom of the cylinder; the plating tank contains a plating solution to soak the plating drum; and the driver is disposed in the plating tank for driving The engaging portion rotates to drive the electroplating drum to rotate to generate centrifugal force.

在本發明之一實施例中,該驅動器具有一驅動馬達,用以與該電鍍滾筒的卡合部相卡合,而帶動該筒體旋轉。 In one embodiment of the present invention, the driver has a driving motor for engaging with the engaging portion of the electroplating drum to drive the cylinder to rotate.

在本發明之一實施例中,該移動架具有一固定板、二側板、二輔助桿及一旋轉接頭,該等側板組合在該固定板的二側,該等輔助桿設置在該等側板之間,使該筒體位於該輔助桿之上,該旋轉接頭樞接該固定板上,用以與該轉軸的第二端組合在一起。 In one embodiment of the present invention, the moving frame has a fixed plate, two side plates, two auxiliary rods, and a rotary joint. The side plates are combined on two sides of the fixed plate, and the auxiliary rods are disposed on the side plates. In the meantime, the cylinder is positioned above the auxiliary rod, and the rotary joint is pivotally connected to the fixing plate for combination with the second end of the rotating shaft.

在本發明之一實施例中,該移動架另具有二陰極座,該等陰極座設置在該固定板的一底部的二側,用以與一陰極環電性連接。 In an embodiment of the present invention, the moving frame further has two cathode holders, which are disposed on two sides of a bottom of the fixed plate for electrically connecting with a cathode ring.

在本發明之一實施例中,該筒體具有一底座、一圍繞壁及一上蓋,該底座與該圍繞壁相結合,該圍繞壁內形成該陰極環,該轉軸自該底座連接該上蓋並向外延伸。 In one embodiment of the present invention, the cylinder has a base, a surrounding wall, and an upper cover. The base is combined with the surrounding wall. The cathode wall is formed in the surrounding wall. The rotating shaft is connected to the upper cover from the base. Extend outward.

在本發明之一實施例中,該電鍍裝置另具有一漏接盤,設置在該驅動馬達上,用以承裝由該電鍍槽漏出的液體。 In one embodiment of the present invention, the electroplating device further has a leakage tray, which is disposed on the driving motor and used for receiving the liquid leaked from the electroplating tank.

如上所述,利用將該驅動器設置在該電鍍槽下,並且透過該卡合部及該驅動馬達相卡合的方式帶動該電鍍滾筒旋轉,不僅使該電鍍滾筒容易移動置換,也能夠提升該等小型零件的電鍍速度及效率,而且該小型零件的電鍍裝置的結構簡單,使得後續的維護成本較低。 As described above, by using the driver to be installed under the plating tank and driving the plating drum to rotate through the engagement portion and the driving motor, the plating drum is not only easily moved and replaced, but also can be improved. The plating speed and efficiency of small parts, and the simple structure of the plating device for small parts makes subsequent maintenance costs lower.

101‧‧‧座體 101‧‧‧ seat

102‧‧‧電鍍單元 102‧‧‧Plating unit

103‧‧‧隔板 103‧‧‧ bulkhead

2‧‧‧電鍍滾筒 2‧‧‧Plating roller

21‧‧‧筒體 21‧‧‧Cylinder

211‧‧‧底座 211‧‧‧base

212‧‧‧圍繞壁 212‧‧‧ around the wall

213‧‧‧上蓋 213‧‧‧Top

210‧‧‧陰極環 210‧‧‧ cathode ring

22‧‧‧轉軸 22‧‧‧ shaft

221‧‧‧第一端 221‧‧‧ the first end

222‧‧‧第二端 222‧‧‧ second end

23‧‧‧卡合部 23‧‧‧ Engagement Department

24‧‧‧電流傳輸層 24‧‧‧Current transmission layer

25‧‧‧陰極導體 25‧‧‧ cathode conductor

26‧‧‧電力線導環 26‧‧‧Power line guide ring

3、3’‧‧‧電鍍槽 3, 3’‧‧‧ electroplating tank

4‧‧‧驅動器 4‧‧‧Driver

41‧‧‧驅動馬達 41‧‧‧Drive motor

42‧‧‧電極接頭 42‧‧‧electrode connector

43‧‧‧漏接盤 43‧‧‧Missing tray

5‧‧‧移動架 5‧‧‧ mobile rack

51‧‧‧固定板 51‧‧‧Fixed plate

52‧‧‧側板 52‧‧‧Side

53‧‧‧對位塊 53‧‧‧Alignment block

54‧‧‧輔助桿 54‧‧‧ Auxiliary lever

55‧‧‧蓋體 55‧‧‧ Lid

56‧‧‧握持件 56‧‧‧Grip

57‧‧‧旋轉接頭 57‧‧‧rotary joint

58‧‧‧陰極座 58‧‧‧ cathode holder

59‧‧‧陰極導線 59‧‧‧ cathode wire

6‧‧‧固定座 6‧‧‧Fixed

7‧‧‧升降座 7‧‧‧lifting seat

第1及2圖是依據本發明小型零件的電鍍裝置的一第一較佳實施例的局部結構的一示意圖;第3圖是依據本發明小型零件的電鍍裝置的一第二較佳實施例的局部結構的一立體圖;第4圖是依據第3圖的A-A切線的一剖視圖;及第5圖是依據本發明小型零件的電鍍裝置的一第二較佳實施例顯示二電鍍槽的一示意圖。 Figures 1 and 2 are schematic diagrams of the partial structure of a first preferred embodiment of a plating device for small parts according to the present invention; Figure 3 is a diagram of a second preferred embodiment of a plating device for small parts according to the present invention A perspective view of the partial structure; FIG. 4 is a cross-sectional view according to the AA tangent line of FIG. 3; and FIG. 5 is a schematic diagram showing a second electroplating tank according to a second preferred embodiment of a plating device for small parts according to the present invention.

為了讓本發明之上述及其他目的、特徵、優點能更明顯易懂,下文將特舉本發明較佳實施例,並配合所附圖式,作詳細說明如下。再者,本發明所提到的方向用語,例如上、下、頂、底、前、後、左、右、內、外、側面、周圍、中央、水平、橫向、垂直、縱向、軸向、徑向、最上層或最下層等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本發明,而非用以限制本發明。 In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the following describes the preferred embodiments of the present invention and the accompanying drawings in detail, as follows. Furthermore, the directional terms mentioned in the present invention include, for example, top, bottom, top, bottom, front, back, left, right, inside, outside, side, periphery, center, horizontal, horizontal, vertical, vertical, axial, The radial direction, the uppermost layer, or the lowermost layer, etc., are only directions referring to the attached drawings. Therefore, the directional terms used are for explaining and understanding the present invention, but not for limiting the present invention.

請參照第1及2圖所示,為本發明一種小型零件的電鍍裝置的一較佳實施例,用以電鍍或化學鍍多個小型零件,例如:晶片型電阻、電感、電容、連接器、精密零件等。其中該小型零件的電鍍裝置包含一座體101及至少一個或以上的電鍍單元102。本發明將於下文詳細說明各元件的細部構造、組裝關係及其運作原理。 Please refer to FIG. 1 and FIG. 2, which is a preferred embodiment of an electroplating device for a small part of the present invention, which is used to electroplat or chemically plate a plurality of small parts, such as chip-type resistors, inductors, capacitors, connectors, Precision parts, etc. The electroplating device for the small parts includes a base 101 and at least one or more electroplating units 102. The present invention will explain in detail the detailed structure, assembly relationship and operation principle of each element.

續參照第1及2圖所示,該小型零件的電鍍裝置是將一個電鍍單元102設置在該座體101上,而且每一個電鍍單元102包含一電鍍滾筒2、 一電鍍槽3、一驅動器4及一移動架5。要說明的是,在其他實施例中,也可以設置在一座體101上設置有多個電鍍單元102,並不以本實施例為限。 Continuing to refer to FIGS. 1 and 2, the electroplating device for the small parts is provided with an electroplating unit 102 on the base 101, and each electroplating unit 102 includes an electroplating drum 2, A plating tank 3, a driver 4 and a moving frame 5. It should be noted that, in other embodiments, a plurality of electroplating units 102 may also be provided on a base 101, which is not limited to this embodiment.

續參照第1及2圖所示,該電鍍滾筒2具有一筒體21、一轉軸22、一卡合部23及一電流傳輸層24,其中該轉軸22的一第一端221設置在該筒體21上,該卡合部23設置在該筒體21的一底部。進一步來說,該筒體21具有一底座211、一圍繞壁212及一上蓋213,該底座211的凸垣與該圍繞壁212相卡合,該圍繞壁212內形成一陰極環210,而且該上蓋213覆蓋在該圍繞壁212而界定一內部空間(未標示),而且該電流傳輸層24設置在該筒體21的底座211上,而且該轉軸22自該底座211連接至該上蓋213並向外延伸。 Continuing to refer to FIGS. 1 and 2, the electroplating drum 2 has a cylinder 21, a rotating shaft 22, an engaging portion 23, and a current transmission layer 24. A first end 221 of the rotating shaft 22 is disposed on the barrel. On the body 21, the engaging portion 23 is disposed on a bottom of the cylindrical body 21. Further, the cylindrical body 21 has a base 211, a surrounding wall 212, and an upper cover 213. The convexity of the base 211 is engaged with the surrounding wall 212, and a cathode ring 210 is formed in the surrounding wall 212. An upper cover 213 covers an inner space (not labeled) covering the surrounding wall 212, and the current transmission layer 24 is disposed on the base 211 of the cylinder 21, and the rotating shaft 22 is connected from the base 211 to the upper cover 213 and faces the upper cover 213. Outside extension.

續參照第1及2圖所示,該電鍍槽3為一矩形容器,其中設置一隔板103,該隔板103上方用以容置一電鍍液,該電鍍滾筒2可被浸泡在該電鍍槽3中,而且而且該電鍍槽3內可浸泡一個或多個陽極籃103。 Continuing to refer to FIGS. 1 and 2, the electroplating tank 3 is a rectangular container, in which a partition plate 103 is disposed. The partition plate 103 is used to receive a plating solution, and the electroplating drum 2 can be immersed in the electroplating tank. 3, and one or more anode baskets 103 can be immersed in the plating tank 3.

續參照第1及2圖所示,該驅動器4設置在該電鍍槽3的底部的下方,用以驅動該卡合部23轉動而帶動該電鍍滾筒2旋轉;且該驅動器4具有一驅動馬達41及一電極接頭42,該驅動馬達41為直流驅動馬達,用以與該電鍍滾筒2的卡合部23相卡合,進而使該筒體21被該卡合部23帶動而旋轉,例如:該卡合部23的一夾爪與該驅動馬達41的一凹槽相卡合;該電極接頭42是設置在該驅動馬達41上,用以與一陰極電性連接。又,該電鍍滾筒2另具有一陰極導體25,該陰極導體25設置在該卡合部23內,用以與該電極接頭42電性接觸。 Continuing to refer to FIGS. 1 and 2, the driver 4 is disposed below the bottom of the electroplating tank 3 to drive the engaging portion 23 to rotate and rotate the electroplating drum 2; and the driver 4 has a driving motor 41 And an electrode joint 42, the drive motor 41 is a DC drive motor for engaging with the engaging portion 23 of the electroplating drum 2, and then the cylinder 21 is driven by the engaging portion 23 to rotate, for example: the A clamping claw of the engaging portion 23 is engaged with a groove of the driving motor 41; the electrode joint 42 is disposed on the driving motor 41 and is used to be electrically connected to a cathode. In addition, the electroplating drum 2 further has a cathode conductor 25. The cathode conductor 25 is disposed in the engaging portion 23 to be in electrical contact with the electrode joint 42.

續參照第1及2圖所示,該移動架5組合在該座體101上,並用以在該座體101上移動,而且位於該電鍍槽3的一頂部,而且透過移動該移動 架5可將該電鍍滾筒2自該電鍍槽3抽離,並放置於另一電鍍槽(未繪示)中;另外,該轉軸22的一第二端222樞接在該移動架5上,而且該卡合部23位於該第一端221的下方。進一步說明的是,該移動架5具有一固定板51、二側板52、二對位塊53、二輔助桿54及一蓋體55,其中該固定板51用以供該轉軸22的第二端222樞接,該兩側板52組合在該固定板51的二側,該兩對位塊53設置在該固定板51的二側,而且位於該兩側板52外,該兩對位塊53是分別用以對位固定在該等側板52上;該兩輔助桿54設置在該等側板52之間,使該筒體21位於該輔助桿54之上,該蓋體55用以與該轉軸22的第一端221螺合在一起而固定在該固定板51上。 Continuing to refer to FIGS. 1 and 2, the moving frame 5 is combined on the base body 101 and used to move on the base body 101, and is located on a top of the plating tank 3, and the movement is performed by moving The rack 5 can withdraw the plating drum 2 from the plating tank 3 and place it in another plating tank (not shown). In addition, a second end 222 of the rotating shaft 22 is pivotally connected to the moving rack 5. The engaging portion 23 is located below the first end 221. It is further explained that the moving frame 5 has a fixing plate 51, two side plates 52, two positioning blocks 53, two auxiliary rods 54, and a cover 55, wherein the fixing plate 51 is used for the second end of the rotating shaft 22. 222 is pivoted, and the two side plates 52 are combined on two sides of the fixing plate 51. The two positioning blocks 53 are disposed on the two sides of the fixing plate 51 and are located outside the two side plates 52. The two positioning blocks 53 are respectively The two auxiliary rods 54 are arranged between the side plates 52 so that the cylinder 21 is located on the auxiliary rods 54. The cover 55 is used to connect with the shaft 22. The first ends 221 are screwed together and fixed on the fixing plate 51.

續參照第1及2圖所示,該座體101具有一升降座7,其中該移動架5設置在該升降座7上,而且該移動架5受該升降座7帶動而在靠近該電鍍槽3的一浸泡位置及遠離該電鍍槽3的一準備位置之間移動。 Continued to refer to FIGS. 1 and 2, the base body 101 has a lifting base 7, wherein the moving frame 5 is disposed on the lifting base 7, and the moving frame 5 is driven by the lifting base 7 and is close to the plating tank. 3 is moved between an immersion position of 3 and a preparation position remote from the plating tank 3.

進一步說明的是,該電鍍滾筒2的筒體21的圍繞壁212的一內壁可裝設有該陰極環210,該陰極環210可連接至該卡合部23內的一陰極導體25,而與該電極接頭42電性連接,並且利用該電鍍滾筒2在旋轉時的離心力,使該筒體21中的該等小型零件被帶動至該陰極環表面上。 It is further explained that an inner wall of the surrounding wall 212 of the barrel 21 of the electroplating drum 2 may be provided with the cathode ring 210, and the cathode ring 210 may be connected to a cathode conductor 25 in the engaging portion 23, and It is electrically connected to the electrode joint 42 and uses the centrifugal force of the electroplating drum 2 during rotation to cause the small parts in the cylinder 21 to be driven onto the surface of the cathode ring.

要說明的是,該電流傳輸層24是由鈦金屬或鍍鈦、噴鈦物質所製成,該筒體21是由塑膠類材質所製成,該電流傳輸層24及該筒體21之間設置一中間層(未繪示),該中間層由塑膠類材質所製成。 It should be noted that the current transmission layer 24 is made of titanium metal, titanium plating, or titanium sprayed material, and the cylinder 21 is made of a plastic material. Between the current transmission layer 24 and the cylinder 21 An intermediate layer (not shown) is provided, and the intermediate layer is made of plastic material.

依據上述的結構,利用將該驅動器4設置在該電鍍槽3的底部下方,而透過該卡合部23及該驅動馬達41相卡合的方式帶動該電鍍滾筒2作間歇性旋轉,並藉由該陰極環表面可電性連接至該電極接頭42,同時利用 該電鍍滾筒2在旋轉時的離心力,使該筒體21中的該等小型零件被帶動至該陰極環表面上,而達到該等小型零件的表面均勻電鍍的效果。 According to the above structure, the driver 4 is arranged below the bottom of the plating tank 3, and the plating drum 2 is driven to rotate intermittently through the engagement of the engaging portion 23 and the driving motor 41, and by The surface of the cathode ring can be electrically connected to the electrode joint 42 while using The centrifugal force of the electroplating drum 2 during rotation causes the small parts in the cylinder body 21 to be driven onto the surface of the cathode ring, thereby achieving the effect of evenly plating the surfaces of the small parts.

如上所述,利用將該驅動器4設置在該電鍍槽3中,並且透過該卡合部23及該驅動馬達41相卡合的方式帶動該電鍍滾筒2旋轉,不僅使該電鍍滾筒2容易移動置換,也能夠提升該等小型零件的電鍍速度及效率,而且該小型零件的電鍍裝置的結構簡單,使得後續的維護成本較低。 As described above, the driver 4 is installed in the plating tank 3 and the plating drum 2 is driven to rotate through the engagement between the engaging portion 23 and the driving motor 41, so that the plating drum 2 is not only easily moved and replaced. It can also improve the plating speed and efficiency of such small parts, and the structure of the plating device of the small parts is simple, so that subsequent maintenance costs are lower.

請參照第3、4及5圖所示,為本發明小型零件的電鍍裝置的一第二較佳實施例,並大致沿用上述較佳實施例相同元件名稱及圖號,但兩者間差異之特徵在於:該移動架5可透過外部裝置,例如:機械手臂來進行搬移,使該電鍍滾筒2可其中一電鍍槽3被移動至另一電鍍槽3’;再者,該電鍍滾筒2另具有一電力線導環26,設置在該筒體21內且與該圍繞壁212相間隔;該移動架5係具有一固定板51、二側板52、二輔助桿54、二握持件56、一旋轉接頭57及二陰極座58,其中該等側板52組合在該固定板51的二側,該等輔助桿54設置在該等側板52之間,使該筒體21位於該輔助桿54之上,該等握持件56分別間隔設置在該固定板51的一頂面的二側,該旋轉接頭57樞接該固定板51上,用以與該轉軸22的第二端222組合在一起,該等陰極座58設置在該固定板51的一底部的二側,用以透過一陰極導線59經該轉軸22而與該陰極環210電性連接。另外,該筒體21的底部具有強制性渦流葉片,可使其中的電鍍液交換快速,該驅動馬達41是設置在該電鍍槽3的底部的下方,而且該電鍍裝置另具有一漏接盤43,設置在該驅動馬達41及該電鍍槽3的底部之間,用以承裝由該電鍍槽3漏出的液體。 Please refer to Figs. 3, 4 and 5, which are a second preferred embodiment of the electroplating device for small parts of the present invention, and generally use the same component names and drawing numbers of the above-mentioned preferred embodiments, but there are differences between the two. It is characterized in that the moving frame 5 can be moved through an external device, such as a robot arm, so that the electroplating drum 2 can be moved from one electroplating tank 3 to the other electroplating tank 3 '; further, the electroplating drum 2 has another A power line guide ring 26 is disposed in the cylinder 21 and spaced from the surrounding wall 212. The moving frame 5 has a fixed plate 51, two side plates 52, two auxiliary rods 54, two grips 56, and one rotation. The joint 57 and the two cathode bases 58, wherein the side plates 52 are combined on both sides of the fixing plate 51, and the auxiliary rods 54 are arranged between the side plates 52 so that the cylinder 21 is located on the auxiliary rods 54. The holding members 56 are respectively disposed on two sides of a top surface of the fixing plate 51 at intervals. The rotary joint 57 is pivotally connected to the fixing plate 51 for combining with the second end 222 of the rotating shaft 22. The cathode holder 58 is disposed on two sides of a bottom of the fixed plate 51 for transmitting a cathode 59 is connected to the cathode 210 is electrically ring 22 via the spindle. In addition, the bottom of the cylinder 21 is provided with a compulsory vortex blade, which can exchange the plating solution quickly. The driving motor 41 is disposed below the bottom of the plating tank 3, and the plating device also has a leakage plate 43. Is disposed between the driving motor 41 and the bottom of the plating tank 3 for receiving the liquid leaked from the plating tank 3.

依據上述的結構,鬆開該旋轉接頭57可以使該筒體21與該轉軸22一併脫離該移動架5,該固定板51的底部的二側的該等陰極座58在電接觸時能夠與該陰極環210電性連接,當該固定板51搬離時形成斷電。另外,當該陰極環210旋轉加速至一指定轉速時,該筒體21內的該等小型零件(被鍍物)因離心力緊貼於該陰極環210,並且供電進行電鍍,在一段時間後斷電並使該陰極環210減速至一低轉速,該筒體21內的該等小型零件(被鍍物)因重力落於該筒體21底部而進行混合,接著該等小型零件(被鍍物)混合之後再將該陰極環210旋轉加速至指定轉速,如此間歇進行該等小型零件(被鍍物)低速混合及加速電鍍,再低速混合及加速電鍍,進而使該等小型零件(被鍍物)的表面能夠有更均勻的電鍍效果。 According to the above structure, loosening the rotary joint 57 can disengage the cylinder 21 and the rotating shaft 22 from the moving frame 5 together. The cathode holders 58 on the two sides of the bottom of the fixed plate 51 can be in electrical contact with each other. The cathode ring 210 is electrically connected, and power is cut off when the fixing plate 51 is moved away. In addition, when the cathode ring 210 rotates and accelerates to a specified speed, the small parts (the objects to be plated) in the cylinder 21 are closely attached to the cathode ring 210 due to centrifugal force, and the power is supplied for electroplating, and it will be broken after a period of time. Electricity and decelerates the cathode ring 210 to a low speed, the small parts (the objects to be plated) in the cylinder 21 are mixed due to gravity falling on the bottom of the cylinder 21, and then the small parts (the objects to be plated) are mixed ) After mixing, the cathode ring 210 is rotated and accelerated to a specified speed, so that low-speed mixing and accelerated plating of these small parts (plated objects) are performed intermittently, and then low-speed mixing and accelerated plating are performed, so that these small parts (plated objects) ) Surface can have more uniform plating effect.

雖然本發明已以較佳實施例揭露,然其並非用以限制本發明,任何熟習此項技藝之人士,在不脫離本發明之精神和範圍內,當可作各種更動與修飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.

Claims (5)

一種小型零件的電鍍裝置,包括:至少一個電鍍單元,每一個電鍍單元包含:一移動架;一電鍍滾筒,具有一筒體、一轉軸及一卡合部,其中該轉軸的一第一端設置在該筒體上,該卡合部設置在該筒體的一底部,其中該筒體具有一底座、一圍繞壁及一上蓋,該底座與該圍繞壁相結合,該圍繞壁內形成該陰極環,該轉軸自該底座連接該上蓋並向外延伸;一電鍍槽,容置一電鍍液以浸泡該電鍍滾筒;及一驅動器,用以驅動該卡合部轉動而帶動該電鍍滾筒旋轉。An electroplating device for small parts includes: at least one electroplating unit, each electroplating unit includes: a moving frame; an electroplating drum having a cylinder, a rotating shaft and an engaging portion, wherein a first end of the rotating shaft is arranged On the cylinder, the engaging portion is disposed on a bottom of the cylinder. The cylinder has a base, a surrounding wall and an upper cover. The base is combined with the surrounding wall, and the cathode is formed in the surrounding wall. A ring, the rotating shaft is connected to the upper cover from the base and extends outward; a plating tank containing a plating solution to soak the plating drum; and a driver for driving the engaging portion to rotate to drive the plating drum to rotate. 如申請專利範圍第1項所述之小型零件的電鍍裝置,其中該驅動器具有一驅動馬達,用以與該電鍍滾筒的卡合部相卡合,而帶動該筒體間歇地旋轉。The electroplating device for small parts as described in item 1 of the scope of patent application, wherein the driver has a driving motor for engaging with the engaging part of the electroplating drum to drive the cylinder to rotate intermittently. 如申請專利範圍第1項所述之小型零件的電鍍裝置,其中該移動架具有:一固定板;二側板,組合在該固定板的二側;二輔助桿,設置在該等側板之間,使該筒體位於該輔助桿之上;及一旋轉接頭,樞接該固定板上,用以與該轉軸的第二端組合在一起。The electroplating device for small parts as described in item 1 of the scope of patent application, wherein the moving frame has: a fixed plate; two side plates combined on two sides of the fixed plate; two auxiliary rods arranged between the side plates, The cylinder is positioned on the auxiliary rod; and a rotary joint is pivotally connected to the fixing plate for combining with the second end of the rotating shaft. 如申請專利範圍第3項所述之小型零件的電鍍裝置,其中該移動架另具有二陰極座,設置在該固定板的一底部的二側,用以與一陰極環電性連接。The electroplating device for small parts as described in the third item of the patent application scope, wherein the moving frame further has two cathode bases, which are arranged on two sides of one bottom of the fixed plate for electrical connection with a cathode ring. 如申請專利範圍第1項所述之小型零件的電鍍裝置,另具有一漏接盤,設置在該驅動馬達上,用以承裝由該電鍍槽漏出的液體。The electroplating device for small parts as described in item 1 of the scope of the patent application, further has a leakage tray, which is arranged on the driving motor to receive the liquid leaked from the electroplating tank.
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CN205893444U (en) * 2016-06-29 2017-01-18 盐城中航自动化装备有限公司 Small -size barrel -plating equipment of tilting

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JP2019522733A (en) 2019-08-15
KR102244497B1 (en) 2021-04-26

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